CN103608656B - 热敏标签 - Google Patents

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Publication number
CN103608656B
CN103608656B CN201280016507.5A CN201280016507A CN103608656B CN 103608656 B CN103608656 B CN 103608656B CN 201280016507 A CN201280016507 A CN 201280016507A CN 103608656 B CN103608656 B CN 103608656B
Authority
CN
China
Prior art keywords
shape memory
label according
memory element
filiform
filamentary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280016507.5A
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English (en)
Chinese (zh)
Other versions
CN103608656A (zh
Inventor
L·卡塔尼奥
F·布泰拉
S·阿拉克夸
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SAES Getters SpA
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SAES Getters SpA
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Publication date
Application filed by SAES Getters SpA filed Critical SAES Getters SpA
Publication of CN103608656A publication Critical patent/CN103608656A/zh
Application granted granted Critical
Publication of CN103608656B publication Critical patent/CN103608656B/zh
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K3/00—Thermometers giving results other than momentary value of temperature
    • G01K3/02—Thermometers giving results other than momentary value of temperature giving means values; giving integrated values
    • G01K3/04—Thermometers giving results other than momentary value of temperature giving means values; giving integrated values in respect of time
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K5/00—Measuring temperature based on the expansion or contraction of a material
    • G01K5/48—Measuring temperature based on the expansion or contraction of a material the material being a solid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K5/00—Measuring temperature based on the expansion or contraction of a material
    • G01K5/48—Measuring temperature based on the expansion or contraction of a material the material being a solid
    • G01K5/483—Measuring temperature based on the expansion or contraction of a material the material being a solid using materials with a configuration memory, e.g. Ni-Ti alloys

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Display Devices Of Pinball Game Machines (AREA)
CN201280016507.5A 2011-03-29 2012-03-21 热敏标签 Active CN103608656B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITMI2011A000499 2011-03-29
IT000499A ITMI20110499A1 (it) 2011-03-29 2011-03-29 Etichetta termosensibile
PCT/IB2012/051345 WO2012131538A1 (en) 2011-03-29 2012-03-21 Temperature-sensitive label

Publications (2)

Publication Number Publication Date
CN103608656A CN103608656A (zh) 2014-02-26
CN103608656B true CN103608656B (zh) 2016-01-20

Family

ID=43977164

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280016507.5A Active CN103608656B (zh) 2011-03-29 2012-03-21 热敏标签

Country Status (8)

Country Link
US (1) US8870082B2 (enExample)
EP (1) EP2691753B1 (enExample)
JP (1) JP5795428B2 (enExample)
KR (1) KR101545118B1 (enExample)
CN (1) CN103608656B (enExample)
ES (1) ES2483167T3 (enExample)
IT (1) ITMI20110499A1 (enExample)
WO (1) WO2012131538A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20120273A1 (it) 2012-02-24 2013-08-25 Getters Spa Etichetta termosensibile
CN103824513B (zh) * 2014-03-03 2017-09-26 深圳九星印刷包装集团有限公司 一种温变疫苗标签及其制备方法
US10109024B2 (en) 2014-09-05 2018-10-23 The Climate Corporation Collecting data to generate an agricultural prescription
CN113887265B (zh) 2015-03-30 2025-11-04 斑马技术公司 带有动态环境数据系统、方法和装置的二维条形码
US10546172B2 (en) 2015-03-30 2020-01-28 Temptime Corporation Two dimensional barcode with dynamic environmental data system, method, and apparatus
CN105758551A (zh) * 2016-02-25 2016-07-13 深圳九星印刷包装集团有限公司 时间温度指示装置
US10095972B2 (en) 2016-03-01 2018-10-09 Temptime Corporation Switchable RFID antennas responsive to an environmental sensor
CN106370320B (zh) * 2016-08-30 2019-05-14 沈阳建筑大学 一种基于形状记忆合金的过冷温度监测方法
KR101711819B1 (ko) 2016-09-27 2017-03-03 주식회사 이노솔루텍 전자 장치용 상태 감지 라벨 및 이의 실행 방법
US10739211B2 (en) * 2016-12-16 2020-08-11 Vdw Design, Llc Chipless RFID-based temperature threshold sensor
CN108981937B (zh) * 2018-04-25 2024-09-03 曹生珠 一种冷链超温监测装置及其制作方法
CN111551269B (zh) * 2020-05-11 2021-09-10 浙江大学 一种基于形状记忆聚合物的结构健康监测系统
US11913845B2 (en) 2021-02-25 2024-02-27 Temptime Corporation Tunable capacitance-based temperature sensor
US11734539B2 (en) 2021-04-05 2023-08-22 Temptime Corporation Dynamic optical property windows in indicia with sensors
US12352717B2 (en) 2022-07-18 2025-07-08 Zebra Technologies Corporation Capacitance-based humidity and gas sensing RFID tags
US12020097B1 (en) 2023-01-31 2024-06-25 Temptime Corporation 2D bar code using active overlays

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1323981A (zh) * 2000-05-17 2001-11-28 大韩新药株式会社 使用了形状记忆合金的温度传感器及其制造方法
US20030188677A1 (en) * 1999-04-28 2003-10-09 Akers Jeffrey W. Shape memory thermal exposure monitor
CN101059898A (zh) * 2006-04-20 2007-10-24 张卫社 一种基于记忆合金丝的线型温度感知元件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3483752A (en) 1967-02-10 1969-12-16 Avco Corp Temperature monitor
US3516082A (en) 1967-06-09 1970-06-02 Roy G Cooper Temperature sensing devices
US4114559A (en) * 1974-09-23 1978-09-19 Nicoa Corporation Temperature monitoring
JPS58216318A (ja) * 1982-06-08 1983-12-16 株式会社井上ジャパックス研究所 熱応答スイツチ
JP3038928B2 (ja) * 1989-12-28 2000-05-08 吉富製薬株式会社 保存温度管理用インディケーター
JPH0475929U (enExample) * 1990-11-14 1992-07-02
JPH07198502A (ja) * 1993-12-28 1995-08-01 Tokin Corp 温度指示計
US6806808B1 (en) 1999-02-26 2004-10-19 Sri International Wireless event-recording device with identification codes
US6612739B2 (en) 2001-12-05 2003-09-02 Mohsen Shahinpoor Shape memory alloy temperature sensor
JP2005300424A (ja) * 2004-04-14 2005-10-27 Kubota Corp 温度検出装置
US20060273876A1 (en) * 2005-06-02 2006-12-07 Pachla Timothy E Over-temperature protection devices, applications and circuits
US20090120106A1 (en) 2007-11-12 2009-05-14 Milton Chin Temperature Alert Device for Cryopreservation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030188677A1 (en) * 1999-04-28 2003-10-09 Akers Jeffrey W. Shape memory thermal exposure monitor
CN1323981A (zh) * 2000-05-17 2001-11-28 大韩新药株式会社 使用了形状记忆合金的温度传感器及其制造方法
CN101059898A (zh) * 2006-04-20 2007-10-24 张卫社 一种基于记忆合金丝的线型温度感知元件

Also Published As

Publication number Publication date
ES2483167T3 (es) 2014-08-05
ITMI20110499A1 (it) 2012-09-30
US8870082B2 (en) 2014-10-28
US20140001273A1 (en) 2014-01-02
KR20140026438A (ko) 2014-03-05
JP2014509749A (ja) 2014-04-21
KR101545118B1 (ko) 2015-08-18
EP2691753A1 (en) 2014-02-05
JP5795428B2 (ja) 2015-10-14
EP2691753B1 (en) 2014-05-14
WO2012131538A1 (en) 2012-10-04
CN103608656A (zh) 2014-02-26

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SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
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