CN103597585A - Water-soluble cutting fluid for fixed abrasive grain wire saw, cutting method using same, and recycling method therefor - Google Patents
Water-soluble cutting fluid for fixed abrasive grain wire saw, cutting method using same, and recycling method therefor Download PDFInfo
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- CN103597585A CN103597585A CN201280029282.7A CN201280029282A CN103597585A CN 103597585 A CN103597585 A CN 103597585A CN 201280029282 A CN201280029282 A CN 201280029282A CN 103597585 A CN103597585 A CN 103597585A
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- Prior art keywords
- water
- cutting
- abrasive grains
- scroll saw
- soluble cutting
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- 238000005520 cutting process Methods 0.000 title claims abstract description 94
- 239000006061 abrasive grain Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000002173 cutting fluid Substances 0.000 title abstract 5
- 238000004064 recycling Methods 0.000 title abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 15
- 239000010703 silicon Substances 0.000 claims abstract description 15
- 229920001400 block copolymer Polymers 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920001515 polyalkylene glycol Polymers 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 47
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 27
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 14
- 235000007586 terpenes Nutrition 0.000 claims description 9
- -1 glycol ethers Chemical class 0.000 claims description 8
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 7
- 239000002270 dispersing agent Substances 0.000 claims description 7
- 238000011084 recovery Methods 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims 1
- 238000005187 foaming Methods 0.000 abstract description 4
- 229920001521 polyalkylene glycol ether Polymers 0.000 abstract 2
- 150000002334 glycols Chemical class 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 18
- 230000000694 effects Effects 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 5
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 4
- 239000013530 defoamer Substances 0.000 description 4
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229960003511 macrogol Drugs 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 239000010802 sludge Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- RBACIKXCRWGCBB-UHFFFAOYSA-N 1,2-Epoxybutane Chemical compound CCC1CO1 RBACIKXCRWGCBB-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- JECYNCQXXKQDJN-UHFFFAOYSA-N 2-(2-methylhexan-2-yloxymethyl)oxirane Chemical compound CCCCC(C)(C)OCC1CO1 JECYNCQXXKQDJN-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- JQMFQLVAJGZSQS-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-N-(2-oxo-3H-1,3-benzoxazol-6-yl)acetamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)NC1=CC2=C(NC(O2)=O)C=C1 JQMFQLVAJGZSQS-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 239000008258 liquid foam Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229930003658 monoterpene Natural products 0.000 description 1
- 150000002773 monoterpene derivatives Chemical class 0.000 description 1
- 235000002577 monoterpenes Nutrition 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229930004725 sesquiterpene Natural products 0.000 description 1
- 150000004354 sesquiterpene derivatives Chemical class 0.000 description 1
- 229930002368 sesterterpene Natural products 0.000 description 1
- 150000002653 sesterterpene derivatives Chemical class 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 235000013599 spices Nutrition 0.000 description 1
- 230000003019 stabilising effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 150000003535 tetraterpenes Chemical class 0.000 description 1
- 235000009657 tetraterpenes Nutrition 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 150000003648 triterpenes Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Provided are: a water-soluble cutting fluid for a fixed abrasive grain wire saw, causing little foaming and attaining high cutting performance; a cutting method using the same; and a recycling method therefor. A water-soluble cutting fluid for a fixed abrasive grain wire saw, characterized by comprising (a) a terpene-alkylene oxide block copolymer, (b) at least one component selected from among glycols, polyalkylene glycols, glycol ethers and polyalkylene glycol ethers, and (c) water; an ingot-cutting method characterized by cutting a silicon ingot with a fixed abrasive grain wire saw while applying the water-soluble cutting fluid for a fixed abrasive grain wire saw; and a recycling method for a water-soluble cutting fluid for a fixed abrasive grain wire saw.
Description
Technical field
The present invention relates to a kind of for the fixedly abrasive grains of using fixing abrasive grains scroll saw (fixed abrasive grain wire saw) cutting silicon ingot water-soluble cutting liquid, the cutting method of using it and recovery method thereof for scroll saw.
Background technology
Since previously, the cutting of silicon is to have the band saw of free abrasive grains or scroll saw to carry out by use.There are the following problems by use, to have the band saw of free abrasive grains or cutting that scroll saw carries out: slurries are attached on the wafer of cutting, cleaning burden in subsequent step is heavier, again, be difficult to from using liquid to isolate free abrasive grains, sludge, cutting liquid, recyclability is poor.
For described problem, to develop and use to electroplate or resin binds and makes abrasive grains be fixed on the fixedly scroll saw on line, it has the following advantages: cleaning step is simplified or by by cutting liquid, recyclability improves with sludge is separated.The cutting liquid using when utilizing this static line sawing to cut silicon, proposes there is water or as the water-soluble cutting liquid of patent documentation 1～3.
Patent documentation 1: 2003-No. 82334 communiques of TOHKEMY;
Patent documentation 2: 2009-No. 57423 communiques of TOHKEMY;
Patent documentation 3: No. 2011/058929th, International Publication.
Summary of the invention
Yet, in using the situation of described water-soluble cutting liquid cutting silicon, in recent years, for quality aspect and cutting speed improve and linear velocity are accelerated, consequently, water-soluble cutting liquid used bubbles, thereby has the problem that cannot cut out the second best in quality wafer.
Therefore, the invention provides a kind of foaming less and fixedly abrasive grains that cutting performance is higher water-soluble cutting liquid, the cutting method of using it and recovery method thereof for scroll saw.
For reaching above object, the present inventor etc. further investigate repeatedly, found that: by use, contain in (a) terpenes alkylene oxide (terpene alkylene oxide) block copolymer, (b) glycol (glycol), poly-alkane glycol (polyalkylene glycol), glycol ethers and poly alkane glycol ether at least a kind and (c) the water-soluble cutting liquid of water, even if in using the situation of fixing abrasive grains scroll saw, bubble also less, and cutting performance is higher.That is, the present invention is the water-soluble cutting liquid of a kind of fixedly abrasive grains scroll saw, it is characterized in that containing: (a) terpenes alkylene oxide block copolymer; (b) at least a kind in glycol, poly-alkane glycol, glycol ethers and poly alkane glycol ether; And (c) water.
Again, the present invention is a kind of cutting method of ingot, it is characterized in that: use the water-soluble cutting liquid of above-mentioned fixedly abrasive grains scroll saw, by fixing abrasive grains scroll saw cutting silicon ingot; And the recovery method of water-soluble cutting liquid for a kind of fixedly abrasive grains scroll saw, it is characterized in that: by this ingot cutting method, undertaken after the cutting of ingot, fixedly abrasive grains scroll saw is separated from silicon with water-soluble cutting liquid to use centrifugal separator or filter.
As mentioned above, according to the present invention, can provide a kind of foaming less and fixedly abrasive grains that cutting performance is higher water-soluble cutting liquid, the cutting method of using it and recovery method thereof for scroll saw.
Embodiment
(a) terpenes alkylene oxide block copolymer for fixedly abrasive grains scroll saw of the present invention with water-soluble cutting liquid, be at least a kind that makes in oxirane, expoxy propane and epoxy butane, take monoterpene (carbon number 10), sesquiterpene (carbon number 15), two terpenes (carbon number 20), sesterterpene (carbon number 25), triterpene (carbon number 30) and tetraterpene (carbon number 40) the combined polymerization person of obtaining of the hydrocarbon that isoprene is Component units with being.Wherein, be especially preferably with oxirane and epoxypropane copolymerization and person, its ratio is preferably with respect to 1 mole of above-mentioned terpenes, oxirane and expoxy propane are respectively 3～30 moles and 3～20 moles.
Again, to be preferably with respect to whole cutting liquids be 0.01～5.0 % by weight for addition (a).If addition (a) does not reach 0.01 % by weight, do not there is defoaming effect, again, the cutting bits that do not have producing in cutting process disperse the effect of cleaning, so not good.Again, even if surpass 5.0 % by weight, during with situation below 5.0 % by weight, compare, defoaming effect and disperses the effect of cleaning also not have difference to the cutting bits that produce in cutting process, 5.0 % by weight can obtain below sufficient defoaming effect and the cutting bits that produce in cutting process are disperseed to the effect of cleaning, therefore with regard to the viewpoint reducing costs, be preferably below 5.0 % by weight.
Previously, as fixing abrasive grains scroll saw, with the defoamer of water-soluble cutting liquid, be that use silicon is defoamer, yet silicon is defoamer, exist liquid stabilising poor, easily become the tendency of inhomogeneous liquid.Yet, in the present invention, by using (a) even if terpenes alkylene oxide block copolymer and not use silicon be defoamer also can improve defoaming effect and the cutting bits that produce in cutting process are disperseed to the effect of cleaning, thereby raising cutting performance.
At fixedly abrasive grains scroll saw of the present invention with in water-soluble cutting liquid, (b) as long as glycol has two OH bases, for example can enumerate: monoethylene glycol, diethylene glycol, triethylene glycol, MPG, DPG, tripropylene glycol and 2-first-2,4-pentanediol (hexylene glycol) etc.Again, as poly-alkane glycol, such as enumerating: the copolymer of the copolymer of polyethylene glycol, polypropylene glycol, polyoxyethylene polyoxypropylene, polyoxyethylene polyoxy butylene etc.Again, as glycol ethers, such as enumerating: diethylene glycol monomethyl ether, diethylene glycol monobutyl ether and diethylene glycol monohexyl ether etc.Again, as polyoxyethylene glycol ether, such as enumerating: the butyl ether of polyoxyethylene methyl ether, polyoxyethylene polyoxy propylene glycol copolymers etc.Its grade can be used alone a kind, also two or more can be used in combination.Again, weight average molecular weight (b) is preferably 50～5, and 000.If its reason is weight average molecular weight (b) and surpasses 5,000, viscosity is higher, can exert an influence to cutting performance.The weight average molecular weight of better (b) is 50～1,000.
Fixedly abrasive grains scroll saw of the present invention can add (d) dispersant as required with water-soluble cutting liquid.As used dispersant, there are the polycarboxylic acid or its salt that make polyoxyalkylene monoalky lether (polyoxyalkylene monoalkyl ether) glycerol polymerization in the copolymer of allyl alcohol, maleic anhydride and obtain; Make the glycerol polymerization of polyoxyalkylene monoalky lether in allyl alcohol, maleic anhydride, cinnamic copolymer and polycarboxylic acid or its salt; And naphthalene sulfonic acid condensate or its salt etc., can use usually used as dispersant sellers.(d) to be preferably with respect to whole cutting liquids be 0.1～5.0 % by weight to the content of dispersant.If do not reach 0.1 % by weight, cannot obtain the effect of dispersant, so not good.Again, even if surpass 5.0 % by weight, and be that 5.0 % by weight are compared when following, also there is not variation in dispersion effect, and 5.0 % by weight can obtain sufficient dispersant effect below, so with regard to the viewpoint reducing costs, are preferably below 5.0 % by weight.The content of better (d) is 0.1～1.0 % by weight.
At fixedly abrasive grains scroll saw of the present invention with in water-soluble cutting liquid, can contain with arbitrary proportion (a), (b), (c) and (d), but with regard to preferred ratio, (a), (b) and weight ratio (d) and (c) be 99:1～50:50.If (c) be less than 99:1, the cutting heat producing in cutting process is by the deterioration of the wafer that causes cutting out; If (c) more than 50:50, the silicon bits that produce in cutting process will be dried and be attached on cutting crystal wafer, thereby in the cleaning step of subsequent step, cause the bad problem that becomes of cleaning, and change because moisture evaporation produces viscosity.Better weight ratio is 90:10～50:50.
Again, fixedly abrasive grains scroll saw of the present invention also can add rust inhibitor, anticorrisive agent, spices and dyestuff etc. as required with water-soluble cutting liquid.
Fixedly abrasive grains scroll saw of the present invention in the cutting of the Silicon Wafer as semiconductor element or solar cell material, can be used fixedly abrasive grains scroll saw as cutting tool, to use multi-wire saw as cutting processing machine with water-soluble cutting liquid.
Fixedly abrasive grains scroll saw of the present invention after cutting, can be used centrifugal separator and filter that silicon is separated with water-soluble cutting liquid with water-soluble cutting liquid, thereby by its recovery.
Embodiment
Then, fixedly abrasive grains scroll saw of the present invention is described with the embodiment of water-soluble cutting liquid, but the present invention is not limited thereto.First, according to the blended amount of table 1 or table 2 utilize common method by its etc. mix, obtain thus the water-soluble cutting liquid of fixedly abrasive grains scroll saw of water-soluble cutting liquid and comparative example 1～comparative example 6 for the fixedly abrasive grains scroll saw of embodiment 1～embodiment 7.
[table 1]
* 1:RHODOCLEAN EFC Rho dia manufactures
* 2:RHODOFAC HP Rhodia manufactures
* 3: Macrogol 200 You company manufactures
* 4:ADEKAPluronic L-64ADEKA manufactures
* 5:UNILUB50MB-5 You company manufactures
* 6:MALIALIMAKM-0531 You company manufactures
* the industrial drugmaker of 7:LAVELIN FAN first manufactures
[table 2]
* 1:RHODOCLEAN EFC Rhodia manufactures
* 2:RHODOFAC HP Rhodia manufactures
* 3: Macrogol 200 You company manufactures
* 4:ADEKAPluronic L-64ADEKA manufactures
* 5:UNILUB50MB-5 You company manufactures
* 6:MALIALIMAKM--0531 You company manufactures
* 8:ADEKAPluronic17R4ADEKA manufactures
(foaming test)
Then, suppose in cutting process, will bubble or removal process in will bubble, the fixedly abrasive grains scroll saw of embodiment 1～embodiment 7 is injected into the having in plug graduated cylinder of 100ml with water-soluble cutting liquid with 50ml with the fixedly abrasive grains scroll saw of water-soluble cutting liquid and comparative example 1～comparative example 6, after jumping a queue, it is acutely shaken to foam number and foam time after confirming.The results are shown in table 3.Known according to table 3, thus water-soluble cutting liquid of the present invention bubbles better less.
[table 3]
| Cutting liquid | Foam number (ml) | Foam time (sec) |
| Embodiment 1 | 0 | 0 |
| Embodiment 2 | 0 | 0 |
| Embodiment 3 | 1 | 3 |
| Embodiment 4 | 0 | 0 |
| Embodiment 5 | 0 | 0 |
| Embodiment 6 | 0 | 0 |
| Embodiment 7 | 1 | 1 |
| Comparative example 1 | 8 | More than 1 minute |
| Comparative example 2 | 2 | 10 |
| Comparative example 3 | 3 | 15 |
| Comparative example 4 | 12 | More than 1 minute |
| Comparative example 5 | 2 | 3 |
| Comparative example 6 | 0 | 0 |
(cutting test)
Then, use the water-soluble cutting liquid of fixedly abrasive grains scroll saw of water-soluble cutting liquid and comparative example 1～comparative example 6 for the fixedly abrasive grains scroll saw of embodiment 1～embodiment 7, according to the condition of table 4, carry out cutting test, measure the maximum valley depth (PV) of the section curve of the wafer cutting out.Show the result in table 5.Known according to table 5, the fixedly abrasive grains scroll saw of the present embodiment is good with the cutting performance of water-soluble cutting liquid.
[table 4]
[table 5]
| Cutting liquid | PV(μm) |
| Embodiment 1 | 24.5 |
| Embodiment 2 | 20.8 |
| Embodiment 3 | 25.7 |
| Embodiment 4 | 22.3 |
| Embodiment 5 | 23.4 |
| Embodiment 6 | 20.2 |
| Embodiment 7 | 25.2 |
| Comparative example 1 | 38.5 |
| Comparative example 2 | 33.3 |
| Comparative example 3 | 28.2 |
| Comparative example 4 | 28.6 |
| Comparative example 5 | 52.3 |
| Comparative example 6 | 38.7 |
Claims (6)
1. the fixing water-soluble cutting liquid of abrasive grains scroll saw, contains: (a) terpenes alkylene oxide (terpene alkylene oxide) block copolymer; (b) at least a kind in glycol (glycol), poly-alkane glycol (polyalkylene glycol), glycol ethers and poly alkane glycol ether; And (c) water.
2. the water-soluble cutting liquid of fixedly abrasive grains scroll saw as claimed in claim 1, wherein, should (a) be 0.01～5.0 % by weight with respect to whole cutting liquids.
3. the water-soluble cutting liquid of fixedly abrasive grains scroll saw as claimed in claim 1 or 2, wherein, weight average molecular weight that should (b) is 50～5,000.
4. the fixing water-soluble cutting liquid of abrasive grains scroll saw as claimed any one in claims 1 to 3, wherein, and then contains (d) dispersant 0.1～5.0 % by weight.
5. the cutting method of ingot: right to use requires the water-soluble cutting liquid of fixedly abrasive grains scroll saw described in any one in 1 to 4, cuts silicon ingot by fixing abrasive grains scroll saw.
6. the fixing recovery method of water-soluble cutting liquid for abrasive grains scroll saw: in the cutting method by ingot claimed in claim 5, carry out after the cutting of ingot, use centrifugal separator fixedly abrasive grains scroll saw with water-soluble cutting liquid from silicon separation.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-233196 | 2011-10-24 | ||
| JP2011233196 | 2011-10-24 | ||
| PCT/JP2012/072878 WO2013061695A1 (en) | 2011-10-24 | 2012-09-07 | Water-soluble cutting fluid for fixed abrasive grain wire saw, cutting method using same, and recycling method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103597585A true CN103597585A (en) | 2014-02-19 |
| CN103597585B CN103597585B (en) | 2016-10-19 |
Family
ID=48167534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280029282.7A Expired - Fee Related CN103597585B (en) | 2011-10-24 | 2012-09-07 | Fixing abrasive grains scroll saw water solublity cutting liquid, the cutting method using it and recovery method thereof |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5207498B1 (en) |
| KR (1) | KR101506027B1 (en) |
| CN (1) | CN103597585B (en) |
| MY (1) | MY156441A (en) |
| TW (1) | TW201317335A (en) |
| WO (1) | WO2013061695A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105861112A (en) * | 2015-02-10 | 2016-08-17 | 达兴材料股份有限公司 | Additive of water-based cutting fluid for cutting process and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY177479A (en) * | 2013-04-05 | 2020-09-16 | Palace Chemical Co Ltd | Water-soluble cutting fluid for fixed abrasive grain wire saw, method for cutting ingot using cutting fluid, and substrate for electronic material obtained by cutting method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030054972A1 (en) * | 1996-12-20 | 2003-03-20 | Jean-Luc Joye | Polyalkoxylated terpenic compounds, their process of preparation and their use as defoaming agents |
| WO2009133612A1 (en) * | 2008-04-30 | 2009-11-05 | パレス化学株式会社 | Water-soluble cutting fluid composition, water-soluble cutting fluid, and method of cutting with the water-soluble cutting fluid |
| WO2011058929A1 (en) * | 2009-11-12 | 2011-05-19 | パレス化学株式会社 | Water-soluble cutting solution for fixed abrasive wire saw, method for cutting ingot using same, method for recycling the solution, and wafer produced by cutting |
| CN102071090A (en) * | 2009-11-20 | 2011-05-25 | 安集微电子（上海）有限公司 | Wire cutting solution for solar silicon slice |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4497767B2 (en) | 2001-09-06 | 2010-07-07 | ユシロ化学工業株式会社 | Water-soluble machining fluid composition for fixed abrasive wire saw |
| US6784248B2 (en) * | 2002-02-15 | 2004-08-31 | Ppg Industries Ohio, Inc. | Thermosetting compositions containing alternating copolymers of isobutylene type monomers |
| JP2007134371A (en) * | 2005-11-08 | 2007-05-31 | Nikka Seiko Kk | Method and apparatus for forming reference surface of wafer |
| JP5408639B2 (en) * | 2007-05-25 | 2014-02-05 | 大同化学工業株式会社 | Working fluid composition for hydrous slicing |
| JP5332914B2 (en) * | 2009-05-29 | 2013-11-06 | 信越半導体株式会社 | Cutting method of silicon ingot |
| JP2011005561A (en) * | 2009-06-23 | 2011-01-13 | Shin Etsu Handotai Co Ltd | Method and system for cutting silicon ingot |
-
2012
- 2012-09-07 WO PCT/JP2012/072878 patent/WO2013061695A1/en active Application Filing
- 2012-09-07 KR KR1020137030403A patent/KR101506027B1/en not_active IP Right Cessation
- 2012-09-07 MY MYPI2013702098A patent/MY156441A/en unknown
- 2012-09-07 JP JP2012553104A patent/JP5207498B1/en not_active Expired - Fee Related
- 2012-09-07 CN CN201280029282.7A patent/CN103597585B/en not_active Expired - Fee Related
- 2012-09-17 TW TW101133952A patent/TW201317335A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030054972A1 (en) * | 1996-12-20 | 2003-03-20 | Jean-Luc Joye | Polyalkoxylated terpenic compounds, their process of preparation and their use as defoaming agents |
| WO2009133612A1 (en) * | 2008-04-30 | 2009-11-05 | パレス化学株式会社 | Water-soluble cutting fluid composition, water-soluble cutting fluid, and method of cutting with the water-soluble cutting fluid |
| WO2011058929A1 (en) * | 2009-11-12 | 2011-05-19 | パレス化学株式会社 | Water-soluble cutting solution for fixed abrasive wire saw, method for cutting ingot using same, method for recycling the solution, and wafer produced by cutting |
| CN102071090A (en) * | 2009-11-20 | 2011-05-25 | 安集微电子（上海）有限公司 | Wire cutting solution for solar silicon slice |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105861112A (en) * | 2015-02-10 | 2016-08-17 | 达兴材料股份有限公司 | Additive of water-based cutting fluid for cutting process and preparation method thereof |
| CN105861112B (en) * | 2015-02-10 | 2021-12-14 | 达兴材料股份有限公司 | Additive of water-based cutting fluid for cutting process and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013061695A1 (en) | 2013-05-02 |
| JPWO2013061695A1 (en) | 2015-04-02 |
| KR101506027B1 (en) | 2015-03-25 |
| CN103597585B (en) | 2016-10-19 |
| TW201317335A (en) | 2013-05-01 |
| JP5207498B1 (en) | 2013-06-12 |
| MY156441A (en) | 2016-02-26 |
| KR20130141702A (en) | 2013-12-26 |
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