CN103597585B - Fixing abrasive grains scroll saw water solublity cutting liquid, the cutting method using it and recovery method thereof - Google Patents
Fixing abrasive grains scroll saw water solublity cutting liquid, the cutting method using it and recovery method thereof Download PDFInfo
- Publication number
- CN103597585B CN103597585B CN201280029282.7A CN201280029282A CN103597585B CN 103597585 B CN103597585 B CN 103597585B CN 201280029282 A CN201280029282 A CN 201280029282A CN 103597585 B CN103597585 B CN 103597585B
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- CN
- China
- Prior art keywords
- cutting
- abrasive grains
- water solublity
- scroll saw
- fixing abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
Abstract
The present invention provides a kind of and bubbles less and cutting method that the higher fixing abrasive grains scroll saw (fixed abrasive grain wire saw) of cutting performance with water solublity cutting liquid, uses it and recovery method thereof.The one that the present invention provides fixes abrasive grains scroll saw water solublity cutting liquid, it is characterised in that contain: (a) terpenes alkylene oxide (terpene alkylene oxide) block copolymer；At least one in (b) glycol (glyco1), poly-alkane glycol (polyalkylene glycol), glycol ethers and poly alkane glycol ether；And (c) water.The cutting method of a kind of ingot that the present invention provides, it is characterised in that: use above-mentioned fixing abrasive grains scroll saw water solublity cutting liquid, by fixing abrasive grains saw blade cutting silicon ingot；And the present invention also provides for the recovery method of a kind of fixing abrasive grains scroll saw water solublity cutting liquid.
Description
Technical field
The present invention relates to a kind of for using fixing abrasive grains scroll saw (fixed abrasive grain wire saw) to cut
Cut the fixing abrasive grains scroll saw water solublity cutting liquid of silicon ingot, the cutting method using it and recovery method thereof.
Background technology
Since previously, the cutting of silicon is to have the band saw of free abrasive grains or scroll saw to carry out by use.By using
There are the following problems in the cutting having the band saw of free abrasive grains or scroll saw and carry out: serosity is attached on cleaved wafer, after
Cleaning heavy load in continuous step, also, be difficult to from using liquid to isolate free abrasive grains, sludge, cutting liquid, recyclability is relatively
Difference.
For described problem, develop the fixing scroll saw using plating or resin to bind and make abrasive grains be fixed on line,
It has the advantage that cleaning step simplifies or by being separated with sludge by cutting liquid and recyclability raising.Solid as utilizing this
The cutting liquid used during alignment saw cut silicon, proposes have water or the water solublity cutting liquid such as patent documentation 1～3.
Patent documentation 1: 2003 No. 82334 publications of Japanese Unexamined Patent Publication；
Patent documentation 2: 2009 No. 57423 publications of Japanese Unexamined Patent Publication；
Patent documentation 3: International Publication the 2011/058929th.
Summary of the invention
But, in the situation using described water solublity cutting liquid cutting silicon, in recent years, for quality aspect and cutting speed
Degree improves and makes linear velocity accelerate, as a result of which it is, water solublity cutting liquid used bubbles, thus existence cannot to cut out quality good
The problem of good wafer.
Therefore, the fixing abrasive grains scroll saw water solublity that the present invention provides a kind of foaming less and cutting performance is higher cuts
Liquid, the cutting method using it and recovery method thereof.
For reaching object above, the present inventor etc. furthers investigate repeatedly, found that: by using containing (a)
Terpenes alkylene oxide (terpene alkylene oxide) block copolymer, (b) glycol (glycol), poly-alkane glycol
At least one in (polyalkylene glycol), glycol ethers and poly alkane glycol ether and the water solublity cutting liquid of (c) water, i.e.
Just, in the situation using fixing abrasive grains scroll saw, bubble the most less, and cutting performance is higher.That is, the present invention is a kind of fixing
Abrasive grains scroll saw water solublity cutting liquid, it is characterised in that contain: (a) terpenes alkylene oxide block copolymer；(b) glycol, poly-alkane
At least one in glycol, glycol ethers and poly alkane glycol ether；And (c) water.
Also, the present invention is the cutting method of a kind of ingot, it is characterised in that: use above-mentioned fixing abrasive grains scroll saw water solublity
Cutting liquid, by fixing abrasive grains saw blade cutting silicon ingot；And the recovery side of a kind of fixing abrasive grains scroll saw water solublity cutting liquid
Method, it is characterised in that: after the cutting being carried out ingot by this ingot cutting method, use centrifugal separator or defecator to fix
Abrasive grains scroll saw water solublity cutting liquid separates from silicon.
Bubble less and the higher fixing abrasive grains scroll saw water of cutting performance as it has been described above, can provide a kind of according to the present invention
Dissolubility cutting liquid, the cutting method using it and recovery method thereof.
Detailed description of the invention
For (a) terpenes alkylene oxide block copolymer of the fixing abrasive grains scroll saw water solublity cutting liquid of the present invention, it is
Make at least one in oxirane, expoxy propane and epoxy butane, with the monoterpene of the hydrocarbon being with isoprene as Component units
Alkene (carbon number 10), sesquiterpene (carbon number 15), two terpenes (carbon number 20), sesterterpene (carbon number 25), triterpene (carbon number 30)
And tetraterpene (carbon number 40) combined polymerization and person.Wherein, especially preferably with oxirane and epoxypropane copolymerization and person,
Its ratio is preferably relative to above-mentioned terpenes 1 mole, and oxirane and expoxy propane are respectively 3～30 moles and 3～20 moles.
Also, it is 0.01～5.0 weight % that the addition of (a) is preferably relative to whole cutting liquids.If addition (a) is not
Reach 0.01 weight %, the most not there is defoaming effect, carry out what dispersion was cleaned also, do not have to cut generation in cutting process to consider to be worth doing
Effect, so the best.Even if also, more than 5.0 weight %, compared with during situation below 5.0 weight %, defoaming effect and to cutting
The cutting bits produced during cutting carry out the effect of dispersion cleaning and the most there is not difference, can obtain and fill below 5.0 weight %
Point defoaming effect and generations in cutting process cut bits carry out dispersion clean effect, therefore with regard to reduction cost viewpoint
For, below preferably 5.0 weight %.
Since Xian Qian, the defoamer as fixing abrasive grains scroll saw water solublity cutting liquid is to use silicon system defoamer, so
And silicon system defoamer to there is liquid stability poor, easily become the tendency of uneven liquid.But, in the present invention, pass through
Even if using (a) terpenes alkylene oxide block copolymer and not using silicon system defoamer, defoaming effect also can be improved and to cutting through
The cutting bits produced in journey carry out the effect that dispersion is cleaned, thus improve cutting performance.
In the fixing abrasive grains scroll saw water solublity cutting liquid of the present invention, as long as (b) glycol has two OH bases,
Include, for example: monoethylene glycol, diethylene glycol, triethylene glycol, MPG, dipropylene glycol, tripropylene glycol and 2-first-2,4-penta
Glycol (hexylene glycol) etc..Also, as poly-alkane glycol, include, for example: Polyethylene Glycol, polypropylene glycol, polyoxyethylene
The copolymer of polyoxypropylene, the copolymer etc. of polyoxyethylene polybutylene.Also, as glycol ethers, include, for example: diethylene glycol
Monomethyl ether, diethylene glycol monobutyl ether and diethylene glycol monohexyl ether etc..Also, as polyoxyethylene glycol ether, include, for example: polyoxy
Vinyl methyl ether, the butyl ether etc. of polyoxyethylene polyoxypropylene glycol copolymer.Its etc. can be used alone a kind, also can be by two or more
It is applied in combination.Also, the weight average molecular weight of (b) is preferably 50～5,000.If its reason is the weight averaged molecular of (b)
Measure more than 5,000, then viscosity is higher, cutting performance can be produced impact.The more preferably weight average molecular weight of (b) is 50～1,
000。
The fixing abrasive grains scroll saw water solublity cutting liquid of the present invention can be added as needed on (d) dispersant.As being made
Dispersant, make polyalkylene oxide monoalkylether (polyoxyalkylene monoalkyl ether) glycerol polymerization in alkene
Propanol, maleic anhydride copolymer obtained by polycarboxylic acid or its salt；Make polyalkylene oxide monoalkylether glycerol polymerization in 1-propenol-3, horse
Come polycarboxylic acid or its salt obtained by anhydride, cinnamic copolymer；And naphthalene sulfonic acid condensate or its salt etc., can use usually used as
Dispersant and seller.D the content of () dispersant is preferably relative to whole cutting liquids is 0.1～5.0 weight %.If not reaching
0.1 weight %, then cannot obtain the effect of dispersant, so the best.Even if also, more than 5.0 weight %, and for 5.0 weight %
Comparing time following, the most there is not change in dispersion effect, can obtain sufficient dispersant effect, the most just below 5.0 weight %
For reducing the viewpoint of cost, below preferably 5.0 weight %.The more preferably content of (d) is 0.1～1.0 weight %.
In the fixing abrasive grains scroll saw water solublity cutting liquid of the present invention, (a), (b), (c) can be contained with arbitrary proportion
And (d), but for preferred ratio, (a), (b) and (d) is 99:1～50:50 with the weight ratio of (c).If (c) less than 99:
1, then the cutting heat produced in cutting process will cause the deterioration of wafer cut out；If (c) more than 50:50, then cutting
During produce silicon bits will be dried and be attached on cutting crystal wafer, cause in the cleaning step of subsequent step cleaning bad from
And become problem, and produce viscosity change because of moisture evaporation.More preferably weight ratio is 90:10～50:50.
Also, the fixing abrasive grains scroll saw water solublity cutting liquid of the present invention also can be added as needed on antirust agent, preservative,
Spice and dyestuff etc..
The fixing abrasive grains scroll saw water solublity cutting liquid of the present invention is in as semiconductor element or solar cell material
In the cutting of Silicon Wafer, fixing abrasive grains scroll saw can be used as cutting tool, use multi-wire saw as cutting processing machine.
The fixing abrasive grains scroll saw water solublity cutting liquid of the present invention after dicing, can use centrifugal separator and filter dress
Put and silicon is separated with water solublity cutting liquid, thus reclaimed.
Embodiment
Then, the embodiment of the fixing abrasive grains scroll saw water solublity cutting liquid of the present invention is illustrated, but the present invention
It is not limited to this.First, according to the blended amount of table 1 or table 2 utilize common method by its etc. mix, be derived from implement
Example 1～the fixing abrasive grains scroll saw water solublity cutting liquid of embodiment 7 and comparative example 1～the fixing abrasive grains scroll saw of comparative example 6
Use water solublity cutting liquid.
[table 1]
* 1:RHODOCLEAN EFC Rho dia manufactures
* 2:RHODOFAC HP Rhodia manufactures
* 3: polyethylene glycol 200 You company manufactures
* 4:ADEKAPluronic L-64ADEKA manufactures
* 5:UNILUB50MB-5 You company manufactures
* 6:MALIALIMAKM-0531 You company manufactures
* 7:LAVELIN FAN the first industrial pharmaceutical company manufactures
[table 2]
* 1:RHODOCLEAN EFC Rhodia manufactures
* 2:RHODOFAC HP Rhodia manufactures
* 3: polyethylene glycol 200 You company manufactures
* 4:ADEKAPluronic L-64ADEKA manufactures
* 5:UNILUB50MB-5 You company manufactures
* 6:MALIALIMAKM--0531 You company manufactures
* 8:ADEKAPluronic17R4ADEKA manufactures
(foaming test)
Then, it is assumed that will bubble in cutting process or will bubble in removal process, fixing by embodiment 1～embodiment 7
The fixing abrasive grains scroll saw water solublity cutting liquid of abrasive grains scroll saw water solublity cutting liquid and comparative example 1～comparative example 6 with
50ml is injected into having of 100ml and fills in graduated cylinder, after jumping a queue, is aggressively shaken, the foam number after confirmation and foam time.
The results are shown in table 3.According to table 3, the water solublity cutting liquid of the present invention bubbles less thus better.
[table 3]
| Cutting liquid | Foam number (ml) | Foam time (sec) |
| Embodiment 1 | 0 | 0 |
| Embodiment 2 | 0 | 0 |
| Embodiment 3 | 1 | 3 |
| Embodiment 4 | 0 | 0 |
| Embodiment 5 | 0 | 0 |
| Embodiment 6 | 0 | 0 |
| Embodiment 7 | 1 | 1 |
| Comparative example 1 | 8 | More than 1 minute |
| Comparative example 2 | 2 | 10 |
| Comparative example 3 | 3 | 15 |
| Comparative example 4 | 12 | More than 1 minute |
| Comparative example 5 | 2 | 3 |
| Comparative example 6 | 0 | 0 |
(cutting test)
Then, embodiment 1～the fixing abrasive grains scroll saw water solublity cutting liquid of embodiment 7 and comparative example 1～ratio are used
The fixing abrasive grains scroll saw water solublity cutting liquid of relatively example 6, carries out cutting test according to the condition of table 4, measures the crystalline substance cut out
The maximum valley depth (PV) of the section curve of circle.Show the result in table 5.According to table 5, the fixing abrasive grains line of the present embodiment
The cutting performance of saw water solublity cutting liquid is good.
[table 4]
[table 5]
| Cutting liquid | PV(μm) |
| Embodiment 1 | 24.5 |
| Embodiment 2 | 20.8 |
| Embodiment 3 | 25.7 |
| Embodiment 4 | 22.3 |
| Embodiment 5 | 23.4 |
| Embodiment 6 | 20.2 |
| Embodiment 7 | 25.2 |
| Comparative example 1 | 38.5 |
| Comparative example 2 | 33.3 |
| Comparative example 3 | 28.2 |
| Comparative example 4 | 28.6 |
| Comparative example 5 | 52.3 |
| Comparative example 6 | 38.7 |
Claims (5)
1. a fixing abrasive grains scroll saw water solublity cutting liquid, contains: (a) terpenes alkylene oxide (terpene alkylene
Oxide) block copolymer；(b) glycol (glycol), poly-alkane glycol (polyalkylene glycol), glycol ethers and poly-alkane two
At least one in alcohol ether；And (c) water, this terpenes alkylene oxide block copolymer is 0.01～5.0 weights relative to whole cutting liquids
Amount %.
2. fixing abrasive grains scroll saw water solublity cutting liquid as claimed in claim 1, wherein, is somebody's turn to do the weight averaged molecular of (b)
Amount is 50～5,000.
3. fixing abrasive grains scroll saw water solublity cutting liquid as claimed in claim 1 or 2, wherein, and then containing (d) dispersant
0.1～5.0 weight %.
4. the cutting method of an ingot: use the fixing abrasive grains scroll saw water solublity according to any one of claim 1 to 3
Cutting liquid, by fixing abrasive grains saw blade cutting silicon ingot.
5. the recovery method of a fixing abrasive grains scroll saw water solublity cutting liquid: cutting by the ingot described in claim 4
After segmentation method carries out the cutting of ingot, centrifugal separator is used to be separated from silicon by fixing abrasive grains scroll saw water solublity cutting liquid.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011233196 | 2011-10-24 | ||
| JP2011-233196 | 2011-10-24 | ||
| PCT/JP2012/072878 WO2013061695A1 (en) | 2011-10-24 | 2012-09-07 | Water-soluble cutting fluid for fixed abrasive grain wire saw, cutting method using same, and recycling method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103597585A CN103597585A (en) | 2014-02-19 |
| CN103597585B true CN103597585B (en) | 2016-10-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280029282.7A Expired - Fee Related CN103597585B (en) | 2011-10-24 | 2012-09-07 | Fixing abrasive grains scroll saw water solublity cutting liquid, the cutting method using it and recovery method thereof |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5207498B1 (en) |
| KR (1) | KR101506027B1 (en) |
| CN (1) | CN103597585B (en) |
| MY (1) | MY156441A (en) |
| TW (1) | TW201317335A (en) |
| WO (1) | WO2013061695A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105121614B (en) * | 2013-04-05 | 2020-04-17 | 帕莱斯化学株式会社 | Water-soluble cutting fluid for fixed abrasive wire saw, method for cutting ingot using same, and substrate for electronic material obtained therefrom |
| TWI640619B (en) * | 2015-02-10 | 2018-11-11 | 達興材料股份有限公司 | An additive for an aqueous cutting fluid for a cutting process and a manufacturign method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102071090A (en) * | 2009-11-20 | 2011-05-25 | 安集微电子（上海）有限公司 | Wire cutting solution for solar silicon slice |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020035052A1 (en) * | 1996-12-20 | 2002-03-21 | Jean-Luc Joye | Polyalkoxylated terpenic compounds, their process of preparation and their use as defoaming agents |
| JP4497767B2 (en) | 2001-09-06 | 2010-07-07 | ユシロ化学工業株式会社 | Water-soluble machining fluid composition for fixed abrasive wire saw |
| US6784248B2 (en) * | 2002-02-15 | 2004-08-31 | Ppg Industries Ohio, Inc. | Thermosetting compositions containing alternating copolymers of isobutylene type monomers |
| JP2007134371A (en) * | 2005-11-08 | 2007-05-31 | Nikka Seiko Kk | Method and apparatus for forming reference surface of wafer |
| JP5408639B2 (en) * | 2007-05-25 | 2014-02-05 | 大同化学工業株式会社 | Working fluid composition for hydrous slicing |
| KR101718988B1 (en) * | 2008-04-30 | 2017-03-22 | 팰리스 카가쿠 가부시기가이샤 | Water-soluble cutting fluid composition, water-soluble cutting fluid, and method of cutting with the water-soluble cutting fluid |
| JP5332914B2 (en) * | 2009-05-29 | 2013-11-06 | 信越半導体株式会社 | Cutting method of silicon ingot |
| JP2011005561A (en) * | 2009-06-23 | 2011-01-13 | Shin Etsu Handotai Co Ltd | Method and system for cutting silicon ingot |
| WO2011058929A1 (en) * | 2009-11-12 | 2011-05-19 | パレス化学株式会社 | Water-soluble cutting solution for fixed abrasive wire saw, method for cutting ingot using same, method for recycling the solution, and wafer produced by cutting |
-
2012
- 2012-09-07 JP JP2012553104A patent/JP5207498B1/en not_active Expired - Fee Related
- 2012-09-07 WO PCT/JP2012/072878 patent/WO2013061695A1/en active Application Filing
- 2012-09-07 MY MYPI2013702098A patent/MY156441A/en unknown
- 2012-09-07 KR KR1020137030403A patent/KR101506027B1/en not_active IP Right Cessation
- 2012-09-07 CN CN201280029282.7A patent/CN103597585B/en not_active Expired - Fee Related
- 2012-09-17 TW TW101133952A patent/TW201317335A/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102071090A (en) * | 2009-11-20 | 2011-05-25 | 安集微电子（上海）有限公司 | Wire cutting solution for solar silicon slice |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103597585A (en) | 2014-02-19 |
| JP5207498B1 (en) | 2013-06-12 |
| WO2013061695A1 (en) | 2013-05-02 |
| KR101506027B1 (en) | 2015-03-25 |
| KR20130141702A (en) | 2013-12-26 |
| TW201317335A (en) | 2013-05-01 |
| JPWO2013061695A1 (en) | 2015-04-02 |
| MY156441A (en) | 2016-02-26 |
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