CN106118840A - A kind of diamond linear cutting fluid, its preparation method and using method - Google Patents

A kind of diamond linear cutting fluid, its preparation method and using method Download PDF

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Publication number
CN106118840A
CN106118840A CN201610472167.7A CN201610472167A CN106118840A CN 106118840 A CN106118840 A CN 106118840A CN 201610472167 A CN201610472167 A CN 201610472167A CN 106118840 A CN106118840 A CN 106118840A
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Prior art keywords
cutting fluid
linear cutting
diamond
cutting
polyether
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CN201610472167.7A
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Inventor
叶俊
邓舜
郭海江
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Shanghai Han Yao Novel Material Science And Technology Ltd
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Shanghai Han Yao Novel Material Science And Technology Ltd
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Priority to CN201610472167.7A priority Critical patent/CN106118840A/en
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    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00Lubricating compositions containing more than 10% water
    • C10M173/02Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M169/00Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
    • C10M169/04Mixtures of base-materials and additives
    • C10M169/044Mixtures of base-materials and additives the additives being a mixture of non-macromolecular and macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/10Carboxylix acids; Neutral salts thereof
    • C10M2207/12Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M2207/125Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of eight up to twenty-nine carbon atoms, i.e. fatty acids
    • C10M2207/126Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of eight up to twenty-nine carbon atoms, i.e. fatty acids monocarboxylic
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/104Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10NINDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/04Detergent property or dispersant property
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10NINDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/18Anti-foaming property
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10NINDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/64Environmental friendly compositions

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Lubricants (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The invention discloses a kind of diamond linear cutting fluid, its preparation method and using method, use trans block polyether, amino-polyether and polyvalent alcohol are raw material, enhance the defoaming capacity of cutting liquid, dispersibility and cleansing power, avoid the defects such as the later process making herbs into wool white macula white point that silica flour is reunited or the line clogging that causes of deposition and cutting liquid residual cause, simultaneously because cutting liquid is mainly made up of polyethers, excellent lubrication is just possessed under low concentration, cooling and antifoam performance, greatly reduce the COD discharge in cutting waste liquor, simultaneously because without organic silicon defoamer, make cutting waste liquor more disposable.The present invention is applicable to during diamond wire saw use, especially cutting solar energy crystal silicon chip.

Description

A kind of diamond linear cutting fluid, its preparation method and using method
Technical field
The present invention relates to a kind of cutting liquid, be specifically related to a kind of diamond linear cutting fluid, its preparation method and using method.
Background technology
In crystal silicon solar energy battery production process, diamond wire saw owing to having efficiently, low cost, the advantage such as environmental protection Rise abruptly in silicon chip cutting industry;Diamond wire saw is to utilize plating or resin bonded method to be attached to by diamond abrasive Steel wire surface, directly acts on silicon rod by diamond wire or silicon ingot surface produces grinding, thus reaches the effect of cutting, therefore should The mortar spray that process mixes with cutting liquid relative to traditional mortar cutting technique-utilize cutting blade material carborundum falls at cutting of steel On the gauze of silk composition, the silicon carbide press in mortar is made to embed the silicon rod i.e. silicon ingot table being pressed on gauze by high-speed motion Face, forms Three-body Abrasive Wear thus produces dissection, have faster cutting speed and efficiency, but cutting simultaneously can produce Bigger heat and abrasion, therefore cutting liquid must have preferably lubrication and cooling performance;Simultaneously because cutting process produces Raw substantial amounts of silica flour enters in cutting liquid, and cutting liquid viscosity constantly increases, and can produce a large amount of gas during cutting liquid circulating cooling Bubble, the silica flour that therefore cutting liquid also needs to producing has the strongest dispersibility and froth breaking suds ability;In addition in order to ensure The silicon chip of cutting can well be applicable to lower road making herbs into wool operation, and cutting liquid must also have good cleansing power, in case cutting Liquid residual causes the defects such as making herbs into wool white macula white point.
At present, the diamond linear cutting fluid used both at home and abroad mostly is oils and fats or common polyether super fatting agent is equipped with a certain amount of Organic silicon defoamer forms, although this kind of cutting liquid can play certain lubrication defoaming effect, but due to organosilicon and oils and fats all Easily adsorb silicon chip surface and cause difficult and follow-up making herbs into wool white macula problem of cleaning, simultaneously because organosilicon is not easily decomposed follow-up Cutting waste liquor process also result in difficulty;Therefore silicon chip cutting process often brings new problem.
Therefore, a kind of easy cleaning of research, and reduce the cutting liquid that waste liquid produces, have great importance.
Summary of the invention
The technical problem to be solved in the present invention, is to provide a kind of diamond linear cutting fluid, its preparation method and using method, Using trans block polyether, amino-polyether and polyvalent alcohol is raw material, enhances the defoaming capacity of cutting liquid, dispersibility and clear Wash ability, it is to avoid silica flour is reunited or deposition causes line clogging and cutting liquid remain the later process making herbs into wool white macula caused The defects such as white point, simultaneously because cutting liquid is mainly made up of polyethers, just possesses excellent lubrication under low concentration, cool down and disappear Bubble performance, greatly reduces the COD discharge in cutting waste liquor, simultaneously because make cutting waste liquor easily locate without organic silicon defoamer Reason.
For solving above-mentioned technical problem, the technical solution used in the present invention is:
A kind of diamond linear cutting fluid, including the raw material of following percentage by weight:
Trans block polyether 20~40%, amino-polyether 20~40%, polyvalent alcohol 1~10%,
Organic acid 1~5%, water surplus.
As a kind of restriction of the present invention, the molecular weight of described trans block polyether is 1000~2000.
As the further restriction of above-mentioned restriction, described trans block polyether is by epoxy butane and ethylene oxide polymerization Become.
As the further restriction of above-mentioned restriction, described trans block polyether is water soluble polyether, and wherein concentration is When 10%, cloud point is 25~40 DEG C.
As the another kind of restriction of the present invention, described amino-polyether is amine terminated polyether, and molecular structural formula is NH2- [PO-EO]N-H, wherein N=10~40, EO is oxirane, and PO is expoxy propane.
The third as the present invention limits, and the molecular weight of described polyvalent alcohol is 3000~5000.
As the further restriction of above-mentioned restriction, described polyvalent alcohol is Polyethylene Glycol, polypropylene glycol or polytetramethylene glycol In one.
As the 4th kind of restriction of the present invention, described organic acid is the one in caprylic acid, different n-nonanoic acid or capric acid.
Present invention also offers the method preparing above-mentioned diamond linear cutting fluid, it is carried out according to following steps order:
1) raw material is got the raw materials ready;
2) at ambient temperature, trans block polyether, amino-polyether, polyvalent alcohol are added to water according to percentage by weight In, stir, add organic acid afterwards and proceed stirring, finally regulating to pH is 7.0~7.1, finally prepares diamond Wire cutting liquid.
Present invention also offers the ratio of the method using above-mentioned diamond linear cutting fluid, this diamond linear cutting fluid and water For 1:400~500.
Owing to have employed above-mentioned technical scheme, compared with prior art, acquired technological progress is the present invention:
The present invention uses trans block polyether, amino-polyether and polyvalent alcohol to be raw material, enhances the froth breaking energy of cutting liquid Power, dispersibility and cleansing power, it is to avoid silica flour is reunited or deposition causes line clogging and cutting liquid residual cause The defects such as later process making herbs into wool white macula white point.Simultaneously because cutting liquid is mainly made up of polyethers and does not contains organic silicon defoamer, greatly Reduce greatly the COD discharge in cutting waste liquor so that cutting waste liquor is disposable.The environment-friendly high-efficiency diamond wire saw of the present invention Liquid, is satisfied by requirement, total yield rate > 98% for silicon wafer thickness, TTV, WARP of diamond wire saw.
The present invention is applicable to during diamond wire saw use, especially cutting solar energy crystal silicon chip.
The present invention is described in further detail below in conjunction with specific embodiment.
Detailed description of the invention
1 one kinds of diamond linear cutting fluids of embodiment, its preparation method and using method
A kind of diamond linear cutting fluid, the diamond cut liquid of preparation 1000g, the raw material including following weight forms:
Trans block polyether 300g, amine terminated polyether 270g, Polyethylene Glycol 30g, caprylic acid 40g,
Water 360g.
Wherein, the molecular weight of trans block polyether is 1500, epoxy butane and ethylene oxide polymerization form, its cloud point (10%) it is the water soluble polyether of 33 DEG C.
Wherein, the molecular structural formula of described amine terminated polyether is NH2-[PO-EO]N-H, wherein N=20, EO is epoxy second Alkane, PO is expoxy propane.
Wherein, the molecular weight of Polyethylene Glycol is 3000.
The method preparing above-mentioned diamond linear cutting fluid, is carried out according to following steps order:
1) raw material is got the raw materials ready;
2) at ambient temperature, trans block polyether, amino-polyether, polyvalent alcohol are added to water according to percentage by weight In, stirring, add organic acid afterwards and proceed stirring, final regulation is 7.05 to pH, and the final diamond wire for preparing is cut Cut liquid.
Present invention also offers the ratio of the method using above-mentioned diamond linear cutting fluid, this diamond linear cutting fluid and water For 1:400.Diamond wire wire cutting liquid obtained by the present embodiment, just possess when low concentration (0.25%) excellent lubrication, Cooling and antifoam performance, simultaneously because the materials self such as the trans block polyether, amino-polyether and the polyvalent alcohol that use possess excellent Different defoaming capacity, dispersibility and cleansing power, therefore need not in cutting process additionally add defoamer, simultaneously to cutting During the silica flour that produces have a preferable dispersibility, it is to avoid silica flour is reunited or deposition causes line clogging and cutting liquid The defects such as the later process making herbs into wool white macula white point that residual causes;Additionally due to cutting liquid addition dilution ratio height cutting waste liquor COD is also substantially reduced, simultaneously because containing only polyethers Organic substance without the difficult material of silicone in waste liquid, therefore give up Liquid processes simple, embodies environmental protection characteristic.The silicon wafer thickness of cutting, TTV, WARP are satisfied by requirement, total yield rate > 98%
Embodiment 2-6 diamond linear cutting fluid, its preparation method and using method
Embodiment 2-6 is respectively in a kind of diamond linear cutting fluid, its preparation method and using method, with embodiment 1 Preparation method is similar with using method, is preparation 1000g diamond linear cutting fluid, the difference is that only the use of wherein raw material Technical parameter involved in amount, preparation method and using method is different, shown in table specific as follows:
Embodiment 2-6 is similar to the effect reached in embodiment 1.
The above, be only presently preferred embodiments of the present invention, is not the restriction that the present invention makees other form, appoints What those skilled in the art is changed possibly also with above-mentioned technology contents as enlightenment or is modified as equivalent variations Equivalent embodiments.But every without departing from technical solution of the present invention content, the technical spirit of the foundation present invention is to above example Done simple modification, equivalent variations and remodeling, still fall within the protection domain of the claims in the present invention.

Claims (10)

1. a diamond linear cutting fluid, it is characterised in that it includes the raw material of following percentage by weight:
Trans block polyether 20~40%, amino-polyether 20~40%, polyvalent alcohol 1~10%,
Organic acid 1~5%, water surplus.
A kind of diamond linear cutting fluid the most according to claim 1, it is characterised in that: dividing of described trans block polyether Son amount is 1000~2000.
A kind of diamond linear cutting fluid the most according to claim 2, it is characterised in that: described trans block polyether is by ring Oxygen butane and ethylene oxide polymerization form.
A kind of diamond linear cutting fluid the most according to claim 3, it is characterised in that: described trans block polyether is water Dissolubility polyethers, cloud point during its 10% concentration is 25~40 DEG C.
A kind of diamond linear cutting fluid the most according to claim 1, it is characterised in that: described amino-polyether is Amino End Group Polyethers, molecular structural formula is NH2-[PO-EO]N-H, wherein N=10~40, EO is oxirane, and PO is expoxy propane.
A kind of diamond linear cutting fluid the most according to claim 1, it is characterised in that: the molecular weight of described polyvalent alcohol It is 3000~5000.
A kind of diamond linear cutting fluid the most according to claim 6, it is characterised in that: described polyvalent alcohol is poly-second two One in alcohol, polypropylene glycol or polytetramethylene glycol.
A kind of diamond linear cutting fluid the most according to claim 1, it is characterised in that: described organic acid be caprylic acid, One in different n-nonanoic acid or capric acid.
9. the method for a kind of diamond linear cutting fluid prepared as according to any one of claim 1~8, it is characterised in that It is carried out according to following steps order:
1) raw material is got the raw materials ready;
2) at ambient temperature, trans block polyether, amino-polyether, polyvalent alcohol are added in water according to percentage by weight, Stirring, add organic acid afterwards and proceed stirring, final regulation is 7.0~7.1 to pH, and the final diamond wire for preparing is cut Cut liquid.
10. a method for the use a kind of diamond linear cutting fluid as according to any one of claim 1~8, its feature exists In: this diamond linear cutting fluid is 1:400~500 with the ratio of water.
CN201610472167.7A 2016-06-24 2016-06-24 A kind of diamond linear cutting fluid, its preparation method and using method Pending CN106118840A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108424523A (en) * 2018-05-08 2018-08-21 四会市格鲁森润滑技术有限公司 A kind of microwave catalysis self-defoaming type copolyether lubricant and its manufacturing method
CN109022115A (en) * 2017-06-12 2018-12-18 天津工业大学 A kind of silicon crystal multi-wire saw water-base cutting fluid
CN111593412A (en) * 2020-05-25 2020-08-28 常州时创能源股份有限公司 Additive for chain type texture surface making of monocrystalline silicon piece and application thereof
CN112779079A (en) * 2021-02-09 2021-05-11 常州时创能源股份有限公司 Crystalline silicon cutting fluid and preparation method and application thereof
CN113667529A (en) * 2021-08-19 2021-11-19 江苏美科太阳能科技有限公司 Cooling liquid for large-size solar-grade silicon wafer diamond wire cutting

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CN102851108A (en) * 2012-08-03 2013-01-02 江西赛维Ldk太阳能高科技有限公司 Diamond wire cutting fluid and preparation method thereof
CN104450132A (en) * 2014-10-31 2015-03-25 江南大学 Special line-cutting fluid for diamond and preparation method of line-cutting fluid
CN104673472A (en) * 2013-11-28 2015-06-03 深圳市富兰克科技有限公司 Silicon crystal cutting fluid

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CN102851108A (en) * 2012-08-03 2013-01-02 江西赛维Ldk太阳能高科技有限公司 Diamond wire cutting fluid and preparation method thereof
CN104673472A (en) * 2013-11-28 2015-06-03 深圳市富兰克科技有限公司 Silicon crystal cutting fluid
CN104450132A (en) * 2014-10-31 2015-03-25 江南大学 Special line-cutting fluid for diamond and preparation method of line-cutting fluid

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109022115A (en) * 2017-06-12 2018-12-18 天津工业大学 A kind of silicon crystal multi-wire saw water-base cutting fluid
CN108424523A (en) * 2018-05-08 2018-08-21 四会市格鲁森润滑技术有限公司 A kind of microwave catalysis self-defoaming type copolyether lubricant and its manufacturing method
CN111593412A (en) * 2020-05-25 2020-08-28 常州时创能源股份有限公司 Additive for chain type texture surface making of monocrystalline silicon piece and application thereof
CN111593412B (en) * 2020-05-25 2021-03-30 常州时创能源股份有限公司 Additive for chain type texture surface making of monocrystalline silicon piece and application thereof
CN112779079A (en) * 2021-02-09 2021-05-11 常州时创能源股份有限公司 Crystalline silicon cutting fluid and preparation method and application thereof
CN112779079B (en) * 2021-02-09 2022-04-01 常州时创能源股份有限公司 Crystalline silicon cutting fluid and preparation method and application thereof
CN113667529A (en) * 2021-08-19 2021-11-19 江苏美科太阳能科技有限公司 Cooling liquid for large-size solar-grade silicon wafer diamond wire cutting
CN113667529B (en) * 2021-08-19 2023-02-24 江苏美科太阳能科技股份有限公司 Cooling liquid for large-size solar-grade silicon wafer diamond wire cutting

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