KR20130141702A - Water-soluble cutting fluid for fixed abrasive grain wire saw, cutting method using same, and recycling method therefor - Google Patents

Water-soluble cutting fluid for fixed abrasive grain wire saw, cutting method using same, and recycling method therefor Download PDF

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KR20130141702A
KR20130141702A KR1020137030403A KR20137030403A KR20130141702A KR 20130141702 A KR20130141702 A KR 20130141702A KR 1020137030403 A KR1020137030403 A KR 1020137030403A KR 20137030403 A KR20137030403 A KR 20137030403A KR 20130141702 A KR20130141702 A KR 20130141702A
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water
fixed abrasive
cutting
abrasive wire
soluble cutting
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KR101506027B1 (en
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키요후미 스즈키
키요토 토시마
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팰리스 카가쿠 가부시기가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives

Abstract

본 발명은 발포가 적고, 절단 성능이 높은 고정 지립 와이어 톱용 수용성 절단액, 그것을 이용한 절단 방법 및 그 리사이클 방법을 제공하는 것을 과제로 한다. 이 과제를 해결하기 위하여 본 발명에 의하면, (a) 터펜-알킬렌 옥사이드 블록 공중합체와, (b) 글라이콜, 폴리알킬렌 글라이콜, 글라이콜 에터 및 폴리알킬렌 글라이콜 에터 중 적어도 1종과, (c) 물을 포함하는 것을 특징으로 하는 고정 지립 와이어 톱용 수용성 절단액이 제공된다. 또한, 상기 고정 지립 와이어 톱용 수용성 절단액을 이용해서, 고정 지립 와이어 톱에 의해 실리콘의 잉곳을 절단하는 것을 특징으로 하는 잉곳의 절단 방법 및 고정 지립 와이어 톱용 수용성 절단액의 리사이클 방법이 제공된다.An object of this invention is to provide the water-soluble cutting liquid for fixed abrasive wire saws with little foaming, and high cutting performance, the cutting method using the same, and its recycling method. In order to solve this problem, according to the present invention, (a) terpene-alkylene oxide block copolymer and (b) glycol, polyalkylene glycol, glycol ether and polyalkylene glycol ether The water-soluble cutting liquid for fixed abrasive wire saws provided with at least 1 sort (s) and (c) water is provided. Moreover, the ingot cutting method and the recycling method of the water-soluble cutting liquid for fixed abrasive wire saws which cut the silicon ingot with a fixed abrasive wire saw using the said water-soluble cutting liquid for fixed abrasive wire saws are provided.

Description

고정 지립 와이어 톱용 수용성 절단액, 그것을 이용한 절단 방법 및 그 리사이클 방법{WATER-SOLUBLE CUTTING FLUID FOR FIXED ABRASIVE GRAIN WIRE SAW, CUTTING METHOD USING SAME, AND RECYCLING METHOD THEREFOR}WATER-SOLUBLE CUTTING FLUID FOR FIXED ABRASIVE GRAIN WIRE SAW, CUTTING METHOD USING SAME, AND RECYCLING METHOD THEREFOR}

본 발명은, 고정 지립 와이어 톱(fixed-abrasive-grain wire saw)을 이용해서 실리콘 잉곳(ingot)을 절단하기 위하여 이용되는 고정 지립 와이어 톱용 수용성 절단액, 그것을 이용한 절단 방법 및 그 리사이클 방법에 관한 것이다.The present invention relates to a water-soluble cutting liquid for a fixed abrasive wire saw used for cutting a silicon ingot using a fixed-abrasive-grain wire saw, a cutting method using the same, and a recycling method thereof. .

종래부터, 실리콘의 절단에는, 유리(free) 지립을 이용한 띠 톱이나 와이어 톱에 의한 절단이 사용되고 있다. 유리 지립을 이용한 띠 톱이나 와이어 톱에 의한 절단은, 절단된 웨이퍼에 슬러리가 부착되어, 후속 공정에서의 세정 부하가 높고, 또한, 사용액으로부터 유리 지립, 슬러지, 절단액을 분리하는 것이 어려워, 리사이클성이 나쁘다고 하는 문제가 있다.Conventionally, the cutting | disconnection by the band saw and the wire saw which used free abrasive grains is used for the cutting | disconnection of silicon | silicone. In the cutting by a band saw or a wire saw using glass abrasive grains, the slurry adheres to the cut wafer, and the cleaning load in the subsequent step is high, and it is difficult to separate the glass abrasive grains, sludge, and cutting liquid from the used liquid, and recycling is performed. There is a problem that sex is bad.

이들 문제에 대해서, 와이어에 전착이나 레진 본딩을 이용해서 지립을 고정시킨 고정 와이어 톱이 개발되어, 세정 공정의 간소화나 절단액과 슬러지를 분리시킴으로써 리사이클성이 향상된다고 하는 이점을 지닌다. 이 고정 와이어 톱을 이용해서 실리콘을 절단할 때에 사용되는 절단액으로서, 물이나 특허문헌 1 내지 3과 같은 수용성 절단액이 제안되어 있다.In response to these problems, a fixed wire saw having fixed abrasive grains by electrodeposition or resin bonding to a wire has been developed, which has the advantage that the recycling property is improved by simplifying the cleaning process and separating the cutting fluid and the sludge. As a cutting liquid used when cut | disconnecting silicon using this fixed wire saw, water and water-soluble cutting liquids like patent documents 1-3 are proposed.

JPJP 2003-823342003-82334 AA JPJP 2009-574232009-57423 AA WO2011/058929 AWO2011 / 058929 A

그러나, 이들 수용성 절단액을 이용해서 실리콘을 절단할 경우, 최근, 품질면 및 절단 속도 향상을 위하여, 와이어 속도가 빨라지고 있으며, 그 결과로서 사용하고 있는 수용성 절단액이 발포되어, 품질이 양호한 웨이퍼를 절단할 수 없다고 하는 문제가 있다. However, when silicon is cut using these water-soluble cutting liquids, in recent years, the wire speed has been increased in order to improve the quality and cutting speed, and as a result, the water-soluble cutting liquid used is foamed, resulting in a wafer of good quality. There is a problem that it cannot be cut.

따라서, 본 발명은, 발포가 적고, 절단 성능이 높은 고정 지립 와이어 톱용 수용성 절단액, 그것을 이용한 절단 방법 및 그 리사이클 방법을 제공하는 것이다.Therefore, this invention provides the water-soluble cutting liquid for fixed abrasive wire saws with little foaming, and high cutting performance, the cutting method using the same, and its recycling method.

이상의 목적을 달성하기 위하여, 본 발명자들은, 예의 연구를 거듭한 결과, (a) 터펜-알킬렌 옥사이드 블록 공중합체와, (b) 글라이콜, 폴리알킬렌 글라이콜, 글라이콜 에터 및 폴리알킬렌 글라이콜 에터 중 적어도 1종과, (c) 물을 포함시킨 수용성 절단액을 이용함으로써, 고정 지립 와이어 톱에 이용할 경우더라도, 발포가 적고, 절단 성능이 높은 것을 발견하였다. 즉, 본 발명은, (a) 터펜-알킬렌 옥사이드 블록 공중합체와, (b) 글라이콜, 폴리알킬렌 글라이콜, 글라이콜 에터 및 폴리알킬렌 글라이콜 에터 중 적어도 1종과, (c) 물을 포함하는 것을 특징으로 하는 고정 지립 와이어 톱용 수용성 절단액이다.In order to achieve the above object, the present inventors, after earnest research, (a) terpene-alkylene oxide block copolymer, (b) glycol, polyalkylene glycol, glycol ether, By using at least 1 type of polyalkylene glycol ether and the water-soluble cutting liquid containing (c) water, even if it used for a fixed abrasive wire saw, it discovered that foaming was few and high cutting performance was high. That is, the present invention provides a composition comprising: (a) a terpene-alkylene oxide block copolymer, (b) at least one of glycol, polyalkylene glycol, glycol ether, and polyalkylene glycol ether; and (c) water. A water-soluble cutting liquid for a fixed abrasive wire saw.

또, 본 발명은, 상기 고정 지립 와이어 톱용 수용성 절단액을 이용해서, 고정 지립 와이어 톱에 의해 실리콘의 잉곳을 절단하는 것을 특징으로 하는 잉곳의 절단 방법, 및 그 잉곳 절단 방법에 의해서 잉곳의 절단을 행한 후에, 원심분리기나 여과장치를 이용해서 고정 지립 와이어 톱용 수용성 절단액을 실리콘으로부터 분리시키는 것을 특징으로 하는 고정 지립 와이어 톱용 수용성 절단액의 리사이클 방법이다.Moreover, this invention cut | disconnects an ingot by the ingot cutting method characterized by cutting the ingot of silicon with a fixed abrasive wire saw using the said water-soluble cutting liquid for fixed abrasive wire saws, and the ingot cutting method. After performing, the water-soluble cutting liquid for fixed abrasive wire saws is isolate | separated from silicone using a centrifugal separator or a filtration apparatus.

이상과 같이 , 본 발명에 따르면, 발포가 적고, 절단 성능이 높은 고정 지립 와이어 톱용 수용성 절단액, 그것을 이용한 절단 방법 및 그 리사이클 방법을 제공할 수 있다.As mentioned above, according to this invention, the water-soluble cutting liquid for fixed abrasive wire saws with little foaming and high cutting performance, the cutting method using the same, and its recycling method can be provided.

본 발명에 따른 고정 지립 와이어 톱용 수용성 절단액에 이용되는 (ａ) 터펜-알킬렌 옥사이드 블록 공중합체는, 아이소프렌을 구성 단위로 하는 탄화수소인 모노터펜(탄소수 10), 세스퀴터펜(탄소수 15), 다이터펜(탄소수 20), 세스터터펜(탄소수 25), 트라이터펜(탄소수 30) 및 테트라터펜(탄소수 40)에 에틸렌 옥사이드, 프로필렌 옥사이드 및 뷰틸렌 옥사이드 중 적어도 1종을 공중합시킨 것이다. 그 중에서도 특히, 에틸렌 옥사이드와 프로필렌 옥사이드를 공중합시킨 것이 바람직하며, 그 비율은, 상기 터펜 1몰에 대해서, 각각, 에틸렌 옥사이드가 3 내지 30몰, 프로필렌 옥사이드가 3 내지 20몰이 바람직하다.(A) Terpene-alkylene oxide block copolymer used for the water-soluble cutting liquid for fixed abrasive wire saws which concerns on this invention is a monoterpene (C10) and sesquiterpene (C15) which are hydrocarbons which use isoprene as a structural unit. At least one of ethylene oxide, propylene oxide and butylene oxide is copolymerized with a diterpene (20 carbon atoms), a sesterterpene (25 carbon atoms), a triterpene (30 carbon atoms) and a tetraterpene (40 carbon atoms). Especially, it is preferable to copolymerize ethylene oxide and propylene oxide especially, and the ratio is preferably 3-30 mol of ethylene oxide and 3-20 mol of propylene oxide with respect to 1 mol of said terpenes, respectively.

또, (a)의 첨가량으로서는, 절단액 전체에 대해서 0.01 내지 5.0중량%가 바람직하다. (a)의 첨가량이, 0.01중량% 미만에서는, 소포(消泡)효과가 없고, 또한, 절단 중에 발생하는 절단 지스러기를 분산 세정하는 효과가 없기 때문에 바람직하지 못하다. 또한, 5.0중량%를 초과해도, 5.0중량% 이하인 경우와 소포 효과 및 절단 중에 발생하는 절단 지스러기를 분산 세정하는 효과에 차이가 없으며, 5.0중량% 이하에서 충분한 소포 효과 및 절단 중에 발생하는 절단 지스러기를 분산 세정하는 효과가 얻어지므로, 비용 경감의 관점에서 5.0중량% 이하가 바람직하다.Moreover, as addition amount of (a), 0.01-5.0 weight% is preferable with respect to the whole cutting liquid. If the addition amount of (a) is less than 0.01% by weight, it is not preferable because there is no defoaming effect and there is no effect of dispersing and cleaning the cutting chips generated during cutting. Moreover, even if it exceeds 5.0 weight%, there is no difference in the defoaming effect and the effect of disperse | distributing and cleaning the cutting debris which generate | occur | produces during cutting, at 5.0 weight% or less, sufficient defoaming effect and the cutting debris which generate | occur | produces during cutting Since the effect of dispersion washing is obtained, 5.0 weight% or less is preferable from a cost reduction viewpoint.

종래, 고정 지립 와이어 톱용 수용성 절단액의 소포제로서 실리콘계의 소포제가 사용되고 있지만, 실리콘계 소포제는, 액 안정성이 나빠, 불균일한 액으로 되기 쉬운 경향이 있다. 그러나, 본 발명에 있어서는, (a) 터펜-알킬렌 옥사이드 블록 공중합체를 이용함으로써, 실리콘계의 소포제를 사용하지 않아도, 소포 효과 및 절단 중에 발생하는 절단 지스러기를 분산 세정하는 효과가 향상되어, 절단 성능을 향상시킬 수 있다.Conventionally, although a silicone type antifoamer is used as an antifoamer of the water-soluble cutting liquid for fixed abrasive wire saws, a silicone antifoamer has a bad liquid stability and tends to become a nonuniform liquid. However, in the present invention, by using the (a) terpene-alkylene oxide block copolymer, even without using a silicone-based antifoaming agent, the defoaming effect and the effect of dispersing and cleaning the cutting chips generated during cutting are improved, thereby cutting performance. Can improve.

본 발명에 따른 고정 지립 와이어 톱용 수용성 절단액에 있어서, (b) 글라이콜은, OH기를 2개 지니면 되고, 예를 들어, 모노에틸렌 글라이콜, 다이에틸렌 글라이콜, 트라이에틸렌 글라이콜, 모노프로필렌 글라이콜, 다이프로필렌 글라이콜, 트라이프로필렌 글라이콜 및 헥실렌 글라이콜 등을 들 수 있다. 또, 폴리알킬렌 글라이콜로서는, 예를 들어, 폴리에틸렌 글라이콜, 폴리프로필렌 글라이콜, 폴리옥시에틸렌 폴리옥시프로필렌의 공중합체, 폴리옥시에틸렌 폴리옥시뷰틸렌의 공중합체 등을 들 수 있다. 또한, 글라이콜 에터로서는, 예를 들어, 다이에틸렌 글라이콜 모노메틸에터, 다이에틸렌 글라이콜 모노뷰틸에터 및 다이에틸렌 글라이콜 모노헥실에터 등을 들 수 있다. 또, 폴리옥시에틸렌 글라이콜 에터로서는, 예를 들어, 폴리옥시에틸렌 메틸에터, 폴리옥시에틸렌 폴리옥시프로필렌 글라이콜 공중합체의 뷰틸에터 등을 들 수 있다. 이들은, 1종을 단독으로 이용해도 되고, 2종 이상을 조합시켜서 이용해도 된다. 또한, (b)의 중량평균 분자량은 50 내지 5,000이 바람직하다. (b)의 중량평균 분자량이, 5,000을 초과하면 점도가 높고, 절단 성능에 영향을 미치기 때문이다. 보다 바람직한 (b)의 중량평균 분자량으로서는, 50 내지 1,000이다.In the water-soluble cutting liquid for fixed abrasive wire saws which concerns on this invention, (b) glycol should just have two OH groups, For example, monoethylene glycol, diethylene glycol, triethylene glycol And propylene, monopropylene glycol, dipropylene glycol, tripropylene glycol, hexylene glycol, and the like. Moreover, as polyalkylene glycol, the copolymer of polyethyleneglycol, polypropylene glycol, the polyoxyethylene polyoxypropylene, the copolymer of polyoxyethylene polyoxybutylene, etc. are mentioned, for example. . Moreover, as a glycol ether, a diethylene glycol monomethyl ether, a diethylene glycol monobutyl ether, a diethylene glycol monohexyl ether, etc. are mentioned, for example. Moreover, as polyoxyethylene glycol ether, the polyether ethylene methyl ether, the butyl ether of polyoxyethylene polyoxypropylene glycol copolymer, etc. are mentioned, for example. These may be used individually by 1 type and may be used in combination of 2 or more type. Moreover, as for the weight average molecular weight of (b), 50-5,000 are preferable. When the weight average molecular weight of (b) exceeds 5,000, it is because a viscosity is high and it affects cutting performance. As a weight average molecular weight of more preferable (b), it is 50-1,000.

본 발명에 따른 고정 지립 와이어 톱용 수용성 절단액은, 필요에 따라서 (d) 분산제를 첨가할 수 있다. 사용하는 분산제로서는, 알릴 알코올, 무수 말레산의 공중합체에 폴리옥시알킬렌 모노알킬에터의 그라프트 중합한 폴리카복시산이나 그 염, 알릴 알코올, 무수 말레산, 스타이렌의 공중합체에 폴리옥시알킬렌 모노알킬에터의 그라프트 중합한 폴리카복시산이나 그 염, 나프탈렌설폰산 축합물이나 그 염 등이 있고, 일반적으로 분산제로서 판매되어 있는 것을 사용할 수 있다. (d) 분산제의 함유량은, 절단액 전체에 대해서 0.1 내지 5.0중량%인 것이 바람직하다. 0.1중량% 미만에서는 분산제의 효과가 얻어지지 않으므로 바람직하지 못하다. 또한, 5.0중량%를 초과해도, 5.0중량% 이하와 비교할 때 분산 효과에 변화가 없고, 5.0중량% 이하에서 충분히 분산제의 효과를 얻을 수 있기 때문에, 비용 경감의 관점에서 5.0중량% 이하가 바람직하다. 보다 바람직한 (d)의 함유량은 0.1 내지 1.0중량%가다.The water-soluble cutting liquid for fixed abrasive wire saws which concerns on this invention can add (d) dispersing agent as needed. As a dispersing agent to be used, it is polyoxy to the copolymer of allyl alcohol and the copolymer of maleic anhydride, the polycarboxylic acid graft-polymerized of polyoxyalkylene monoalkyl ether, its salt, allyl alcohol, maleic anhydride, and styrene. Graft-polymerized polycarboxylic acid, its salt, naphthalene sulfonic acid condensate, its salt, etc. of the alkylene monoalkyl ether can be used, and what is generally sold as a dispersing agent can be used. (d) It is preferable that content of a dispersing agent is 0.1 to 5.0 weight% with respect to the whole cutting liquid. If it is less than 0.1 weight%, since the effect of a dispersing agent is not acquired, it is unpreferable. Moreover, even if it exceeds 5.0 weight%, since there is no change in dispersing effect compared with 5.0 weight% or less, and the effect of a dispersing agent can be fully acquired at 5.0 weight% or less, 5.0 weight% or less is preferable from a cost reduction viewpoint. . More preferable content of (d) is 0.1-1.0 weight%.

본 발명에 따른 고정 지립 와이어 톱용 수용성 절단액에 있어서, (a), (b), (c) 및 (d)는 임의의 비율로 포함할 수 있지만, 바람직한 비율은, (a), (b) 및 (d)와 (c)의 중량비로, 99:1 내지 50:50이다. 99:1보다도 (c)가 적다면 절단 중에 발생하는 절단 열에 의해, 절단한 웨이퍼의 품질을 악화시키고, 50:50보다도 (c)가 많다면 절단 중에 발생한 실리콘 지스러기가 절단 웨이퍼에 건조 부착되어, 후속 공정의 세정 공정에서 세정 불량을 일으켜서 문제로 되는 동시에, 수분의 증발에 의한 점도변화가 생긴다. 보다 바람직한 중량비는 90:10 내지 50:50이다.In the water-soluble cutting liquid for fixed abrasive wire saws which concerns on this invention, although (a), (b), (c) and (d) can be included in arbitrary ratios, a preferable ratio is (a), (b) And (d) and (c) in a weight ratio of 99: 1 to 50:50. If (c) is less than 99: 1, the quality of the cut wafer is deteriorated by the cutting heat generated during cutting. If (c) is more than 50:50, the silicon chips generated during cutting are dried and adhered to the cut wafer. In the subsequent cleaning step, the cleaning failure occurs, which causes problems, and at the same time, changes in viscosity due to evaporation of moisture occur. More preferred weight ratio is 90:10 to 50:50.

또, 본 발명에 따른 고정 지립 와이어 톱용 수용성 절단액은, 필요에 따라서, 방청제, 방부제, 향료, 염료 등을 첨가해도 된다.Moreover, the water-soluble cutting liquid for fixed abrasive wire saws which concerns on this invention may add a rust inhibitor, an antiseptic | preservative, a fragrance | flavor, dye, etc. as needed.

본 발명에 따른 고정 지립 와이어 톱용 수용성 절단액은, 반도체 소자나 태양 전지 재료인 실리콘 웨이퍼의 절단에 있어서, 절단 공구로서 고정 지립 와이어 톱을 이용하고, 절단 가공기로서 멀티와이어 톱을 이용할 수 있다.The water-soluble cutting liquid for fixed abrasive wire saws which concerns on this invention can use a multi-wire saw as a cutting machine, using a fixed abrasive wire saw as a cutting tool in cutting | disconnection of the silicon wafer which is a semiconductor element or a solar cell material.

본 발명에 따른 고정 지립 와이어 톱용 수용성 절단액은, 절단한 후, 원심분리기 및 여과 장치를 이용하여, 실리콘과 수용성 절단액을 분리시켜, 리사이클할 수 있다.After cutting | disconnection, the water-soluble cutting liquid for fixed abrasive wire saws which concerns on this invention can be recycled by isolate | separating silicone and a water-soluble cutting liquid using a centrifuge and a filtration apparatus.

실시예Example

다음에, 본 발명에 따른 고정 지립 와이어 톱용 수용성 절단액의 실시예에 대해서 설명하지만, 본 발명은 이것에 의해 한정되는 것은 아니다. 우선, 표 1 또는 표 2의 배합량에 따라서, 이들을 상법에 의해 혼합함으로써, 실시예 1 내지 실시예 7에 따른 고정 지립 와이어 톱용 수용성 절단액, 및 비교예 1 내지 비교예 6에 따른 고정 지립 와이어 톱용 수용성 절단액을 얻었다.Next, although the Example of the water-soluble cutting liquid for fixed abrasive wire saws which concerns on this invention is described, this invention is not limited by this. First, according to the compounding quantity of Table 1 or Table 2, by mixing these by a conventional method, the water-soluble cutting liquid for fixed abrasive wire saws according to Examples 1-7, and for fixed abrasive wire saws according to Comparative Examples 1-6 An aqueous cutting solution was obtained.

Figure pct00001
Figure pct00001

Figure pct00002
Figure pct00002

(발포 시험)(Foaming test)

다음에, 절단 중 발포 혹은 리사이클 중 발포를 상정해서, 실시예 1 내지 실시예 7에 따른 고정 지립 와이어 톱용 수용성 절단액 및 비교예 1 내지 비교예 6에 따른 고정 지립 와이어 톱용 수용성 절단액을 마개부착 100㎖ 메스실린더에 50㎖ 넣고, 마개를 덮은 후, 격렬하게 진탕하고, 그 후의 발포량 및 소포 시간을 확인하였다. 그 결과를 표 3에 나타낸다. 표 3으로부터, 본 발명에 따른 수용성 절단액은 발포가 적어 양호한 것을 알 수 있다.Next, assuming that foaming during cutting or foaming during recycling is carried out, the water-soluble cutting liquid for fixed abrasive wire saws according to Examples 1 to 7 and the water-soluble cutting liquid for fixed abrasive wire saws according to Comparative Examples 1 to 6 are plugged. 50 ml was put in a 100 ml measuring cylinder, the stopper was covered, it was shaken violently, and the foaming amount and defoaming time after that were confirmed. The results are shown in Table 3. From Table 3, it turns out that the water-soluble cutting liquid which concerns on this invention is favorable with little foaming.

Figure pct00003
Figure pct00003

(절단 시험)(Cutting test)

다음에, 실시예 1 내지 실시예 7에 따른 고정 지립 와이어 톱용 수용성 절단액, 및 비교예 1 내지 비교예 6에 따른 고정 지립 와이어 톱용 수용성 절단액을 사용해서, 표 4의 조건에서 절단 시험을 행하여, 절단된 웨이퍼의 단면곡선의 최대 골 높이(PV)를 측정하였다. 결과를 표 5에 나타낸다. 표 5로부터, 본 실시예에 따른 고정 지립 와이어 톱용 수용성 절단액은, 절단 성능이 양호한 것을 알 수 있다.Next, using the water-soluble cutting liquid for fixed abrasive wire saws according to Examples 1-7, and the water-soluble cutting liquid for fixed abrasive wire saws according to Comparative Examples 1 to 6, a cutting test was performed on the conditions of Table 4, The maximum bone height (PV) of the cross-sectional curve of the cut wafer was measured. The results are shown in Table 5. From Table 5, it turns out that the water-soluble cutting liquid for fixed abrasive wire saws which concerns on a present Example has favorable cutting performance.

Figure pct00004
Figure pct00004

Figure pct00005
Figure pct00005

Claims (6)

(a) 터펜-알킬렌 옥사이드 블록 공중합체; (b) 글라이콜, 폴리알킬렌 글라이콜, 글라이콜 에터 및 폴리알킬렌 글라이콜 에터 중 적어도 1종; 및 (c) 물을 포함하는 것을 특징으로 하는 고정 지립 와이어 톱(fixed-abrasive-grain wire saw)용 수용성 절단액.(a) terpene-alkylene oxide block copolymers; (b) at least one of glycol, polyalkylene glycol, glycol ether, and polyalkylene glycol ether; And (c) water-soluble cutting fluid for a fixed-abrasive-grain wire saw. 제1항에 있어서, 상기 (a)는 절단액 전체에 대해서 0.01 내지 5.0중량%인 것을 특징으로 하는 고정 지립 와이어 톱용 수용성 절단액.The water-soluble cutting liquid for fixed abrasive wire saws of Claim 1 whose said (a) is 0.01 to 5.0 weight% with respect to the whole cutting liquid. 제1항 또는 제2항에 있어서, 상기 (b)의 중량평균 분자량이 50 내지 5,000인 것을 특징으로 하는 고정 지립 와이어 톱용 수용성 절단액.The water-soluble cutting liquid for fixed abrasive wire saws of Claim 1 or 2 whose weight average molecular weights of said (b) are 50-5,000. 제1항 내지 제3항 중 어느 한 항에 있어서, (d) 분산제를 0.1 내지 5.0중량% 더 포함하는 것을 특징으로 하는 고정 지립 와이어 톱용 수용성 절단액.The water-soluble cutting liquid for fixed abrasive wire saws in any one of Claims 1-3 which further contains 0.1-5.0 weight% of (d) dispersing agents. 제1항 내지 제4항 중 어느 한 항에 기재된 고정 지립 와이어 톱용 수용성 절단액을 이용해서, 고정 지립 와이어 톱에 의해 실리콘의 잉곳을 절단하는 것을 특징으로 하는 잉곳의 절단 방법.The ingot of silicon | silicone is cut | disconnected with a fixed abrasive wire saw using the water-soluble cutting liquid for fixed abrasive wire saws in any one of Claims 1-4. 제5항에 기재된 잉곳 절단 방법에 의해서 잉곳의 절단을 행한 후에, 원심분리기를 이용해서 고정 지립 와이어 톱용 수용성 절단액을 실리콘으로부터 분리시키는 것을 특징으로 하는 고정 지립 와이어 톱용 수용성 절단액의 리사이클 방법.After cutting an ingot by the ingot cutting method of Claim 5, the water-soluble cutting liquid for fixed abrasive wire saws is isolate | separated from silicone using a centrifugal separator, The recycling method of the water-soluble cutting liquid for fixed abrasive wire saws characterized by the above-mentioned.
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CN103597585B (en) 2016-10-19
MY156441A (en) 2016-02-26

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