CN103594541A - 用于太阳能电池的多晶硅/单晶硅异质结结构及其制备方法 - Google Patents
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Abstract
本发明提供了一种用于太阳能电池的多晶硅/单晶硅异质结结构及其制备方法。其结构为单晶硅片上一层掺杂类型相反的多晶硅薄膜作为发射极。多晶硅薄膜的结构及厚度、掺杂浓度分布均是可调的。其制备方法是:先低温气相沉积法沉积一层掺杂非晶或微晶硅薄膜,然后快速热处理晶化。本发明可获得更灵活的晶硅太阳能电池pn结结构和制备方法,为进一步改善晶硅太阳能电池器件结构和工艺,提高其转换效率提供了空间。
Description
技术领域
本发明涉及一种太阳能电池材料的结构及制备方法,尤其涉及一种用于太阳能电池的多晶硅/单晶硅异质结结构及其制备方法。
背景技术
太阳能发电是人类最重要的可再生清洁能源的利用方式之一。其中晶硅太阳能电池以其丰富的原材料来源及相对成熟的制备技术受到人们的广泛关注,是太阳能电池的主流产品类别。
晶硅太阳能电池是目前太阳能光伏发电产品的主流类别,其结构根据光电转换核心-pn结的构成材料异同分为同质结结构和异质结结构。同质结结构是目前市场上的主流。现在同质结晶硅电池的pn结结构及制备工艺大概如下所述:晶硅片为p型,采用磷元素扩散及后继工艺-去磷硅玻璃制成,扩散层深度约200~300 nm。时至今日,该技术的发展遇到了瓶颈-无法进行更薄厚度的扩散层制备,且形成的扩散层掺杂浓度分布极不均匀。异质结结构晶硅太阳能电池正处于发展阶段,其典型代表为日本松下公司的HIT结构及制备工艺。该结构的太阳能电池的可适应大批量生产的面积的电池片的最高效率已经达到了24.7%。其问题在于工艺要求高,不宜掌握,至今未能打破常规扩散太阳能电池的垄断地位。
开发新的器件结构及制备工艺,打破现在器件结构及制造技术的瓶颈,才能使晶硅太阳能电池的性能进一步提高,产品成本进一步下降,加速太阳能电池的普及运用。
发明内容
本发明的目的在于提供一种用于太阳能电池的多晶硅/单晶硅异质结结构及其制备方法,以突破现有工艺对晶硅太阳能电池器件结构改进和工艺调节范围的限制,提高太阳能电池的性能,降低其制备难度,节约生产成本,最终获得更高转换效率的太阳能电池。
为了实现上述目的,本发明采用了下述技术方案。
一种用于太阳能电池的多晶硅/单晶硅异质结结构,其特征是单晶硅片作为基极和光吸收层,在其迎光面上是制作一层多晶硅薄膜作为发射极。单晶硅片与多晶硅薄膜的掺杂类型需相反,即,如果单晶硅片为p型,则多晶硅薄膜为n型;如果单晶硅片为n型,则多晶硅薄膜为p型。发射极的厚度为5~1000 nm,其掺杂浓度是可设计的,即可以均匀分布的,也可为有规律的不均匀分布的-梯度分布或者图形化的。
一种用于太阳能电池的多晶硅/单晶硅异质结结构的制备方法,其特征是首先采用低温薄膜制备技术,包括等离子体辅助化学气相沉积、热丝化学气相沉积、磁控溅射、离子束溅射等气相沉积方法,在硅片或者部分完成的晶硅太阳能电池上沉积掺杂非晶硅或者微晶硅薄膜。其中:1)硅薄膜的导电类型和掺杂浓度可由沉积薄膜所用原料的类别、成份比例以及薄膜沉积工艺参数来调节。 2)硅薄膜的厚度由沉积工艺和沉积时间进行调控。3)如需要多晶硅薄膜的掺杂浓度非均匀分布,则需要采用掩膜板或者改变沉积工艺的方法获得所需的图形化式样或者梯度分布。随后采用快速热处理的方法使得制备的非晶硅或者微晶硅薄膜晶化变成多晶硅,并激活薄膜中的掺杂元素,使得在掺杂元素不发生明显扩散的条件下获得所需性能的多晶硅薄膜。热处理过程中采用Ar、H2等气氛进行保护并改善薄膜质量。
本发明相比于常规的同质结及其高温扩散的制备方法,具有以下方面的优点,从而可进一步提高太阳能电池的性能和改善工艺:
1)多晶硅/单晶硅异质结结构为突变结,具有更高的光电响应速度和转换效率。
2)多晶硅薄膜的厚度、掺杂元素的种类和掺杂浓度的分布可有更广的选择范围。减少器件在高温的存放时间,减弱了热过程对器件性能的影响,并且可节省能源。
附图说明
图1为用于太阳能电池的均匀掺杂多晶硅薄膜/单晶硅异质结结构示意图
图2为用于太阳能电池的均匀掺杂多晶硅薄膜/单晶硅异质结结构中掺杂元素磷(P)和硼(B)的分布情况。
图3为用于太阳能电池的双层不同掺杂浓度的多晶硅薄膜/单晶硅异质结结构示意图
图4为用于太阳能电池的双层不同掺杂浓度的多晶硅薄膜/单晶硅异质结结构中掺杂元素磷(P)和硼(B)的分布情况。
图5为用于太阳能电池的图形化高掺杂浓度的多晶硅薄膜/低掺杂浓度的多晶硅薄膜/单晶硅异质结结构示意图。
图6为用于太阳能电池的图形化高掺杂浓度的多晶硅薄膜/低掺杂浓度的多晶硅薄膜/单晶硅异质结结构中掺杂元素磷(P)和硼(B)的分布情况。
在图中 1、均匀掺杂的多晶硅薄膜 2、单晶硅片 3、高掺杂浓度的多晶硅薄膜 4、低掺杂浓度的多晶硅薄膜 5、高掺杂浓度的图形化多晶硅薄膜。
具体实施方式
为了便于理解,下面结合优选实施例对本发明进一步详细阐明。
实施例1
一种用于太阳能电池的均匀掺杂多晶硅薄膜/单晶硅异质结结构如图1所示,其中掺杂元素磷(P)和硼(B)的分布情况如图2所示,此处以p型硅片为例进行说明,但硅片并不仅限于此,也可采用n型硅片,但需对发射极掺杂类型、工艺方法等进行调整。下面对该结构及其制备方法进行必要的举例说明:
1) 对于发射极均匀掺杂的多晶硅薄膜1,该层的掺杂浓度为2×1018 cm-3,厚度可在10~500 nm间调节,此处选定为100 nm。
2) 该层的制备方法可采用如下工艺流程,但不仅限于此。首先将需要沉积薄膜的单晶硅片2的一面进行必要的清洗;然后采用PECVD法沉积厚度略厚于100nm的磷(P)元素掺杂浓度为2×1018cm-3的均匀掺杂的多晶硅薄膜1;随后将沉积结束的电池片放入快速热处理设备中采用Ar保护,1100 oC, 20秒的热处理。最后去除表面的自然氧化层。
实施例2
一种用于太阳能电池的双层不同掺杂浓度的多晶硅薄膜/单晶硅异质结结构如图3所示,其中掺杂元素磷(P)和硼(B)的分布情况如图4所示。此处以p型硅片为例进行说明,但硅片并不仅限于此,也可采用n型硅片,但需对发射极掺杂类型、工艺方法等进行调整。下面对该结构及其制备方法进行必要的举例说明:
1) 高掺杂浓度的多晶硅薄膜3的掺杂浓度为2×1019 cm-3,厚度可在3~50 nm间变化,此处选定为10 nm;低掺杂浓度的多晶硅薄膜4的掺杂浓度为1×1018cm-3,厚度可在20~500 nm间变化,此处选定为100 nm;
2) 该双层多晶硅发射极的制备方法可采用如下工艺流程,但不仅限于此。首先将需要沉积薄膜的单晶硅片2的一面进行必要的清洗;然后采用PECVD法沉积厚度略厚于100nm的磷(P)元素掺杂浓度为1×1018cm-3的低掺杂浓度的多晶硅薄膜4;再改变掺杂源气体的比例,沉积厚度略厚于10 nm的掺磷(P)元素浓度为2×1019cm-3的高掺杂浓度的多晶硅薄膜3;随后将沉积结束的电池片放入快速热处理设备中采用Ar保护,1100 oC, 20秒的热处理。最后去除表面的自然氧化层。
实施例3
一种用于太阳能电池的图形化高掺杂浓度的多晶硅薄膜/低掺杂浓度的多晶硅薄膜/单晶硅异质结结构如图5所示,其中中掺杂元素磷(P)和硼(B)的分布情况如图6所示。此处以p型硅片为例进行说明,但硅片并不仅限于此,也可采用n型硅片,但需对发射极掺杂类型、工艺方法等进行调整。下面对该结构及其制备方法进行必要的举例说明:
1) 高掺杂浓度的图形化多晶硅薄膜5的掺杂浓度为2×1019 cm-3,厚度可在3~50 nm间变化,此处选定为10 nm;低掺杂浓度的多晶硅薄膜4的掺杂浓度为1×1018 cm-3,厚度可在20~500 nm间变化,此处选定为100 nm;
该图形化高掺杂浓度的多晶硅薄膜/低掺杂浓度的多晶硅薄膜结构的制备方法可采用如下工艺流程,但不仅限于此。首先将需要沉积薄膜的单晶硅片2的一面进行必要的清洗;然后采用磁控溅射法沉积厚度略厚于100 nm的磷(P)元素掺杂浓度为1×1018 cm-3的低掺杂浓度的多晶硅薄膜4;再在沉积表面上加盖不锈钢材质的掩膜板,改换掺杂元素浓度不同的靶材,沉积厚度略厚于10 nm的掺磷(P)元素浓度为2×1019 cm-3的高掺杂浓度的图形化多晶硅薄膜5;随后将沉积结束的电池片放入快速热处理设备中采用Ar保护,1100 oC, 20秒的热处理。最后去除薄膜表面的自然氧化层。
上述实施例对本发明的实施方式作了详细说明,但并不能理解为对本发明保护范围的限制,在本领域的普通技术人员所具备的知识范围内,还可以在不脱离本发明宗旨的前提下作出各种变化。
Claims (6)
1.一种用于太阳能电池的多晶硅/单晶硅异质结结构,其特征是单晶硅片作为基极和光吸收层,在其迎光面上是制作一层或多层多晶硅薄膜作为发射极。
2.根据权利要求1所述的一种用于太阳能电池的多晶硅/单晶硅异质结结构,其特征是单晶硅片与多晶硅薄膜的掺杂类型需相反。
3.根据权利要求1所述的一种用于太阳能电池的多晶硅/单晶硅异质结结构,其特征是发射极的厚度为5~500 nm,其掺杂浓度是均匀分布、梯度分布或图形化不均匀分布。
4.一种根据权利要求1至3所述的用于太阳能电池的多晶硅/单晶硅异质结结构的制备方法,其特征是首先采用低温薄膜制备方法在硅片或者部分完成的晶硅太阳能电池上沉积掺杂非晶硅或者微晶硅薄膜;随后采用快速热处理的方法使得制备的非晶硅或者微晶硅薄膜晶化变成多晶硅,并激活薄膜中的掺杂元素,使得在掺杂元素不发生明显扩散的条件下获得所需性能的多晶硅薄膜。
5.根据权利要求4所述的一种用于太阳能电池的多晶硅/单晶硅异质结结构的制备方法,其特征是热处理过程中采用Ar、H2气氛进行保护。
6.根据权利要求4所述的一种用于太阳能电池的多晶硅/单晶硅异质结结构的制备方法,其特征是采用掩膜板或者改变沉积工艺的方法获得所需的图形化式样或者梯度分布。
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