CN103583057A - 半导体装置以及麦克风 - Google Patents

半导体装置以及麦克风 Download PDF

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Publication number
CN103583057A
CN103583057A CN201280025569.2A CN201280025569A CN103583057A CN 103583057 A CN103583057 A CN 103583057A CN 201280025569 A CN201280025569 A CN 201280025569A CN 103583057 A CN103583057 A CN 103583057A
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CN
China
Prior art keywords
pad
microphone
substrate
circuit element
semiconductor device
Prior art date
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Pending
Application number
CN201280025569.2A
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English (en)
Chinese (zh)
Inventor
鞍谷直人
前川智史
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Omron Corp
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Omron Corp
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Application filed by Omron Corp filed Critical Omron Corp
Publication of CN103583057A publication Critical patent/CN103583057A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/093—Conductive package seal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/096—Feed-through, via through the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/097—Interconnects arranged on the substrate or the lid, and covered by the package seal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H10W76/67—Seals characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
CN201280025569.2A 2011-09-16 2012-09-14 半导体装置以及麦克风 Pending CN103583057A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011202981A JP5633493B2 (ja) 2011-09-16 2011-09-16 半導体装置及びマイクロフォン
JP2011-202981 2011-09-16
PCT/JP2012/073744 WO2013039239A1 (ja) 2011-09-16 2012-09-14 半導体装置及びマイクロフォン

Publications (1)

Publication Number Publication Date
CN103583057A true CN103583057A (zh) 2014-02-12

Family

ID=47883454

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280025569.2A Pending CN103583057A (zh) 2011-09-16 2012-09-14 半导体装置以及麦克风

Country Status (5)

Country Link
US (1) US20140367808A1 (https=)
EP (1) EP2757812A4 (https=)
JP (1) JP5633493B2 (https=)
CN (1) CN103583057A (https=)
WO (1) WO2013039239A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107155354A (zh) * 2014-09-15 2017-09-12 法雷奥电机设备公司 用于距离测量的机动车辆超声换能器、相应的制造方法和用途

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US9570376B2 (en) * 2010-06-29 2017-02-14 General Electric Company Electrical interconnect for an integrated circuit package and method of making same
US8653670B2 (en) 2010-06-29 2014-02-18 General Electric Company Electrical interconnect for an integrated circuit package and method of making same
CN104244152B (zh) * 2013-06-13 2018-11-06 无锡芯奥微传感技术有限公司 微机电系统麦克风封装及封装方法
JP6311376B2 (ja) * 2014-03-14 2018-04-18 オムロン株式会社 マイクロフォン
US9663357B2 (en) * 2015-07-15 2017-05-30 Texas Instruments Incorporated Open cavity package using chip-embedding technology
KR101684526B1 (ko) * 2015-08-28 2016-12-08 현대자동차 주식회사 마이크로폰 및 그 제조 방법
KR102052899B1 (ko) 2016-03-31 2019-12-06 삼성전자주식회사 전자부품 패키지
KR102418952B1 (ko) 2017-08-31 2022-07-08 삼성전자주식회사 음성인식 기능을 갖는 가전제품
US11012790B2 (en) * 2018-08-17 2021-05-18 Invensense, Inc. Flipchip package
CN109362013B (zh) * 2018-12-07 2023-11-14 潍坊歌尔微电子有限公司 组合传感器
CN215453270U (zh) * 2021-07-07 2022-01-07 瑞声声学科技(深圳)有限公司 麦克风

Citations (4)

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CN101765047A (zh) * 2009-09-28 2010-06-30 瑞声声学科技(深圳)有限公司 电容麦克风及其制作方法
US20100290644A1 (en) * 2009-05-15 2010-11-18 Aac Acoustic Technologies (Shenzhen) Co., Ltd Silicon based capacitive microphone
CN102275861A (zh) * 2010-06-01 2011-12-14 欧姆龙株式会社 半导体装置及传声器
CN103548361A (zh) * 2011-09-09 2014-01-29 欧姆龙株式会社 半导体装置及麦克风

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JP2005340961A (ja) * 2004-05-24 2005-12-08 Matsushita Electric Works Ltd 音波受信装置
US7373835B2 (en) * 2005-01-31 2008-05-20 Sanyo Electric Industries, Ltd. Semiconductor sensor
JP2008002953A (ja) * 2006-06-22 2008-01-10 Yamaha Corp 半導体装置及びその製造方法
JP2008187607A (ja) * 2007-01-31 2008-08-14 Yamaha Corp 半導体装置
TWI359480B (en) * 2007-06-13 2012-03-01 Advanced Semiconductor Eng Semiconductor package structure, applications ther
JP2010183312A (ja) * 2009-02-05 2010-08-19 Funai Electric Co Ltd マイクロホンユニット
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JP5302867B2 (ja) * 2009-12-07 2013-10-02 ホシデン株式会社 マイクロホン
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US8666505B2 (en) * 2010-10-26 2014-03-04 Medtronic, Inc. Wafer-scale package including power source
US8476720B2 (en) * 2011-06-29 2013-07-02 Honeywell International Inc. Systems and methods for vertically stacking a sensor on an integrated circuit chip

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US20100290644A1 (en) * 2009-05-15 2010-11-18 Aac Acoustic Technologies (Shenzhen) Co., Ltd Silicon based capacitive microphone
CN101765047A (zh) * 2009-09-28 2010-06-30 瑞声声学科技(深圳)有限公司 电容麦克风及其制作方法
CN102275861A (zh) * 2010-06-01 2011-12-14 欧姆龙株式会社 半导体装置及传声器
CN103548361A (zh) * 2011-09-09 2014-01-29 欧姆龙株式会社 半导体装置及麦克风

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107155354A (zh) * 2014-09-15 2017-09-12 法雷奥电机设备公司 用于距离测量的机动车辆超声换能器、相应的制造方法和用途

Also Published As

Publication number Publication date
US20140367808A1 (en) 2014-12-18
EP2757812A1 (en) 2014-07-23
JP5633493B2 (ja) 2014-12-03
WO2013039239A1 (ja) 2013-03-21
JP2013066021A (ja) 2013-04-11
EP2757812A4 (en) 2015-05-06

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Application publication date: 20140212