CN103579282A - Multi-channel integrated optical couplers and method for manufacturing same - Google Patents
Multi-channel integrated optical couplers and method for manufacturing same Download PDFInfo
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses multi-channel integrated optical couplers and a method for manufacturing the multi-channel integrated optical couplers. Optical coupler units are arranged on the same side of a substrate. One-to-one correspondence of organic electroluminescence components and organic photosensitive components can be achieved without increasing the areas of the optical coupler units. All the independent optical couplers do not need independently packaging, and therefore the level of integration is high. Lighttight isolation columns are arranged between the optical coupler units, light signal crosstalk between adjacent optical coupler units does not exist, and therefore the interference resistance performance is good. All the components are made of organic materials, and therefore the multi-channel integrated optical couplers have flexibility and are light, thin, small in size and wide in application range. Due to the adoption of an organic thin-film device manufacturing technology, all the optical coupler units are arranged on the same side of the substrate, and accordingly the level of integration is high; furthermore, the lighttight isolation columns are arranged between the optical coupler units, light signal crosstalk between the adjacent optical coupler units does not exist, and therefore the interference resistance performance is good; an adopted production process of existing organic thin-film devices is mature and low in manufacturing cost.
Description
Technical field
The present invention relates to optoelectronic areas, be specifically related to integrated optocoupler of a kind of multichannel and preparation method thereof.
Background technology
Optocoupler is a kind of opto-electronic device that when isolation electricity can signal transmission that is generally used for.It can be converted into light signal a kind of signal, again light signal is converted into the signal that another kind can be surveyed, generally at least comprises three important functional parts: the signal of telecommunication can be converted into light and export light functional part, there is electric insulation and electric insulation isolated part that can transmission light and take light signal as being output as the photosensitive functional part of detectable signal.The most frequently used optocoupler, as shown in Figure 1, utilize an electroluminescent elements A that a signal of telecommunication is converted into light signal, recycle a photosensitive part B, such as photo resistance, photosensitive capacitor, photodiode or phototriode etc. are converted into the signal of telecommunication light signal, between A and B, by electric insulation isolated part C electricity, isolate.Optocoupler is of wide application, such as being applied in high-tension electricity isolated controlling, at low-pressure end, controlling the signal of telecommunication, be loaded in electroluminescent elements, obtain reflecting the light signal of the signal of telecommunication, then irradiation obtains loading on the signal of telecommunication on high pressure to the light-sensitive device in high voltage potential, and this signal of telecommunication just can be used for controlling circuit, equipment of high-pressure side etc.
The volume of integrated circuit is little, lightweight, lead-out wire and solder joint is few, reliability is high; For separating component circuit, the circuitry performance index that adopt integrated circuit to form are higher, and the stable work time of equipment also can improve greatly, and cost price is lower simultaneously, is convenient to large-scale production.Therefore it is widely used at aspects such as industry, consumer electronic device and military affairs, communication, remote controls, for the miniaturization and the high-resolution that realize electronic equipment, has especially irreplaceable effect.Yet at present optocoupler majority is comprised of inorganic light-emitting parts and inorganic photosensitive part, because inorganic light-emitting device is difficult to High Density Integration, so the integrated optocoupler of multichannel is difficult to realize, and more impossible original position is prepared the integrated optocoupler of highdensity multichannel.Therefore, the height of realizing optocoupler is integrated, and the application tool for optocoupler in electron trade is of great significance.
Organic Light Emitting Diode and organic semiconductor light-sensitive device are the thin-film devices that utilizes organic semiconducting materials to prepare, can realize high-resolution integrated, this becomes possibility with regard to the High Density Integration that makes to utilize organic light emission and organic semiconductor Using Photosensitive Technique to realize optocoupler.
There have been at present some application studies about organic light-coupling device (referring to patent documentation CN101442043A, CN1897311A, CN101783358A), but conventionally take substrate as electric isolated insulation parts in these researchs, luminous component and photosensitive part are common uses a substrate, and is separately positioned on substrate both sides.In optocoupler, luminous component and photosensitive part need corresponding one by one, with this understanding, be arranged on the luminous component of substrate both sides and area that photosensitive part must have a certain size and could meet corresponding requirement, thereby limited its application in integrated circuit, not effectively performance organic film device in high-resolution the advantage aspect integrated.
Summary of the invention
For this reason, existing organic light-coupling device to be solved by this invention cannot be realized highly integrated technical problem, and a kind of highly integrated integrated optocoupler of multichannel and preparation method thereof of realizing is provided.
For solving the problems of the technologies described above, the technical solution used in the present invention is as follows:
The integrated optocoupler of a kind of multichannel of the present invention, comprises a plurality of optocouplers unit that is arranged on substrate homonymy, is provided with insulated column light tight and insulation between adjacent described optocoupler unit, and described insulated column is for carrying out light isolation to adjacent described optocoupler unit.
Described optocoupler unit comprises that stack is arranged on the organic electroluminescent parts on described substrate, transparent electric insulation isolated part and organic photosensitive parts, described organic electroluminescent parts and organic photosensitive parts are arranged on the both sides of described electric insulation isolated part, and the electrode near described electric insulation isolated part in organic electroluminescent parts and organic photosensitive parts is identical or different transparency electrode.
Described organic electroluminescent parts further include the first electrode, the organic luminescence function layer of organic electro luminescent parts, the second electrode of organic electroluminescent parts.
Described organic photosensitive parts are the organic photosensitive devices of the organic semiconducting materials that contains photoconductive effect or light sensitivity, further comprise the second electrode of the first electrode of organic photosensitive part, photosensitive functional layer, organic photosensitive parts.
Described insulated column comprises many groups of the first insulated columns that are arranged on described substrate, on the same group in the first insulated column be parallel to each other, the first insulated column place straight line intersects on the same group; Described the first insulated column is comprised of high insulated column group and low insulated column group; Described high insulated column group is row by described optocoupler dividing elements, the height of described high insulated column group equals in described organic luminescence function layer and described photosensitive functional layer away from the upper level in one deck of described substrate, and the height of described low insulated column group equals in described organic luminescence function layer and described photosensitive functional layer near the lower surface height in one deck of described substrate.
Described insulated column also comprises the second insulated column arranging with layer with described electric insulation isolated part, the height of described the second insulated column is identical with the thickness of described electric insulation isolated part, and the projection of described the second insulated column on described substrate overlaps with the projection of described low insulated column group on described substrate.
Described in all described optocouplers unit, organic electroluminescent parts are identical with the relative position of described organic photosensitive parts.
Described organic electroluminescent parts are Organic Light Emitting Diode or organic electrochemistry pond.
Described organic photosensitive devices is a kind of in organic photosensitive resistance, organic photosensitive diode, organic photosensitive triode or organic photosensitive transistor.
Described insulated column is one or more the stacked structure in silicon nitride, carborundum, silica, polyimides or photoresist.
Described electric insulation isolated part is the hyaline membrane structure of one or more the stacking formation in fluoropolymer, polymethyl methacrylate, dimethyl silicone polymer.
Described transparency electrode is one or more the alloy in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or the electrode layer that alternately forms of one or more and its fluoride in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or a kind of in tin indium oxide, polythiophene/polyvinylbenzenesulfonic acid sodium, polyaniline, carbon nano-tube, Graphene.
Described substrate is flexible base, board.
Top, described optocoupler unit is also provided with encapsulated layer, for described encapsulation of crossing the integrated optocoupler of passage.
The preparation method of the integrated optocoupler of a kind of multichannel of the present invention, comprises the steps:
S1, on substrate, be formed with the first electrode of organic electro luminescent parts, and the second electrode pin of organic electroluminescent parts is, the second electrode pin of the first electrode pin of organic photosensitive parts, organic photosensitive parts;
S2, on the first electrode of described organic electroluminescent parts, form many groups the first insulated columns, on the same group, the first insulated column is parallel to each other, the first insulated column place straight line does not intersect on the same group, described in formation exposed portions serve, the aperture array of the first electrode of organic electroluminescent parts is to limit optocoupler unit, and described the first insulated column is comprised of high insulated column group and low insulated column group; Described high insulated column group is divided into row by described opening, the height of described high insulated column group equals the height at photosensitive functional layer upper surface place in organic photosensitive parts, and the height of described low insulated column group equals the height at organic luminescence function layer upper surface place in described organic electroluminescent parts;
S3, in described opening, form successively organic light emitting functional layer, and the second electrode that covers the organic electroluminescent parts of described low insulated column group, the second electrode of described organic electroluminescent parts is electrically connected to the second electrode pin of described organic electroluminescent parts;
S4, on the second electrode of described organic electroluminescent parts, directly form the second insulated column, described the second insulated column is identical with the position of described the first insulated column projection on described substrate being covered by the second electrode of described organic electroluminescent parts, the capped aperture array that partly forms the second electrode of organic electroluminescent parts described in exposed portions serve in described the second insulated column and described the first insulated column; It is described that to be opened on the described optocoupler unit that limits in step S2 corresponding one by one, in described aperture array, form the electric insulation isolated part of the second electrode that covers described organic electroluminescent parts, the thickness of described electric insulation isolated part is identical with the height of described the second insulated column;
S5, on described electric insulation isolated part, directly form to cover the first electrode of the organic photosensitive parts of described the second insulated column, the first electrode of described organic photosensitive parts is electrically connected to the first electrode pin of described organic photosensitive parts;
S6, by light shield technique, on the first electrode of described organic photosensitive parts, form photosensitive unit separated from one another, described photosensitive unit is corresponding one by one with the described optocoupler unit limiting in step S2;
S7, on described photosensitive unit, directly form to cover the second electrode of the described organic photosensitive parts of described high insulated column group, the second electrode of described organic photosensitive parts is electrically connected to the second electrode pin of described organic photosensitive parts.
The preparation method of the integrated optocoupler of a kind of multichannel of the present invention, comprises the steps:
S1, on substrate, form the second electrode of organic photosensitive part, and the first electrode pin of organic photosensitive parts is, the second electrode pin of the first electrode pin of organic electroluminescent parts, organic electroluminescent parts;
S2, on the second electrode of described organic photosensitive parts, form many groups the first insulated columns, on the same group, the first insulated column is parallel to each other, the first insulated column place straight line does not intersect on the same group, described in formation exposed portions serve, the aperture array of the second electrode of organic photosensitive parts is to limit optocoupler unit, and described the first insulated column is comprised of high insulated column group and low insulated column group; Described high insulated column group is divided into row by described opening, the height of described high insulated column group equals the height at organic luminescence function layer upper surface place in organic electroluminescent parts, and the height of described low insulated column group equals the height at photosensitive functional layer upper surface place in organic photosensitive parts;
S3, in described opening, form successively photosensitive functional layer from bottom to top, and the first electrode that covers the organic photosensitive parts of described low insulated column group, the first electrode of described organic photosensitive parts is electrically connected to the first electrode pin of described organic photosensitive parts;
S4, on the first electrode of described organic photosensitive parts, directly form the second insulated column, described the second insulated column is identical with the position of described the first insulated column projection on described substrate being covered by the first electrode of described organic photosensitive parts, the capped aperture array that partly forms the second electrode of organic electroluminescent parts described in exposed portions serve in described the second insulated column and described the first insulated column; It is described that to be opened on the described optocoupler unit that limits in step S2 corresponding one by one, in described aperture array, form the electric insulation isolated part of the first electrode that covers described organic photosensitive parts, the thickness of described electric insulation isolated part is identical with the height of described the second insulated column;
S5, on described electric insulation isolated part, directly form to cover the second electrode of the organic electroluminescent parts of described the second insulated column, described organic electroluminescent parts are electrically connected to described organic electroluminescent parts pin;
S6, by light shield technique, on described organic electroluminescent parts, form organic luminescence function unit separated from one another, described organic luminescence function unit is corresponding one by one with the described optocoupler unit limiting in step S2;
S7, on described organic luminescence function unit, directly form to cover the first electrode of the described organic electroluminescent parts of described high insulated column group, the first electrode of described organic electroluminescent parts is electrically connected to the first electrode pin of described organic electroluminescent parts.
After step S7, also comprise formation encapsulated layer, the step that the integrated optocoupler of described multichannel is encapsulated.
The first electrode of described organic photosensitive parts and the second electrode of organic electroluminescent parts are transparency electrode.
Described transparency electrode is one or more the alloy in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or the electrode layer that alternately forms of one or more and its fluoride in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or a kind of in tin indium oxide, polythiophene/polyvinylbenzenesulfonic acid sodium, polyaniline, carbon nano-tube, Graphene.
Described insulated column is one or more the stacked structure in silicon nitride, carborundum, silica, polyimides or photoresist.
Described electric insulation isolated part is the hyaline membrane structure of one or more the stacking formation in fluoropolymer, polymethyl methacrylate, dimethyl silicone polymer.
Technique scheme of the present invention has the following advantages compared to existing technology:
1, the integrated optocoupler of a kind of multichannel of the present invention, optocoupler unit is arranged on substrate homonymy, without the correspondence one by one that increases optocoupler cellar area and just can realize organic electroluminescent parts and organic photosensitive parts, and between each optocoupler unit without independent encapsulation, integrated level is high; And be provided with lighttight insulated column between each optocoupler unit, and unglazed signal cross-talk problem between adjacent optocoupler unit, antijamming capability is strong.
2, the integrated optocoupler of a kind of multichannel of the present invention, each parts are that organic material is made, and make the integrated optocoupler of described multichannel possess flexibility, applied widely.
3, the integrated optocoupler of a kind of multichannel of the present invention, each parts are organic film device, light, thin, volume is little.
4, the preparation method of the integrated optocoupler of a kind of multichannel of the present invention, adopts organic film device preparation technology, and each optocoupler unit is arranged on to substrate homonymy, and between each optocoupler unit, without independent encapsulation, not only integrated level is high but also preparation technology is simple; Meanwhile, between each optocoupler unit, be provided with lighttight insulated column, unglazed signal cross-talk problem between adjacent optocoupler unit, antijamming capability is strong.
5, the preparation method of the integrated optocoupler of a kind of multichannel of the present invention, adopts the production technology of existing organic film device, and technical maturity, preparation cost are low.
Accompanying drawing explanation
For content of the present invention is more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is single channel organic light-coupling device principle schematic in prior art;
Fig. 2 is the integrated optocoupler device architecture of multichannel described in embodiment 1 schematic diagram;
Fig. 3 is the integrated optocoupler device architecture of multichannel described in embodiment 2 schematic diagram;
Fig. 4 is organic electroluminescent modular construction schematic diagram;
Fig. 5 is organic photosensitive modular construction schematic diagram;
Fig. 6-1～Fig. 6-10th, the preparation flow figure of the integrated optocoupler of multichannel shown in Fig. 2;
Fig. 7 is the cutaway view of the integrated optocoupler of multichannel shown in Fig. 6-1～Fig. 6-10;
Fig. 8 is the integrated optocoupler device circuitry of multichannel shown in Fig. 7 figure;
Fig. 9 is the input current signal of two optocoupler unit and the graph of a relation of output current signal in the integrated optocoupler of multichannel described in embodiment 1;
Figure 10 is the frequency response chart of the integrated optocoupler of multichannel described in embodiment 1.
In figure, Reference numeral is expressed as: A-organic electroluminescent parts, B-organic photosensitive parts, C-electric insulation isolated part, D-insulated column, the high insulated column group of D11-, the low insulated column group of D12-, D2-the second insulated column, 1-substrate, the first electrode of 41-organic electroluminescent parts, 42-organic luminescence function layer, the second electrode of 43-organic electroluminescent parts, the second electrode of 431-organic electroluminescent parts, the first electrode of 51-organic photosensitive parts, the first electrode pin of 511-organic photosensitive parts, the photosensitive functional layer of 52-, the second electrode of 53-organic photosensitive parts, the second electrode pin of 531-organic photosensitive parts, 6-encapsulated layer.
Embodiment
In order to make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, embodiments of the present invention are described in further detail.
The present invention can implement in many different forms, and should not be understood to be limited to embodiment set forth herein.On the contrary, provide these embodiment, making the disclosure will be thorough and complete, and design of the present invention fully will be conveyed to those skilled in the art, and the present invention will only be limited by claim.In the accompanying drawings, for clarity, can exaggerate layer and size and the relative size in region.Should be understood that, when element for example layer, region or substrate be known as " being formed on " or " being arranged on " another element " on " time, this element can be set directly on described another element, or also can have intermediary element.On the contrary, when element is known as on " being formed directly into " or " being set directly at " another element, there is not intermediary element.
The present embodiment provides a kind of multichannel integrated optocoupler, as shown in Figure 2, comprise a plurality of optocouplers unit being arranged on substrate 1, described optocoupler unit further includes organic electro luminescent components A, is vertically set on the organic photosensitive part B of described organic electroluminescent components A top, and the transparent electrical of isolation organic electroluminescent components A and organic photosensitive part B insulation isolated part C, the electrode near described electric insulation isolated part C in organic electroluminescent components A and organic photosensitive part B is identical or different transparency electrode.All described optocouplers unit is arranged on the homonymy of described substrate 1; Between adjacent described optocoupler unit, be provided with insulated column D light tight and insulation, adjacent described optocoupler unit is carried out to light isolation.
Described substrate 1 can be glass substrate or polymeric substrates, the present embodiment preferred flexible polyimide substrate.
In the present embodiment, organic electroluminescent components A preferably has OLED, can be that organic molecule luminescent device can be also polymer light-emitting device, include the first electrode 41, the organic luminescence function layer 42 of organic electro luminescent parts, the second electrode 42 of organic electroluminescent parts, as shown in Figure 4, described organic luminescence function layer 42 further comprises organic luminous layer, and one or more the combination in hole injection layer, hole transmission layer, electron injecting layer, electron transfer layer.
In the present embodiment, described organic electroluminescent parts include successively from the bottom to top the first electrode 41, hole injection layer, hole transmission layer, the luminescent layer of organic electro luminescent parts, the second electrode 42 of organic electroluminescent parts in the direction perpendicular to described substrate 1.
The first electrode 41 of organic electroluminescent parts, can adopt inorganic conductive material or organic conductive material, inorganic material is generally the metal oxides such as tin indium oxide (hereinafter to be referred as ITO), zinc oxide, zinc tin oxide or gold, copper, silver, the metal that the work functions such as nickel alumin(i)um alloy are higher, organic conductive material is generally polythiophene/polyvinylbenzenesulfonic acid sodium (hereinafter to be referred as PEDOT:PSS), polyaniline (hereinafter to be referred as PANI), carbon nano-tube, Graphene, the preferred nickel alumin(i)um alloy of the present embodiment.
Hole injection layer, hole transmission layer, luminescent layer material therefor and the same prior art of preparation method, the preferably copper of hole injection layer described in the present embodiment phthalocyanine (CuPc), hole transmission layer can adopt the low molecular material of the arylamine Lei He branch polymer same clan, is preferably N, N '-bis--(1-naphthyl)-N, N '-diphenyl-1,1-xenyl-4,4-diamines (NPB), luminescent layer can, for fluorescent material or phosphor material, as metal organic complex, can be selected from three (oxine) aluminium (Alq
3), (the adjacent amine phenol of salicylidene)-(oxine) closes aluminium (III) (Al(Saph-q)) compounds, can dopant dye in this small molecule material, doping content is 0.01wt ﹪～20wt ﹪ of small molecule material, dyestuff is generally aromatic condensed ring class material, as 5, 6, 11, 12-tetraphenyl aphthacene (being called for short rubrene), Coumarins material, as N, N '-dimethylquinacridone (being called for short DMQA), 10-(2-[4-morpholinodithio)-1, 1, 7, 7,-tetramethyl-2, 3, 6, 7-tetrahydrochysene-1H, 5H, 11H-benzo [1] pyrans [6, 7, 8-ij] quinoline piperazine (being called for short C545T), or be two pyrans class materials, as the 4-4-dicyano methylene-2-tert-butyl group-6-(1, 1, 7, 7-tetramethyl-julolidine-9-vinyl)-4H-pyrans (being called for short DCJTB), luminescent layer material also can adopt carbazole derivates as 4,4 '-N, N '-bis-carbazole-biphenyl (being called for short CBP), polyvinylcarbazole (PVK), can Doping Phosphorus photoinitiator dye in this material, as three (2-phenylpyridine) iridium (Ir (ppy) 3), two (2-phenylpyridine) (acetylacetone,2,4-pentanedione) iridium (Ir (ppy) 2 (acac)), octaethylporphyrin platinum (PtOEP) etc., the preferred Alq of the present embodiment
3and DCJTB.
The second electrode 43 of organic electroluminescent parts is general adopts the alloy of metal that the work functions such as lithium, magnesium, calcium, strontium, aluminium, indium are lower or they and copper, gold, silver, or the electrode layer that alternately forms of above-mentioned metal and its fluoride, or also use ITO, the light that organic light emission components A is sent must see through this layer of ejaculation, the preferred Ag electrode of the present embodiment.
Organic photosensitive part B is the organic photosensitive devices of the organic semiconducting materials that contains photoconductive effect or light sensitivity, can be a kind of in organic photosensitive resistance, organic photosensitive diode, organic photosensitive triode, organic photosensitive transistor.
The preferred organic photo resistance of the present embodiment, structure as shown in Figure 5, comprises successively from the bottom to top the second electrode 53 of the first electrode 51, photosensitive functional layer 52 and the organic photosensitive parts of organic photosensitive part in the direction perpendicular to described substrate 1.
Described photo resistance prepare the same prior art of materials and methods, wherein, photosensitive functional layer 52 can be acene class, phthalocyanines and azobenzene material, the preferred pentacene thin film of the present embodiment; The first electrode 51 of organic photosensitive parts should be transparent extraction electrode, can for lithium, magnesium, calcium, strontium, aluminium, indium,
The alloy of one or more in copper, gold, silver, or the electrode layer that alternately forms of one or more and its fluoride in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or a kind of in tin indium oxide, polythiophene/polyvinylbenzenesulfonic acid sodium, polyaniline, carbon nano-tube, Graphene, the preferred ITO electrode of the present embodiment; The second electrode 53 of organic photosensitive parts can be opaque metal electrode, preferably Ag electrode.
Described electric insulation isolated part C is the hyaline membrane structure of one or more the stacking formation in fluoropolymer, polymethyl methacrylate, dimethyl silicone polymer, the fluoropolymer film of the present embodiment preferably clear.
The preparation flow of the integrated optocoupler of described multichannel is as shown in Fig. 6-1～Fig. 6-10, and concrete preparation method is:
S1, as in Figure 6-1, by magnetron sputtering technique, on described substrate 1, form nickel alumin(i)um alloy conductive film, utilize photoetching and etching technics that it is prepared into the first electrode 41 of horizontal strip organic electroluminescent parts, and the second electrode pin 431 of organic electroluminescent parts is, the second electrode pin 531 of the first electrode pin 511 of organic photosensitive parts, organic photosensitive parts.
S2, as shown in Fig. 6-2, the method preparation that is exposed, developed by photoresists forms two group of first insulated column D11 and D12 on the first electrode 41 of described organic electroluminescent parts, on the same group, the first insulated column is parallel to each other, the first insulated column place straight line does not intersect on the same group, the RS1100 type photoresist that described the first preferential Taiwan of insulated column Xin Yingcai company produces; Described in formation exposed portions serve, the aperture array of the first electrode 41 of organic electroluminescent parts is to limit optocoupler unit.
Described in the present embodiment, in the first insulated column, longitudinal high insulated column group D11 and horizontal low insulated column group D12 are divided into opening row by aperture array, thereby obtain the first netted insulated column layer of black; The height of low insulated column group D12 is relevant with the thickness of organic electroluminescent components A, and in the present embodiment, the height of low insulated column group D12 is 100nm, identical with described organic luminescence function layer upper surface place height; The height of high insulated column group D11 is relevant with the gross thickness of organic electroluminescent components A, organic photosensitive part B and electric insulation isolated part C, in the present embodiment, the height of high insulated column group D11 is 680nm, identical with the height at photosensitive functional layer upper surface place in described organic photosensitive parts.
In the present embodiment, the first insulated column only has 2 groups, and described optocoupler unit is restricted to quadrangle, as other embodiment of the present invention; described the first insulated column can be many groups; described optocoupler unit can be arbitrary polygon, all can realize object of the present invention, belongs to protection scope of the present invention.
S3, as shown in Fig. 6-3, by vacuum evaporation process organic luminescence function layer 42 in layer by layer deposition organic electroluminescent components A in the substrate 1 with insulated column D, be the copper phthalocyanine of 100nm, the NPB of 20nm, and by the method that in vacuum, steam altogether in two sources, evaporation 30nm Alq
3and DCJTB; They are divided into different luminescence units by netted insulated column.As shown in Fig. 6-4, the Ag electrode of direct vacuum evaporation 30nm on described organic luminescence function layer 42, form the second electrode 43 of the organic electroluminescent parts that cover described shared insulated column, the second electrode 43 of organic electroluminescent parts has covered horizontal low insulated column group D12, longitudinally by high insulated column group D11, be isolated into strip, the second electrode 43 of the described organic electroluminescent parts of each strip shaped electric poles is electrically connected to the second electrode pin 431 of described organic electroluminescent parts.
S4, as shown in Fig. 6-5, the opaque photoetching glue (the RS1100 type photoresist that Taiwan Xin Yingcai company produces) of method deposition one deck 300nm of vacuum evaporation, by the dry method photoetching process of removing photoresist, form the second insulated column D2, described the second insulated column D2 is identical with described the first insulated column (the being D12) position of projection on described substrate 1 being covered by the second electrode 43 of described organic electroluminescent parts, the aperture array of the second electrode 43 of organic electroluminescent parts described in capped partly (being D11) formation exposed portions serve in described the second insulated column D2 and described the first insulated column, it is described that to be opened on the described optocoupler unit that limits in step S2 corresponding one by one.As shown in Fig. 6-6, transparent fluoropolymer (the Teflon polyflon that the preferably E.I.Du Pont Company produces) film of method deposition one deck 300nm of vacuum evaporation, the electric insulation isolated part C that forms the second electrode 43 that covers described organic electroluminescent parts, electric insulation isolated part C is longitudinally being divided into strip by high insulated column group D11.In described aperture array, form the electric insulation isolated part C of the second electrode 43 that covers described organic electroluminescent parts.
S5, as shown in Fig. 6-7, by method Direct precipitation on described electric insulation isolated part C of magnetron sputtering, cover the 80nm ITO transparent membrane of the D2 of described the second insulated column, the first electrode 51 as organic photosensitive parts, this electrode is also divided into strip by high insulated column group D11, and the first electrode 51 of described organic photosensitive parts is connected with the first electrode pin electricity 511 of described organic photosensitive parts.
S6, as shown in Fig. 6-8, pentacene thin film by light shield technique vacuum evaporation 50nm on the first electrode 51 of described organic photosensitive parts is as photo resistance layer, form photosensitive functional layer 52, under the acting in conjunction of light shield and high insulated column group D11, described photosensitive functional layer 52 is divided into photosensitive unit independent of each other, and described photosensitive unit is corresponding one by one with the optocoupler unit limiting in step S2.
S7, as Figure 6-9, by vacuum evaporation process Direct precipitation 150nm Ag electrode on described photosensitive unit, form the second electrode 53 of the described organic photosensitive parts that cover described connected insulated column D, under the effect of template, this electrode is horizontal strip form film, and the second electrode 53 of described organic photosensitive parts is electrically connected to the second electrode pin 531 of described organic photosensitive parts.
S8, as shown in Fig. 6-10, by magnetron sputtering technique, on the second electrode 53 of described organic photosensitive parts, deposit again one deck Al
2o
3film, as encapsulated layer 6, at this moment, is integrated in the multichannel optocoupler device being isolated from each other in a substrate 1 and has prepared, and as shown in Figure 7, Fig. 8 is the circuit diagram of structure shown in Fig. 7 to the cutaway view of the integrated optocoupler of described multichannel.
The integrated optocoupler of described multichannel is tested, used Agilent device analysis instrument to carry out the test of the signal of telecommunication, and the signal of telecommunication that extracts each optocoupler unit imports processing terminal and carry out data processing, data as shown in Figure 9 and Figure 10.
Figure in accompanying drawing 9 (a) and figure (b) are respectively the input current signal of two optocoupler unit in the integrated optocoupler of described multichannel and the relation between output current signal, from scheming to there is good consistency between the optocoupler unit of visible this device, and input and output have extraordinary linear relationship, can compare favourably with inorganic optocoupler of the prior art.
Accompanying drawing 10 is frequency response charts of the integrated optocoupler of described multichannel, from scheming the input and output of visible this device, has extraordinary linear relationship, and its cut-off frequency can be greater than 400kHz, compares favourably with inorganic optocoupler of the prior art.Because of the substrate of organic optocoupler for this reason, use organic polymer flexible material again, so whole optocoupler is all flexible, greatly expanded the wide field of the integrated optocoupler of described multichannel.
The present embodiment provides a kind of multichannel integrated optocoupler, as shown in Figure 3, preparation method and use material with embodiment 1, unique different be that organic photosensitive part B, electric insulation isolated part C and organic electroluminescent components A are just prepared successively in first preparation from bottom to top in substrate on substrate.Concrete preparation method is:
S1, on substrate 1, form the second electrode of organic photosensitive part, and the first electrode pin of organic photosensitive parts is, the second electrode pin of the first electrode pin of organic electroluminescent parts, organic electroluminescent parts;
S2, on the second electrode of described organic photosensitive parts, form many groups the first insulated columns, on the same group, the first insulated column is parallel to each other, the first insulated column place straight line does not intersect on the same group, form the aperture array of the second electrode of organic photosensitive parts described in exposed portions serve to limit optocoupler unit, in opening, each height that is connected the first insulated column is greater than the height that wherein shares the first insulated column described in the same column of formation;
S3, in described opening, form successively photosensitive functional layer from bottom to top, and covering the first electrode that shares the organic photosensitive parts of the first insulated column described in same column opening, the first electrode of described organic photosensitive parts is electrically connected to the first electrode pin of described organic photosensitive parts;
S4, on the first electrode of described organic photosensitive parts, directly form the second insulated column, described the second insulated column is identical with the position of described the first insulated column projection on described substrate being covered by the first electrode of described organic photosensitive parts, the capped aperture array that partly forms the second electrode of organic electroluminescent parts described in exposed portions serve in described the second insulated column and described the first insulated column; Described to be opened on the described optocoupler unit that limits in step S2 corresponding one by one, forms the electric insulation isolated part of the first electrode that covers described organic photosensitive parts in described aperture array;
S5, on described electric insulation isolated part, directly form to cover the second electrode of the organic electroluminescent parts of described the second insulated column, described organic electroluminescent parts are electrically connected to described organic electroluminescent parts pin;
S6, by light shield technique, on described organic electroluminescent parts, form organic luminescence function unit separated from one another, described organic luminescence function unit is corresponding one by one with the described optocoupler unit limiting in step S2;
S7, on described organic luminescence function unit, directly form to cover the first electrode of the described organic electroluminescent parts of described connected insulated column, the first electrode of described organic electroluminescent parts is electrically connected to the first electrode pin of described organic electroluminescent parts;
S8, on the first electrode of described organic electroluminescent parts, prepare one deck encapsulated layer.
Obviously, above-described embodiment is only for example is clearly described, and the not restriction to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without also giving all execution modes.And the apparent variation of being extended out thus or change are still among protection scope of the present invention.
Claims (21)
1. the integrated optocoupler of multichannel, it is characterized in that: comprise a plurality of optocouplers unit that is arranged on substrate homonymy, between adjacent described optocoupler unit, be provided with insulated column light tight and insulation, described insulated column is for carrying out light isolation to adjacent described optocoupler unit.
2. the integrated optocoupler of multichannel according to claim 1, it is characterized in that: described optocoupler unit comprises that stack is arranged on the organic electroluminescent parts on described substrate, transparent electric insulation isolated part and organic photosensitive parts, described organic electroluminescent parts and organic photosensitive parts are arranged on the both sides of described electric insulation isolated part, and the electrode near described electric insulation isolated part in organic electroluminescent parts and organic photosensitive parts is identical or different transparency electrode.
3. the integrated optocoupler of multichannel according to claim 2, is characterized in that: described organic electroluminescent parts further include the first electrode, the organic luminescence function layer of organic electro luminescent parts, the second electrode of organic electroluminescent parts.
4. the integrated optocoupler of multichannel according to claim 3, it is characterized in that: described organic photosensitive parts are the organic photosensitive devices of the organic semiconducting materials that contains photoconductive effect or light sensitivity, further comprise the second electrode of the first electrode of organic photosensitive part, photosensitive functional layer, organic photosensitive parts.
5. the integrated optocoupler of multichannel according to claim 4, is characterized in that: described insulated column comprises many groups of the first insulated columns that are arranged on described substrate, on the same group in the first insulated column be parallel to each other, the first insulated column place straight line intersects on the same group; Described the first insulated column is comprised of high insulated column group and low insulated column group; Described high insulated column group is row by described optocoupler dividing elements, the height of described high insulated column group equals in described organic luminescence function layer and described photosensitive functional layer the height away from the upper surface place in one deck of described substrate, and the height of described low insulated column group equals in described organic luminescence function layer and described photosensitive functional layer the height near the lower surface place in one deck of described substrate.
6. the integrated optocoupler of multichannel according to claim 5, it is characterized in that: described insulated column also comprises the second insulated column arranging with layer with described electric insulation isolated part, the height of described the second insulated column is identical with the thickness of described electric insulation isolated part, and the projection of described the second insulated column on described substrate overlaps with the projection of described low insulated column group on described substrate.
7. the integrated optocoupler of multichannel according to claim 6, is characterized in that, described in all described optocouplers unit, organic electroluminescent parts are identical with the relative position of described organic photosensitive parts.
8. the integrated optocoupler of multichannel according to claim 7, is characterized in that, described organic electroluminescent parts are Organic Light Emitting Diode or organic electrochemistry pond.
9. the integrated optocoupler of multichannel according to claim 8, is characterized in that, described organic photosensitive devices is a kind of in organic photosensitive resistance, organic photosensitive diode, organic photosensitive triode or organic photosensitive transistor.
10. the integrated optocoupler of multichannel according to claim 9, is characterized in that, described insulated column is one or more the stacked structure in silicon nitride, carborundum, silica, polyimides or photoresist.
The integrated optocoupler of 11. multichannel according to claim 10, is characterized in that, described electric insulation isolated part is the hyaline membrane structure of one or more the stacking formation in fluoropolymer, polymethyl methacrylate, dimethyl silicone polymer.
The integrated optocoupler of 12. multichannel according to claim 11, it is characterized in that, described transparency electrode is one or more the alloy in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or the electrode layer that alternately forms of one or more and its fluoride in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or a kind of in tin indium oxide, polythiophene/polyvinylbenzenesulfonic acid sodium, polyaniline, carbon nano-tube, Graphene.
The integrated optocoupler of 13. multichannel according to claim 12, is characterized in that, described substrate is flexible base, board.
The integrated optocoupler of 14. multichannel according to claim 13, is characterized in that, top, described optocoupler unit is also provided with encapsulated layer, for described encapsulation of crossing the integrated optocoupler of passage.
The preparation method of 15. 1 kinds of arbitrary described integrated optocouplers of multichannel of claim 1-14, is characterized in that, comprises the steps:
S1, on substrate, be formed with the first electrode of organic electro luminescent parts, and the second electrode pin of organic electroluminescent parts is, the second electrode pin of the first electrode pin of organic photosensitive parts, organic photosensitive parts;
S2, on the first electrode of described organic electroluminescent parts, form many groups the first insulated columns, on the same group, the first insulated column is parallel to each other, the first insulated column place straight line does not intersect on the same group, described in formation exposed portions serve, the aperture array of the first electrode of organic electroluminescent parts is to limit optocoupler unit, and described the first insulated column is comprised of high insulated column group and low insulated column group; Described high insulated column group is divided into row by described opening, the height of described high insulated column group equals the height at photosensitive functional layer upper surface place in organic photosensitive parts, and the height of described low insulated column group equals the height at organic luminescence function layer upper surface place in described organic electroluminescent parts;
S3, in described opening, form successively organic light emitting functional layer, and the second electrode that covers the organic electroluminescent parts of described low insulated column group, the second electrode of described organic electroluminescent parts is electrically connected to the second electrode pin of described organic electroluminescent parts;
S4, on the second electrode of described organic electroluminescent parts, directly form the second insulated column, described the second insulated column is identical with the position of described the first insulated column projection on described substrate being covered by the second electrode of described organic electroluminescent parts, the capped aperture array that partly forms the second electrode of organic electroluminescent parts described in exposed portions serve in described the second insulated column and described the first insulated column; It is described that to be opened on the described optocoupler unit that limits in step S2 corresponding one by one, in described aperture array, form the electric insulation isolated part of the second electrode that covers described organic electroluminescent parts, the thickness of described electric insulation isolated part is identical with the height of described the second insulated column;
S5, on described electric insulation isolated part, directly form to cover the first electrode of the organic photosensitive parts of described the second insulated column, the first electrode of described organic photosensitive parts is electrically connected to the first electrode pin of described organic photosensitive parts;
S6, by light shield technique, on the first electrode of described organic photosensitive parts, form photosensitive unit separated from one another, described photosensitive unit is corresponding one by one with the described optocoupler unit limiting in step S2;
S7, on described photosensitive unit, directly form to cover the second electrode of the described organic photosensitive parts of described high insulated column group, the second electrode of described organic photosensitive parts is electrically connected to the second electrode pin of described organic photosensitive parts.
The preparation method of 16. 1 kinds of arbitrary described integrated optocouplers of multichannel of claim 1-14, is characterized in that, comprises the steps:
S1, on substrate, form the second electrode of organic photosensitive part, and the first electrode pin of organic photosensitive parts is, the second electrode pin of the first electrode pin of organic electroluminescent parts, organic electroluminescent parts;
S2, on the second electrode of described organic photosensitive parts, form many groups the first insulated columns, on the same group, the first insulated column is parallel to each other, the first insulated column place straight line does not intersect on the same group, described in formation exposed portions serve, the aperture array of the second electrode of organic photosensitive parts is to limit optocoupler unit, and described the first insulated column is comprised of high insulated column group and low insulated column group; Described high insulated column group is divided into row by described opening, the height of described high insulated column group equals the height at organic luminescence function layer upper surface place in organic electroluminescent parts, and the height of described low insulated column group equals the height at photosensitive functional layer upper surface place in organic photosensitive parts;
S3, in described opening, form successively photosensitive functional layer from bottom to top, and the first electrode that covers the organic photosensitive parts of described low insulated column group, the first electrode of described organic photosensitive parts is electrically connected to the first electrode pin of described organic photosensitive parts;
S4, on the first electrode of described organic photosensitive parts, directly form the second insulated column, described the second insulated column is identical with the position of described the first insulated column projection on described substrate being covered by the first electrode of described organic photosensitive parts, the capped aperture array that partly forms the second electrode of organic electroluminescent parts described in exposed portions serve in described the second insulated column and described the first insulated column; It is described that to be opened on the described optocoupler unit that limits in step S2 corresponding one by one, in described aperture array, form the electric insulation isolated part of the first electrode that covers described organic photosensitive parts, the thickness of described electric insulation isolated part is identical with the height of described the second insulated column;
S5, on described electric insulation isolated part, directly form to cover the second electrode of the organic electroluminescent parts of described the second insulated column, described organic electroluminescent parts are electrically connected to described organic electroluminescent parts pin;
S6, by light shield technique, on described organic electroluminescent parts, form organic luminescence function unit separated from one another, described organic luminescence function unit is corresponding one by one with the described optocoupler unit limiting in step S2;
S7, on described organic luminescence function unit, directly form to cover the first electrode of the described organic electroluminescent parts of described high insulated column group, the first electrode of described organic electroluminescent parts is electrically connected to the first electrode pin of described organic electroluminescent parts.
17. according to the preparation method of the integrated optocoupler of multichannel described in claim 15 or 16, it is characterized in that, also comprises formation encapsulated layer, the step that the integrated optocoupler of described multichannel is encapsulated after step S7.
The preparation method of the integrated optocoupler of 18. multichannel according to claim 17, is characterized in that, the first electrode of described organic photosensitive parts and the second electrode of organic electroluminescent parts are transparency electrode.
The preparation method of the integrated optocoupler of 19. multichannel according to claim 18, it is characterized in that, described transparency electrode is one or more the alloy in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or the electrode layer that alternately forms of one or more and its fluoride in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or a kind of in tin indium oxide, polythiophene/polyvinylbenzenesulfonic acid sodium, polyaniline, carbon nano-tube, Graphene.
The preparation method of the integrated optocoupler of 20. multichannel according to claim 19, is characterized in that, described insulated column is one or more the stacked structure in silicon nitride, carborundum, silica, polyimides or photoresist.
The preparation method of the integrated optocoupler of 21. multichannel according to claim 20, it is characterized in that, described electric insulation isolated part is the hyaline membrane structure of one or more the stacking formation in fluoropolymer, polymethyl methacrylate, dimethyl silicone polymer.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022135A (en) * | 2014-05-19 | 2014-09-03 | 清华大学 | Optical coupler and preparation method for same |
| CN105790732A (en) * | 2014-12-24 | 2016-07-20 | 清华大学 | Multipath signal superposition device |
| CN107256900A (en) * | 2017-06-27 | 2017-10-17 | 苏州楚博生物技术有限公司 | A kind of light-sensitive material for sensor |
| CN114499555A (en) * | 2022-02-24 | 2022-05-13 | 南京亿高微波系统工程有限公司 | Communication signal high-voltage isolation module and device |
| CN114503374A (en) * | 2019-10-02 | 2022-05-13 | 赛峰电子与防务公司 | Method for electrically insulating an electronic device and device obtained by said method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1881552A (en) * | 2005-06-16 | 2006-12-20 | 夏普株式会社 | Method for manufacturing optocoupler |
| CN1897311A (en) * | 2006-05-16 | 2007-01-17 | 清华大学 | Organic light-coupling device |
| EP1811579A1 (en) * | 2006-01-18 | 2007-07-25 | STMicroelectronics S.r.l. | Galvanic optocoupler structure and corresponding hybrid integration process |
| WO2007148066A1 (en) * | 2006-06-19 | 2007-12-27 | Cambridge Display Technology Limited | Organic electroluminescent optocouplers |
| CN101442043A (en) * | 2008-12-31 | 2009-05-27 | 清华大学 | Organic light coupling device |
| US7989822B2 (en) * | 2007-11-08 | 2011-08-02 | Eugene R. Worley | Optocoupler using silicon based LEDs |
-
2013
- 2013-09-29 CN CN201310456024.3A patent/CN103579282B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1881552A (en) * | 2005-06-16 | 2006-12-20 | 夏普株式会社 | Method for manufacturing optocoupler |
| EP1811579A1 (en) * | 2006-01-18 | 2007-07-25 | STMicroelectronics S.r.l. | Galvanic optocoupler structure and corresponding hybrid integration process |
| CN1897311A (en) * | 2006-05-16 | 2007-01-17 | 清华大学 | Organic light-coupling device |
| WO2007148066A1 (en) * | 2006-06-19 | 2007-12-27 | Cambridge Display Technology Limited | Organic electroluminescent optocouplers |
| US7989822B2 (en) * | 2007-11-08 | 2011-08-02 | Eugene R. Worley | Optocoupler using silicon based LEDs |
| CN101442043A (en) * | 2008-12-31 | 2009-05-27 | 清华大学 | Organic light coupling device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022135A (en) * | 2014-05-19 | 2014-09-03 | 清华大学 | Optical coupler and preparation method for same |
| CN104022135B (en) * | 2014-05-19 | 2017-05-03 | 清华大学 | Optical coupler and preparation method for same |
| CN105790732A (en) * | 2014-12-24 | 2016-07-20 | 清华大学 | Multipath signal superposition device |
| CN105790732B (en) * | 2014-12-24 | 2018-05-29 | 清华大学 | A kind of multiple signals stacking apparatus |
| CN107256900A (en) * | 2017-06-27 | 2017-10-17 | 苏州楚博生物技术有限公司 | A kind of light-sensitive material for sensor |
| CN114503374A (en) * | 2019-10-02 | 2022-05-13 | 赛峰电子与防务公司 | Method for electrically insulating an electronic device and device obtained by said method |
| CN114499555A (en) * | 2022-02-24 | 2022-05-13 | 南京亿高微波系统工程有限公司 | Communication signal high-voltage isolation module and device |
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