CN105790732A - Multipath signal superposition device - Google Patents
Multipath signal superposition device Download PDFInfo
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- CN105790732A CN105790732A CN201410818573.5A CN201410818573A CN105790732A CN 105790732 A CN105790732 A CN 105790732A CN 201410818573 A CN201410818573 A CN 201410818573A CN 105790732 A CN105790732 A CN 105790732A
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Abstract
The invention discloses a multipath signal superposition device. The multipath signal superposition device comprises a photosensitive component and multiple electroluminescent components arranged on a sensing surface of the photosensitive component. The light emitting surfaces of the electroluminescent components and the sensing surface of the electroluminescent surface are stacked or arranged closely; current signals in each path are converted into optical signals through each electroluminescent component; and then the optical signals in each path are subjected to superposition and conversion through the photosensitive component arranged at the other side of a substrate and are output in a form of a single-path current signal. As the current signals in the single path are converted into the optical signals through an electroluminescent device and the optical signal after being superposed through the photosensitive component are converted into a single current signal, the signal crosstalk is not easy to occur, and high stability is obtained; and furthermore, superposition of signals at different electric levels can be realized, and a wide application range is obtained.
Description
Technical field
The present invention relates to optoelectronic areas, be specifically related to a kind of multichannel electric current signal superposition device realizing different potentials Signal averaging.
Background technology
Signal modulation technique has highly important meaning in fields such as video and audio transmission, radio communication collection, system controls, along with developing rapidly of optical fiber sensing technology and Networks of Fiber Communications technology, utilize signal modulation technique that semiconductor device is carried out electric current control, have become as research direction and the trend in this field current.Modulation technique can make the signal after modulating have stronger capacity of resisting disturbance, simultaneously that the interference of adjacent channel signal is little, and demodulation is convenient and is easily integrated, and signal generation superposition is then the basis of signal modulation technique.As in transmission of video, by multi-channel video signal being modulated synthesis or superposition, it is possible to achieve utilize a cable to transmit multiple signals, be conducive to cost control, and in radio communication collection, it is possible to use multiple signals synthesis realizes the amplification etc. of signal.
But, in studying about the device of signal syntheses at present (CN101447764B, CN201976077U, CN203482173U), the signal synthetic apparatus proposed is generally of more complicated circuit structure, not only device volume is big, do not meet the development trend that electrical equipment is microminiaturized, and complex process, yields are low, manufacturing cost is high.The more important thing is, in existing signal synthetic apparatus, effectively do not electrically insulate between input signal channel, not only the signal cross-talk of different channels is serious, and cannot realize the superposition between the signal being on different potentials, and the scope of application is less.
Summary of the invention
For this, existing signal synthetic apparatus structure to be solved by this invention is complicated, the easy crosstalk of signal and cannot realize different potentials signal cannot the problem of superposition, thus providing a kind of simple in construction, signal stabilization, the multiple signals stacking apparatus of different potentials Signal averaging can being realized.
For solving above-mentioned technical problem, the technical solution used in the present invention is as follows:
A kind of multiple signals stacking apparatus of the present invention, including a photosensitive components, and the sensitive surface stacking being arranged on the some electroluminescence parts in described photosensitive components sensitive surface, the exiting surface of described electroluminescence part and described photosensitive components arranges or is arranged close to；
Each road current signal is respectively converted into optical signal by each described electroluminescence part, and optical signal described in each road is overlapped conversion by described photosensitive components, exports with single channel current signal.
Also include transparent electrical insulated substrate, described electroluminescence part and described photosensitive components and be separately positioned on the both sides of described substrate.
Described electroluminescence part is on the substrate in array distribution, and described electroluminescence part is thin-film device；Described photosensitive components is thin-film device.
Described electroluminescence part is at least one in Organic Light Emitting Diode (OLED), organic electrochemistry pond (LEC), light emitting diode (LED), cold cathode fluorescence lamp (CCFL).
Preferably, described electroluminescence part is Organic Light Emitting Diode.
Described photosensitive components is the light-sensitive device containing photoconductive effect semi-conducting material or heliosensitivity semi-conducting material.
Described semi-conducting material is organic metal halogenation perovskite material.
Described photosensitive components is the one in organic photosensitive resistance, organic photosensitive diode, organic photosensitive audion or organic phototransistors.
Each described electroluminescence part is provided with current signal input；Described photosensitive components is provided with current signal output end.
Described substrate is rigidity or the flexible plate-like structure of one or more stratification in glass, fluoropolymer, polymethyl methacrylate, polydimethylsiloxane.
Described electroluminescence part and photosensitive components are additionally provided with encapsulated layer away from the side of described substrate, for the encapsulation of described multiple signals stacking apparatus.
The technique scheme of the present invention has the advantage that compared to existing technology
1, a kind of multiple signals stacking apparatus of the present invention, including a photosensitive components, and the sensitive surface stacking being arranged on the some electroluminescence parts in described photosensitive components sensitive surface, the exiting surface of described electroluminescence part and described photosensitive components arranges or is arranged close to；Each road current signal is converted to optical signal respectively through each electroluminescence part, then passes through the photosensitive components being arranged on substrate opposite side and each road optical signal is overlapped conversion, export with single channel current signal.Owing to the current signal of single channel is converted into optical signal respectively through el light emitting device, single current signal is converted to by after optical signal superposition again through photosensitive components, signal not easily crosstalk, stability height, and the superposition between the signal being on different potentials can be realized, applied widely.
2, a kind of multiple signals stacking apparatus of the present invention, each parts are thin-film device, light, thin, volume is little, meets the demand that electric device integrated level is increasingly higher.
3, a kind of multiple signals stacking apparatus of the present invention, described photosensitive components is preferably organic photosensitive diode, and the photosensitive functional layer in described organic photosensitive diode includes organic metal halide perovskite material (RNH3MX3), this absorbed peak span is big, the visible-range near infrared light of even part all can be absorbed, weaken the requirement to electroluminescence part of the described multiple signals stacking apparatus；And this material is similar in different-waveband absorption intensity, even if the light generation wavelength shift that the described light-emitting film group in described multiple signals stacking apparatus sends, impact with superposing without to the transmission of signal, so that described multiple signals stacking apparatus has high stability.
4, a kind of multiple signals stacking apparatus of the present invention, simple in construction, it is not necessary to arrange the circuit structure of complexity, yields is high.
Accompanying drawing explanation
In order to make present disclosure be more likely to be clearly understood, below according to specific embodiments of the invention and in conjunction with accompanying drawing, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation of multiple signals stacking apparatus of the present invention；
Fig. 2 is the operation principle schematic diagram of multiple signals stacking apparatus of the present invention；
Fig. 3 is the graph of a relation of input current signal and output current signal in multiple signals stacking apparatus described in test case 1；
Fig. 4 is the graph of a relation of input current signal and output current signal in multiple signals stacking apparatus described in test case 2；
Fig. 5 is the first signal waveform；
Fig. 6 is secondary signal waveform；
Fig. 7 is the 3rd signal waveform；
Fig. 8 is the graph of a relation of input current signal and output current signal in multiple signals stacking apparatus described in test case 3；
Fig. 9 is the 4th signal waveform；
Figure 10 is the 5th signal waveform；
Figure 11 is the 6th signal waveform；
Figure 12 is the graph of a relation of input current signal and output current signal in multiple signals stacking apparatus described in test case 4；
Figure 13 is the 7th signal waveform；
Figure 14 is the 8th signal waveform；
Figure 15 is the 9th signal waveform；
Figure 16 is the graph of a relation of input current signal and output current signal in multiple signals stacking apparatus described in test case 5；
Figure 17 is the tenth signal waveform；
Figure 18 is the 11st signal waveform；
Figure 19 is the tenth binary signal waveform；
Figure 20 is the graph of a relation of input current signal and output current signal in multiple signals stacking apparatus described in test case 6.
In figure, accompanying drawing labelling is expressed as: 1-substrate, 2-electroluminescence part, 3-photosensitive components, 4-current signal input, 5-current signal output end.
Detailed description of the invention
In order to make the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiments of the present invention are described in further detail.
The present invention can be embodied in many different forms, and should not be construed as limited to embodiment set forth herein.On the contrary, it is provided that these embodiments so that the disclosure will be thorough and complete, and the design of the present invention being fully conveyed to those skilled in the art, the present invention will only be defined by the appended claims.In the accompanying drawings, for clarity, the size in layer and region and relative size can be exaggerated.It should be appreciated that when element such as layer, region or substrate be referred to as " formed exist " or " being arranged on " another element " on " time, this element can be arranged directly on another element described, or can also there is intermediary element.
Embodiment
The present embodiment provides a kind of multiple signals stacking apparatus, as shown in Figure 1, including transparent electrical insulated substrate 1, it is separately positioned on multiple electroluminescence parts 2 of described substrate 1 both sides and a photosensitive components 3, the orthographic projection on described substrate 1 of each described electroluminescence part 2 is within the scope of the orthographic projection on described substrate 1 of the described photosensitive components 3, and the sensitive surface of the exiting surface of described electroluminescence part 2 and described photosensitive components 3 is close to described substrate 1 and arranges.
It should be appreciated that according to general knowledge known in this field, " both sides " of described substrate 1 should be area maximized surface and opposite thereof in described substrate 1.
Convertible embodiment as the present invention, described multiple signals stacking apparatus can also be not provided with described substrate 1, namely the described electroluminescence part 2 of multiple same layers arrangement is set directly in the sensitive surface of described photosensitive components 3, and the exiting surface of described electroluminescence part 2 is arranged towards the sensitive surface of described photosensitive components 3；Or described substrate 1 is replaced to vacuum layer or air layer etc., all can realize the purpose of the present invention, belong to protection scope of the present invention.
As in figure 2 it is shown, each road current signal is respectively converted into optical signal by current signal input 4 by each described electroluminescence part 1；Optical signal described in each road, under extra electric field, is overlapped conversion by described photosensitive components 3, is exported with single channel current signal by described current signal input 5.
Described electroluminescence part 2 is in array distribution on described substrate 1, and described electroluminescence part 2 is thin-film device；Wherein, described electroluminescence part 3 is at least one in Organic Light Emitting Diode (OLED), organic electrochemistry pond (LEC), light emitting diode (LED), cold cathode fluorescence lamp (CCFL)；In the present embodiment, described electroluminescence part 2 is preferably Organic Light Emitting Diode.
Described Organic Light Emitting Diode at least includes the first electrode, luminescent layer and the second electrode that are cascading, as the convertible embodiment of the present invention, described Organic Light Emitting Diode can also include one or more the combination in hole injection layer, hole transmission layer, electron injecting layer, electron transfer layer.
Described first electrode can be metal-oxide or gold, copper, the silver such as tin indium oxide (being called for short ITO), zinc oxide, zinc tin oxide; the metal that the work functions such as nickel alumin(i)um alloy are higher; or it is at least one in polythiophene/polyvinylbenzenesulfonic acid sodium (being called for short PEDOT:PSS), polyaniline (being called for short PANI), CNT, Graphene; all can realize the purpose of the present invention, belong to protection scope of the present invention.
The functional layers such as described hole injection layer, described hole transmission layer, described electron transfer layer and luminescent layer material therefor and preparation method are compared with technology, and hole injection layer described in the present embodiment is preferably C.I. Pigment Blue 15 (CuPc)；Hole transmission layer can adopt arylamine class and branch polymer same clan low molecule material, it is preferred to N, N '-two-(1-naphthyl)-N, N '-diphenyl-1,1-xenyl-4,4-diamidogen (NPB)；Luminescent layer can be fluorescent material or phosphor material, it is preferred to three (oxine) aluminum (Alq3) and 10-(2-[4-morpholinodithio)-1,1,7,7 ,-tetramethyl-2,3,6,7-tetrahydrochysene-1H, 5H, the doped layer that 11H-benzo [1] pyrans [6,7,8-ij] quinoline piperazine (is called for short C545T), wherein the doping volume ratio of Alq3 is 0.8%.
Described second electrode is generally adopted the alloy of the relatively low metal of the work functions such as lithium, magnesium, calcium, strontium, aluminum, indium or they and copper, gold, silver or the electrode layer that above-mentioned metal is alternatively formed with its fluoride.
Described first electrode is euphotic electrode with at least one in described second electrode, in order to light exports.
Described photosensitive components 3 is thin-film device, for the light-sensitive device containing photoconductive effect semi-conducting material or heliosensitivity semi-conducting material, selected from but be not limited to the one in organic photosensitive resistance, organic photosensitive diode, organic photosensitive audion or organic phototransistors.The preferred organic photosensitive diode of the present embodiment, including the 3rd electrode, photosensitive layer and the 4th electrode that stacking is arranged.
Described organic photosensitive diode prepare materials and methods compared with technology, wherein, photosensitive layer can one or more have photoconductive effect semi-conducting material or the combination of heliosensitivity semi-conducting material for acene class, phthalocyanines, azobenzene, fullerene, perovskite etc., the preferred perovskite material CH of the present embodiment3NH3PbI3Layer；3rd electrode is arranged near described substrate 1, should be transparent induction electrode, it can be one or more the alloy in lithium, magnesium, calcium, strontium, aluminum, indium, copper, gold, silver, or one or more electrode layers being alternatively formed with its fluoride in lithium, magnesium, calcium, strontium, aluminum, indium, copper, gold, silver, or the one in tin indium oxide, polythiophene/polyvinylbenzenesulfonic acid sodium, polyaniline, CNT, Graphene, the preferred ITO electrode of the present embodiment；4th electrode can be opaque metal electrode, it is preferable that Al electrode.
Described substrate 1 is rigidity or flexible plate-like structure, the fluoropolymer film of the present embodiment preferably clear of one or more stratification in glass, fluoropolymer, polymethyl methacrylate, polydimethylsiloxane.
In the present embodiment, described electroluminescence part 2 and photosensitive components 3 are additionally provided with encapsulated layer (for the purpose of clear, not shown) away from the side of described substrate 1, for the encapsulation of described multiple signals stacking apparatus.Each assembly in described multiple signals stacking apparatus can be selected as organic film device, and adopts flexible package, both gently, thin, volume is little, can realize again flexibility, applied widely.
Test case 1
Test with the multiple signals stacking apparatus described in embodiment, described current signal input 4 at two described electroluminescence parts inputs square-wave signal respectively, its waveform is such as shown in Fig. 3 lower curve, after described multiple signals stacking apparatus is modulated, the single current signal obtained is exported by the current signal output end 5 being arranged on described photosensitive components 3, its waveform is such as shown in Fig. 3 upper curve, described multiple signals stacking apparatus strong anti-interference performance, has significantly high signal stabilization as can be seen from Figure 3.
Test case 2
Test with the multiple signals stacking apparatus described in embodiment, described current signal input 4 input sine wave signal at a described electroluminescence part, its waveform is such as shown in Fig. 4 lower curve, after described multiple signals stacking apparatus is modulated, the single current signal obtained is exported by the current signal output end 5 being arranged on described photosensitive components 3, its waveform is such as shown in Fig. 4 upper curve, described multiple signals stacking apparatus strong anti-interference performance, has significantly high signal stabilization as can be seen from Figure 4.
Test case 3
Test with the multiple signals stacking apparatus described in embodiment, described current signal input 4 at two described electroluminescence parts inputs the first signal and secondary signal respectively, described first signal is square-wave signal, its waveform is as shown in Figure 5, described secondary signal is sine wave signal, and its waveform is as shown in Figure 6.By calculating, obtaining the 3rd signal after being synthesized with described secondary signal by described first signal, its waveform is as shown in Figure 7.Described first signal and described secondary signal are after described multiple signals stacking apparatus is modulated, and the single current signal obtained is exported by the current signal output end 5 being arranged on described photosensitive components 3, and its waveform is as shown in Figure 8.Fig. 8 also includes described 3rd signal is inputted the signal waveform that described input 4 obtains, as can be seen from Figure 8, the electric current superposed signal of described multiple signals stacking apparatus output can with the fine compound of waveform of the output signal of theoretical composite signal, highly sensitive, disturb little.
Test case 4
Test with the multiple signals stacking apparatus described in embodiment, described current signal input 4 at two described electroluminescence parts inputs the 4th signal and the 5th signal respectively, described 4th signal is square-wave signal, its waveform is as shown in Figure 9, described 5th signal is square-wave signal, as shown in Figure 10, both start-phase differ 180 ° to its waveform.By calculating, obtaining the 6th signal after described 4th signal and described 5th signal syntheses, its waveform is as shown in figure 11.Described 4th signal and described 5th signal are after described multiple signals stacking apparatus is modulated, and the single current signal obtained is exported by the current signal output end 5 being arranged on described photosensitive components 3, and its waveform is as shown in figure 12.Figure 12 also includes described 6th signal is inputted the signal waveform that described input 4 obtains, as can be seen from Figure 12, described multiple signals stacking apparatus can by the multichannel electric current Signal averaging of out of phase, the electric current superposed signal of output can with the fine compound of waveform of the output signal of theoretical composite signal, highly sensitive, disturb little.
Test case 5
Test with the multiple signals stacking apparatus described in embodiment, described current signal input 4 at two described electroluminescence parts inputs the 7th signal and the 8th signal respectively, described 7th signal is square-wave signal, its waveform is as shown in figure 13, described 8th signal is square-wave signal, and as shown in figure 14, both start-phase differ 90 ° to its waveform, and the 7th signal dutyfactor is 25%, the 8th signal dutyfactor is 50%.By calculating, obtaining the 9th signal after described 7th signal and described 8th signal syntheses, its waveform is as shown in figure 15.Described 7th signal and described 8th signal are after described multiple signals stacking apparatus is modulated, and the single current signal obtained is exported by the current signal output end 5 being arranged on described photosensitive components 3, and its waveform is as shown in figure 16.Figure 16 also includes described 9th signal is inputted the signal waveform that described input 4 obtains, as can be seen from Figure 16, the multichannel current signal of out of phase, different duty can be overlapped by described multiple signals stacking apparatus, the electric current superposed signal of output can with the fine compound of waveform of the output signal of theoretical composite signal, highly sensitive, disturb little.
Test case 6
Test with the multiple signals stacking apparatus described in embodiment, described current signal input 4 at two described electroluminescence parts inputs the tenth signal and the 11st signal respectively, described tenth signal is 1000V high-voltage dc signal, its waveform is as shown in figure 17, described 11st signal is square-wave signal, and its waveform is as shown in figure 18.By calculating, obtaining the tenth binary signal after described tenth signal and described 11st signal syntheses, its waveform is as shown in figure 19.Described tenth signal and described 11st signal are after described multiple signals stacking apparatus is modulated, and the single current signal obtained is exported by the current signal output end 5 being arranged on described photosensitive components 3, and its waveform is as shown in figure 20.Figure 20 also includes described tenth binary signal is inputted the signal waveform that described input 4 obtains, as can be seen from Figure 20, described multiple signals stacking apparatus can by the multichannel electric current Signal averaging of different potentials, the electric current superposed signal of output can with the fine compound of waveform of the output signal of theoretical composite signal, highly sensitive, disturb little.
Obviously, above-described embodiment is only for clearly demonstrating example, and is not the restriction to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also cannot all of embodiment be given exhaustive.And the apparent change thus extended out or variation are still among protection scope of the present invention.
Claims (11)
1. a multiple signals stacking apparatus, it is characterized in that: include a photosensitive components, and the sensitive surface stacking being arranged on the some electroluminescence parts in described photosensitive components sensitive surface, the exiting surface of described electroluminescence part and described photosensitive components arranges or is arranged close to；
Each road current signal is respectively converted into optical signal by each described electroluminescence part, and optical signal described in each road is overlapped conversion by described photosensitive components, exports with single channel current signal.
2. multiple signals stacking apparatus according to claim 1, it is characterised in that: also include transparent electrical insulated substrate, described electroluminescence part and described photosensitive components and be separately positioned on the both sides of described substrate.
3. multiple signals stacking apparatus according to claim 2, it is characterised in that: described electroluminescence part is on the substrate in array distribution, and described electroluminescence part is thin-film device；Described photosensitive components is thin-film device.
4. multiple signals stacking apparatus according to claim 3, it is characterised in that: described electroluminescence part is at least one in Organic Light Emitting Diode (OLED), organic electrochemistry pond (LEC), light emitting diode (LED), cold cathode fluorescence lamp (CCFL).
5. multiple signals stacking apparatus according to claim 4, it is characterised in that: described electroluminescence part is Organic Light Emitting Diode.
6. the multiple signals stacking apparatus according to any one of claim 1-5, it is characterised in that: described photosensitive components is the light-sensitive device containing photoconductive effect semi-conducting material or heliosensitivity semi-conducting material.
7. multiple signals stacking apparatus according to claim 6, it is characterised in that: described semi-conducting material is organic metal halogenation perovskite material.
8. multiple signals stacking apparatus according to claim 7, it is characterised in that: described photosensitive components is the one in organic photosensitive resistance, organic photosensitive diode, organic photosensitive audion or organic phototransistors.
9. the multiple signals stacking apparatus according to claim 1-5 or 7 or 8 any one, it is characterised in that: each described electroluminescence part is provided with current signal input；Described photosensitive components is provided with current signal output end.
10. multiple signals stacking apparatus according to claim 9, it is characterised in that: described substrate is rigidity or the flexible plate-like structure of one or more stratification in glass, fluoropolymer, polymethyl methacrylate, polydimethylsiloxane.
11. according to the multiple signals stacking apparatus described in claim 1-5 or 7 or 8 or 10 any one, it is characterised in that: described electroluminescence part and photosensitive components are additionally provided with encapsulated layer away from the side of described substrate, for the encapsulation of described multiple signals stacking apparatus.
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| CN103579282A (en) * | 2013-09-29 | 2014-02-12 | 清华大学 | Multi-channel integrated optical couplers and method for manufacturing same |
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| US20120009333A1 (en) * | 2004-02-06 | 2012-01-12 | Canon Kabushiki Kaisha | Organic el element array |
| CN1881552A (en) * | 2005-06-16 | 2006-12-20 | 夏普株式会社 | Method for manufacturing optocoupler |
| CN103579282A (en) * | 2013-09-29 | 2014-02-12 | 清华大学 | Multi-channel integrated optical couplers and method for manufacturing same |
| CN104022135A (en) * | 2014-05-19 | 2014-09-03 | 清华大学 | Optical coupler and preparation method for same |
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