CN104022135A - Optical coupler and preparation method for same - Google Patents

Optical coupler and preparation method for same Download PDF

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CN104022135A
CN104022135A CN201410287332.2A CN201410287332A CN104022135A CN 104022135 A CN104022135 A CN 104022135A CN 201410287332 A CN201410287332 A CN 201410287332A CN 104022135 A CN104022135 A CN 104022135A
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film group
electrode
light
photo
conductive film
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CN104022135B (en
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董桂芳
李东
李闻哲
王立铎
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Tsinghua University
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Tsinghua University
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

Abstract

The invention discloses an optical coupler. The optical coupler comprises a substrate, and a luminous thin film group, a transparent electric insulating and isolating layer and a photosensitive thin film group, which are sequentially stacked on the substrate, wherein the photosensitive thin film group further comprises a first electrode of the photosensitive thin film group, a photosensitive functional layer and a second electrode of the photosensitive thin film group; the photosensitive functional layer comprises an organic photosensitive layer with photoelectric conduction effects or photosensitivity; and the absorption spectrum width of the photosensitive layer is more than or equal to 300nm; the color coordinates of the luminous thin film group are CIEx=0.05 to 0.7 and CIEy=0.05 to 0.7. According to the optical coupler, by the photosensitive layer with a great absorption spectrum width, the range of the color coordinates of the luminous thin film group can be widened, limitations to the selection of light sources are reduced, the transmittance of a medium is ensured, and meanwhile, the luminous intensity is also effectively enhanced, so that the effective absorption of the photosensitive thin film group over light rays emitted by the luminous thin film group is ensured, and the current transmission ratio is increased.

Description

A kind of optocoupler and preparation method thereof
Technical field
The present invention relates to optoelectronic areas, be specifically related to optocoupler of a kind of high current transfer ratio and preparation method thereof.
Background technology
Optocoupler is a kind of opto-electronic device that when isolation electricity can signal transmission that is generally used for.It can be converted into light signal a kind of signal, again light signal is converted into the signal that another kind can be surveyed, generally at least comprises three important functional parts: the signal of telecommunication can be converted into light and export light functional part, there is electric insulation and electric insulation separator that can transmission light and taking light signal as being output as the photosensitive functional part of detectable signal.The most frequently used optocoupler, as shown in Figure 1, utilize a luminescent device A that a signal of telecommunication is converted into light signal, recycle a light-sensitive device B, such as photo resistance, photosensitive capacitor, photodiode or phototriode etc. are converted into the signal of telecommunication light signal, between A and B, isolate by electric insulation separator C electricity.Optocoupler is of wide application, such as being applied in high-tension electricity isolated controlling, be loaded on luminescent device controlling the signal of telecommunication at low-pressure end, obtain reflecting the light signal of the signal of telecommunication, then irradiation obtains loading on the signal of telecommunication on high pressure to the light-sensitive device in high voltage potential, and this signal of telecommunication just can be used for controlling circuit, the equipment etc. of high-pressure side.
Because emission wavelength is longer, the penetration power of light in medium is stronger, and therefore, optocoupler of the prior art generally uses the monochromatic light such as ruddiness and infrared light (wavelength is 650nm-1000nm) that wavelength the grows light source as optocoupler.But ruddiness and infrared light supply are easily absorbed by surrounding environment, therefore in the process of light transmission, very easily cause energy loss, thereby badly influence the current delivery efficiency of optocoupler.
And these monochromatic sources also exist the problem of spectral drift, result of study shows, constant in ambient temperature, in drive current increase process, emission peak wavelength there will be blue-shifted phenomenon; In, variation of ambient temperature process constant at drive current, the emission peak wavelength of described light source there will be Red Shift Phenomena; Under varying environment temperature, different driving current condition, even because service time is long, the emission peak wavelength of described light source can change.And the absworption peak scope of existing inorganic semiconductor light-sensitive material is generally narrower, so just causes energy loss, thereby further fallen the current delivery efficiency of optocoupler.
At present, researcher has developed many organic semiconducting materials, although they also have wider absorbing wavelength scope, their absorption spectrum shows obvious maximum absorption band, and under a certain wavelength, its absorption will be apparently higher than the absorption under other wavelength.The difference of absorption value under its absorption spectrum different wave length, will cause optical source wavelength when drift, the change of its light sensitive effect, thus affect the conduction of signal.Therefore, the organic semiconducting materials of wide absorption spectrum can not address the above problem well.Simultaneously, in prior art, organic semiconducting materials is regardless of being in mobility or having larger gap aspect electric charge transmission compared with inorganic semiconductor material, therefore, people generally believe that the current transfer ratio of the optocoupler that uses organic material is more much smaller than inorganic optocoupler.In view of above understanding, at present, there is not the organic photosensitive material of wide absorption spectrum in optocoupler, to obtain the precedent of utilizing.
Summary of the invention
For this reason, the low problem of the current transfer ratio of optocoupler in prior art to be solved by this invention, thus a kind of optocoupler with wide and stable spectral response, high current transfer ratio and preparation method thereof is provided.
For solving the problems of the technologies described above, the technical solution used in the present invention is as follows:
A kind of optocoupler of the present invention, the light-emitting film group that comprises substrate, be cascading on described substrate, transparent electric insulation separator and photo-conductive film group, described photo-conductive film group further comprises the second electrode of the first electrode of photo-conductive film group, photosensitive functional layer, photo-conductive film group, described photosensitive functional layer comprises the organic photosensitive layer with photoconductive effect or light sensitivity, and the absorption spectrum width of described photosensitive layer is more than or equal to 300nm.
The structural formula of described photosensitive layer material is RNH 3mX 3,
Wherein R is C 1-C 20aliphat straight or branched alkyl, M is that configuration of extra-nuclear electron is nd 10(n+1) s 2(n+1) p 2metallic atom, X is one or more the combination in halogen.
Described photosensitive layer material is p-type, and described photosensitive functional layer also comprises the first N-shaped semiconductor layer, and described photosensitive layer arranges near described light-emitting film group.
Described photosensitive functional layer also comprises the second p-type semiconductor layer and the second N-shaped semiconductor layer that are arranged on described photosensitive layer both sides, and described the second p-type semiconductor layer arranges near described light-emitting film group.
The organic electroluminescent LED that described light-emitting film group is at least one stacked setting, described light-emitting film group further comprises the first electrode, the light emitting functional layer of light-emitting film group, the second electrode of light-emitting film group.
The chromaticity coordinates of described light-emitting film group is CIEx=0.05~0.7, CIEy=0.05~0.7.
Described electric insulation separator is the hyaline membrane structure of one or more the stacking formation in fluoropolymer, polymethyl methacrylate, dimethyl silicone polymer.
Electrode near described electric insulation separator in described light-emitting film group and described photo-conductive film group is identical or different transparency electrode.
Described transparency electrode is one or more the alloy in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or the electrode layer that alternately forms of one or more and its fluoride in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or one in tin indium oxide, polythiophene/polyvinylbenzenesulfonic acid sodium, polyaniline, carbon nano-tube, Graphene.
The preparation method of a kind of optocoupler of the present invention, comprises the steps:
S1, on substrate, form the first electrode of light-emitting film group, and the second electrode pin of light-emitting film group, the first electrode pin of photo-conductive film group, the second electrode pin of photo-conductive film group;
S2, on the first electrode of described light-emitting film group, form successively the second electrode of light emitting functional layer, light-emitting film group, the second electrode of described light-emitting film group is electrically connected with the second electrode pin of described light-emitting film group;
S3, on the second electrode of described light-emitting film group, directly form transparent electric insulation separator;
S4, on described electric insulation separator, directly form the first electrode of photo-conductive film group, the first electrode of described photo-conductive film group is electrically connected with the first electrode pin of described photo-conductive film group;
S5, on the first electrode of described photo-conductive film group, form photosensitive functional layer, described photosensitive functional layer overlaps in the vertical direction of described substrate with the light emitting functional layer described in step S2;
S6, in described photosensitive functional layer, directly form the second electrode of described photo-conductive film group that covers described photosensitive functional layer, the second electrode of described photo-conductive film group is electrically connected with the second electrode pin of described photo-conductive film group.
The preparation method of a kind of optocoupler of the present invention, comprises the steps:
S1, on substrate, form the second electrode of photo-conductive film group, and the first electrode pin of photo-conductive film group, the first electrode pin of light-emitting film group, the second electrode pin of light-emitting film group;
S2, on the second electrode of described photo-conductive film group, form successively the first electrode of photosensitive functional layer, photo-conductive film group, the first electrode of described photo-conductive film group is electrically connected with the first electrode pin of described photo-conductive film group;
S3, on the first electrode of described photo-conductive film group, directly form transparent electric insulation separator;
S4, on described electric insulation separator, directly form the second electrode of light-emitting film group, the second electrode of described light-emitting film group is electrically connected with the second electrode pin of described light-emitting film group;
S5, in described light-emitting film group, form light emitting functional layer, described light emitting functional layer overlaps in the vertical direction of described substrate with the described photosensitive functional layer limiting in step S2;
S6, in described light emitting functional layer, directly form the first electrode of described light-emitting film group that covers described light emitting functional layer, the first electrode of described light-emitting film group is electrically connected with the first electrode pin of described light-emitting film group.
After step S6, also comprise formation encapsulated layer, the step that described optocoupler is encapsulated.
Technique scheme of the present invention has the following advantages compared to existing technology:
1, a kind of optocoupler of the present invention, the light-emitting film group that comprises substrate, be cascading on described substrate, transparent electric insulation separator and photo-conductive film group, described photo-conductive film group further comprises the second electrode of the first electrode of photo-conductive film group, photosensitive functional layer, photo-conductive film group, and described photosensitive functional layer comprises the photosensitive layer with photoconductive effect or light sensitivity.And overcome the technology prejudice that in prior art, inorganic semiconductor material absworption peak is narrow, organic semiconducting materials is not suitable for photosensitive layer in optocoupler, the semi-conducting material that creationary proposition employing absorption spectrum width is more than or equal to 300nm is as photosensitive layer, not only can expand the chromaticity coordinates scope of described light-emitting film group, reduce the restriction that light source is selected, in ensureing medium penetration, also effectively strengthen luminous intensity, because the photon of various wavelength in light source all can utilize, thereby increase current transfer ratio.
2, a kind of optocoupler of the present invention, employing structural formula is RNH 3mX 3semi-conducting material as photosensitive layer, particularly R is C 1-C 20aliphat straight or branched alkyl, M is that configuration of extra-nuclear electron is nd 10(n+1) s 2(n+1) p 2metallic atom, X is one or more the material of combination in halogen, absworption peak span is large, overcome the narrower problem of traditional inorganic semiconductor material absworption peak, to visible-range even the near infrared light of part all can absorb, weakened the requirement of described optocoupler to light source, not only can use monochromatic source can also use mixed light, thereby increase the intensity of described light-emitting film group emitted light, increased the current transfer ratio of described optocoupler; And, absorption intensity is approximate, overcome the different problem of traditional organic semiconducting materials different-waveband absorption intensity, even the light generation wavelength shift that the described light-emitting film group in described optocoupler is sent, can not cause energy loss, thereby further increase the current transfer ratio of described optocoupler yet.
3, a kind of optocoupler of the present invention, light source, spacer assembly and photosensitive part, all adopt film assembly, effectively reduced the volume of described optocoupler, thereby increased the scope of application of described optocoupler.Simultaneously, described light-emitting film group, electric insulation separator and photo-conductive film group all can adopt organic material preparation, not only can give its large area and flexible function, further increase the scope of application, but also can realize by photoetching technique the preparation of the integrated optocoupler of multichannel.
4, the preparation method of a kind of optocoupler of the present invention, light source, spacer assembly and photosensitive part, all adopt film assembly preparation technology simple, has very wide application prospect.
Brief description of the drawings
For content of the present invention is more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is optocoupler principle schematic in prior art;
Fig. 2 is optocoupler structural representation described in embodiment 1;
Fig. 3 is optocoupler structural representation described in embodiment 2;
Fig. 4 is light-emitting film group structural representation;
Fig. 5 is photo-conductive film group structural representation;
Fig. 6-1~Fig. 6-8th, the preparation flow figure of optocoupler shown in Fig. 2;
Fig. 7 is the input and output current curve diagram of optocoupler described in embodiment 1;
Fig. 8 is the input and output current curve diagram of optocoupler described in embodiment 2;
Fig. 9 is the input and output current curve diagram of optocoupler described in embodiment 3;
Figure 10 is the frequency response curve of optocoupler described in embodiment 3;
Figure 11 is the input and output current curve diagram of optocoupler described in comparative example;
Figure 12 is the abosrption spectrogram of photosensitive layer described in embodiment 1;
Figure 13 is the abosrption spectrogram of photosensitive layer described in comparative example.
In figure, Reference numeral is expressed as: A-light-emitting film group, B-photo-conductive film group, C-electric insulation separator, 1-substrate, the first electrode of 41-light-emitting film group, 42-light emitting functional layer, the second electrode of 43-light-emitting film group, the second electrode pin of 431-light-emitting film group, the first electrode of 51-photo-conductive film group, the first electrode pin of 511-photo-conductive film group, the photosensitive functional layer of 52-, the second electrode of 53-photo-conductive film group, the second electrode pin of 531-photo-conductive film group, 6-encapsulated layer.
Embodiment
In order to make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, embodiments of the present invention are described in further detail.
The present invention can implement in many different forms, and should not be understood to be limited to embodiment set forth herein.On the contrary, provide these embodiment, making the disclosure will be thorough and complete, and design of the present invention fully will be conveyed to those skilled in the art, and the present invention will only be limited by claim.In the accompanying drawings, for clarity, can exaggerate layer and size and the relative size in region.Should be understood that, when element for example layer, region or substrate be known as " being formed on " or " being arranged on " another element " on " time, this element can be set directly on described another element, or also can have intermediary element.On the contrary, in the time that element is known as on " being formed directly into " or " being set directly at " another element, there is not intermediary element.
Embodiment 1
The present embodiment provides a kind of optocoupler, as shown in Figure 2, be included in light-emitting film group A, the transparent electrical dielectric isolation layer C, the photo-conductive film group B that on substrate 1, are cascading, the electrode near described electric insulation separator C in light-emitting film group A and photo-conductive film group B is identical or different transparency electrode.
Described substrate 1 can be glass substrate or polymeric substrates, the present embodiment preferred flexible polyimide substrate.
Described light-emitting film group A preferably has OLED, can be that organic molecule luminescent device can be also polymer light-emitting device, comprise the first electrode 41, the light emitting functional layer 42 of light-emitting film group, the second electrode 43 of light-emitting film group, as shown in Figure 4, described light emitting functional layer 42 further comprises organic luminous layer, and one or more combination in hole injection layer, hole transmission layer, electron injecting layer, electron transfer layer.
In the present embodiment, described light-emitting film group comprises successively from the bottom to top the first electrode 41, hole injection layer, hole transmission layer, luminescent layer, the electron transfer layer of light-emitting film group, the second electrode 43 of light-emitting film group in the direction perpendicular to described substrate 1.
The first electrode 41 of light-emitting film group, can adopt inorganic conductive material or organic conductive material, inorganic material is generally the metal oxides such as tin indium oxide (hereinafter to be referred as ITO), zinc oxide, zinc tin oxide or gold, copper, silver, the metal that the work functions such as nickel alumin(i)um alloy are higher, organic conductive material is generally polythiophene/polyvinylbenzenesulfonic acid sodium (hereinafter to be referred as PEDOT:PSS), polyaniline (hereinafter to be referred as PANI), carbon nano-tube, Graphene, the present embodiment preferred chromium nickel alloy (GrNi), thickness is 150nm.
Hole injection layer, hole transmission layer, luminescent layer material therefor and the same prior art of preparation method, the preferably copper of hole injection layer described in the present embodiment phthalocyanine (CuPc), thickness is 100nm; Hole transmission layer can adopt the low molecular material of arylamine class and the branch polymer same clan, is preferably N, N '-bis--(1-naphthyl)-N, and N '-diphenyl-1,1-xenyl-4,4-diamines (NPB), thickness is 20nm.
Luminescent layer can be fluorescent material or phosphor material, as metal organic complex, can be selected from three (oxine) aluminium (Alq 3), (the adjacent amine phenol of salicylidene)-(oxine) closes aluminium (III) (Al (Saph-q)) compounds, can dopant dye in this small molecule material, doping content is 0.01wt ﹪~20wt ﹪ of small molecule material, dyestuff is generally aromatic condensed ring class material, as 5, 6, 11, 12-tetraphenyl aphthacene (being called for short rubrene), Coumarins material, as N, N '-dimethylquinacridone (being called for short DMQA), 10-(2-[4-morpholinodithio)-1, 1, 7, 7,-tetramethyl-2, 3, 6, 7-tetrahydrochysene-1H, 5H, 11H-benzo [1] pyrans [6, 7, 8-ij] quinoline piperazine (being called for short C545T), or be two pyrans class materials, as the 4-4-dicyano methylene-2-tert-butyl group-6-(1, 1, 7, 7-tetramethyl-julolidine-9-vinyl)-4H-pyrans (being called for short DCJTB), luminescent layer material also can adopt carbazole derivates as 4,4 '-N, N '-bis-carbazole-biphenyl (being called for short CBP), polyvinylcarbazole (PVK), can Doping Phosphorus photoinitiator dye in this material, as three (2-phenylpyridine) iridium (Ir (ppy) 3), two (2-phenylpyridine) (acetylacetone,2,4-pentanedione) iridium (Ir (ppy) 2 (acac)), octaethylporphyrin platinum (PtOEP) etc., the preferred Alq of the present embodiment 3with the doped layer of C545T, wherein Alq 3doping volume ratio be 0.8%, thickness is 30nm.
Described electron transfer layer material therefor and the same prior art of preparation method, the preferred Alq of electron transfer layer described in the present embodiment 3layer, thickness is 20nm.
The second electrode 43 of described light-emitting film group is general adopts the alloy of metal that the work functions such as lithium, magnesium, calcium, strontium, aluminium, indium are lower or they and copper, gold, silver, or above-mentioned metal and the alternately electrode layer of formation of its fluoride, or also use ITO, the light that described light-emitting film group A sends must see through this layer of ejaculation, the preferred Ag electrode of the present embodiment, thickness is 30nm.
The chromaticity coordinates of described light-emitting film group A is (0.3,0.36).
Photo-conductive film group B described in the present embodiment, structure as shown in Figure 5, comprises successively from the bottom to top the second electrode 53 of the first electrode 51, photosensitive functional layer 52 and the photo-conductive film group of photo-conductive film group in the direction perpendicular to described substrate 1.
Described photosensitive functional layer 52 comprises the photosensitive layer with photoconductive effect or light sensitivity, and the absorption spectrum width of described photosensitive layer is more than or equal to 300nm.Described photosensitive layer material is selected from but is not limited to perovskite material, such as RNH 3mX 3, wherein R is C 1-C 20aliphat straight or branched alkyl, M is that configuration of extra-nuclear electron is nd 10(n+1) s 2(n+1) p 2metallic atom, X is one or more the combination in halogen.
The present embodiment, described photosensitive functional layer 52 only comprises photosensitive layer, preferably CH 3nH 3pbI 3, thickness is 200nm, as shown in figure 12, absworption peak wave-length coverage is 400~750nm.
The first electrode 51 of described photo-conductive film group should be transparent extraction electrode, it can be one or more the alloy in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or the electrode layer that alternately forms of one or more and its fluoride in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or one in tin indium oxide, polythiophene/polyvinylbenzenesulfonic acid sodium, polyaniline, carbon nano-tube, Graphene, the preferred ITO electrode of the present embodiment, thickness is 80nm; The second electrode 53 of described photo-conductive film group can be opaque metal electrode, preferably Ag electrode, and thickness is 150nm.
Described electric insulation separator C is the hyaline membrane structure of one or more the stacking formation in fluoropolymer, polymethyl methacrylate, dimethyl silicone polymer, fluoropolymer (teflon) film of the present embodiment preferably clear, and thickness is 300nm.
The preparation flow of described optocoupler is as shown in Fig. 6-1~Fig. 6-8, and concrete preparation method is:
S1, as in Figure 6-1, on described substrate 1, form chrome-nickel conductive film by magnetron sputtering technique, utilize photoetching and etching technics that it is prepared into the first electrode 41 of horizontal strip light-emitting film group, and the second electrode pin 431 of light-emitting film group, the first electrode pin 511 of photo-conductive film group, the second electrode pin 531 of photo-conductive film group.
S2, as shown in Fig. 6-2, by vacuum evaporation process light emitting functional layer 42 in layer by layer deposition light-emitting film group A on the first electrode 41 of described light-emitting film group, be the copper phthalocyanine of 100nm, the NPB of 20nm, by the method that in vacuum, steam altogether in two sources, evaporation 30nm Alq 3and C545T, and the Alq of 20nm 3.
As shown in Fig. 6-3, the Ag electrode of direct vacuum evaporation 30nm in described light emitting functional layer 42, the second electrode 43 that forms the light-emitting film group that covers described shared insulated column, the second electrode 43 of light-emitting film group is electrically connected with the second electrode pin 431 of described light-emitting film group.
S3, as shown in Fig. 6-4, transparent fluoropolymer (the Teflon polyflon that the preferably E.I.Du Pont Company produces) film of method deposition one deck 300nm of vacuum evaporation, formation covers the electric insulation separator C of the second electrode 43 of described light-emitting film group.
S4, as shown in Fig. 6-5, by method Direct precipitation 80nm ITO transparent membrane on described electric insulation separator C of magnetron sputtering, as the first electrode 51 of photo-conductive film group, the first electrode 51 of described photo-conductive film group is connected with the first electrode pin electricity 511 of described photo-conductive film group.
S5, as shown in Fig. 6-6, on the first electrode 51 of described photo-conductive film group, form CH by wet method spin coating proceeding 3nH 3pbI 3as photosensitive layer, form photosensitive functional layer 52.Spin coating solution is CH 3nH 3i and PbI 2dimethyl formamide (DMF) saturated solution, wherein CH 3nH 3i and PbI 2mol ratio be 1:1.
As convertible embodiment of the present invention, described photosensitive layer can pass through wet method spin-coating method, vacuum vapour deposition preparation.
Described wet method spin coating proceeding can be divided into two kinds of a step spin coating and two step spin coatings.
A described step spin-coating method refers to preparation preparation CH 3nH 3pbI 3the solution of film, only carried out a step spin coating and formed film; Solution is by CH 3nH 3i and PbI 2mix according to a certain ratio, solvent can be a kind of or two kinds of mixing in DMF or 2-propanol.
Described two step spin-coating methods refer to preparation CH 3nH 3pbI 3the required bi-material of film is mixed with respectively certain density solution, and spin coating forms photosensitive layer film successively in two steps, as by PbI 2be dissolved in DMF, make the solution that solubility is 462mg/mL, with the speed spin coating 60s of 5000rpm, the 15min that anneals at 80 DEG C, being then immersed in concentration is 10mg/mLCH 3nH 3in the DMF solution of I, and the 15min that anneals at 80 DEG C, make photosensitive layer film.
The method of vacuum evaporation can be divided into single source evaporation and double source steams two kinds altogether.
Described single source evaporation refers to and will first synthesize CH 3nH 3pbI 3, then this material is directly formed to required film with the speed evaporation of 0.1~0.5nm/s.
Described double source steams altogether and refers to and will prepare the required bi-material CH of perovskite thin film 3nH 3i and PbI 2, respectively as two evaporation sources, with identical evaporation rate, as 0.1~0.5nm/s, obtain the photosensitive layer film of certain proportioning.
S6, as shown in Fig. 6-7, by vacuum evaporation process Direct precipitation 150nm Ag electrode on described photosensitive unit, the second electrode 53 that forms the described photo-conductive film group that covers described photosensitive functional layer 52, the second electrode 53 of described photo-conductive film group is electrically connected with the second electrode pin 531 of described photo-conductive film group.
S7, as shown in Fig. 6-8, on the second electrode 53 of described photo-conductive film group, deposit again one deck TiN film as encapsulated layer 6 by magnetron sputtering technique, at this moment, prepared by described optocoupler.
Described optocoupler is tested, used Agilent device analysis instrument to carry out the test of the signal of telecommunication, and the signal of telecommunication that extracts each optocoupler unit imports processing terminal and carry out data processing, data as shown in Figure 7.
Have extraordinary linear relationship from the input and output of scheming visible this device, current transfer ratio can reach 30-100%.
Embodiment 2
The present embodiment provides a kind of optocoupler, as shown in Figure 3, prepares successively photo-conductive film group B, electric insulation separator C and light-emitting film group A on substrate 1 from bottom to top.Concrete preparation method is:
S1, adopt magnetron sputtering technique and mask direct the second electrode of formation photo-conductive film group on substrate 1, and the first electrode pin of photo-conductive film group, the first electrode pin of light-emitting film group, the second electrode pin of light-emitting film group;
Described substrate preferred flexible polyimide substrate, the second electrode of described photo-conductive film group is preferably aluminium electrode, and thickness is 100nm.
S2, on the second electrode of described photo-conductive film group, form the first electrode of photosensitive functional layer, photo-conductive film group by wet processing or atom layer deposition process, the first electrode of described photo-conductive film group is electrically connected with the first electrode pin of described photo-conductive film group.
In the present embodiment, described photosensitive functional layer further comprises photosensitive layer and the first N-shaped semiconductor layer of stacking setting, and described photosensitive layer arranges near described light-emitting film group.
Described the first N-shaped semiconductor layer is the first N-shaped semiconductor material layer, as ZnO layer or TiO 2layer, can also can prepare by atom layer deposition process by wet processing preparation of the prior art, and described in the present embodiment, the first N-shaped semiconductor layer is preferably the ZnO layer of preparing by atom layer deposition process, and thickness is 150nm.
Described photosensitive layer is RNH 3mX 3, wherein R is C 1-C 20aliphat straight or branched alkyl, M is that configuration of extra-nuclear electron is nd 10(n+1) s 2(n+1) p 2metallic atom, X is one or more the combination in halogen.The present embodiment is preferably CH 3nH 3pbI 3, thickness is 200nm, as shown in figure 12, absworption peak wave-length coverage is 400~750nm.
The first electrode of described photo-conductive film group is preferably ITO electrode, and thickness is 60nm.
S3, on the first electrode of described photo-conductive film group, directly form transparent electric insulation separator, material therefor and preparation method are with embodiment 1.
S4, on described electric insulation separator, directly form the second electrode of light-emitting film group, the second electrode of described light-emitting film group is electrically connected with the second electrode pin of described light-emitting film group; In the present embodiment, the second electrode of described light-emitting film group is preferably the ITO electrode that thickness is 80nm.
S5, in described light-emitting film group, form light emitting functional layer, described light emitting functional layer overlaps in the vertical direction of described substrate with the described photosensitive functional layer limiting in step S2;
In the present embodiment, described light emitting functional layer comprises hole transmission layer, luminescent layer, the electron transfer layer of stacked setting.Described hole transmission layer, described luminescent layer, described electron transfer layer material therefor and all same prior aries of preparation method.In the present embodiment, described hole transmission layer is preferably the NPB of 40nm; Described luminescent layer is the doped layer of ADN (9,10-bis-(2-naphthyl) the anthracene)/DPVBi ([4,4 ' bis-(2,2 diphenylethyllene) 1,1 ' biphenyl) of 30nm, and the doping volume ratio of described AND is 7%; Described electron transfer layer is preferably the BPhen (4,7-diphenyl-1,10-phenanthroline) of 40nm.
S6, in described light emitting functional layer, directly form the first electrode of described light-emitting film group that covers described light emitting functional layer by magnetron sputtering technique, in the present embodiment, the first electrode of described light-emitting film group is preferably the Mg:Al/Ag layer of stacked setting, Mg:Al layer compares evaporation with the quality of 10:1, thickness is 150nm, the thickness of Ag layer is 50nm, and the first electrode of described light-emitting film group is electrically connected with the first electrode pin of described light-emitting film group.
In the present embodiment, the chromaticity coordinates of described light-emitting film group is (0.15,0.08).
S7, on the second electrode 53 of described photo-conductive film group, deposit one deck TiN film as encapsulated layer 6 by magnetron sputtering technique, at this moment, prepared by described optocoupler again.
Described optocoupler is tested, used Agilent device analysis instrument to carry out the test of the signal of telecommunication, and the signal of telecommunication that extracts each optocoupler unit imports processing terminal and carry out data processing, data as shown in Figure 8.
Have extraordinary linear relationship from the input and output of scheming visible this device, current transfer ratio can reach 30-100%.
Embodiment 3
The present embodiment provides a kind of optocoupler, concrete structure and preparation method are with embodiment 2, unique different be in the present embodiment, described photosensitive functional layer further comprises the second p-type semiconductor layer and the second N-shaped semiconductor layer that are arranged on described photosensitive layer both sides, and described the second p-type semiconductor layer arranges near described light-emitting film group.
Described the second N-shaped semiconductor layer is N-shaped semiconductor material layer, is selected from but is not limited to TiO 2, ZnO etc. has the inorganic semiconductor material of larger electron mobility, the present embodiment is preferably TiO 2layer, thickness is 150nm.
Described the second p-type semiconductor layer is p-type semiconductor material layer, be selected from but be not limited to the poly-triarylamine (PTAA), 2 of organic semiconducting materials, 2', 7,7'-tetrabromo-9,9'-spiral shell two, three (4-iodobenzene) amine (Spiro-MeOTAD), the present embodiment is preferably Spiro-MeOTAD, and thickness is 40nm.
Described optocoupler is tested, used Agilent device analysis instrument to carry out the test of the signal of telecommunication, and the signal of telecommunication that extracts each optocoupler unit imports processing terminal and carry out data processing, data as shown in Figures 9 and 10.
Have extraordinary linear relationship from the input and output of scheming visible this device, and under high-frequency input signal, still have the very signal output of coupling, current transfer ratio can reach 50-100%.
Comparative example
This comparative example provides a kind of optocoupler, and concrete structure and preparation method be with embodiment 1, unique different be photosensitive layer material difference, be indoles squarylium cyanine dyes, as shown in figure 13, absworption peak wave-length coverage is 600-700nm to absorption spectrum.
Described optocoupler is tested, used Agilent device analysis instrument to carry out the test of the signal of telecommunication, and the signal of telecommunication that extracts each optocoupler unit imports processing terminal and carry out data processing, data as shown in figure 11.
Also have certain linear relationship from the input and output of scheming visible this device, still, the maximum of current transfer ratio is only 2%, far below the data in embodiment 1-3.
Obviously, above-described embodiment is only for example is clearly described, and the not restriction to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also giving exhaustive to all execution modes.And the apparent variation of being extended out thus or variation are still among protection scope of the present invention.

Claims (12)

1. an optocoupler, the light-emitting film group that comprises substrate, be cascading on described substrate, transparent electric insulation separator and photo-conductive film group, it is characterized in that, described photo-conductive film group further comprises the second electrode of the first electrode of photo-conductive film group, photosensitive functional layer, photo-conductive film group, described photosensitive functional layer comprises the organic photosensitive layer with photoconductive effect or light sensitivity, and the absorption spectrum width of described photosensitive layer is more than or equal to 300nm.
2. optocoupler according to claim 1, is characterized in that, the structural formula of described photosensitive layer material is RNH 3mX 3,
Wherein R is C 1-C 20aliphat straight or branched alkyl, M is that configuration of extra-nuclear electron is nd 10(n+1) s 2(n+1) p 2metallic atom, X is one or more the combination in halogen.
3. optocoupler according to claim 1 and 2, is characterized in that, described photosensitive layer material is p-type, and described photosensitive functional layer also comprises the first N-shaped semiconductor layer, and described photosensitive layer arranges near described light-emitting film group.
4. according to the arbitrary described optocoupler of claim 1-3, it is characterized in that, described photosensitive functional layer also comprises the second p-type semiconductor layer and the second N-shaped semiconductor layer that are arranged on described photosensitive layer both sides, and described the second p-type semiconductor layer arranges near described light-emitting film group.
5. according to the arbitrary described optocoupler of claim 1-4, it is characterized in that, the organic electroluminescent LED that described light-emitting film group is at least one stacked setting, described light-emitting film group further comprises the first electrode, the light emitting functional layer of light-emitting film group, the second electrode of light-emitting film group.
6. according to the arbitrary described optocoupler of claim 1-5, it is characterized in that, the chromaticity coordinates of described light-emitting film group is CIEx=0.05~0.7, CIEy=0.05~0.7.
7. according to the arbitrary described optocoupler of claim 1-6, it is characterized in that, described electric insulation separator is the hyaline membrane structure of one or more the stacking formation in fluoropolymer, polymethyl methacrylate, dimethyl silicone polymer.
8. according to the arbitrary described optocoupler of claim 1-7, it is characterized in that, the electrode near described electric insulation separator in described light-emitting film group and described photo-conductive film group is identical or different transparency electrode.
9. according to the arbitrary described optocoupler of claim 1-8, it is characterized in that, described transparency electrode is one or more the alloy in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or the electrode layer that alternately forms of one or more and its fluoride in lithium, magnesium, calcium, strontium, aluminium, indium, copper, gold, silver, or one in tin indium oxide, polythiophene/polyvinylbenzenesulfonic acid sodium, polyaniline, carbon nano-tube, Graphene.
10. a preparation method for the arbitrary described optocoupler of claim 1-9, is characterized in that, comprises the steps:
S1, on substrate, form the first electrode of light-emitting film group, and the second electrode pin of light-emitting film group, the first electrode pin of photo-conductive film group, the second electrode pin of photo-conductive film group;
S2, on the first electrode of described light-emitting film group, form successively the second electrode of light emitting functional layer, light-emitting film group, the second electrode of described light-emitting film group is electrically connected with the second electrode pin of described light-emitting film group;
S3, on the second electrode of described light-emitting film group, directly form transparent electric insulation separator;
S4, on described electric insulation separator, directly form the first electrode of photo-conductive film group, the first electrode of described photo-conductive film group is electrically connected with the first electrode pin of described photo-conductive film group;
S5, on the first electrode of described photo-conductive film group, form photosensitive functional layer, described photosensitive functional layer overlaps in the vertical direction of described substrate with the light emitting functional layer described in step S2;
S6, in described photosensitive functional layer, directly form the second electrode of described photo-conductive film group that covers described photosensitive functional layer, the second electrode of described photo-conductive film group is electrically connected with the second electrode pin of described photo-conductive film group.
The preparation method of 11. 1 kinds of arbitrary described optocouplers of claim 1-9, is characterized in that, comprises the steps:
S1, on substrate, form the second electrode of photo-conductive film group, and the first electrode pin of photo-conductive film group, the first electrode pin of light-emitting film group, the second electrode pin of light-emitting film group;
S2, on the second electrode of described photo-conductive film group, form successively the first electrode of photosensitive functional layer, photo-conductive film group, the first electrode of described photo-conductive film group is electrically connected with the first electrode pin of described photo-conductive film group;
S3, on the first electrode of described photo-conductive film group, directly form transparent electric insulation separator;
S4, on described electric insulation separator, directly form the second electrode of light-emitting film group, the second electrode of described light-emitting film group is electrically connected with the second electrode pin of described light-emitting film group;
S5, in described light-emitting film group, form light emitting functional layer, described light emitting functional layer overlaps in the vertical direction of described substrate with the described photosensitive functional layer limiting in step S2;
S6, in described light emitting functional layer, directly form the first electrode of described light-emitting film group that covers described light emitting functional layer, the first electrode of described light-emitting film group is electrically connected with the first electrode pin of described light-emitting film group.
12. according to the preparation method of the optocoupler described in claim 10 or 11, it is characterized in that, also comprises formation encapsulated layer, the step that described optocoupler is encapsulated after step S6.
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