CN103563399A - Cmos兼容的硅差分电容器麦克风及其制造方法 - Google Patents
Cmos兼容的硅差分电容器麦克风及其制造方法 Download PDFInfo
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- CN103563399A CN103563399A CN201180007064.9A CN201180007064A CN103563399A CN 103563399 A CN103563399 A CN 103563399A CN 201180007064 A CN201180007064 A CN 201180007064A CN 103563399 A CN103563399 A CN 103563399A
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- backboard
- vibrating diaphragm
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- dielectric oxide
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 83
- 239000010703 silicon Substances 0.000 title claims abstract description 83
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 27
- 238000002161 passivation Methods 0.000 claims abstract description 23
- 239000003990 capacitor Substances 0.000 claims description 82
- 230000004888 barrier function Effects 0.000 claims description 14
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 14
- 229920005591 polysilicon Polymers 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 11
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- 229910052581 Si3N4 Inorganic materials 0.000 claims description 7
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 7
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- 150000004767 nitrides Chemical class 0.000 claims description 6
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- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims description 4
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- 240000001973 Ficus microcarpa Species 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Pressure Sensors (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2011/071741 WO2012122696A1 (en) | 2011-03-11 | 2011-03-11 | Cmos compatible silicon differential condenser microphone and method for manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103563399A true CN103563399A (zh) | 2014-02-05 |
CN103563399B CN103563399B (zh) | 2017-06-09 |
Family
ID=46830020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180007064.9A Active CN103563399B (zh) | 2011-03-11 | 2011-03-11 | Cmos兼容的硅差分电容器麦克风及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8860154B2 (zh) |
CN (1) | CN103563399B (zh) |
WO (1) | WO2012122696A1 (zh) |
Cited By (27)
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CN105067178A (zh) * | 2015-05-29 | 2015-11-18 | 歌尔声学股份有限公司 | 一种差分电容式mems压力传感器及其制造方法 |
CN105611474A (zh) * | 2014-11-24 | 2016-05-25 | 北京卓锐微技术有限公司 | 一种硅电容麦克风 |
CN105704627A (zh) * | 2014-12-15 | 2016-06-22 | 意法半导体股份有限公司 | 差动型mems声换能器 |
CN105992109A (zh) * | 2015-03-17 | 2016-10-05 | Dsp集团有限公司 | 基于mems的扬声器实现 |
CN106145028A (zh) * | 2015-05-15 | 2016-11-23 | 风起科技股份有限公司 | 支撑柱、微型集音器、cmos麦克风单晶片及制造方法 |
CN106170119A (zh) * | 2015-05-20 | 2016-11-30 | 英飞凌科技股份有限公司 | 用于mems换能器的系统和方法 |
CN106658248A (zh) * | 2017-01-06 | 2017-05-10 | 北京博实联创科技有限公司 | 双指向性和无指向性功能互换的电容式麦克风及电子设备 |
CN106794981A (zh) * | 2014-07-28 | 2017-05-31 | ams国际有限公司 | 用于电容式压力传感器的悬置膜 |
CN106957044A (zh) * | 2016-01-08 | 2017-07-18 | 中芯国际集成电路制造(上海)有限公司 | 一种mems器件及其制造方法和电子装置 |
CN107040857A (zh) * | 2016-02-04 | 2017-08-11 | 北京卓锐微技术有限公司 | Mems结构及其制造方法 |
CN107529120A (zh) * | 2016-06-20 | 2017-12-29 | 上海丽恒光微电子科技有限公司 | 麦克风传感器及其制备方法 |
CN107666645A (zh) * | 2017-08-14 | 2018-02-06 | 苏州敏芯微电子技术股份有限公司 | 具有双振膜的差分电容式麦克风 |
CN107920318A (zh) * | 2016-10-08 | 2018-04-17 | 中芯国际集成电路制造(上海)有限公司 | Mems麦克风及其形成方法 |
CN108002340A (zh) * | 2016-10-28 | 2018-05-08 | 中芯国际集成电路制造(上海)有限公司 | 一种mems器件及制备方法、电子装置 |
CN108100990A (zh) * | 2017-12-21 | 2018-06-01 | 中国电子科技集团公司第五十四研究所 | 一种三明治夹心型光刻胶牺牲层的制备方法 |
CN108347683A (zh) * | 2017-01-23 | 2018-07-31 | 英飞凌科技股份有限公司 | 微机电式麦克风 |
CN108449702A (zh) * | 2017-02-16 | 2018-08-24 | 英飞凌科技股份有限公司 | 微机电式麦克风 |
CN110178385A (zh) * | 2016-11-18 | 2019-08-27 | 罗伯特·博世有限公司 | 具有电极组装件的mems传声器系统 |
CN110603818A (zh) * | 2018-12-29 | 2019-12-20 | 共达电声股份有限公司 | Mems声音传感器、mems麦克风及电子设备 |
CN111263282A (zh) * | 2018-11-30 | 2020-06-09 | 达菲感测有限公司 | 电容式传声器及其制作方法 |
CN112399311A (zh) * | 2019-08-19 | 2021-02-23 | 英飞凌科技股份有限公司 | 用于双背板换能器的膜支撑件 |
WO2021128638A1 (zh) * | 2019-12-27 | 2021-07-01 | 潍坊歌尔微电子有限公司 | 一种mems芯片 |
WO2021248930A1 (zh) * | 2020-06-09 | 2021-12-16 | 通用微(深圳)科技有限公司 | 硅基麦克风装置及电子设备 |
CN114422930A (zh) * | 2022-01-27 | 2022-04-29 | 苏州敏芯微电子技术股份有限公司 | 双背极板麦克风及其制造方法 |
CN114501266A (zh) * | 2022-01-20 | 2022-05-13 | 中国兵器工业集团第二一四研究所苏州研发中心 | 单支点差分结构抗振动干扰芯片及具有该芯片的麦克风 |
TWI790578B (zh) * | 2020-06-09 | 2023-01-21 | 大陸商通用微(深圳)科技有限公司 | 矽基麥克風裝置及電子設備 |
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WO2011025939A1 (en) * | 2009-08-28 | 2011-03-03 | Analog Devices, Inc. | Dual single-crystal backplate microphone system and method of fabricating same |
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-
2011
- 2011-03-11 CN CN201180007064.9A patent/CN103563399B/zh active Active
- 2011-03-11 WO PCT/CN2011/071741 patent/WO2012122696A1/en active Application Filing
- 2011-03-11 US US13/581,882 patent/US8860154B2/en active Active
Cited By (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106794981A (zh) * | 2014-07-28 | 2017-05-31 | ams国际有限公司 | 用于电容式压力传感器的悬置膜 |
CN106794981B (zh) * | 2014-07-28 | 2018-07-20 | ams国际有限公司 | 用于电容式压力传感器的悬置膜 |
CN105611474A (zh) * | 2014-11-24 | 2016-05-25 | 北京卓锐微技术有限公司 | 一种硅电容麦克风 |
CN105611474B (zh) * | 2014-11-24 | 2019-01-29 | 山东共达电声股份有限公司 | 一种硅电容麦克风 |
CN105704627B (zh) * | 2014-12-15 | 2019-10-01 | 意法半导体股份有限公司 | 差动型mems声换能器 |
CN105704627A (zh) * | 2014-12-15 | 2016-06-22 | 意法半导体股份有限公司 | 差动型mems声换能器 |
CN105992109A (zh) * | 2015-03-17 | 2016-10-05 | Dsp集团有限公司 | 基于mems的扬声器实现 |
CN107973267B (zh) * | 2015-05-15 | 2020-08-21 | 风起科技股份有限公司 | Cmos感测组件、cmos单晶片及制造方法 |
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