CN103543615A - Laser imaging processing device - Google Patents
Laser imaging processing device Download PDFInfo
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- CN103543615A CN103543615A CN201310517635.4A CN201310517635A CN103543615A CN 103543615 A CN103543615 A CN 103543615A CN 201310517635 A CN201310517635 A CN 201310517635A CN 103543615 A CN103543615 A CN 103543615A
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Abstract
The invention discloses a laser imaging processing device. The laser imaging processing device comprises a plurality of exposure devices and a working platform, wherein the exposure devices adjacent in the X axis direction of the working platform are arranged at intervals in the Y axis direction of the working platform; a plurality of light spots are projected on the working platform by the exposure devices, and the projections of the light spots on the X axis are connected into a line. The laser imaging processing device utilizes a plurality of exposure devices to carry out exposure work at the same time, controls the parameters of the light spots, such as shapes, sizes and grey levels through the angle of each exposure device, and carries out quick exposure treatment on a circuit board by combining the movable working platform to solve the problem of inaccurate processing caused by no expansion of negative plates in the exposure face, and meanwhile, a focused laser beam can process extremely precision circuits.
Description
Technical field
The present invention relates to laser process equipment technical field, relate in particular to a kind of laser imaging processing unit (plant).
Background technology
Without the micro-shadow technology of light shield, be called again direct imaging, in the products such as semiconductor and personal computer motherboard, there is splendid advantage, compared to the micro-shadow technology of tradition, need use light shield by image imaging on photoresistance, without the micro-shadow technology of light shield, not only save cost, in use, also have more elasticity.Groundwork mode is directly to utilize the data of CAM workstation output, and driving laser imaging device carries out pattern imaging being coated with on the printed circuit board of photoresist.
Traditional printed circuit exposure method is the method for using UV-irradiation light shield, needs adding of light shield egative film in process, and in this method, because ultraviolet light uniformity coefficient is different, near the re-covering property of live width edge is bad; In addition, there is the problem of breathing in egative film, to precision, can impact, and has tens errors to hundreds of micron on the circuit board of 500mm; Along with the development of circuit board technology, the size that circuit board line requires becomes more and more thinner, has caused the reduction of throughput rate and product quality, and meanwhile, it is longer that the processing of traditional single laser head reaches cycle of exposing patterns, and operation is more loaded down with trivial details.
Summary of the invention
The object of the invention is to overcome the deficiency that prior art exists, provide a kind of many laser heads with ad hoc fashion, to arrange the laser imaging processing unit (plant) of realizing the required figure of instantaneous exposure.
In order to achieve the above object, the technical scheme that an embodiment of the present invention adopts is:
A processing unit (plant), comprising:
Some exposure devices;
Workbench;
Adjacent exposure device in the X-direction of described workbench is provided with spacing in the Y direction of described workbench, and described some exposure devices project and have some hot spots on described workbench, and the projection of described some hot spots in X-axis connects being aligned.
As a further improvement on the present invention, between the projection of the hot spot of the hot spot of each exposure device projection and the projection of adjacent exposure device in Y-axis, be provided with gap.
As a further improvement on the present invention, the spacing size that in described X-direction, adjacent exposure device is provided with in described Y direction is identical.
As a further improvement on the present invention, the hot spot that described some exposure devices are projeced on described workbench is provided with gap each other.
As a further improvement on the present invention, described exposure device includes laser instrument, the first beam expanding lens, the one 45 degree half anti-mirror, DLP chip, the 2 45 degree half anti-mirror and the second beam expanding lens, the output terminal of described laser instrument arranges described the first beam expanding lens, the output terminal of described the first beam expanding lens arranges described the one 45 degree half anti-mirror, the reflection output terminal of described the one 45 degree half anti-mirror is arranged described DLP chip, the output terminal of described DLP chip is arranged by described the 2 45 degree half anti-mirror, the transmission output terminal of described the 2 45 degree half anti-mirror is arranged described the second beam expanding lens, described the second beam expanding lens is right against described workbench.
As a further improvement on the present invention, going out of described the second beam expanding lens is also provided with focus lamp on optical link.
As a further improvement on the present invention, described laser instrument is continuous wave laser, and the wavelength of its exposure light source is 355nm purple light wave band.
As a further improvement on the present invention, described laser instrument is continuous wave laser, and the wavelength of its exposure light source is 405nm royal purple optical band.
Beneficial effect of the present invention is, utilize some exposure devices to carry out exposure work simultaneously, angle by each exposure device is controlled the parameters such as the shape, size, gray scale of hot spot, in conjunction with mobile workbench, circuit board is carried out to exposure-processed fast, the not accurate enough problem of processing that does not have egative film breathing to cause to solve plane of exposure, the laser beam after simultaneously focusing on can be processed very meticulous circuit.
Accompanying drawing explanation
Fig. 1 is the one-piece construction schematic diagram of the laser image forming apparatus of an embodiment of the present invention;
Fig. 2 is the exposure device structural representation of the laser image forming apparatus of an embodiment of the present invention.
Embodiment
Below with reference to embodiment shown in the drawings, describe the present invention.But these embodiments do not limit the present invention, the conversion in the structure that those of ordinary skill in the art makes according to these embodiments, method or function is all included in protection scope of the present invention.
Shown in please refer to the drawing 1, be the laser imaging processing unit (plant) of an embodiment of the present invention, this device comprises: workbench 8 and the some exposure devices 10 that are right against workbench 8.Especially, be positioned at exposure device adjacent in the X-direction of workbench 8 10, in the Y direction of workbench 8, be provided with spacing, these some exposure devices 10 project and have some hot spots on workbench 8, and the projection of some hot spots in X-axis connects being aligned.Certainly, in other embodiments, the figure that the hot spot of exposure device 10 projections forms can be set according to concrete industrial requirement, in its process, can control the work that simultaneously exposes of some exposure devices 10, also can control wherein some or several exposure device 10 work, to realize required exposure figure.
Particularly, in the present invention, between the projection of the hot spot of the hot spot of each exposure device 10 projection and 10 projections of adjacent exposure device in Y-axis, be provided with gap.Wherein, identical in the spacing of Y-axis at the adjacent exposure device 8 of X-axis.Especially, the hot spot that some exposure devices 10 are projeced on workbench 8 is provided with gap each other.These some exposure devices 10 so arrange so that the hot spot of projection is projected in X-axis and connect being aligned, are projected to the setting of Y-axis equal intervals.
Please refer to shown in Fig. 2, the exposure device 10 of an embodiment of the present invention includes laser instrument 1, the first beam expanding lens the 2, the 1 degree half anti-mirror 3, DLP chip the 4, the 2 45 degree half anti-mirror 5 and the second beam expanding lens 6.Particularly, the output terminal of laser instrument 1 arranges the first beam expanding lens 2, the output terminal of the first beam expanding lens 2 arranges the one 45 degree half anti-mirror 3, the reflection output terminal of the one 45 degree half anti-mirror 3 is arranged DLP chip 4, the output terminal of this DLP chip 4 is arranged by the transmission output terminal of anti-mirror 5, the 2 45 degree half anti-mirrors 5 of the 2 45 degree half and is arranged that the second beam expanding lens 6, the second beam expanding lenss 6 are right against workbench 8, especially, in going out of this second beam expanding lens 6, on optical link, be also provided with focus lamp 7.The interior element of this exposure device 10 closely cooperates, thereby realize Laser emission, goes out exposure light source.
In the present embodiment, laser instrument 1 is continuous wave laser, and the wavelength of its exposure light source is 355nm purple light wave band or 405nm royal purple optical band.The DLP chip 4 that this exposure device 10 is used is that model is the chip of DLP9500, DLP7000 or DLP3000.
Especially, in the present embodiment, workbench 8 can comprise X-axis delivery unit, Y-axis delivery unit and substrate 81, and preferably, substrate 81 adopts the circuit board sample that refractory ceramics substrates and this substrate can the various styles of fixing printing.The substrate 81 that certain other materials can be used for exposure image is also included within protection domain of the present invention.X-axis delivery unit and Y-axis delivery unit can be controlled this workbench 8 in horizontal and vertical movement, thereby make it simple to operate, easy to control, reach the object that working (machining) efficiency is high.At length, this X-axis delivery unit comprises X-axis slide rail and controls the motor that X-axis slide rail moves.Y-axis delivery unit comprises Y-axis slide rail and controls the motor of described Y-axis slide rail motion.Wherein, substrate 81 is placed on X-axis slide rail or Y-axis slide rail, particularly, X-axis can be placed on Y-axis, then by substrate 81 fixing with this X-axis on wherein X-axis can slide along Y-axis, substrate 81 can slide along X-axis; Also Y-axis can be placed on X-axis, then substrate 81 is installed in Y-axis, wherein Y-axis can be slided along X-axis, and substrate 81 can be moving along y-axis shift, and above two kinds of modes all can realize substrate 81 and move at X axis or Y-axis.Particularly, in the present invention, after workbench 8 exposes completely in Y direction, workbench 8 moves to next unexposed portion along X-direction, carries out the moving exposure in next round Y direction.In addition, it should be noted that, in the present invention, can also on some exposure devices 10, be provided with X-axis delivery unit and Y-axis delivery unit, to control exposure device 10, in X-axis or Y-axis, move, thereby realize the demand of instantaneous exposure.
At length, said apparatus adds man-hour for laser imaging, ultrashort pulse laser 1 sends laser and enters the first beam expanding lens 2, through the first beam expanding lens 2 of adjustable multiple, realize the amplification of light beam, after the one 45 degree half anti-mirror 3, enter DLP chip 4, DLP chip 4 is controlled by CAM workstation, the direct output image of CAM workstation enters DLP chip 4, DMD system in DLP chip 4 is modulated light beam, each micro mirror in DMD system is subject to instruction to control swaying direction, the shape of beam and focus, the parameters such as gray scale are modulated, thereby reach the hot spot requirement needing, finally printed circuit board is carried out to exposure-processed, light beam after modulation is after the 2 45 degree half anti-mirror 5 transmissions, the second beam expanding lens 6 through adjustable multiple amplifies or focuses on again, light beam is subject to the second beam expanding lens 6 and this second beam expanding lens 6 to go out focus lamp 7 on optical link to act on printed circuit board and focus on, by the X-axis delivery unit on workbench 8, Y-axis delivery unit mobile platform, realize X-axis or Y direction moves.
Especially, in the present invention, owing to having abandoned the use of light shield egative film, therefore, operation greatly reduces, and the working time is reduction greatly also, and production efficiency significantly improves.At length, the present invention is by being incident upon ultra-short pulse laser on DLP chip 4, and the image of being exported by CAM workstation is modulated laser beam, by optical device, light beam is incident upon and on processed sample, makes its exposure again, have simple to operate, processed sample fineness is high, quality better and working (machining) efficiency high.Angle by each exposure device 10 is controlled the parameters such as the shape, size, gray scale of hot spot, in conjunction with mobile working platform 8, circuit board is carried out to exposure-processed fast, the not accurate enough problem of processing that does not have egative film breathing to cause to obtain plane of exposure, the laser beam after simultaneously focusing on can be processed very meticulous circuit.
Be to be understood that, although this instructions is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of instructions is only for clarity sake, those skilled in the art should make instructions as a whole, technical scheme in each embodiment also can, through appropriately combined, form other embodiments that it will be appreciated by those skilled in the art that.
Listed a series of detailed description is above only illustrating for feasibility embodiment of the present invention; they are not in order to limit the scope of the invention, all disengaging within equivalent embodiment that skill spirit of the present invention does or change all should be included in protection scope of the present invention.
Claims (8)
1. a laser imaging processing unit (plant), is characterized in that, comprising:
Some exposure devices;
Workbench;
Adjacent exposure device in the X-direction of described workbench is provided with spacing in the Y direction of described workbench, and described some exposure devices project and have some hot spots on described workbench, and the projection of described some hot spots in X-axis connects being aligned.
2. laser imaging processing unit (plant) according to claim 1, is characterized in that, between the projection of the hot spot of the hot spot of each exposure device projection and the projection of adjacent exposure device in Y-axis, is provided with gap.
3. laser imaging processing unit (plant) according to claim 1, is characterized in that, the spacing size that in described X-direction, adjacent exposure device is provided with in described Y direction is identical.
4. laser imaging processing unit (plant) according to claim 1, is characterized in that, the hot spot that described some exposure devices are projeced on described workbench is provided with gap each other.
5. laser imaging processing unit (plant) according to claim 1, it is characterized in that, described exposure device includes laser instrument, the first beam expanding lens, the one 45 degree half anti-mirror, DLP chip, the 2 45 degree half anti-mirror and the second beam expanding lens, the output terminal of described laser instrument arranges described the first beam expanding lens, the output terminal of described the first beam expanding lens arranges described the one 45 degree half anti-mirror, the reflection output terminal of described the one 45 degree half anti-mirror is arranged described DLP chip, the output terminal of described DLP chip is arranged by described the 2 45 degree half anti-mirror, the transmission output terminal of described the 2 45 degree half anti-mirror is arranged described the second beam expanding lens, described the second beam expanding lens is right against described workbench.
6. laser imaging processing unit (plant) according to claim 5, is characterized in that, going out of described the second beam expanding lens is also provided with focus lamp on optical link.
7. laser imaging processing unit (plant) according to claim 6, is characterized in that, described laser instrument is continuous wave laser, and the wavelength of its exposure light source is 355nm purple light wave band.
8. laser imaging processing unit (plant) according to claim 6, is characterized in that, described laser instrument is continuous wave laser, and the wavelength of its exposure light source is 405nm royal purple optical band.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310517635.4A CN103543615A (en) | 2013-10-29 | 2013-10-29 | Laser imaging processing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310517635.4A CN103543615A (en) | 2013-10-29 | 2013-10-29 | Laser imaging processing device |
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| CN103543615A true CN103543615A (en) | 2014-01-29 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1459671A (en) * | 2002-05-22 | 2003-12-03 | 尼康株式会社 | Exposure method, exposure apparatus and element mfg. method |
| CN1520152A (en) * | 2003-01-31 | 2004-08-11 | ��ʿ��Ƭ��ʽ���� | Plotter head unit, plotter and plotting method |
| CN1766736A (en) * | 2004-04-30 | 2006-05-03 | 富士胶片株式会社 | Photolithography method and apparatus |
| CN1945441A (en) * | 2005-10-04 | 2007-04-11 | Asml荷兰有限公司 | System and method for compensating for radiation induced thermal distortions |
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2013
- 2013-10-29 CN CN201310517635.4A patent/CN103543615A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1459671A (en) * | 2002-05-22 | 2003-12-03 | 尼康株式会社 | Exposure method, exposure apparatus and element mfg. method |
| CN1520152A (en) * | 2003-01-31 | 2004-08-11 | ��ʿ��Ƭ��ʽ���� | Plotter head unit, plotter and plotting method |
| CN1766736A (en) * | 2004-04-30 | 2006-05-03 | 富士胶片株式会社 | Photolithography method and apparatus |
| CN1945441A (en) * | 2005-10-04 | 2007-04-11 | Asml荷兰有限公司 | System and method for compensating for radiation induced thermal distortions |
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Application publication date: 20140129 |