CN103543372A - 光学检测装置 - Google Patents
光学检测装置 Download PDFInfo
- Publication number
- CN103543372A CN103543372A CN201310253573.0A CN201310253573A CN103543372A CN 103543372 A CN103543372 A CN 103543372A CN 201310253573 A CN201310253573 A CN 201310253573A CN 103543372 A CN103543372 A CN 103543372A
- Authority
- CN
- China
- Prior art keywords
- probe
- hole
- camera lens
- fixing base
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 158
- 238000001514 detection method Methods 0.000 title claims abstract description 88
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- 239000000758 substrate Substances 0.000 claims abstract description 42
- 230000004308 accommodation Effects 0.000 claims description 160
- 230000007246 mechanism Effects 0.000 claims description 38
- 210000005056 cell body Anatomy 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 18
- 238000010586 diagram Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920006351 engineering plastic Polymers 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 230000004313 glare Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
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- 239000002184 metal Substances 0.000 description 2
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- 238000004064 recycling Methods 0.000 description 2
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Lens Barrels (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Microscoopes, Condenser (AREA)
Abstract
Description
Claims (27)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101213567 | 2012-07-13 | ||
TW101213567 | 2012-07-13 | ||
TW102105460A TWI481874B (zh) | 2012-07-13 | 2013-02-08 | 光學檢測裝置 |
TW102105460 | 2013-02-08 | ||
TW102203849 | 2013-03-01 | ||
TW102203849U TWM460391U (zh) | 2012-07-13 | 2013-03-01 | 具光學調制之鏡頭調整機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103543372A true CN103543372A (zh) | 2014-01-29 |
CN103543372B CN103543372B (zh) | 2016-08-24 |
Family
ID=49913751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310253573.0A Expired - Fee Related CN103543372B (zh) | 2012-07-13 | 2013-06-24 | 光学检测装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20140016124A1 (zh) |
JP (1) | JP5694452B2 (zh) |
CN (1) | CN103543372B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107656107A (zh) * | 2016-07-25 | 2018-02-02 | 旺矽科技股份有限公司 | 具有悬臂式微机电探针的探针模块及其制造方法 |
CN112816746A (zh) * | 2021-01-06 | 2021-05-18 | 上海华虹宏力半导体制造有限公司 | 一种探针卡结构 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9597847B2 (en) * | 2011-09-20 | 2017-03-21 | Milliken & Company | Method and apparatus for inserting a spacer between annular reinforcement bands |
CN103543298B (zh) * | 2012-07-13 | 2016-03-23 | 旺矽科技股份有限公司 | 探针固持结构及其光学检测装置 |
US9654637B2 (en) * | 2014-08-27 | 2017-05-16 | Genesys Telecommunications Laboratories, Inc. | Customer controlled interaction management |
WO2016166564A1 (de) * | 2015-04-14 | 2016-10-20 | Cascade Microtech, Inc. | Prober mit einem vergrössernden optischen instrument |
EP3306387B1 (en) * | 2015-11-16 | 2018-10-03 | Axis AB | An elastic gasket, the use thereof, and a system comprising the elastic gasket |
EP3477352B1 (en) | 2016-06-23 | 2023-07-26 | Ningbo Sunny Opotech Co., Ltd. | Fixed-focus camera module |
US11114409B2 (en) * | 2020-01-30 | 2021-09-07 | Hewlett Packard Enterprise Development Lp | Chip on wafer on substrate optoelectronic assembly and methods of assembly thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4480223A (en) * | 1981-11-25 | 1984-10-30 | Seiichiro Aigo | Unitary probe assembly |
US4747784A (en) * | 1986-05-16 | 1988-05-31 | Daymarc Corporation | Contactor for integrated circuits |
US20070268483A1 (en) * | 2006-05-18 | 2007-11-22 | Aitos Inc. | Inspection apparatus for image pickup device, optical inspection unit device, and optical inspection unit |
TW200949256A (en) * | 2008-05-19 | 2009-12-01 | Probeleader Co Ltd | Probe card for testing image sensing chips |
CN201623765U (zh) * | 2010-01-15 | 2010-11-03 | 富港电子(东莞)有限公司 | 影像装置 |
CN101923105A (zh) * | 2009-06-16 | 2010-12-22 | 励威电子股份有限公司 | 用于测试图像感测芯片的探针卡 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09274125A (ja) * | 1996-04-05 | 1997-10-21 | Minolta Co Ltd | プラスチックレンズの取付構造 |
JPH1126521A (ja) * | 1997-07-08 | 1999-01-29 | Sony Corp | 固体撮像素子の評価装置 |
AU2003284483A1 (en) * | 2002-12-06 | 2004-06-30 | Inter Action Corporation | Instrument for testing solid-state imaging device |
JP2007103787A (ja) * | 2005-10-06 | 2007-04-19 | Fujifilm Corp | 固体撮像素子の検査装置 |
JP5283266B2 (ja) * | 2006-11-15 | 2013-09-04 | 日本電子材料株式会社 | 光デバイス用検査装置 |
CN103543304B (zh) * | 2012-07-13 | 2016-05-18 | 旺矽科技股份有限公司 | 高频探针卡 |
-
2013
- 2013-06-24 CN CN201310253573.0A patent/CN103543372B/zh not_active Expired - Fee Related
- 2013-07-03 JP JP2013139854A patent/JP5694452B2/ja not_active Expired - Fee Related
- 2013-07-12 US US13/941,009 patent/US20140016124A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4480223A (en) * | 1981-11-25 | 1984-10-30 | Seiichiro Aigo | Unitary probe assembly |
US4747784A (en) * | 1986-05-16 | 1988-05-31 | Daymarc Corporation | Contactor for integrated circuits |
US20070268483A1 (en) * | 2006-05-18 | 2007-11-22 | Aitos Inc. | Inspection apparatus for image pickup device, optical inspection unit device, and optical inspection unit |
TW200949256A (en) * | 2008-05-19 | 2009-12-01 | Probeleader Co Ltd | Probe card for testing image sensing chips |
CN101923105A (zh) * | 2009-06-16 | 2010-12-22 | 励威电子股份有限公司 | 用于测试图像感测芯片的探针卡 |
CN201623765U (zh) * | 2010-01-15 | 2010-11-03 | 富港电子(东莞)有限公司 | 影像装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107656107A (zh) * | 2016-07-25 | 2018-02-02 | 旺矽科技股份有限公司 | 具有悬臂式微机电探针的探针模块及其制造方法 |
CN112816746A (zh) * | 2021-01-06 | 2021-05-18 | 上海华虹宏力半导体制造有限公司 | 一种探针卡结构 |
Also Published As
Publication number | Publication date |
---|---|
CN103543372B (zh) | 2016-08-24 |
US20140016124A1 (en) | 2014-01-16 |
JP2014021486A (ja) | 2014-02-03 |
JP5694452B2 (ja) | 2015-04-01 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Cai Jinyi Inventor after: Chen Jianhong Inventor after: Zhang Jiatai Inventor after: Yu Chenzhi Inventor after: Lai Jianzhang Inventor after: Yang Jintian Inventor after: Yang Huibin Inventor after: Zhang Gengsheng Inventor after: Huang Yunru Inventor after: Chen Qiugui Inventor before: Cai Jinyi Inventor before: Zhang Jiatai Inventor before: Yu Chenzhi Inventor before: Lai Jianzhang Inventor before: Yang Jintian Inventor before: Yang Huibin |
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CB03 | Change of inventor or designer information | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160824 Termination date: 20180624 |
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CF01 | Termination of patent right due to non-payment of annual fee |