CN103542478B - A kind of semiconductor air conditioner - Google Patents
A kind of semiconductor air conditioner Download PDFInfo
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- CN103542478B CN103542478B CN201310575755.XA CN201310575755A CN103542478B CN 103542478 B CN103542478 B CN 103542478B CN 201310575755 A CN201310575755 A CN 201310575755A CN 103542478 B CN103542478 B CN 103542478B
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- type semiconductor
- metal flow
- flow deflector
- semiconductor module
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Abstract
The present invention discloses a kind of semiconductor air conditioner, becomes primarily of multiple N-type semiconductor module, multiple P-type semiconductor module, multiple metal flow deflector, two substrates, two force ventilated blower fans and two group of terminals; Described metal flow deflector is provided with air-flow passage; Described substrate is the plate of two insulation and thermal insulations; Described N-type semiconductor and P-type semiconductor are alternately interspersed between metal flow deflector; Air-flow passage on described adjacent two metal flow deflectors is vertical; Like this, separately, and metal flow deflector directly uses as radiator element in the cold and hot air channel of the semiconductor air conditioner rearranged according to said sequence, it is to increase the efficiency that semi-conductor freezes, safe and reliable non-environmental-pollution.
Description
Technical field
The present invention relates to a kind of thermoelectric refrigeration technical field with refrigeration, it is specifically related to a kind of semiconductor air conditioner.
Background technology
The current air-conditioning system for Regulate Environment temperature mainly consists of indoor heat exchanger and outdoor heat exchanger, this kind of air-conditioning system can realize the temperature adjusting to condensing agent by the highly energy-consuming of compressor in indoor heat exchanger, thus indirectly change indoor environment temperature, this kind of air-conditioning system does not accomplish good save energy, thus cause the unnecessary waste of electric energy, running cost remain high, and in using, environment is polluted by normal generation refrigerant external leakage.
Summary of the invention
For solving prior art Problems existing, the present invention provide a kind of structure simple, implement easily, the semiconductor air conditioner of energy-saving and emission-reduction, with the metal flow deflector on semi-conductor cooling piece directly as scatterer, the heat on semi-conductor cooling piece two sides with cold energy transport out, thus improve the heat radiation efficiency of conventional semiconductors cooling piece, reduce energy dissipation simultaneously and improve environment-friendly quality.
Technical solution problem of the present invention adopts following technical scheme:
A kind of semiconductor air conditioner, comprises multiple N-type semiconductor module and multiple P-type semiconductor module, it is characterised in that, also comprise multiple metal flow deflector, two substrates, two force ventilated blower fans, two wiring ends; Described metal flow deflector is provided with air-flow passage; Described two force ventilated blower fans comprise cold airduct draft fan (7) and hot air passage draft fan (8); Described substrate is the plate of two insulation and thermal insulations; Side and the substrate one (9) of described metal flow deflector one (31) are in close contact, and are provided with wiring end one (5) between metal flow deflector one (31) and substrate one (9); Another side of described metal flow deflector one (31) and the side of described N-type semiconductor module one (11) are in close contact; Another side of described N-type semiconductor module one (11) and the side of described metal flow deflector two (41) are in close contact; Another side of described metal flow deflector two (41) and the side of described P-type semiconductor module one (21) are in close contact; Another side of described P-type semiconductor module one (21) and the side of described metal flow deflector three (32) are in close contact; Another side of described metal flow deflector three (32) and the side of described N-type semiconductor module two (12) are in close contact; Another side of described N-type semiconductor module two (12) and the side of described metal flow deflector four (42) are in close contact; Another side of described metal flow deflector four (42) and the side of described P-type semiconductor module two (22) are in close contact; Another side of described P-type semiconductor module two (22) and the side of described metal flow deflector five (33) are in close contact; Another side and the substrate two (10) of described metal flow deflector five (33) are in close contact, and are provided with wiring end two (6) between metal flow deflector five (33) and substrate two (10); Like this, described multiple N-type semiconductor module, multiple P-type semiconductor module, multiple metal flow deflector install a composition semiconductor air conditioner according to said sequence arrangement.
The above metal flow deflector (31; 32; 33) the air-flow passage being provided with and described metal flow deflector (41; 42) the air-flow passage being provided with is vertical; Described cold airduct draft fan (7) lays respectively on above-described two groups of vertical air channels with described hot air passage draft fan (8).
The above N-type semiconductor module is a monoblock N-type semiconductor.
The above N-type semiconductor module is the integrated a bulk of N-type semiconductor module group of multiple little N-type semiconductor block, and is provided with the material of thermal insulation, insulation between adjacent little N-type semiconductor block.
The above P-type semiconductor module is a monoblock P-type semiconductor.
The above P-type semiconductor module is the integrated a bulk of P-type semiconductor module group of multiple little P-type semiconductor block, and is provided with the material of thermal insulation, insulation between adjacent little P-type semiconductor block.
The wiring end one (5) of the above pilot circuit and semiconductor air conditioner, wiring end two (6), cold airduct draft fan (7) are connected with hot air passage draft fan (8).
The present invention is compared with prior art, the metal flow deflector of the present invention both can provide pole plate for semi-conductor cooling piece, again can directly as heat exchanger, can be in close contact mutually with the hot face of the system of semi-conductor cooling piece and chill surface respectively, increase the hot face of system and the heat radiation area of chill surface of semi-conductor cooling piece, it is to increase semi-conductor cooling piece refrigerating efficiency; By the design of the air-flow passage on metal flow deflector, separating with cold heat of heat in N-type and P-type semiconductor module group can be carried, the room that concentration of energy cold like this is got up and is transported to by the cold air-flow passage on metal flow deflector and needs heat radiation, thermal energy concentrates the air-flow channel transfer by the heat on metal flow deflector to go out, ensure that the job stability of semi-conductor cooling piece, this semiconductor air conditioner can be applied to the heat radiation temperature control in the fields such as base station, machine room and large-scale electrical equipment.
Accompanying drawing explanation
Fig. 1 is the internal structure schematic diagram of semiconductor air conditioner of the present invention.
Fig. 2 is the structural representation of the present invention.
In figure: (11) N-type semiconductor module one; (12) N-type semiconductor module two; (21) P-type semiconductor module one; (22) P-type semiconductor module two; (31) metal flow deflector one; (32) metal flow deflector three; (33) metal flow deflector five; (41) metal flow deflector two; (42) metal flow deflector four; (5) wiring end one; (6) wiring end two; (7) cold airduct draft fan; (8) hot air passage draft fan; (9) substrate one; (10) substrate two.
Embodiment
The internal structure schematic diagram of semiconductor air conditioner of the present invention as shown in Figure 1, comprise N-type semiconductor module one (11), N-type semiconductor module two (12), P-type semiconductor module one (21), P-type semiconductor module two (22), metal flow deflector one (31), metal flow deflector three (32), metal flow deflector five (33), metal flow deflector two (41), metal flow deflector four (42), wiring end one (5), wiring end two (6), cold airduct draft fan (7), hot air passage draft fan (8), substrate one (9), substrate two (10) and pilot circuit, described metal flow deflector is provided with air-flow passage, described two force ventilated blower fans comprise cold airduct draft fan (7) and hot air passage draft fan (8), described substrate is the plate of two insulation and thermal insulations, side and the substrate one (9) of described metal flow deflector one (31) are in close contact, and are provided with wiring end one (5) between metal flow deflector one (31) and substrate one (9), another side of described metal flow deflector one (31) and the side of described N-type semiconductor module one (11) are in close contact, another side of described N-type semiconductor module one (11) and the side of described metal flow deflector two (41) are in close contact, another side of described metal flow deflector two (41) and the side of described P-type semiconductor module one (21) are in close contact, another side of described P-type semiconductor module one (21) and the side of described metal flow deflector three (32) are in close contact, another side of described metal flow deflector three (32) and the side of described N-type semiconductor module two (12) are in close contact, another side of described N-type semiconductor module two (12) and the side of described metal flow deflector four (42) are in close contact, another side of described metal flow deflector four (42) and the side of described P-type semiconductor module two (22) are in close contact, another side of described P-type semiconductor module two (22) and the side of described metal flow deflector five (33) are in close contact, another side and the substrate two (10) of described metal flow deflector five (33) are in close contact, and are provided with wiring end two (6) between metal flow deflector five (33) and substrate two (10), like this, described multiple N-type semiconductor module, multiple P-type semiconductor module, multiple metal flow deflector install a composition semiconductor air conditioner according to said sequence arrangement.
If Fig. 2 is the structural representation of the present invention, when the semiconductor air conditioner of the present invention works, pilot circuit is that N-type semiconductor module group, P-type semiconductor module group, cold airduct draft fan (7) and hot air passage draft fan (8) carry suitable electric current; Then needing the warm air in the space of heat radiation to carry out heat exchange by the chill surface in cold airduct draft fan (7) air channel, place and semi-conductor cooling piece, such warm air is transported to the space needing heat radiation after cooling; Cold air carries out heat exchange by the hot face of system of hot air passage draft fan (8) air channel, place and semi-conductor cooling piece, carry out the cold air after heat exchange to be transferred out, so endlessly the thermal energy of indoor is transferred out, reduce temperature in room, reach the object of refrigeration; Owing to metal flow deflector both can provide pole plate for semi-conductor cooling piece, again can directly as heat exchanger, can be in close contact mutually with the hot face of the system of semi-conductor cooling piece and chill surface respectively, increase the hot face of system and the heat radiation area of chill surface of semi-conductor cooling piece, it is to increase semi-conductor cooling piece refrigerating efficiency.
Claims (7)
1. a semiconductor air conditioner, comprises multiple N-type semiconductor module and multiple P-type semiconductor module, it is characterised in that, also comprise multiple metal flow deflector, two substrates, two force ventilated blower fans, two wiring ends; Described metal flow deflector is provided with air-flow passage; Described two force ventilated blower fans comprise cold airduct draft fan (7) and hot air passage draft fan (8); Described substrate is the plate of two insulation and thermal insulations; Side and the substrate one (9) of metal flow deflector one (31) are in close contact, and are provided with wiring end one (5) between metal flow deflector one (31) and substrate one (9); Another side of metal flow deflector one (31) and the side of N-type semiconductor module one (11) are in close contact; Another side of N-type semiconductor module one (11) and the side of metal flow deflector two (41) are in close contact; Another side of metal flow deflector two (41) and the side of P-type semiconductor module one (21) are in close contact; Another side of P-type semiconductor module one (21) and the side of metal flow deflector three (32) are in close contact; Another side of metal flow deflector three (32) and the side of N-type semiconductor module two (12) are in close contact; Another side of N-type semiconductor module two (12) and the side of metal flow deflector four (42) are in close contact; Another side of metal flow deflector four (42) and the side of P-type semiconductor module two (22) are in close contact; Another side of P-type semiconductor module two (22) and the side of metal flow deflector five (33) are in close contact; Another side and the substrate two (10) of metal flow deflector five (33) are in close contact, and are provided with wiring end two (6) between metal flow deflector five (33) and substrate two (10); Like this, multiple N-type semiconductor module, multiple P-type semiconductor module, multiple metal flow deflector install a composition semiconductor air conditioner according to said sequence arrangement.
2. a kind of semiconductor air conditioner according to claim 1, being further characterized in that, the air-flow passage that the air-flow passage that described metal flow deflector one (31), metal flow deflector three (32) are provided with metal flow deflector five (33) is provided with described metal flow deflector two (41) and metal flow deflector four (42) is vertical; Described cold airduct draft fan (7) and described hot air passage draft fan (8) lay respectively on above-described two groups of vertical gas circulation roads.
3. a kind of semiconductor air conditioner according to claim 1, is further characterized in that, described N-type semiconductor module is a monoblock N-type semiconductor.
4. a kind of semiconductor air conditioner according to claim 1, it is further characterized in that, described N-type semiconductor module is the integrated a bulk of N-type semiconductor module group of multiple little N-type semiconductor block, and is provided with the material of thermal insulation, insulation between adjacent little N-type semiconductor block.
5. a kind of semiconductor air conditioner according to claim 1, is further characterized in that, described P-type semiconductor module is a monoblock P-type semiconductor.
6. a kind of semiconductor air conditioner according to claim 1, it is further characterized in that, described P-type semiconductor module is the integrated a bulk of P-type semiconductor module group of multiple little P-type semiconductor block, and is provided with the material of thermal insulation, insulation between adjacent little P-type semiconductor block.
7. a kind of semiconductor air conditioner according to claim 1, is further characterized in that, the wiring end one (5) of pilot circuit and semiconductor air conditioner, wiring end two (6), cold airduct draft fan (7) are connected with hot air passage draft fan (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310575755.XA CN103542478B (en) | 2013-11-18 | 2013-11-18 | A kind of semiconductor air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310575755.XA CN103542478B (en) | 2013-11-18 | 2013-11-18 | A kind of semiconductor air conditioner |
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| Publication Number | Publication Date |
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| CN103542478A CN103542478A (en) | 2014-01-29 |
| CN103542478B true CN103542478B (en) | 2016-06-01 |
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| CN201310575755.XA Active CN103542478B (en) | 2013-11-18 | 2013-11-18 | A kind of semiconductor air conditioner |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109798649A (en) * | 2018-11-30 | 2019-05-24 | 陈柏年 | Semiconductor full heat recovery device, fresh air ventilator and rotary dehumidifier |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2648360Y (en) * | 2003-08-11 | 2004-10-13 | 孟友良 | Energy saving green air conditioner for vehicle |
| CN1556912A (en) * | 2001-07-20 | 2004-12-22 | 谒磨技术株式会社 | Heat exchanger assembly and heat exchange manifold |
| CN101055109A (en) * | 2006-09-29 | 2007-10-17 | 曹爱国 | Thermoelectric air conditioning unit and thermoelectric air conditioner possessing same |
| CN201764602U (en) * | 2010-09-01 | 2011-03-16 | 谢建祥 | Semiconductor air conditioner |
| CN203628890U (en) * | 2013-11-18 | 2014-06-04 | 北京德能恒信科技有限公司 | Semiconductor air conditioner |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU8249498A (en) * | 1997-06-04 | 1998-12-21 | Obschestvo S Ogranichennoi Otvetstvennostyu Mak-Bet | Thermo-electric battery, thermo-electric cooling unit and device for heating andcooling a liquid |
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- 2013-11-18 CN CN201310575755.XA patent/CN103542478B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1556912A (en) * | 2001-07-20 | 2004-12-22 | 谒磨技术株式会社 | Heat exchanger assembly and heat exchange manifold |
| CN2648360Y (en) * | 2003-08-11 | 2004-10-13 | 孟友良 | Energy saving green air conditioner for vehicle |
| CN101055109A (en) * | 2006-09-29 | 2007-10-17 | 曹爱国 | Thermoelectric air conditioning unit and thermoelectric air conditioner possessing same |
| CN201764602U (en) * | 2010-09-01 | 2011-03-16 | 谢建祥 | Semiconductor air conditioner |
| CN203628890U (en) * | 2013-11-18 | 2014-06-04 | 北京德能恒信科技有限公司 | Semiconductor air conditioner |
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| Publication number | Publication date |
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| CN103542478A (en) | 2014-01-29 |
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Address after: 100041 Beijing, Badachu hi tech park, West Wells Road, building 9415, room 3, No., room 3 Patentee after: Beijing Science and Technology Co., Ltd. Germany To Hanson Address before: 100094 Beijing, Badachu hi tech park, West Wells Road, building 9415, room 3, No., room 3 Patentee before: Beijing Science and Technology Co., Ltd. Germany to Hanson |