CN103542280B - 发光设备 - Google Patents
发光设备 Download PDFInfo
- Publication number
- CN103542280B CN103542280B CN201310241333.9A CN201310241333A CN103542280B CN 103542280 B CN103542280 B CN 103542280B CN 201310241333 A CN201310241333 A CN 201310241333A CN 103542280 B CN103542280 B CN 103542280B
- Authority
- CN
- China
- Prior art keywords
- layer
- wavelength conversion
- light emitting
- light
- conversion layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
- F21V13/08—Combinations of only two kinds of elements the elements being filters or photoluminescent elements and reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120074659A KR101961310B1 (ko) | 2012-07-09 | 2012-07-09 | 발광 장치 |
| KR10-2012-0074659 | 2012-07-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103542280A CN103542280A (zh) | 2014-01-29 |
| CN103542280B true CN103542280B (zh) | 2017-12-08 |
Family
ID=48745811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310241333.9A Active CN103542280B (zh) | 2012-07-09 | 2013-06-18 | 发光设备 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9347650B2 (enExample) |
| EP (1) | EP2685496B1 (enExample) |
| JP (1) | JP2014017474A (enExample) |
| KR (1) | KR101961310B1 (enExample) |
| CN (1) | CN103542280B (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016029686A (ja) * | 2014-07-25 | 2016-03-03 | サンケン電気株式会社 | 発光装置 |
| KR20160017849A (ko) * | 2014-08-06 | 2016-02-17 | 서울바이오시스 주식회사 | 고출력 발광 장치 및 그 제조 방법 |
| KR102346157B1 (ko) * | 2015-03-23 | 2021-12-31 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 패키지 |
| TWI541472B (zh) | 2015-06-11 | 2016-07-11 | 友達光電股份有限公司 | 背光模組 |
| CN106907578A (zh) * | 2015-12-22 | 2017-06-30 | 鸿富锦精密工业(深圳)有限公司 | 照明装置 |
| US10235911B2 (en) * | 2016-01-12 | 2019-03-19 | Ford Global Technologies, Llc | Illuminating badge for a vehicle |
| JP6906914B2 (ja) * | 2016-08-31 | 2021-07-21 | エルジー ディスプレイ カンパニー リミテッド | 波長選択素子、光源装置及び表示装置 |
| CN106764927A (zh) * | 2016-12-17 | 2017-05-31 | 张清 | 反射灯罩以及led路灯 |
| KR102730359B1 (ko) * | 2017-01-25 | 2024-11-18 | 엘지이노텍 주식회사 | 광원 모듈 및 이를 구비한 조명 장치 |
| CN110612417A (zh) * | 2017-05-17 | 2019-12-24 | 夏普株式会社 | 背光单元、显示设备、背光单元的制造方法及背光单元的制造装置 |
| CN111081691B (zh) * | 2019-12-23 | 2025-08-05 | 南昌大学 | 一种多基色led光源的模组结构 |
| KR20210115236A (ko) | 2020-03-12 | 2021-09-27 | 엘지이노텍 주식회사 | 광원모듈 |
| US20240404998A1 (en) * | 2023-05-31 | 2024-12-05 | Creeled, Inc. | Cover structure for beamshaping for light emitting diode packages |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102203505A (zh) * | 2008-11-06 | 2011-09-28 | 皇家飞利浦电子股份有限公司 | 照明设备 |
| CN102270629A (zh) * | 2010-06-01 | 2011-12-07 | Lg伊诺特有限公司 | 发光器件封装及照明系统 |
| CN102299245A (zh) * | 2010-06-22 | 2011-12-28 | 日东电工株式会社 | 复合膜和使用该复合膜的半导体发光器件 |
| CN102460748A (zh) * | 2009-06-09 | 2012-05-16 | 飞利浦拉米尔德斯照明设备有限责任公司 | 具有远程磷光体层和反射基板的led |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004179601A (ja) * | 2002-11-22 | 2004-06-24 | Toshiaki Sakaida | 発光装置 |
| US7462502B2 (en) * | 2004-11-12 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelength converting element |
| TWI433344B (zh) * | 2004-12-24 | 2014-04-01 | Kyocera Corp | 發光裝置及照明裝置 |
| US7821194B2 (en) * | 2006-04-18 | 2010-10-26 | Cree, Inc. | Solid state lighting devices including light mixtures |
| JP4847793B2 (ja) | 2006-06-01 | 2011-12-28 | 京セラ株式会社 | 発光装置 |
| US7842960B2 (en) * | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
| TW200822403A (en) | 2006-10-12 | 2008-05-16 | Matsushita Electric Industrial Co Ltd | Light-emitting device and method for manufacturing the same |
| JP2008153466A (ja) * | 2006-12-18 | 2008-07-03 | Matsushita Electric Works Ltd | 発光装置 |
| US20090147513A1 (en) * | 2007-12-05 | 2009-06-11 | Lumination Llc | Backlighting led power devices |
| JP5113573B2 (ja) * | 2008-03-24 | 2013-01-09 | パナソニック株式会社 | Led照明装置 |
| TWI384651B (zh) | 2008-08-20 | 2013-02-01 | Au Optronics Corp | 發光二極體結構及其製造方法 |
| EP2412038B1 (en) * | 2009-03-19 | 2019-01-02 | Philips Lighting Holding B.V. | Illumination device with remote luminescent material |
| US8431423B2 (en) | 2009-07-16 | 2013-04-30 | Koninklijke Philips Electronics N.V. | Reflective substrate for LEDS |
| WO2011013188A1 (ja) * | 2009-07-27 | 2011-02-03 | 株式会社 東芝 | 発光装置 |
| JP2012009719A (ja) * | 2010-06-28 | 2012-01-12 | Kyocera Corp | 発光装置および照明装置 |
| WO2012011528A1 (ja) | 2010-07-22 | 2012-01-26 | 京セラ株式会社 | 発光装置および照明装置 |
| DE102010045390B4 (de) * | 2010-09-15 | 2025-07-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronisches Halbleiterbauteils |
| US8552454B2 (en) * | 2010-11-29 | 2013-10-08 | Epistar Corporation | Light-emitting device and light mixing device |
-
2012
- 2012-07-09 KR KR1020120074659A patent/KR101961310B1/ko active Active
-
2013
- 2013-03-15 US US13/836,941 patent/US9347650B2/en not_active Expired - Fee Related
- 2013-04-23 JP JP2013090216A patent/JP2014017474A/ja active Pending
- 2013-06-18 CN CN201310241333.9A patent/CN103542280B/zh active Active
- 2013-07-05 EP EP13175375.8A patent/EP2685496B1/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102203505A (zh) * | 2008-11-06 | 2011-09-28 | 皇家飞利浦电子股份有限公司 | 照明设备 |
| CN102460748A (zh) * | 2009-06-09 | 2012-05-16 | 飞利浦拉米尔德斯照明设备有限责任公司 | 具有远程磷光体层和反射基板的led |
| CN102270629A (zh) * | 2010-06-01 | 2011-12-07 | Lg伊诺特有限公司 | 发光器件封装及照明系统 |
| CN102299245A (zh) * | 2010-06-22 | 2011-12-28 | 日东电工株式会社 | 复合膜和使用该复合膜的半导体发光器件 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014017474A (ja) | 2014-01-30 |
| EP2685496B1 (en) | 2020-03-25 |
| KR101961310B1 (ko) | 2019-07-17 |
| US20140009930A1 (en) | 2014-01-09 |
| EP2685496A3 (en) | 2016-01-27 |
| EP2685496A2 (en) | 2014-01-15 |
| US9347650B2 (en) | 2016-05-24 |
| KR20140007209A (ko) | 2014-01-17 |
| CN103542280A (zh) | 2014-01-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210823 Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Leyu Semiconductor Co.,Ltd. Address before: Seoul, South Kerean Patentee before: LG INNOTEK Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Liyu Semiconductor Co.,Ltd. Country or region after: China Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee before: Suzhou Leyu Semiconductor Co.,Ltd. Country or region before: China |