CN103537822A - 一种预成型焊片喷涂用高浓度助焊剂 - Google Patents

一种预成型焊片喷涂用高浓度助焊剂 Download PDF

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CN103537822A
CN103537822A CN201310509895.7A CN201310509895A CN103537822A CN 103537822 A CN103537822 A CN 103537822A CN 201310509895 A CN201310509895 A CN 201310509895A CN 103537822 A CN103537822 A CN 103537822A
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scaling powder
spraying
acid
high concentration
preformed soldering
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CN103537822B (zh
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杜昆
叶富华
韩华
陆雁
赵锦业
黄耀林
陈明汉
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Guangzhou Hanyuan Microelectronic Packaging Material Co ltd
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GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co Ltd
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Priority to JP2016549607A priority patent/JP6334719B2/ja
Priority to PCT/CN2013/090917 priority patent/WO2015058456A1/zh
Priority to US15/031,283 priority patent/US20160250722A1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233Sheets, foils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615N-compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618Carboxylic acids or salts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/365Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paints Or Removers (AREA)
  • Nonmetallic Welding Materials (AREA)

Abstract

本发明提供了一种预成型焊片喷涂用高浓度助焊剂,该助焊剂的组成中不挥发份浓度高,不挥发份与溶剂的质量比可达6:4,保证小比表面积的预成型焊片经过助焊剂喷涂工艺后具有足够的涂覆量。该助焊剂各组成及其质量分数如下:成膜剂35-50%,活性物质1-20%,表面活性剂0.1-1.5%,染料0.005-0.02%,溶剂余量。本发明具有涂覆性能优良、涂覆量可控度高、活性适强、焊后活性物质残留少等优点,适用于各种预成型焊片的高效喷涂工艺和高可靠性焊接。

Description

一种预成型焊片喷涂用高浓度助焊剂
技术领域
本发明涉及助焊剂技术领域,特别涉及一种预成型焊片助焊剂,尤其适用于各种预成型焊片的高效喷涂工艺和高可靠性焊接。
背景技术
预成型焊片是一种可按要求制成不同的形状、大小和表面形态的精密成型的焊料,适用于小公差的各种制造过程,广泛应用于印制线路板(PCB)组装、连接器和终端设备、芯片连接、电源模块基板附着、过滤连接器和电子组件装配等领域。因此,预成型焊片通常用于对焊料的形状和质量有特殊要求的场合,可以做成任意尺寸和形状以满足客户的需要,由于预成型焊片具有形状多样性、可焊性好且能减少助焊剂飞溅、单独使用可以精确控制金属使用量等优点,被确定为焊接中技术革新的一种重要手段。
为实现理想的精确焊接效果,预成型焊片通常需要涂覆合适的助焊剂。助焊剂的涂覆不仅要准确、均匀,而且涂覆量要充足。通过喷涂的方式实现助焊剂的涂覆可提高生产效率,但低浓度的助焊剂不易在预成型焊片表面形成足够厚度的薄膜,成膜质量和活性都难以满足焊接要求。
关于预成型焊片使用的助焊剂,目前一些公开的发明专利也有涉及:
CN 103056556A提供了一种表面涂覆无卤素助焊剂的预成型焊片,无卤素液体助焊剂以其重量计由以下含量的组分组成:载体35-42%,表面润湿剂1.0-1.4 %,均匀剂0.5-1.2 %,活性剂0.3-0.5 %,树脂成膜剂0.1-1.0 %,增稠剂0.15-1.2 %,有机溶剂余量;载体为松香,表面润湿剂为T-80、TX-100和Span60,均匀剂为OP-10,活性剂为乙二酸、水杨酸和苹果酸,树脂成膜剂为聚丁二烯和聚氨脂,增稠剂为氢化蓖麻油,有机溶剂为沸点110℃以下的醇或酮;以涂覆所述助焊剂的预成型焊片重量为基准,所述助焊剂涂层含量为0.2-5.0 %。
US 5932030公开了一种与预成型焊片配合使用的助焊剂,其组成包括:松香,N-取代或非N取代-2吡咯烷酮,以及透明的高沸点酯溶剂。其中,N-取代或非N取代-2吡咯烷酮的质量分数为3-50%,酯溶剂质量分数不大于30%。
US 5984161提出了一种弹性助焊剂包覆预成型焊片及其制备工艺,用于预成型焊片的弹性助焊剂包覆层由以下各物质混合而成:1)5-30 wt%的硅酸钾,摩尔比K2O:SiO2=1:1.25-1.45;2)0.5-10 wt%的浓磷酸;3)0.1-5 wt%的硼酸;4)0-10 wt%的二氧化硅细粉;5)余量是作为粘结剂的水。
以上专利各具特点,但仍存在如下不足:1)助焊剂涂覆量和涂覆均匀性不易控制,特别是对于小比表面积的预成型焊片涂覆量不足,不适用于高效喷涂工艺;2)助焊剂活性低,应用范围小。
发明内容
 针对上述现有专利技术的不足,本发明提供一种预成型焊片喷涂用高浓度助焊剂,该助焊剂具有涂覆性能优良、涂覆量可控度高、活性适强、焊后活性物质残留少等特点。
本发明为解决上述技术问题所采用的技术方案是:一种预成型焊片喷涂用高浓度助焊剂,其各组成及质量分数为:成膜剂35-50%,活性物质1-20%,表面活性剂0.1-1.5%,染料0.005-0.02%,溶剂余量。
作为本发明的一种改进,本发明所述的成膜剂的质量分数为40-45%,所述的活性物质的质量分数为5-20%,所述的表面活性剂的质量分数为0.1-1%,所述的染料的质量分数为0.005-0.01%。
作为本发明的一种改进,本发明所述的成膜剂至少包括松香、聚乙二醇、丙烯酸树脂、丙烯酰胺树脂、酚醛树脂和醇酸树脂中的一种。
作为本发明的一种改进,本发明所述的松香至少包括氢化松香、水白松香、马来松香和丙烯酸改性松香中的一种。
作为本发明的一种改进,本发明所述的活性物质至少包括丁二酸、二溴丁二酸、己二酸、癸二酸、天冬氨酸、谷氨酸、乳酸、酒石酸、水杨酸、由有机胺与酸合成的盐中的一种。
作为本发明的一种改进,本发明所述的有机胺的碱度系数                                                
Figure 794225DEST_PATH_IMAGE001
作为本发明的一种改进,本发明所述的酸的酸度系数
Figure 189434DEST_PATH_IMAGE002
作为本发明的一种改进,本发明所述的表面活性剂至少包括烷基酚聚氧乙烯醚TX-10和OP-10、脂肪醇聚氧乙烯醚AEO-3和AEO-9、非离子氟碳表面活性剂FSN-100和FC-4430、二溴丁烯二醇中的一种。
作为本发明的一种改进,本发明所述的染料包括偶氮类和三苯甲烷类染料。
作为本发明的一种改进,本发明所述的溶剂至少包括乙醇、异丙醇、丁醇、乙二醇甲醚、乙酸丁酯中的一种。
本发明选用与预成型焊片结合力好的成膜剂,其常温下化学性质稳定,在喷涂成膜过程中不易脱落,而且经较长时间(如1年)的储存后结合力也不会明显下降。
活性物质在低温时基本不显示活性,而加热至焊接温度时可以有效地去除焊接面的氧化膜并防止再氧化。由有机胺与酸合成的盐是一种性能优良的活性物质,其活性可以通过选择不同的有机胺和酸进行调整,因而是本发明优选的一种活性物质,而且当与有机酸配合使用时会产生协同效应,效果更佳。此外,本发明所选的活性物质可根据被焊金属材料、焊片合金种类以及焊接工艺进行筛选组合,使其在焊料熔化或焊接结束时基本完全分解,保证焊后活性物质残留少及可靠性高。
为使预成型焊片在焊接过程中更好地铺展,本发明添加了一种或多种表面活性剂以降低焊料的表面张力。
在助焊剂中加入少量的染料有助于判断助焊剂在预成型焊片表面的涂覆量及涂覆均匀度,从而提高了助焊剂涂覆的可控度。偶氮类和三苯甲烷类染料具有十分良好的助焊剂染色及分辨效果,因此成为本发明优选的两种染料。
溶剂既是助焊剂配制时的必要组成,又是助焊剂成膜过程必需脱除的部分,这决定了溶剂不仅要对成膜剂(如松香等)和其他成分有很好的溶解力,而且在干燥成膜时要有合适的挥发速率。挥发速率过大会造成助焊剂膜出现针孔、褶皱和裂纹等不良现象,挥发速率过小则会引起发黏和边缘变厚等弊病。本发明选择沸点低而挥发速率较大的乙醇、异丙醇,以及沸点较高而挥发速率较小的丁醇、乙二醇甲醚、乙酸丁酯作为溶剂,通过适当组合搭配即可满足实际的需要,而且所选溶剂具有溶解力强、毒性小、价格低等优点。
与现有技术相比,本发明有益效果显著。本发明的成膜剂和溶剂涂覆性能优良,价廉环保;通过添加染料提高助焊剂涂覆的可控度,与预成型焊片的高精度使用要求十分匹配;活性物质可以通过筛选组合调整活性,适用范围广;不挥发份浓度高(不挥发份与溶剂的质量比可达6:4),保证小比表面积的预成型焊片经过助焊剂喷涂工艺后具有足够的涂覆量;焊后活性物质残留少,不用清洗,适用于各种预成型焊片的高效喷涂工艺和高可靠性焊接。
具体实施方式
实施例1
本发明的组成及其质量分数如下:
成膜剂:氢化松香  40%
活性物质:丁二酸  2%
          己二酸  4%
          水杨酸  2%
          环己胺盐酸盐  1%
表面活性剂:TX-10  0.2%
            二溴丁烯二醇  0.4%
染料:偶氮胂  0.01%
溶剂:乙醇  35%
      乙二醇甲醚  15.4%
常温下,将以上组分混合均匀制成液体助焊剂,用喷涂的方式涂覆于SnCu0.7长方形预成型焊片上,80℃下烘干。所制得的预成型焊片的助焊剂膜厚度均匀,结合力强;对预成型焊片的焊接润湿性好,焊后活性物质残留少。
实施例2
本发明的组成及其质量分数如下:
成膜剂:水白松香  40%
        聚乙二醇  8%
        醇酸树脂  2%
活性物质:二乙胺对甲苯磺酸盐  1%
表面活性剂:AEO-9  0.5%
            二溴丁烯二醇  1%
染料:乙基紫  0.02%
溶剂:异丙醇  35%
      丁醇  12.5%
常温下,将以上组分混合均匀制成液体助焊剂,用喷涂的方式涂覆于SnAg3Cu0.5圆形预成型焊片上,80℃下烘干。所制得的预成型焊片的助焊剂膜厚度均匀,结合力强;对预成型焊片的焊接润湿性好,焊后活性物质残留少。
实施例3
本发明的组成及其质量分数如下:
成膜剂:氢化松香  30%
        马来松香  3%
        酚醛树脂  2%
活性物质:二溴丁二酸  4%
          天冬氨酸  4%
          乳酸  2%
          二甲胺丙二酸盐  4%
表面活性剂:FSN-100  0.5%
            二溴丁烯二醇  0.5%
染料:结晶紫  0.005%
溶剂:乙醇  35%
      乙酸丁酯  15%
常温下,将以上组分混合均匀制成液体助焊剂,用喷涂的方式涂覆于SnCu2圆环形预成型焊片上,80℃下烘干。所制得的预成型焊片的助焊剂膜厚度均匀,结合力强;对预成型焊片的焊接润湿性好,焊后活性物质残留少。
实施例4
本发明的组成及其质量分数如下:
成膜剂:水白松香  30%
        丙烯酸改性松香  5%
        丙烯酸树脂  5%
活性物质:二溴丁二酸  2%
          癸二酸  4%
          谷氨酸  2%
          酒石酸  4%
          乙醇胺柠檬酸盐  8%
表面活性剂:FC-4430  0.1%
染料:亮绿  0.01%
溶剂:乙醇  25%
      乙二醇甲醚  14.9%
常温下,将以上组分混合均匀制成液体助焊剂,用喷涂的方式涂覆于SnSb5 U形预成型焊片上,80℃下烘干。所制得的预成型焊片的助焊剂膜厚度均匀,结合力强;对预成型焊片的焊接润湿性好,焊后活性物质残留少。
需要说明的是以上实施例均是本发明的较佳实施例,并不是用来限定本发明的保护范围,对于本领域的技术人员来说,在上述实施例的基础上作出的简单的替换均属于本发明权利要求的保护范围。

Claims (9)

1.一种预成型焊片喷涂用高浓度助焊剂,其特征在于:所述助焊剂的各组成及质量分数为:成膜剂35-50%,活性物质1-20%,表面活性剂0.1-1.5%,染料0.005-0.02%,溶剂余量。
2.根据权利要求1所述的预成型焊片喷涂用高浓度助焊剂,其特征在于:所述的成膜剂至少包括松香、聚乙二醇、丙烯酸树脂、丙烯酰胺树脂、酚醛树脂和醇酸树脂中的一种。
3.根据权利要求2所述的预成型焊片喷涂用高浓度助焊剂,其特征在于:所述的松香至少包括氢化松香、水白松香、马来松香和丙烯酸改性松香中的一种。
4.根据权利要求1所述的预成型焊片喷涂用高浓度助焊剂,其特征在于:所述的活性物质至少包括丁二酸、二溴丁二酸、己二酸、癸二酸、天冬氨酸、谷氨酸、乳酸、酒石酸、水杨酸、由有机胺与酸合成的盐中的一种。
5. 根据权利要求4所述的预成型焊片喷涂用高浓度助焊剂,其特征在于:所述的有机胺的碱度系数                                                
Figure 606028DEST_PATH_IMAGE001
6.根据权利要求4所述的预成型焊片喷涂用高浓度助焊剂,其特征在于:所述的酸的酸度系数
7.根据权利要求1所述的预成型焊片喷涂用高浓度助焊剂,其特征在于:所述的表面活性剂至少包括烷基酚聚氧乙烯醚TX-10和OP-10、脂肪醇聚氧乙烯醚AEO-3和AEO-9、非离子氟碳表面活性剂FSN-100和FC-4430、二溴丁烯二醇中的一种。
8.根据权利要求1所述的预成型焊片喷涂用高浓度助焊剂,其特征在于:所述的染料包括偶氮类和三苯甲烷类染料。
9.根据权利要求1所述的预成型焊片喷涂用高浓度助焊剂,其特征在于:所述的溶剂至少包括乙醇、异丙醇、丁醇、乙二醇甲醚、乙酸丁酯中的一种。
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104526186A (zh) * 2014-12-26 2015-04-22 苏州龙腾万里化工科技有限公司 一种SnZn系无铅钎料用新型助焊剂
CN105921911A (zh) * 2016-05-31 2016-09-07 深圳市唯特偶新材料股份有限公司 一种焊后少空洞的预成型焊片用助焊剂
JP2017064787A (ja) * 2015-09-30 2017-04-06 株式会社タムラ製作所 はんだ付け用フラックス組成物、太陽電池モジュールおよび電子基板
CN107262972A (zh) * 2017-07-04 2017-10-20 合肥安力电力工程有限公司 一种用于电路板焊接的助焊剂及其制备方法
CN107346742A (zh) * 2016-05-05 2017-11-14 中芯国际集成电路制造(天津)有限公司 晶圆凸块的制备方法
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JP7185175B1 (ja) 2022-06-08 2022-12-07 千住金属工業株式会社 フラックス

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4762573A (en) * 1984-07-20 1988-08-09 Ytkemiska Institutet Fluxing agent and soldering process
JPH09186449A (ja) * 1995-12-28 1997-07-15 Tamura Kaken Kk 低残さソルダペースト組成物及びリフローはんだ付方法
CN101003111A (zh) * 2007-01-16 2007-07-25 大连理工大学 一种SnZn系无铅钎料用助焊剂及其制备方法
JP2008110369A (ja) * 2006-10-30 2008-05-15 Arakawa Chem Ind Co Ltd クリームはんだ用フラックスおよびクリームはんだ
CN101224528A (zh) * 2008-01-21 2008-07-23 广州瀚源电子科技有限公司 一种电子贴装无铅焊膏用助焊剂及其制备方法
CN101224525A (zh) * 2008-01-21 2008-07-23 广州瀚源电子科技有限公司 一种无铅膏体焊接材料及其制备方法
CN102029488A (zh) * 2010-12-17 2011-04-27 广州瀚源电子科技有限公司 一种免洗型高温浸焊助焊剂
CN102728968A (zh) * 2012-04-24 2012-10-17 西安理工大学 一种用于无铅焊锡膏的非醇醚型助焊剂及其制备方法
CN103302422A (zh) * 2013-06-24 2013-09-18 无锡市彩云机械设备有限公司 无卤素低温锡焊膏
CN103302421A (zh) * 2013-06-24 2013-09-18 无锡市彩云机械设备有限公司 免清洗助焊剂及其锡焊膏

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4505421A (en) * 1981-10-05 1985-03-19 Raychem Corporation Soldering methods and devices
US5198038A (en) * 1990-05-15 1993-03-30 Hughes Aircraft Company Foaming flux for automatic soldering process
JPH09248693A (ja) * 1996-03-15 1997-09-22 Toyota Motor Corp はんだ付け部位における活性剤の分布検出方法、はんだ付け用フラックス、クリームはんだ
JP2002336993A (ja) * 2001-03-16 2002-11-26 Tamura Kaken Co Ltd ソルダペースト組成物及びリフローはんだ付方法
US20060043157A1 (en) * 2004-08-25 2006-03-02 Harima Chemicals, Inc. Flux for soldering, soldering method, and printed circuit board
JP2005169495A (ja) * 2003-11-18 2005-06-30 Yoshihiro Miyano プリフラックス、フラックス、ソルダーペースト及び鉛フリーはんだ付け体の製造方法
US20060180245A1 (en) * 2005-02-15 2006-08-17 Tippy Wicker Lead-free solder paste
CN101112736A (zh) * 2006-07-24 2008-01-30 科利泰电子(深圳)有限公司 无铅焊锡膏
CN101622094B (zh) * 2007-01-04 2014-03-19 弗赖斯金属有限公司 焊剂组合物
CN102581522A (zh) * 2012-02-28 2012-07-18 河南科技大学 一种ZnSn系无铅钎料用松香基助焊剂及制备方法
CN102794582B (zh) * 2012-08-15 2015-01-14 北京工业大学 一种与高熔点钎料配套使用的助焊剂及其配制方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4762573A (en) * 1984-07-20 1988-08-09 Ytkemiska Institutet Fluxing agent and soldering process
JPH09186449A (ja) * 1995-12-28 1997-07-15 Tamura Kaken Kk 低残さソルダペースト組成物及びリフローはんだ付方法
JP2008110369A (ja) * 2006-10-30 2008-05-15 Arakawa Chem Ind Co Ltd クリームはんだ用フラックスおよびクリームはんだ
CN101003111A (zh) * 2007-01-16 2007-07-25 大连理工大学 一种SnZn系无铅钎料用助焊剂及其制备方法
CN101224528A (zh) * 2008-01-21 2008-07-23 广州瀚源电子科技有限公司 一种电子贴装无铅焊膏用助焊剂及其制备方法
CN101224525A (zh) * 2008-01-21 2008-07-23 广州瀚源电子科技有限公司 一种无铅膏体焊接材料及其制备方法
CN102029488A (zh) * 2010-12-17 2011-04-27 广州瀚源电子科技有限公司 一种免洗型高温浸焊助焊剂
CN102728968A (zh) * 2012-04-24 2012-10-17 西安理工大学 一种用于无铅焊锡膏的非醇醚型助焊剂及其制备方法
CN103302422A (zh) * 2013-06-24 2013-09-18 无锡市彩云机械设备有限公司 无卤素低温锡焊膏
CN103302421A (zh) * 2013-06-24 2013-09-18 无锡市彩云机械设备有限公司 免清洗助焊剂及其锡焊膏

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104526186A (zh) * 2014-12-26 2015-04-22 苏州龙腾万里化工科技有限公司 一种SnZn系无铅钎料用新型助焊剂
JP2017064787A (ja) * 2015-09-30 2017-04-06 株式会社タムラ製作所 はんだ付け用フラックス組成物、太陽電池モジュールおよび電子基板
CN107346742A (zh) * 2016-05-05 2017-11-14 中芯国际集成电路制造(天津)有限公司 晶圆凸块的制备方法
CN105921911A (zh) * 2016-05-31 2016-09-07 深圳市唯特偶新材料股份有限公司 一种焊后少空洞的预成型焊片用助焊剂
CN107262972A (zh) * 2017-07-04 2017-10-20 合肥安力电力工程有限公司 一种用于电路板焊接的助焊剂及其制备方法
CN108465978A (zh) * 2018-03-22 2018-08-31 合肥安力电力工程有限公司 一种焊接用助焊剂组合物及其制备方法
CN108453435A (zh) * 2018-03-22 2018-08-28 合肥安力电力工程有限公司 一种低固免清洗助焊剂及其制备方法
CN108747090A (zh) * 2018-06-21 2018-11-06 上海华庆焊材技术有限公司 一种助焊胶及其制备方法、应用
CN108747090B (zh) * 2018-06-21 2020-12-08 上海华庆焊材技术有限公司 一种助焊胶及其制备方法、应用
CN109048121A (zh) * 2018-09-08 2018-12-21 佛山皖和新能源科技有限公司 一种光伏组件用助焊剂
CN113084393A (zh) * 2021-04-21 2021-07-09 兰州理工大学 一种用于金属材料焊接的抗氧化助焊剂
CN113084393B (zh) * 2021-04-21 2022-06-17 兰州理工大学 一种用于金属材料焊接的抗氧化助焊剂
CN116787023A (zh) * 2023-08-01 2023-09-22 广东中实金属有限公司 一种预成型焊片及其制备方法
CN116787023B (zh) * 2023-08-01 2023-12-19 广东中实金属有限公司 一种预成型焊片及其制备方法

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