CN103531449B - 一种能提升冶金级硅片少子寿命的扩散工艺 - Google Patents
一种能提升冶金级硅片少子寿命的扩散工艺 Download PDFInfo
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- CN103531449B CN103531449B CN201310522023.4A CN201310522023A CN103531449B CN 103531449 B CN103531449 B CN 103531449B CN 201310522023 A CN201310522023 A CN 201310522023A CN 103531449 B CN103531449 B CN 103531449B
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- diffusion
- nitrogen
- silicon chip
- temperature
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- 238000009792 diffusion process Methods 0.000 title claims abstract description 95
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 56
- 239000010703 silicon Substances 0.000 title claims abstract description 56
- 238000005516 engineering process Methods 0.000 title claims abstract description 32
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 37
- 239000001301 oxygen Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 27
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 68
- 229910052757 nitrogen Inorganic materials 0.000 claims description 34
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 claims description 24
- 239000010453 quartz Substances 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 9
- 239000012298 atmosphere Substances 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 125000004437 phosphorous atom Chemical group 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 13
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 13
- 239000011574 phosphorus Substances 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 10
- 238000005247 gettering Methods 0.000 abstract description 10
- 238000005272 metallurgy Methods 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000002161 passivation Methods 0.000 abstract description 4
- 238000003892 spreading Methods 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000010583 slow cooling Methods 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/228—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a liquid phase, e.g. alloy diffusion processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Photovoltaic Devices (AREA)
- Silicon Compounds (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310522023.4A CN103531449B (zh) | 2013-10-29 | 2013-10-29 | 一种能提升冶金级硅片少子寿命的扩散工艺 |
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CN201310522023.4A CN103531449B (zh) | 2013-10-29 | 2013-10-29 | 一种能提升冶金级硅片少子寿命的扩散工艺 |
Publications (2)
Publication Number | Publication Date |
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CN103531449A CN103531449A (zh) | 2014-01-22 |
CN103531449B true CN103531449B (zh) | 2016-03-02 |
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CN201310522023.4A Active CN103531449B (zh) | 2013-10-29 | 2013-10-29 | 一种能提升冶金级硅片少子寿命的扩散工艺 |
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CN (1) | CN103531449B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104120494A (zh) * | 2014-06-25 | 2014-10-29 | 上饶光电高科技有限公司 | 一种适用于提升晶体硅太阳能电池转换效率的扩散工艺 |
CN104752564A (zh) * | 2015-04-02 | 2015-07-01 | 中建材浚鑫科技股份有限公司 | 一种提高多晶硅开路电压的新型扩散工艺 |
CN107256828A (zh) * | 2017-05-16 | 2017-10-17 | 扬州晶新微电子有限公司 | 一种提高三极管k值的磷硅玻璃退火工艺 |
CN113206169A (zh) * | 2021-04-18 | 2021-08-03 | 安徽华晟新能源科技有限公司 | 一种铝吸杂方法和铝吸杂设备 |
CN113555464B (zh) * | 2021-05-31 | 2023-03-10 | 天津爱旭太阳能科技有限公司 | 一种抑制载流子注入衰减的晶体硅太阳能电池制备方法 |
Citations (7)
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CN101132033A (zh) * | 2007-10-08 | 2008-02-27 | 苏州阿特斯阳光电力科技有限公司 | 一种制造太阳能电池的磷扩散方法 |
EP2048716A2 (en) * | 2007-10-08 | 2009-04-15 | CSI Cells Co. Ltd. | A process of phosphorus diffusion for manufacturing solar cell |
CN101494251A (zh) * | 2009-03-02 | 2009-07-29 | 苏州阿特斯阳光电力科技有限公司 | 一种制造精炼冶金多晶硅太阳能电池的磷扩散方法 |
CN101587918A (zh) * | 2009-04-02 | 2009-11-25 | 常州天合光能有限公司 | 冶金级多晶硅太阳能电池磷扩散工艺 |
CN102153090A (zh) * | 2011-05-19 | 2011-08-17 | 厦门大学 | 一种冶金法n型多晶硅片硼吸杂方法 |
CN102509748A (zh) * | 2011-11-30 | 2012-06-20 | 合肥晶澳太阳能科技有限公司 | 一种降低冶金级硅太阳能电池暗电流的扩散工艺 |
CN103117328A (zh) * | 2013-02-01 | 2013-05-22 | 内蒙古日月太阳能科技有限责任公司 | 冶金多晶硅片磷吸杂方法及该法制成的硅片和太阳能电池 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080197454A1 (en) * | 2007-02-16 | 2008-08-21 | Calisolar, Inc. | Method and system for removing impurities from low-grade crystalline silicon wafers |
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2013
- 2013-10-29 CN CN201310522023.4A patent/CN103531449B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101132033A (zh) * | 2007-10-08 | 2008-02-27 | 苏州阿特斯阳光电力科技有限公司 | 一种制造太阳能电池的磷扩散方法 |
EP2048716A2 (en) * | 2007-10-08 | 2009-04-15 | CSI Cells Co. Ltd. | A process of phosphorus diffusion for manufacturing solar cell |
CN101494251A (zh) * | 2009-03-02 | 2009-07-29 | 苏州阿特斯阳光电力科技有限公司 | 一种制造精炼冶金多晶硅太阳能电池的磷扩散方法 |
CN101587918A (zh) * | 2009-04-02 | 2009-11-25 | 常州天合光能有限公司 | 冶金级多晶硅太阳能电池磷扩散工艺 |
CN102153090A (zh) * | 2011-05-19 | 2011-08-17 | 厦门大学 | 一种冶金法n型多晶硅片硼吸杂方法 |
CN102509748A (zh) * | 2011-11-30 | 2012-06-20 | 合肥晶澳太阳能科技有限公司 | 一种降低冶金级硅太阳能电池暗电流的扩散工艺 |
CN103117328A (zh) * | 2013-02-01 | 2013-05-22 | 内蒙古日月太阳能科技有限责任公司 | 冶金多晶硅片磷吸杂方法及该法制成的硅片和太阳能电池 |
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Inventor after: Ding Jiye Inventor after: An Baijun Inventor after: Wang Xiong Inventor after: Yuan Jiaxin Inventor after: Xie Yucai Inventor after: Chen Ganggang Inventor after: Yang Lili Inventor after: Yang Jia Inventor after: Wu Jian Inventor before: Yang Lili Inventor before: Yang Jia Inventor before: Wu Jian |
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