CN103484825A - Device for sputtering molding of electro-conductive film - Google Patents
Device for sputtering molding of electro-conductive film Download PDFInfo
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- CN103484825A CN103484825A CN201310480314.1A CN201310480314A CN103484825A CN 103484825 A CN103484825 A CN 103484825A CN 201310480314 A CN201310480314 A CN 201310480314A CN 103484825 A CN103484825 A CN 103484825A
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Abstract
The invention discloses a device for sputtering molding of an electro-conductive film in order to overcome the defects that the prior art is relatively long in production process and high in cost and needs more space and the thermal treatment process of the electro-conductive film has conveying tension which can cause that the film is subjected to tensile deformation and generates thermal contraction in use. The technical scheme has the following key points: the device is a vacuum closed chamber, and a special unwinding chamber, a sputtering chamber and a winding chamber are arranged in the vacuum closed chamber; the device is characterized in that a thermal treatment chamber is arranged between the sputtering chamber and the winding chamber, the thermal treatment chamber is separated from the sputtering chamber through a sputtering chamber clapboard with a seam, the thermal treatment chamber is separated from the winding chamber through a winding chamber clapboard with a seam, the electro-conductive film enters the thermal treatment chamber from the seam of the sputtering chamber clapboard for thermal treatment at first and then enters the winding chamber through the seam of the winding chamber clapboard, the electro-conductive film is transferred in a natural suspended state in the thermal treatment chamber, and heaters are arranged on upper and lower sides of a natural suspended transfer path of the electro-conductive film in the thermal treatment chamber; a sputtering preheating chamber can also be arranged between the unwinding chamber and the sputtering chamber.
Description
Technical field
The present invention relates to the molding device of conductive film, specifically a kind of sputter shaped device of conductive film.
Background technology
Conductive film be a kind ofly be widely used at present flat pannel display, screen formula touch technology, solar panel, solar control film, the material of the numerous areas such as defrosting glass, ice glass, anti-static coating that prevent from hazing.Structure is that the one side at film substrate is attached with transparency conducting layer, adheres to conductive layer and can adopt the technique means such as sputter, pulsed laser deposition, vacuum evaporation, chemical vapour deposition, sol-gel method to realize.
The sputtering process of conductive film, at vacuum state, be filled with under the environment of rare gas element exactly, add high voltage direct current between plastic film base material (anode) and metal targets (negative electrode), the electron excitation rare gas element produced by glow discharge, produce plasma body the atom of metal targets is driven out of, be deposited on film substrate.Metal targets (negative electrode) can adopt the ITO(tin indium oxide), IGZO(Indium sesquioxide gallium zinc), ITiO(Indium sesquioxide titanium), the AZO(aluminum zinc oxide), ZnO(zinc oxide) in a kind of.
The sputter molding device of conductive film, just like the environment division in No. TW201250027A1st, Taiwan patent application, be vacuum sealing indoor be disposed with unreel chamber, sputter preheats chamber, the first sputtering chamber, the second sputtering chamber, rolling chamber, respectively be provided with the thin transmission roller of film in the first sputtering chamber and the second sputtering chamber, the outside of transmitting roller at film respectively is distributed with several metal targets negative electrodes, and the thin transmission of film that sputter preheats process is had tension force to transmit by some guide rollers.
Generally need to heat-treat (or claiming annealing) after the moulding of conductive film sputter, the one, for the transparency conducting layer that impels conductive film forms crystallization, to improve the work-ing life of conductive film; The 2nd, allow conductive film carry out thermal contraction in advance, avoid using there will be thermal contraction in the future.When the conductive film that entire volume is transmitted is heat-treated, if existing, the heat-processed of conductive film transmits tension force, the conductive film distortion that will be stretched, used and also can easily produce the thermal contraction phenomenon in the future, while transmitting overtension, also can cause transparency conducting layer to break.
Equipment for Heating Processing after the moulding of conductive film sputter, just like the environment division in No. TW201221363A1st, Taiwan patent application, is a technical scheme that can reduce the transmission tension force of conductive film heat-processed.Its heating unit adopts the Hot-blast Heating mode, be provided with the hot blast nozzle of a plurality of top-bottom cross to blowing in heating unit, conductive film do horizontal transmission when the process furnace because the air blast of hot blast nozzle top-bottom cross forms suspended state, thereby reduced the transmission tension force of heat-processed.It is not bery even that but heat-processed also can form some tension and the tension force of conductive film the conductive film air blast, so the heats of this elimination tension force is not good.
The shortcoming of using above-mentioned prior art to exist: the one, the equipment for Heating Processing after sputter molding device and sputter moulding is respectively independent means, causes whole conductive film production process longer, and production cost is higher, and the hold facility place is more; The 2nd, still there is certain transmission tension force in the conductive film heat treatment process, can cause conductive film to be stretched and be out of shape and easily generation thermal contraction of use in the future; The 3rd, the thin transmission of the pre-warmed film of sputter is to have tension force to transmit, and can cause conductive film to be stretched distortion and affects the sputter Forming Quality of conductive film; The 4th, several metal targets negative electrodes that are distributed in the film transmission roller outside are not separated, and can cause the sputter homogeneity poor.
Summary of the invention
Main purpose of the present invention is to provide a kind of sputter shaped device of improved conductive film, so that the whole conductive film production process that overcomes prior art is long, production cost is higher, the hold facility place is more and still there is certain transmission tension force in the conductive film heat treatment process, can cause be stretched distortion and in the future use the defect that easily produces thermal contraction of conductive film.Other purpose of the present invention is further improvement, with the thin transmission of the pre-warmed film of the sputter that overcomes prior art, is to have tension force to transmit, and causes conductive film to be stretched distortion and affects sputter Forming Quality and the inhomogeneity defect of sputter of conductive film.
The technical solution adopted for the present invention to solve the technical problems is: a kind of sputter shaped device of conductive film, it is a vacuum seal closed chamber, be provided with in it and unreel chamber, sputtering chamber and rolling chamber, be provided with the thin transmission roller of film in sputtering chamber, film transmits the roller outside and is distributed with several metal targets negative electrodes, film substrate is from unreeling the unreeling structure output of chamber, enter sputtering chamber and transmit the roller transmission around film, the particle sputter discharged by the metal targets negative electrode is on film substrate and become conductive film, then entering the rolling chamber is the rolling of rolling-up mechanism institute, it is characterized in that: between described sputtering chamber and rolling chamber, be provided with thermal chamber, between thermal chamber and sputtering chamber, by the sputtering chamber's dividing plate with sealing, separated, between thermal chamber and rolling chamber, by the rolling chamber dividing plate with sealing, separated, conductive film be first from the sealing of sputtering chamber's dividing plate enters thermal chamber and heat-treats ability enter the rolling chamber from the sealing of rolling chamber dividing plate, conductive film is transmitted with natural overhang, the place, both sides up and down of the transfer path that naturally dangles of the inherent conductive film of thermal chamber is provided with well heater.
The described vacuum sealing of technique scheme is indoor can coordinate with unreeling structure, film transmission roller and rolling-up mechanism etc. the transfer path that forms film substrate and conductive film thereof by some transfer rollers.
The sealing place that the sealing place of inherent sputtering chamber of the described sputtering chamber of technique scheme dividing plate can be provided with a pair of transfer rate restriction roller, the inherent sputtering chamber of thermal chamber dividing plate can be provided with the limiting roll that dangles, the indoor sealing place at rolling chamber dividing plate of described rolling can be provided with in a pair of transfer rate restriction roller, heating chamber can be provided with at the sealing place of rolling chamber dividing plate the limiting roll that dangles, and transfer rate limits roller and can be comprised of the nip drum of a pair of dynamic driving.
The back of the well heater of both sides up and down on the transfer path that naturally dangles of the inherent conductive film of the described thermal chamber of technique scheme can be provided with water cooler, make conductive film after heating before touching the limiting roll that dangles, first obtain coolingly, the film surface is produced to detrimentally affect when avoiding conductive film excess Temperature contact to dangle limiting roll.
The inherent corresponding section, bottom of dangling with conductive film of the described thermal chamber of technique scheme can be provided with the photo-sensor of measuring the bottom position that dangles.
Technique scheme is described to be unreeled between chamber and sputtering chamber and can be provided with sputter and preheat chamber, sputter preheats chamber and unreels between chamber and separated by the chamber dividing plate that unreels with sealing, sputter preheats and preheats the chamber dividing plate by the sputter with sealing between chamber and sputtering chamber and separate, film substrate is that the sealing that first ability preheats the chamber dividing plate from sputter from the sealing that unreels the chamber dividing plate enters the sputter chamber of preheating and preheated enters sputtering chamber, film substrate preheats and is indoorly transmitted with natural overhang at sputter, the place, both sides up and down that sputter preheats the indoor transfer path that naturally dangles at film substrate is provided with well heater.
Technique scheme is described to be unreeled the indoor sealing place unreeling the chamber dividing plate and can be provided with that a pair of transfer rate limits roller, sputter preheats the indoor sealing place unreeling the chamber dividing plate and can be provided with the limiting roll that dangles, the sealing place that the inherent sputter of described sputtering chamber preheats the chamber dividing plate can be provided with a pair of transfer rate and limit roller, sputter and preheat the indoor sealing place that preheats the chamber dividing plate at sputter and can be provided with the limiting roll that dangles, and transfer rate limits roller and can be comprised of the nip drum of a pair of dynamic driving.
The described sputter of technique scheme preheats and indoorly in the corresponding section, bottom of dangling with film substrate, can be provided with the photo-sensor of measuring the bottom position that dangles.
Sputtered surfaces one side for the treatment of that in the described sputtering chamber of technique scheme, can transmit film substrate incision place on roller at film is provided with electricity slurry treater.Electricity slurry treater is reactive behavior, wetting property and the tackiness for the treatment of sputtered surfaces for improving film substrate.
Can between every two adjacent metal target cathode, be provided with dividing plate in the described sputtering chamber of technique scheme.
The described metal targets negative electrode of technique scheme can be plate electrode or cylindrical electrode, can also adopt two electrodes.
Beneficial effect of the present invention: the one, owing between sputtering chamber and rolling chamber, being provided with thermal chamber, between thermal chamber and sputtering chamber, by the sputtering chamber's dividing plate with sealing, separated, between thermal chamber and rolling chamber, by the rolling chamber dividing plate with sealing, separated, conductive film be first from the sealing of sputtering chamber's dividing plate enters thermal chamber and heat-treats ability enter the rolling chamber from the sealing of rolling chamber dividing plate, so the sputter moulding process of conductive film and the thermal treatment process after the sputter moulding can complete on same equipment, whole conductive film production process is short, reduced production cost, minimizing equipment using area, the 2nd, with natural overhang, transmitted, so conductive film is in tension-free state in the process of thermal treatment heating indoor, conductive film can be in the distortion that not be stretched of when heating like this, also can reach the better effect of thermal contraction in advance, solve and used the upper problem that easily produces thermal contraction in the future, the 3rd, because thermal chamber is also in vacuum state, be provided with the well heater of thermal radiation heating in thermal chamber simultaneously, the heat-processed conductive film can not be shaken and by inflation, so film substrate can not touch the well heater of upper and lower both sides, so just can all be provided with well heater at the place, both sides up and down of the transfer path that naturally dangles of film substrate, thereby improve thermal contraction uniformity coefficient and the heating efficiency of conductive film, the 4th, can be provided with sputter and preheat chamber owing to unreeling between chamber and sputtering chamber, film substrate preheats and is indoorly transmitted with natural overhang at sputter, the place, both sides up and down that sputter preheats the indoor transfer path that naturally dangles at film substrate is provided with well heater, so the thin transmission of the pre-warmed film of sputter is also to transmit without tension force, avoid conductive film to preheat process at sputter and be stretched distortion and be subject to during at sputter thermal contraction to produce gauffer, affected the sputter Forming Quality, the 5th, can between every two adjacent metal target cathode, be provided with dividing plate in sputtering chamber, can effectively improve the homogeneity of sputter moulding.
Below in conjunction with drawings and Examples, the invention will be further described.
The accompanying drawing explanation
Fig. 1 is the schematic diagram of an embodiment of the present invention.
Fig. 2 is the schematic diagram of the another kind of embodiment of the present invention.
In figure: 1, vacuum seal closed chamber; 2, unreel chamber; 3, sputtering chamber; 4, rolling chamber; 5, the thin transmission roller of film; 6, metal targets negative electrode; 7, film substrate; 8, unreeling structure; 9, conductive film; 10, rolling-up mechanism; 11, thermal chamber; 12, sealing; 13, sputtering chamber's dividing plate; 14, sealing; 15, rolling chamber dividing plate; 16,17 and 18, well heater; 19, transfer roller; 20, transfer rate limits roller; 21, the limiting roll that dangles; 22, transfer rate limits roller; 23, the limiting roll that dangles; 24, water cooler; 25, bottom dangling; 26 and 27, photo-sensor; 28, electricity slurry treater; 29, transfer rate photoelectric detector; 30, metal targets negative electrode; 31, dividing plate; 32, unreel chamber; 33, sputtering chamber; 34, sputter preheats chamber; 35, sealing; 36, unreel the chamber dividing plate; 37, sealing; 38, sputter preheats the chamber dividing plate; 39, film substrate; 40 and 41, well heater; 42, transfer rate limits roller; 43, the limiting roll that dangles; 44, transfer rate limits roller; 45, the limiting roll that dangles; 46, bottom dangling; 47 and 48, photo-sensor.
Embodiment
With reference to Fig. 1, the sputter shaped device of this conductive film, it is a vacuum seal closed chamber 1, be provided with in it and unreel chamber 2, sputtering chamber 3 and rolling chamber 4, be provided with the thin transmission roller 5 of film in sputtering chamber 3, film transmits roller 5 outsides and is distributed with several metal targets negative electrodes 6 etc., unreeling structure 8 outputs of film substrate 7 from unreeling chamber 2, enter sputtering chamber 3 and transmit roller 5 transmission around film, by the particle sputter of the releases such as metal targets negative electrode 6 on film substrate and become conductive film 9, then enter rolling chamber 4 for 10 rollings of rolling-up mechanism, it is characterized in that: between described sputtering chamber 3 and rolling chamber 4, be provided with thermal chamber 11, between thermal chamber 11 and sputtering chamber 3, by the sputtering chamber's dividing plate 13 with sealing 12, separated, between thermal chamber 11 and rolling chamber 4, by the rolling chamber dividing plate 15 with sealing 14, separated, conductive film 9 be first from the sealing 12 of sputtering chamber's dividing plate 13 enters thermal chamber 11 and heat-treats ability enter rolling chamber 4 from the sealing 14 of rolling chamber dividing plate 15, conductive film 9 is transmitted with natural overhang, the place, both sides up and down of the transfer path that naturally dangles of the inherent conductive film 9 of thermal chamber 11 is provided with well heater 16, 17, 18.
In addition, transmit roller 5 and rolling-up mechanism 10 etc. by some transfer roller 19 grades with unreeling structure 8, film in vacuum seal closed chamber 1 and coordinate the transfer path that forms film substrate 7 and conductive film 9 thereof; Sealing 12 places that sealing 12 places of inherent sputtering chamber of sputtering chamber 3 dividing plate 13 are provided with a pair of transfer rate restriction roller 20, the inherent sputtering chamber of thermal chamber 11 dividing plate 13 are provided with the limiting roll 21 that dangles; Sealing 14 places that sealing 14 places of inherent rolling chamber, rolling chamber 4 dividing plate 15 are provided with a pair of transfer rate restriction roller 22, the inherent rolling of thermal chamber 11 chamber dividing plate 15 are provided with the limiting roll 23 that dangles, and transfer rate limits roller 20 and 22 and all is comprised of the nip drum of a pair of dynamic driving; The back of the well heater of both sides up and down 16,17,18 on the transfer path that naturally dangles of the inherent conductive film 9 of thermal chamber 11 is provided with water cooler 24; Inherent 25 corresponding sections, bottom of dangling with conductive film 9 of thermal chamber 11 are provided with the photo-sensor 26,27 of measuring 25 positions, bottom of dangling etc.; Sputtered surfaces one side for the treatment of that the inherent film of sputtering chamber 3 transmits film substrate 7 incisions place on roller 5 also is provided with electricity slurry treater 28; The transfer path of the inherent conductive film 9 in rolling chamber 4 is provided with transfer rate photoelectric detector 29; Be equipped with dividing plate 31 etc. between sputtering chamber's 3 inherent every two adjacent metal target cathode 6,30 etc.
In use, unreeling structure 8 outputs of film substrate 7 from unreeling chamber 2, enter sputtering chamber 3 and transmit roller 5 transmission around film, by the particle sputter of the releases such as metal targets negative electrode 6 on film substrate 7 and become conductive film 9, then limit roller 20 by transfer rate and carry out the speed limit transmission, sealing 12 through sputtering chamber's dividing plate 13 enters thermal chamber 11, and be hung on dangle limiting roll 21 and 23 and do naturally to dangle transmission downwards, naturally the well heater 16 of transport process by upper and lower both sides dangles, 17, 18 heat-treat, through water cooler 24, carry out cooling again, then the sealing 14 through rolling chamber dividing plate 15 enters rolling chamber 4, for 10 rollings of rolling-up mechanism, photo-sensor 26, 27 grades feed back to pilot circuit at any time by 25 positions, bottom of dangling of conductive film 9, transfer rate photoelectric detector 29 feeds back to pilot circuit at any time by the conveyer line speed of conductive film 9, as complete machine, foundation is controlled in operation.
With reference to Fig. 2, the sputter shaped device of this conductive film, with the sputter shaped device of the conductive film of Fig. 1 relatively, its difference is: unreel and be provided with sputter between chamber 32He sputtering chamber 33 and preheat chamber 34, sputter preheats chamber 34 and unreels between chamber 32 and separated by the chamber dividing plate 36 that unreels with sealing 35, sputter preheats and preheats chamber dividing plate 38 by the sputter with sealing 37 between chamber 34Yu sputtering chamber 33 and separate, film substrate 39 is that the sealing 37 that first ability preheats chamber dividing plate 38 from sputter from the sealing 35 that unreels chamber dividing plate 36 enters sputter and preheats chamber 34 and preheated enters sputtering chamber 33, film substrate 39 is transmitted with natural overhang, the place, both sides up and down that sputter preheats the transfer path that naturally dangles of the inherent film substrate 39 in chamber 34 is provided with well heater 40, 41 etc.
In addition, unreeling sealing 35 places that 32 inherences, chamber unreel chamber dividing plate 36 is provided with a pair of transfer rate and limits roller 42, sputter and preheat sealing 35 places that 34 inherences, chamber unreel chamber dividing plate 36 and be provided with the limiting roll 43 that dangles; Sealing 37 places that the inherent sputter of sputtering chamber 33 preheats chamber dividing plate 38 are provided with a pair of transfer rate and limit roller 44, sputter and preheat sealing 37 places that the inherent sputter in chamber 34 preheats chamber dividing plate 38 and be provided with the limiting roll 45 that dangles; Transfer rate limits roller 42 and 44 and all is comprised of the nip drum of a pair of dynamic driving; Sputter preheats inherent dangling 46 corresponding sections, bottom with film substrate 39, chamber 34 and is provided with the photo-sensor 47,48 of measuring 46 positions, bottom of dangling etc.
Other structures are identical with the sputter shaped device of the conductive film shown in Fig. 1.
In use, film substrate 39 is from unreeling the unreeling structure output of chamber 32, limit roller 42 by transfer rate and do the speed limit transmission, sealing 35 through unreeling chamber dividing plate 36 enters sputter and preheats chamber 34, and be hung on dangle limiting roll 43 and 45 and do naturally to dangle transmission downwards, naturally the well heater 40 of transport process by upper and lower both sides dangles, 41 grades are carried out front the preheating of sputter, then the sealing 37 of sputter through preheating chamber dividing plate 38 enters sputtering chamber 33, and after limiting roller 44 and make speed limit and transmit by transfer rate, upload and send around film transmission roller, carry out the sputter moulding, photo-sensor 47, 48 grades feed back to pilot circuit at any time by 46 positions, bottom of dangling of film substrate 39, as complete machine, foundation is controlled in operation.Other using method are identical with the sputter shaped device of the conductive film shown in Fig. 1.
Claims (9)
1. the sputter shaped device of a conductive film, it is a vacuum seal closed chamber, be provided with in it and unreel chamber, sputtering chamber and rolling chamber, be provided with the thin transmission roller of film in sputtering chamber, film transmits the roller outside and is distributed with several metal targets negative electrodes, film substrate is from unreeling the unreeling structure output of chamber, enter sputtering chamber and transmit the roller transmission around film, the particle sputter discharged by the metal targets negative electrode is on film substrate and become conductive film, then entering the rolling chamber is the rolling of rolling-up mechanism institute, it is characterized in that: between described sputtering chamber and rolling chamber, be provided with thermal chamber, between thermal chamber and sputtering chamber, by the sputtering chamber's dividing plate with sealing, separated, between thermal chamber and rolling chamber, by the rolling chamber dividing plate with sealing, separated, conductive film be first from the sealing of sputtering chamber's dividing plate enters thermal chamber and heat-treats ability enter the rolling chamber from the sealing of rolling chamber dividing plate, conductive film is transmitted with natural overhang, the place, both sides up and down of the transfer path that naturally dangles of the inherent conductive film of thermal chamber is provided with well heater.
2. press the sputter shaped device of conductive film claimed in claim 1, the sealing place that it is characterized in that inherent sputtering chamber of described sputtering chamber dividing plate is provided with the sealing place that a pair of transfer rate limits roller, the inherent sputtering chamber of thermal chamber dividing plate and is provided with the limiting roll that dangles, and the indoor sealing place at rolling chamber dividing plate of described rolling is provided with a pair of transfer rate and limits in roller, heating chamber and be provided with at the sealing place of rolling chamber dividing plate the limiting roll that dangles.
3. by the sputter shaped device of conductive film claimed in claim 1, it is characterized in that the back of the well heater of both sides up and down on the transfer path that naturally dangles of the inherent conductive film of described thermal chamber is provided with water cooler.
4. by the sputter shaped device of conductive film claimed in claim 1, it is characterized in that in described sputtering chamber that sputtered surfaces one side for the treatment of that can transmit film substrate incision place on roller at film is provided with electricity slurry treater.
5. by the sputter shaped device of conductive film claimed in claim 1, it is characterized in that being provided with dividing plate between inherent every two the adjacent metal target cathode of described sputtering chamber.
6. by the sputter shaped device of claim 1,2,3,4 or 5 described conductive films, it is characterized in that the inherent corresponding section, bottom of dangling with conductive film of described thermal chamber is provided with the photo-sensor of measuring the bottom position that dangles.
7. by claim 1, 2, 3, the sputter shaped device of 4 or 5 described conductive films, it is characterized in that described unreeling is provided with sputter between chamber and sputtering chamber and preheats chamber, sputter preheats chamber and unreels between chamber and separated by the chamber dividing plate that unreels with sealing, sputter preheats and preheats the chamber dividing plate by the sputter with sealing between chamber and sputtering chamber and separate, film substrate is that the sealing that first ability preheats the chamber dividing plate from sputter from the sealing that unreels the chamber dividing plate enters the sputter chamber of preheating and preheated enters sputtering chamber, film substrate preheats and is indoorly transmitted with natural overhang at sputter, the place, both sides up and down that sputter preheats the indoor transfer path that naturally dangles at film substrate is provided with well heater.
8. press the sputter shaped device of conductive film claimed in claim 7, it is characterized in that describedly unreeling the indoor sealing place unreeling the chamber dividing plate and being provided with that a pair of transfer rate limits roller, sputter preheats the indoor sealing place unreeling the chamber dividing plate and is provided with the limiting roll that dangles, the sealing place that the inherent sputter of described sputtering chamber preheats the chamber dividing plate is provided with a pair of transfer rate and limits roller, sputter and preheat the indoor sealing place that preheats the chamber dividing plate at sputter and be provided with the limiting roll that dangles.
9. by the sputter shaped device of conductive film claimed in claim 7, it is characterized in that described sputter preheats indoorly in the corresponding section, bottom of dangling with film substrate, to be provided with the photo-sensor of measuring the bottom position that dangles.
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| CN105063568A (en) * | 2015-07-21 | 2015-11-18 | 庄志杰 | Vapor deposition method for vertical single-drum normal-temperature large-area transparent conductive thin film |
| CN107215702A (en) * | 2017-06-09 | 2017-09-29 | 浙江汇锋薄膜科技有限公司 | A kind of air-flotation type film-guiding device on the Preparation equipment of conductive film |
| CN109082638A (en) * | 2018-09-18 | 2018-12-25 | 余泽军 | A kind of sputter molding machine of conductive film |
| CN109913827A (en) * | 2019-03-29 | 2019-06-21 | 太湖金张科技股份有限公司 | A kind of sputtering process protective device and its application method |
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| CN109082638A (en) * | 2018-09-18 | 2018-12-25 | 余泽军 | A kind of sputter molding machine of conductive film |
| CN109913827A (en) * | 2019-03-29 | 2019-06-21 | 太湖金张科技股份有限公司 | A kind of sputtering process protective device and its application method |
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