CN103447194B - A kind of automatically dropping glue curing apparatus and charger automatic assembly line - Google Patents
A kind of automatically dropping glue curing apparatus and charger automatic assembly line Download PDFInfo
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- CN103447194B CN103447194B CN201310384243.5A CN201310384243A CN103447194B CN 103447194 B CN103447194 B CN 103447194B CN 201310384243 A CN201310384243 A CN 201310384243A CN 103447194 B CN103447194 B CN 103447194B
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Abstract
The application relates to charger production technical field, in particular to a kind of automatically dropping glue curing apparatus and charger automatic assembly line, this automatically dropping glue curing apparatus comprises lifting feeding device, point glue equipment, solidification equipment and decline drawing mechanism, described point glue equipment comprises a glue frames, be arranged at the some glue connecting gear in described some glue frames, and be arranged at multiple glue applying mechanism of described some glue connecting gear, the solidification connecting gear that described solidification equipment comprises solidification frames and is arranged in described solidification frames, described solidification connecting gear is provided with the multiple temporarily providing rooms for temporarily storing PCB, the application provides some glue efficiency of a kind of unit interval high, and the automatically dropping glue curing apparatus that solidification cost is low, and a kind of quality effectively can guaranteeing charger is provided, and improve charger production efficiency, reduce the charger automatic assembly line that production cost is low.
Description
Technical field
The application relates to charger production technical field, particularly a kind of automatically dropping glue curing apparatus and charger automatic assembly line.
Background technology
Charger includes housing and is arranged at the PCB in housing.
Process of manufacturing for PCB in prior art generally includes following operation: the electronic devices and components organizing charger are welded on one piece of large PCB connecting plate by (1) more; (2) ICT test step, after relevant electronic devices and components are soldered to PCB connecting plate, carry out energising test respectively to the electronic devices and components on PCB connecting plate, determines whether each electronic devices and components can normally work; (3) foot-measuring high operation, measures the angle of the part on PCB connecting plate is high; (4) ACT test step, by the electronic devices and components of each group charger of PCB connecting plate integrally, carries out energising and tests, and determines often to organize that the electronic devices and components of charger are as a whole whether can normally work, to distinguish non-defective unit and defective products; (5) cutting sorting operation, cuts PCB connecting plate, and carries out automatic sorting according to the non-defective unit in test process and defective products, and non-defective unit then can enter next process; (6) put glue and curing process, a glue is carried out to the relative electronic components on single charger PCB, be cured after some glue completes.
Automatically dropping glue curing apparatus for carrying out a glue and solidification to PCB in prior art includes two parts, point glue equipment and solidification equipment respectively, in prior art, the some glue of each PCB carries out a glue by a point glue equipment, and then be cured the glue on PCB by the Curing assembly of solidification equipment.
The point glue of every block PCB is all carry out a glue by a point glue equipment, and every block PCB often has multiple region need to carry out a glue, after a region point glue is complete, then moves to other region and carry out a glue, the point glue efficiency of unit interval is low, and the production efficiency which results in charger is low; And solidification process have employed Curing assembly to the glue on PCB is cured, by the solidification of glue on the quickening PCB of Curing assembly, to reduce the time of solidification process, and Curing assembly often needs a large amount of electric energy, this just causes the increase of production cost, meanwhile, the Curing assembly parts that cost is higher in automatically dropping glue curing apparatus, adopt Curing assembly then to further increase production cost.
After PCB completes an adhesive curing, PCB is assembled in housing and forms a complete charger, then charger is delivered to automatic aging testing equipment respectively and functional test equipment is tested, after testing, just charger is packed.Wherein, automatic aging testing equipment is used for carrying out automatic aging to charger, and functional test equipment is used for carrying out high pressure and function electric parameter detecting to charger.
In prior art, the PCB of charger produces and charger test separately carries out, and reduce the production efficiency of charger, simultaneously the quality of product also cannot ensure.
Summary of the invention
It is high that one of object of the application is to provide some glue efficiency of a kind of unit interval, and the automatically dropping glue curing apparatus that solidification cost is low.
Two of the object of the application is to provide a kind of quality effectively can guaranteeing charger, and improves charger production efficiency, reduces the charger automatic assembly line that production cost is low.
One of object of the application is achieved through the following technical solutions:
Provide a kind of automatically dropping glue curing apparatus, comprise lifting feeding device, point glue equipment, solidification equipment and decline drawing mechanism,
Described point glue equipment comprises a glue frames, be arranged at the some glue connecting gear in described some glue frames, and be arranged at multiple glue applying mechanism of described some glue connecting gear, described some glue connecting gear comprises a glue transmission parts and the some glue drive motors for driving described some glue transmission parts to transmit, described some glue transmission parts is provided with the multiple loading fixtures for loading PCB, described multiple loading fixture drives to described solidification equipment place from described lifting feeding device with described some glue transmission parts successively, lifting feeding device place is back to from described solidification equipment again with described some glue transmission parts, described loading fixture divides and has territory, polylith glue application region, each glue applying mechanism is corresponding territory, a glue application region respectively,
The solidification connecting gear that described solidification equipment comprises solidification frames and is arranged in described solidification frames, described solidification connecting gear is provided with the multiple temporarily providing rooms for temporarily storing PCB, and described multiple temporarily providing room is driven to described decline drawing mechanism from described point glue equipment by described solidification connecting gear successively.
Wherein, described point glue equipment is provided with four, the setting and described four point glue equipments equidistantly distribute.
Wherein, described loading fixture is divided into territory, four pieces of glue application regions.
Wherein, described solidification connecting gear comprises the first solidification transfer assembly and the second solidification transfer assembly, described first solidification transfer assembly and described second solidification transfer assembly are equipped with the multiple temporarily providing rooms for temporarily storing PCB, its temporarily providing room transmits by described first solidification transfer assembly from the bottom up, its temporarily providing room transmits by described second solidification transfer assembly from top to bottom, the top of described first solidification transfer assembly and described second solidification transfer assembly is provided with auxiliary transmission assemblies, described auxiliary transmission assemblies is sent to the temporarily providing room at described second solidification transfer assembly top by being mounted with the temporarily providing room of PCB loading fixture from described first solidification transfer assembly top.
Wherein, described first solidification transfer assembly and described second solidification transfer assembly have included two groups of chain connecting gears, described two groups of chain connecting gears are oppositely arranged, often organize described chain connecting gear include chain and drive described chain drive motors, described chain is provided with multiple bearing part towards outside, forms a temporarily providing room when two bearing parts are relative in described two groups of chain connecting gears.
Wherein, often organize described chain connecting gear and comprise two parallel chains.
Wherein, described bearing part is the bearing part that L-type sheet metal component is formed.
Two of the object of the application is achieved through the following technical solutions:
Provide a kind of charger automatic production line that have employed above-mentioned automatically dropping glue curing apparatus, comprise ICT testing equipment, foot-measuring height equipment, ACT testing equipment, automatically point plate sorting arrangement and automatically dropping glue curing apparatus, PCB connecting plate is through the detection of described ICT testing equipment, described foot-measuring height equipment and described ACT testing equipment, and divide plate through described automatic point of plate sorting arrangement, sort out the PCB of charger, then PCB is delivered to described automatically dropping glue curing apparatus and carries out a glue and solidification.
Further, also comprise automatic assembly equipment, pre-functional test equipment, automatic aging testing equipment, functional test equipment and automated packaging equipment, complete the PCB after a glue and solidification process, enter automatic assembly equipment to be assembled into complete charger, charger detects through described pre-functional test equipment, automatic aging testing equipment and functional test equipment successively, after detection completes, by described automated packaging equipment, charger is packed automatically.
The beneficial effect of the application:
Described some glue connecting gear is provided with multiple glue applying mechanism, described some glue connecting gear can carry out a glue operation to the loading fixture of multiple PCB of being mounted with simultaneously, that is to say and can carry out a glue operation to the loading fixture of multiple PCB of being mounted with within the unit interval, improve the some glue efficiency in the unit interval.
The time that PCB stops in described solidification connecting gear is longer, when not needing Curing assembly to be cured, glue on PCB can complete solidification under natural state, decreases the use cost of Curing assembly, reduces the production cost of enterprise.Further, because temporarily providing room longitudinally arranges, avoid the problem that temporarily providing room laterally places land occupation area, greatly can reduce the land seizure area of equipment, reduce the cost of enterprise.
And have employed the charger automatic production line of this automatic curing apparatus, the manufacturing process of whole charger is all achieved automated production, effectively can guarantee the quality of charger, and improve charger production efficiency, reduce production cost low.
Accompanying drawing explanation
Utilize accompanying drawing to be described further the application, but the embodiment in accompanying drawing does not form any restriction to the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the following drawings.
Fig. 1 is the structural representation of a kind of automatically dropping glue curing apparatus of the application.
Fig. 2 is the structure for amplifying schematic diagram of A in Fig. 1.
Fig. 3 is the structural representation of solidification equipment in a kind of automatically dropping glue curing apparatus of the application.
Fig. 4 is B structure for amplifying schematic diagram in Fig. 3.
Include in Fig. 1 to Fig. 4:
1-is elevated feeding device, 21-point glue frames, 22-point glue connecting gear, 23-glue applying mechanism, 31-solidifies frames, 32-first solidifies transfer assembly, 311-chain, 312-chain drive motors, 313-bearing part, 33-second solidify transfer assembly, 34-auxiliary transmission assemblies, 4-decline drawing mechanism, 5-loading fixture, 6-temporarily providing room.
Detailed description of the invention
With the following Examples the application is further described.
embodiment 1
The detailed description of the invention of a kind of automatically dropping glue curing apparatus of the application, comprises lifting feeding device 1, point glue equipment, solidification equipment and decline drawing mechanism 4, as shown in Figures 1 to 4.
Described point glue equipment comprises a glue frames 21, be arranged at the some glue connecting gear 22 in described some glue frames 21, and be arranged at four glue applying mechanism 23 of described some glue connecting gear 22, the first glue applying mechanism 23 successively, second point gluing mechanism 23, thirdly gluing mechanism 23 and the 4th glue applying mechanism 23, described four glue applying mechanism 23 equidistantly distribute setting, described some glue connecting gear 22 is belt wheel connecting gear, the point glue drive motors that described some glue connecting gear 22 comprises a glue conveyer belt and transmit for drive point glue conveyer belt, described some glue conveyer belt is provided with the multiple loading fixtures 5 for loading PCB, described multiple loading fixture 5 drives to described solidification equipment place from described lifting feeding device 1 with described some glue conveyer belt successively, lifting feeding device 1 place is back to from described solidification equipment again with described some glue conveyer belt, and form a circulation.
Described loading fixture 5 is divided into territory, four pieces of glue application regions, is respectively a, b, c and d territory, glue application region everywhere, as shown in Figure 2, each glue applying mechanism 23 is corresponding territory, a glue application region respectively, and in this specific embodiment, territory, every block glue application region is placed with one piece of PCB.
The solidification connecting gear that described solidification equipment comprises solidification frames 31 and is arranged in described solidification frames 31, described solidification connecting gear comprises the first solidification transfer assembly 32 and the second solidification transfer assembly 33, described first solidification transfer assembly 32 and described second solidification transfer assembly 33 are equipped with 25 temporarily providing rooms 6 for temporarily storing PCB, corresponding temporarily providing room 6 transmits by described first solidification transfer assembly 32 from the bottom up, corresponding temporarily providing room 6 transmits by described second solidification transfer assembly 33 from top to bottom, the top of described solidification connecting gear is provided with auxiliary transmission assemblies 34, described auxiliary transmission assemblies 34 is sent to the temporarily providing room 6 at described second solidification transfer assembly 33 top from the temporarily providing room 6 at described first solidification transfer assembly 32 top by being mounted with PCB loading fixture 5.
Concrete, described first solidification transfer assembly 32 and described second solidification transfer assembly 33 have included two groups of chain connecting gears, often organize described chain connecting gear and include chain drive motors 312 and two parallel chains 311, described chain 311 is driven by chain drive motors 312, described chain 311 is provided with the bearing part 313 that 54 L-type sheet metal components are formed towards outside, described 12 temporarily providing rooms 6 are formed by 25 bearing parts 313 relative to interior side direction two in two groups of chain connecting gears.
The course of work of the automatically dropping glue curing apparatus of this specific embodiment is as follows:
For point glue equipment: first loading fixture 5 being mounted with PCB is delivered on the conveyer belt of described point glue equipment through described lifting feeding device 1, described loading fixture 5 moves in the transmission direction with described conveyer belt, and above conveyer belt, be provided with four glue applying mechanism 23, and described loading fixture 5 is divided into territory, four pieces of glue application regions, four glue applying mechanism 23 corresponding territories, a glue application region respectively, namely in a glue process, when loading fixture 5 moves to first glue applying mechanism 23 times, first glue applying mechanism 23 carries out a glue to territory, glue application region, a place, when loading fixture 5 moves to second point gluing mechanism 23 times, second glue applying mechanism 23 carries out a glue to territory, glue application region, b place, when loading fixture 5 move to thirdly gluing mechanism 23 times time, thirdly gluing mechanism 23 carries out a glue to territory, glue application region, c place, when loading fixture 5 moves to the 4th glue applying mechanism 23, 4th glue applying mechanism 23 carries out a glue to territory, glue application region, d place, thus the some glue completed PCB on loading fixture 5, each loading fixture 5 repeats above process.When first loading fixture 5 being mounted with PCB moves to second point gluing mechanism 23 times, then second loading fixture 5 being mounted with PCB is had to move to first glue applying mechanism 23 times, and by that analogy.Described some glue connecting gear 22 is provided with four glue applying mechanism 23, described some glue connecting gear 22 can carry out a glue operation to the loading fixture 5 that four are mounted with PCB simultaneously, that is to say and can carry out a glue operation to the loading fixture 5 that four are mounted with PCB within the unit interval, improve the some glue efficiency in the unit interval.
For solidification equipment: initial, the loading fixture 5 being mounted with PCB is delivered to the first solidification transfer assembly 32 through described point glue equipment, the temporarily providing room 6 docked with point glue equipment output in first solidification transfer assembly 32 is the first temporarily providing room 6, described chain drive motors 312 chain drive-belt 311 operates, this first temporarily providing room 6 moves up with chain 311, when the first temporarily providing room 6 moves to the top of described first solidification transfer assembly 32, described auxiliary transmission assemblies 34 is sent to from the first temporarily providing room 6 temporarily providing room 6 that described second solidifies transfer assembly 33 top by being mounted with PCB loading fixture 5, PCB loading fixture 5 will be mounted with by described second solidification transfer assembly 33 again to transmit from top to bottom, and be delivered to decline drawing mechanism 4.First temporarily providing room 6 temporarily providing room 6 is subsequently the second temporarily providing room 6, when the first temporarily providing room 6 moves, then the second temporarily providing room 6 moves and docks with described point glue equipment output.Wherein, when two corresponding carrying tablets go to relative, two corresponding carrying tablets enter the state forming temporarily providing room 6, when a two-phase corresponding carrying tablet goes to not relative, two corresponding carrying tablets then enter the state of temporarily providing room 6 to be formed, due to the continuous rotation of chain 311, two corresponding carrying tablets constantly circulate between the formation state of temporarily providing room 6 and the state of temporarily providing room to be formed 6.When this first temporarily providing room 6 moving to the top of described first solidification transfer assembly 32, bearing part 313 operates to outwardly with chain 311, and this bearing part 313 enters the state of temporarily providing room 6 to be formed simultaneously.The course of work that described second solidification transfer assembly 33 and described second solidifies transfer assembly 33 is similar.
In above-mentioned solidification equipment, described first solidification transfer assembly 32 and described second solidification transfer assembly 33 are provided with 25 temporarily providing rooms 6, described solidification connecting gear has 50 temporarily providing rooms 6, thus the time that PCB can be made to stop in described solidification connecting gear is longer, when not needing Curing assembly to be cured, glue on PCB can complete solidification under natural state, decreases the use cost of Curing assembly, reduces the production cost of enterprise.
Further, because temporarily providing room 6 longitudinally arranges, avoid the problem that temporarily providing room 6 laterally places land occupation area, greatly can reduce the land seizure area of equipment, reduce the cost of enterprise.
embodiment 2
The detailed description of the invention of a kind of charger automatic production line of the application, comprise ICT testing equipment, foot-measuring height equipment, ACT testing equipment, automatically point plate sorting arrangement and automatically dropping glue curing apparatus, PCB connecting plate is through the detection of described ICT testing equipment, described foot-measuring height equipment and described ACT testing equipment, and divide plate through described automatic point of plate sorting arrangement, sort out the PCB of charger, then PCB is delivered to automatically dropping glue curing apparatus described in embodiment 1 and carries out a glue and solidification.
Unaccounted feature in the present embodiment, adopts the explanation in embodiment 1, no longer repeats at this.
Further, also comprise automatic assembly equipment, pre-functional test equipment, automatic aging testing equipment, functional test equipment and automated packaging equipment, complete the PCB after a glue and solidification process, enter automatic assembly equipment to be assembled into complete charger, charger detects through described pre-functional test equipment, automatic aging testing equipment and functional test equipment successively, after detection completes, by described automated packaging equipment, charger is packed automatically.
Wherein said automatic assembly equipment, automatic aging testing equipment, functional test equipment and automated packaging equipment all belong to prior art.And pre-functional test equipment is identical with functional test equipment, be all for carrying out high pressure and function electric parameter detecting to charger.
After automatic aging testing equipment, functional test equipment and automated packaging equipment are received described automatically dropping glue curing apparatus, automatic assembly equipment and pre-functional test equipment are arranged in described automatically dropping glue curing apparatus and described automatic aging testing equipment simultaneously.
Because the time of automatic aging test is longer, before automatic aging test, pre-functional test is carried out to charger, automatic aging testing equipment is entered with exclusive segment defective products, avoid a large amount of defective products to enter described automatic aging testing equipment to test and the at substantial time, thus improve testing efficiency.
And the manufacturing process of whole charger all achieves automated production, effectively can guarantee the quality of charger, and improve charger production efficiency, reduce production cost low.
Finally should be noted that; above embodiment is only in order to illustrate the technical scheme of the application; but not the restriction to the application's protection domain; although done to explain to the application with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to the technical scheme of the application or equivalent replacement, and not depart from essence and the scope of technical scheme.
Claims (7)
1. an automatically dropping glue curing apparatus, comprises lifting feeding device, point glue equipment, solidification equipment and decline drawing mechanism, it is characterized in that:
Described point glue equipment comprises a glue frames, be arranged at the some glue connecting gear in described some glue frames, and be arranged at multiple glue applying mechanism of described some glue connecting gear, described some glue connecting gear comprises a glue transmission parts and the some glue drive motors for driving described some glue transmission parts to transmit, described some glue transmission parts is provided with the multiple loading fixtures for loading PCB, described multiple loading fixture drives to described solidification equipment place from described lifting feeding device with described some glue transmission parts successively, lifting feeding device place is back to from described solidification equipment again with described some glue transmission parts, described loading fixture divides and has territory, polylith glue application region, each glue applying mechanism is corresponding territory, a glue application region respectively,
The solidification connecting gear that described solidification equipment comprises solidification frames and is arranged in described solidification frames, described solidification connecting gear is provided with the multiple temporarily providing rooms for temporarily storing PCB, and described multiple temporarily providing room is driven to described decline drawing mechanism from described point glue equipment by described solidification connecting gear successively;
Described solidification connecting gear comprises the first solidification transfer assembly and the second solidification transfer assembly, described first solidification transfer assembly and described second solidification transfer assembly are equipped with the multiple temporarily providing rooms for temporarily storing PCB, its temporarily providing room transmits by described first solidification transfer assembly from the bottom up, its temporarily providing room transmits by described second solidification transfer assembly from top to bottom, the top of described solidification connecting gear is provided with auxiliary transmission assemblies, the loading fixture being mounted with PCB is sent to from the temporarily providing room at described first solidification transfer assembly top the temporarily providing room that described second solidifies transfer assembly top by described auxiliary transmission assemblies,
Described first solidification transfer assembly and described second solidification transfer assembly have included two groups of chain connecting gears, described two groups of chain connecting gears are oppositely arranged, often organize described chain connecting gear include chain and drive described chain drive motors, described chain is provided with multiple bearing part towards outside, forms a temporarily providing room when two bearing parts are relative in described two groups of chain connecting gears.
2. a kind of automatically dropping glue curing apparatus according to claim 1, is characterized in that: described glue applying mechanism is provided with four, the setting and described four glue applying mechanism equidistantly distribute.
3. a kind of automatically dropping glue curing apparatus according to claim 2, is characterized in that: described loading fixture is divided into territory, four pieces of glue application regions.
4. a kind of automatically dropping glue curing apparatus according to claim 1, is characterized in that: often organize described chain connecting gear and comprise two parallel chains.
5. a kind of automatically dropping glue curing apparatus according to claim 1, is characterized in that: described bearing part is the bearing part that L-type sheet metal component is formed.
6. a charger automatic production line, it is characterized in that: comprise ICT testing equipment, foot-measuring height equipment, ACT testing equipment, automatically point plate sorting arrangement and automatically dropping glue curing apparatus, PCB connecting plate is through the detection of described ICT testing equipment, described foot-measuring height equipment and described ACT testing equipment, and divide plate through described automatic point of plate sorting arrangement, sort out PCB, then PCB is delivered to described automatically dropping glue curing apparatus and carries out a glue and solidification, described automatically dropping glue curing apparatus is a kind of automatically dropping glue curing apparatus in claim 1 to 5 described in any one.
7. a kind of charger automatic production line according to claim 6, it is characterized in that: this charger automatic production line also comprises automatic assembly equipment, pre-functional test equipment, automatic aging testing equipment, functional test equipment and automated packaging equipment, complete the PCB after a glue and solidification process, enter automatic assembly equipment to be assembled into complete charger, charger detects through described pre-functional test equipment, automatic aging testing equipment and functional test equipment successively, after detection completes, by described automated packaging equipment, charger is packed automatically.
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| CN201310384243.5A CN103447194B (en) | 2013-08-29 | 2013-08-29 | A kind of automatically dropping glue curing apparatus and charger automatic assembly line |
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| CN201310384243.5A CN103447194B (en) | 2013-08-29 | 2013-08-29 | A kind of automatically dropping glue curing apparatus and charger automatic assembly line |
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| CN106206379A (en) * | 2016-07-28 | 2016-12-07 | 苏州高登威科技股份有限公司 | The automatically dropping glue solidification equipment of a kind of monocrystal silicon and automatically dropping glue curing |
| CN106206379B (en) * | 2016-07-28 | 2019-02-22 | 苏州高登威科技股份有限公司 | A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon |
| CN106216173A (en) * | 2016-09-05 | 2016-12-14 | 珠海市宏泰机械科技有限公司 | A kind of Full-automatic spot gluing, frictioning, unloader |
| CN106216173B (en) * | 2016-09-05 | 2018-12-04 | 珠海市宏泰机械科技有限公司 | A kind of Full-automatic spot gluing, frictioning, unloader |
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|---|---|
| CN103447194A (en) | 2013-12-18 |
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