CN106206379B - A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon - Google Patents
A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon Download PDFInfo
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- CN106206379B CN106206379B CN201610600935.2A CN201610600935A CN106206379B CN 106206379 B CN106206379 B CN 106206379B CN 201610600935 A CN201610600935 A CN 201610600935A CN 106206379 B CN106206379 B CN 106206379B
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- silicon
- solidification
- automatically dropping
- dropping glue
- curing
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- 238000007711 solidification Methods 0.000 title claims abstract description 112
- 239000003292 glue Substances 0.000 title claims abstract description 69
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 67
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 151
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 150
- 239000010703 silicon Substances 0.000 claims abstract description 150
- 238000009434 installation Methods 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims description 43
- 229920005989 resin Polymers 0.000 claims description 43
- 238000004891 communication Methods 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 7
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive Effects 0.000 description 1
- 238000011031 large scale production Methods 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The present invention provides the automatically dropping glue solidification equipment and automatically dropping glue curing method of a kind of monocrystalline silicon, the automatically dropping glue solidification equipment includes monocrystalline silicon automatic sticking machine and control system, the monocrystalline silicon automatic sticking machine includes discharge end, the automatically dropping glue solidification equipment further includes the solidification equipment to solidify the silicon wafer, the solidification equipment includes the primary solidification device being connected with the discharge end, the curing room of secondary curing is carried out to the silicon wafer after primary solidification device primary solidification and silicon wafer is moved to the indoor arm-and-hand system of solidification from primary solidification device；The primary solidification device includes the driving device of bracket, installation transport unit on the bracket and the driving transport unit, the silicon wafer from the transport unit close to one end of the discharge end run to the one end of the transport unit far from the discharge end after primary solidification complete；To realize the full-automatic production of silicon wafer, saves human cost and avoid the damage of silicon wafer, cause damages.
Description
Technical field
The present invention relates to a kind of monocrystalline silicon bonding machines more particularly to a kind of for realizing monocrystalline silicon in unmanned workshop
The cured automatically dropping glue solidification equipment of automatically dropping glue and automatically dropping glue curing method.
Background technique
When manufacturing silicon wafer, need the crystal silicon fixture, resin and the monocrystalline silicon that are used to fix monocrystalline silicon passing through glue
Water is bonded together in order.Currently, generally by the crystal silicon fixture, resin and monocrystalline silicon bonding being completed by manually
, so that the production efficiency of silicon wafer is low, cost of labor is relatively high, it is unfavorable for realizing the large-scale production of silicon wafer.
Meanwhile when the silicon wafer is just produced, glue not yet solidifies completely, at this point, being bonded in the silicon on resin
Piece is easy to the skew due to effect of external force (such as accidentally the touching of operating staff, the gently collision of handling process and other objects),
Reduce the qualification rate of silicon wafer.
In view of this, it is necessary to provide a kind of automatically dropping glue solidification equipment of new monocrystalline silicon and automatically dropping glue solidification sides
Method, to solve the above problems.
Summary of the invention
The purpose of the present invention is to provide a kind of automatically dropping glue solidification equipments and its operating method for realizing monocrystalline silicon.
For achieving the above object, the present invention adopts the following technical scheme: a kind of automatically dropping glue of monocrystalline silicon solidifies dress
Set, including for crystal silicon fixture, resin and monocrystalline silicon to be bonded together into silicon wafer monocrystalline silicon automatic sticking machine and control
System processed, the monocrystalline silicon automatic sticking machine includes discharge end, and the automatically dropping glue solidification equipment further includes described to solidify
The solidification equipment of silicon wafer, the solidification equipment include the primary solidification device being connected with the discharge end, to through primary solidification
Silicon wafer after device primary solidification carries out the curing room of secondary curing and silicon wafer is moved to curing room from primary solidification device
Interior arm-and-hand system；The primary solidification device includes bracket, described in installation transport unit and driving on the bracket
The driving device of transport unit, the silicon wafer run from the transport unit close to one end of the discharge end separate to the transport unit
Primary solidification is completed behind one end of the discharge end.
Technical solution as a further improvement of that present invention, the automatically dropping glue solidification equipment include multiple be set side by side
The discharge end of monocrystalline silicon automatic sticking machine, each monocrystalline silicon automatic sticking machine is connected with the transport unit.
Technical solution as a further improvement of that present invention, the extension of the extending direction of the transport unit and the discharge end
Direction is perpendicular.
Technical solution as a further improvement of that present invention, the automatically dropping glue solidification equipment further include positioned at described preliminary
Transition bench among solidification equipment and the curing room, the arm-and-hand system and the control system communication connection and the machine
Tool hand system includes removing crystal silicon fixture on the silicon wafer after primary solidification and moving the silicon wafer after the crystal silicon fixture is removed
It moves the first manipulator to transition bench and is transferred to solidification indoor the from transition bench for the silicon wafer after crystal silicon fixture is removed
Two manipulators.
Technical solution as a further improvement of that present invention, the curing room are interior with multiple to place to secondary curing
Silicon wafer solidification lattice, the solidification equipment include to sense it is described solidify no the first sensor in blank state of lattice,
First sensor and the control system communication connection, the control system are consolidated according to what first sensor sensed
The state for changing lattice controls second manipulator.
Technical solution as a further improvement of that present invention, the solidification equipment include to identify that silicon wafer secondary curing is
Second sensor of no completion, the automatically dropping glue solidification equipment further include described solid to remove the silicon wafer after secondary curing
Change the third manipulator of room；Second sensor and the third manipulator with the control system communication connection.
Technical solution as a further improvement of that present invention, the transport unit are made of several idler wheels, the driving device
For the motor for driving several idler wheel rotations.
For achieving the above object, the present invention also provides a kind of automatically dropping glue solidification sides of automatically dropping glue solidification equipment
Method, the automatically dropping glue solidification equipment are the automatically dropping glue solidification equipment of above-mentioned monocrystalline silicon, the automatically dropping glue curing method
Include the following steps:
S1: crystal silicon fixture, resin and monocrystalline silicon are bonded together into silicon wafer；
S2: primary solidification 2 hours；
S3: arm-and-hand system removes the crystal silicon fixture on the silicon wafer, and the silicon wafer is transferred in curing room and is carried out
Secondary curing 4h.
Technical solution as a further improvement of that present invention, the control system include to judge that fixture secondary curing is
Second sensor of no completion, the automatically dropping glue solidification equipment further include described solid to remove the silicon wafer after secondary curing
Change the third manipulator of room；Second sensor and the third manipulator with the control system communication connection；Institute
Stating automatically dropping glue curing method further includes following steps: after the completion of secondary curing, third manipulator takes out from the curing room
The silicon wafer.
Technical solution as a further improvement of that present invention, the monocrystalline silicon automatic sticking machine include monocrystalline silicon feeding system
System, crystal silicon fixture feeding system, resin feeding system, operating system and discharge system, the step S1 specifically include as follows
Step:
S11: the monocrystalline silicon feeding system, crystal silicon fixture feeding system, resin feeding system feeding are given；
S12: opening the dispenser system, gives the crystal silicon fixture glue spraying；
S13: it grabs a piece of resin and is placed on the crystal silicon fixture；
S14: opening the dispenser system, to glue spraying on the resin；
S15: it grabs a piece of monocrystalline silicon and is placed on the resin；
S16: the silicon wafer is delivered to discharge end through discharge system.
The beneficial effects of the present invention are: primary solidification device of the invention is by being arranged the transmission being connected with discharge end
Portion is directly entered transport unit progress tentatively so that being bonded after the silicon wafer to be formed is delivered to discharge end through monocrystalline silicon automatic sticking machine
Solidification, after the silicon wafer is moved to the one end of transport unit far from the discharge end, primary solidification is completed；In addition, of the invention
Automatically dropping glue solidification equipment is additionally provided with the curing room to the silicon wafer progress secondary curing after primary solidification and will be through tentatively solid
Silicon wafer after change is transferred to the indoor arm-and-hand system of solidification, to be moved to the transport unit far from the discharging in the silicon wafer
Behind the one end at end, the silicon wafer is transferred to curing room automatically by the arm-and-hand system, and the process of entire silicon wafer is not necessarily to people
Work operation, to realize automatically dropping glue and the solidification of monocrystalline silicon, i.e. the full-automatic production of silicon wafer has saved human cost and can
It avoids leading to the damage of silicon wafer just produced due to artificial operation in process of production, cause damages.
Detailed description of the invention
Fig. 1 is the flow chart of automatically dropping glue curing method of the invention.
Specific embodiment
Hereinafter, the present invention will be described in detail with reference to various embodiments shown in the accompanying drawings, please refers to shown in Fig. 1, for this
The better embodiment of invention.
The present invention provides a kind of automatically dropping glue solidification equipment of monocrystalline silicon, to realize the full-automatic production of silicon wafer, from
And reduce human cost and avoid leading to the damage of silicon wafer just produced due to artificial operation in process of production, it makes
At loss.
The automatically dropping glue solidification equipment includes that crystal silicon fixture, resin, monocrystalline silicon are bonded together into silicon wafer automatically
Monocrystalline silicon automatic sticking machine, cured solidification equipment and automatic with the monocrystalline silicon is carried out to the silicon wafer produced
The control system of the equal communication connection of bonding machine, solidification equipment.
The monocrystalline silicon automatic sticking machine include crystal silicon fixture feeding system, resin feeding system, monocrystalline silicon feeding system,
Operating system and discharge system.The operating system and the crystal silicon fixture feeding system, resin feeding system and monocrystalline
Silicon feeding system matches the automatic adhesive to realize the crystal silicon fixture, resin, monocrystalline silicon.
The crystal silicon fixture feeding system includes crystal silicon fixture stock shelf and is mounted on the crystal silicon fixture stock shelf
Transmission device.The transmission device includes feed end, and the discharge system is oppositely arranged with the feed end, and the discharging
System has the discharge end far from the feed end so that the silicon wafer that bonding is formed can be transferred to through the discharge system it is described
Discharge end.
The resin feeding system is provided with the resin fixture for placing the resin, and operator can pass through craft
Resin is placed in the resin fixture.
The operating system includes dispenser system and feeding manipulator system.The feeding manipulator system includes track
Module and the first feeding manipulator being mounted on the rail module, first feeding manipulator can be along the tracks
Module is slided to grab resin or monocrystalline silicon.
When using monocrystalline silicon automatic sticking machine, first respectively to the crystal silicon fixture feeding system, resin feeding system,
Monocrystalline silicon feeding system feeding, it may be assumed that be placed in the monocrystalline silicon on the transmission device of monocrystalline silicon feeding system, by crystal silicon fixture
It is placed in the feed end of crystal silicon fixture feeding system, the resin is placed on the resin fixture.The monocrystalline silicon is in institute
The intersection that the transmission device Yu the operating system are moved under the action of the transmission device of monocrystalline silicon feeding system is stated, it is described
Monocrystalline silicon fixture moves to the crystal silicon fixture feeding system and institute under the action of the transmission device of crystal silicon fixture feeding system
State the intersection of operating system.Then, the dispenser system is to the crystal silicon fixture glue spraying, and then, first feeding is mechanical
Hand is moved to right above the resin feeding system and catches a piece of resin, and is moved to the surface of the crystal silicon fixture again,
Resin is placed on the crystal silicon fixture, in this way, resin is just bonded on the crystal silicon fixture.And then, the dispensing system
For system again to the resin glue spraying, then first feeding manipulator, which is moved to right above the monocrystalline silicon, catches a piece of monocrystalline
Silicon, and the monocrystalline silicon is placed on the resin, in this way, the monocrystalline silicon bonds together with the resin, thus real
The sequentially bonding for having showed crystal silicon fixture, resin and monocrystalline silicon forms silicon wafer, work of the last silicon wafer in the discharge system
The discharge end is moved under.
The automatically dropping glue solidification equipment includes multiple monocrystalline silicon automatic sticking machines being set side by side, with can simultaneously to more
A crystal silicon fixture carries out dispensing operation to increase the working efficiency of the automatically dropping glue solidification equipment.It is described in present embodiment
Automatically dropping glue solidification equipment includes three monocrystalline silicon automatic sticking machines being set side by side.
The solidification equipment includes the primary solidification device of primary solidification being carried out to bonding silicon wafer, to through primary solidification
Rear silicon wafer carry out the curing room of secondary curing, the transition bench between primary solidification device and curing room and with the control
System processed communicates the arm-and-hand system of connection.
The primary solidification device includes the transport unit and the driving transport unit of bracket, installation on the bracket
Driving device.The discharge end of multiple monocrystalline silicon automatic sticking machines is connected with the transport unit, makes to pass through discharge system
The silicon wafer to discharge end is sent to be automatically transferred to the transport unit to carry out primary solidification.
The transport unit is made of several idler wheels, and the driving device is the motor of the driving idler wheel rotation.Pass through control
The velocity of rotation for making the idler wheel runs the silicon wafer to the transmission close to one end of the discharge end from the transport unit
Portion needs 2 hours far from one end of the discharge end, that is, makes 2 hours of the silicon wafer primary solidification.
Specifically, the extending direction of the transport unit and the extending direction of the discharge system are perpendicular, from each described
The silicon wafer that discharge end is moved to the transport unit slowly moves 2 hours in the transport unit, on the one hand, completes the silicon
The primary solidification of piece；On the other hand, when the silicon wafer is just produced, glue not yet solidifies completely, avoid the silicon wafer because
Movement speed is too fast, causes the silicon wafer to generate skew, reduces the qualification rate of the silicon wafer.
The arm-and-hand system include to remove the crystal silicon fixture on the silicon wafer after primary solidification and will remove described in
The first manipulator and be transferred to the silicon wafer being located on the transition bench that silicon wafer after crystal silicon fixture is moved on transition bench
Solidify indoor second manipulator.First manipulator, the second manipulator with the control system communication connection.
There are multiple solidification lattice to place the silicon wafer to secondary curing, the solidification equipment also wraps in the curing room
It includes to sense first sensor for solidifying lattice and whether being in blank state, first sensor and the control system
Communication connection.
The information of the solidification lattice in blank state sensed is fed back to the control by first sensor
System, when second manipulator needs for the silicon wafer to be transferred to progress secondary curing in the solidification lattice, the control
System controls second manipulator and the silicon wafer is transferred in the solidification lattice in blank state.
Further, the solidification equipment further includes the second sensing whether completed to identify the silicon wafer secondary curing
Device, the automatically dropping glue solidification equipment further include mechanical the silicon wafer after secondary curing is removed the third for solidifying lattice
Hand.
Second sensor and the third manipulator with the control system communication connection.Second sensing
Device by identify the silicon wafer be placed into it is described solidify the time in lattice judge the silicon wafer whether secondary curing completion, that is,
When the silicon wafer, which is put into the time solidified in lattice, reaches 4 hours, indicate that the silicon wafer complete by secondary curing.
After the completion of second sensor recognizes some and solidifies the silicon wafer secondary curing in lattice, feed back to described
Control system, the control system controls the third manipulator for the silicon chip extracting and is placed in warehouse, in the silicon wafer
After being placed in the warehouse, then silicon wafer production is completed.
As shown in Figure 1, automatically dropping glue curing method of the invention includes the following steps:
S1: crystal silicon fixture, resin and monocrystalline silicon are bonded together into silicon wafer；
S2: primary solidification 2 hours；
S3: arm-and-hand system removes the crystal silicon fixture on the silicon wafer, and the silicon wafer is transferred in curing room and is carried out
Secondary curing 4h.
S4: after the completion of secondary curing, third manipulator takes out the silicon wafer from the curing room.
Above-mentioned steps S1 specifically comprises the following steps:
S11: the monocrystalline silicon feeding system, crystal silicon fixture feeding system, resin feeding system feeding are given；
S12: opening the dispenser system, gives the crystal silicon fixture glue spraying；
S13: it grabs a piece of resin and is placed on the crystal silicon fixture；
S14: opening the dispenser system, to glue spraying on the resin；
S15: it grabs a piece of monocrystalline silicon and is placed on the resin；
S16: the silicon wafer is delivered to discharge end through discharge system.
In conclusion the transport unit that primary solidification device of the invention is connected by setting with discharge end, so that through
Monocrystalline silicon automatic sticking machine is bonded after the silicon wafer to be formed is delivered to discharge end and is directly entered transport unit progress primary solidification, described
After silicon wafer is moved to the one end of transport unit far from the discharge end, primary solidification is completed；In addition, automatically dropping glue of the invention solidifies
Device, which is additionally provided with, to carry out the curing room of secondary curing to the silicon wafer after primary solidification and turns the silicon wafer after primary solidification
The indoor arm-and-hand system of solidification is moved to, with after the silicon wafer is moved to the one end of the transport unit far from the discharge end,
The silicon wafer is transferred to curing room automatically by the arm-and-hand system, the process of entire silicon wafer without human intervention, with reality
The automatically dropping glue of existing monocrystalline silicon and solidification, the i.e. full-automatic production of silicon wafer, have saved human cost and can be avoided and producing
The damage of silicon wafer just produced is led to due to artificial operation in the process, is caused damages.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book
With the other embodiments of understanding.
The series of detailed descriptions listed above only for feasible embodiment of the invention specifically
Protection scope bright, that they are not intended to limit the invention, it is all without departing from equivalent implementations made by technical spirit of the present invention
Or change should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of automatically dropping glue solidification equipment of monocrystalline silicon, including for crystal silicon fixture, resin and monocrystalline silicon to bond together
The monocrystalline silicon automatic sticking machine and control system of silicon wafer are formed, the monocrystalline silicon automatic sticking machine includes discharge end, feature
Be: the automatically dropping glue solidification equipment further includes the solidification equipment to solidify the silicon wafer, the solidification equipment include with
Primary solidification device that the discharge end is connected carries out secondary curing to the silicon wafer after primary solidification device primary solidification
Curing room and silicon wafer is moved to the indoor arm-and-hand system of solidification from primary solidification device；The primary solidification device includes
The driving device of bracket, installation transport unit on the bracket and the driving transport unit, the silicon wafer is from the transmission
Portion close to one end of the discharge end run to the one end of the transport unit far from the discharge end after primary solidification complete.
2. automatically dropping glue solidification equipment as described in claim 1, it is characterised in that: the automatically dropping glue solidification equipment includes more
A monocrystalline silicon automatic sticking machine being set side by side, the discharge end of each monocrystalline silicon automatic sticking machine with the transport unit phase
Connection.
3. automatically dropping glue solidification equipment as claimed in claim 2, it is characterised in that: the extending direction of the transport unit with it is described
The extending direction of discharge end is perpendicular.
4. automatically dropping glue solidification equipment as described in claim 1, it is characterised in that: the automatically dropping glue solidification equipment further includes
Transition bench among the primary solidification device and the curing room, the arm-and-hand system and the control system communicate
Connection and the arm-and-hand system include the crystal silicon fixture removed on the silicon wafer after primary solidification and will remove the crystal silicon folder
The first manipulator and be transferred to the silicon wafer after dismounting crystal silicon fixture from transition bench that silicon wafer after tool is moved on transition bench
Solidify indoor second manipulator.
5. automatically dropping glue solidification equipment as claimed in claim 4, it is characterised in that: have in the curing room multiple to put
The solidification lattice of the silicon wafer to secondary curing are set, the solidification equipment includes to sense whether the solidification lattice are in blank state
The first sensor, first sensor and the control system communication connection, the control system is according to first sense
It surveys the state for solidifying lattice that device senses and controls second manipulator.
6. automatically dropping glue solidification equipment as described in claim 1, it is characterised in that: the solidification equipment includes to identify silicon
The second sensor whether piece secondary curing is completed, the automatically dropping glue solidification equipment further include to by the silicon after secondary curing
Piece removes the third manipulator of the curing room；Second sensor and the third manipulator with the control system
Communication connection.
7. automatically dropping glue solidification equipment as described in claim 1, it is characterised in that: the transport unit is made of several idler wheels,
The driving device is the motor of several idler wheel rotations of driving.
8. a kind of automatically dropping glue curing method of automatically dropping glue solidification equipment, it is characterised in that: the automatically dropping glue solidification equipment
For the automatically dropping glue solidification equipment of monocrystalline silicon described in claim 1, the automatically dropping glue curing method includes the following steps:
S1: crystal silicon fixture, resin and monocrystalline silicon are bonded together into silicon wafer；
S2: primary solidification 2 hours；
S3: arm-and-hand system removes the crystal silicon fixture on the silicon wafer, and the silicon wafer is transferred in curing room carry out it is secondary
Solidify 4h.
9. automatically dropping glue curing method as claimed in claim 8, it is characterised in that: the control system includes to judge to press from both sides
The second sensor for whether completing of tool secondary curing, the automatically dropping glue solidification equipment further include to by the silicon after secondary curing
Piece removes the third manipulator of the curing room；Second sensor and the third manipulator with the control system
Communication connection；The automatically dropping glue curing method further includes following steps: after the completion of secondary curing, third manipulator is from described solid
Change the indoor taking-up silicon wafer.
10. automatically dropping glue curing method as claimed in claim 8, it is characterised in that: the monocrystalline silicon automatic sticking machine includes
Monocrystalline silicon feeding system, crystal silicon fixture feeding system, resin feeding system, operating system and discharge system, the step S1
Specifically comprise the following steps:
S11: the monocrystalline silicon feeding system, crystal silicon fixture feeding system, resin feeding system feeding are given；
S12: opening the dispenser system, gives the crystal silicon fixture glue spraying；
S13: it grabs a piece of resin and is placed on the crystal silicon fixture；
S14: opening the dispenser system, to glue spraying on the resin；
S15: it grabs a piece of monocrystalline silicon and is placed on the resin；
S16: the silicon wafer is delivered to discharge end through discharge system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610600935.2A CN106206379B (en) | 2016-07-28 | 2016-07-28 | A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610600935.2A CN106206379B (en) | 2016-07-28 | 2016-07-28 | A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon |
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| CN106206379A CN106206379A (en) | 2016-12-07 |
| CN106206379B true CN106206379B (en) | 2019-02-22 |
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| CN201610600935.2A Active CN106206379B (en) | 2016-07-28 | 2016-07-28 | A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108816669B (en) * | 2018-08-20 | 2021-03-30 | 苏州高登威科技股份有限公司 | Automatic dispensing curing system and method for silicon rod |
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| CN106206379A (en) | 2016-12-07 |
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