CN106206379B - A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon - Google Patents

A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon Download PDF

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Publication number
CN106206379B
CN106206379B CN201610600935.2A CN201610600935A CN106206379B CN 106206379 B CN106206379 B CN 106206379B CN 201610600935 A CN201610600935 A CN 201610600935A CN 106206379 B CN106206379 B CN 106206379B
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silicon
solidification
automatically dropping
dropping glue
curing
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CN106206379A (en
Inventor
沈皓然
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Suzhou Gaodengwei Technology Co Ltd
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Suzhou Gaodengwei Technology Co Ltd
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

The present invention provides the automatically dropping glue solidification equipment and automatically dropping glue curing method of a kind of monocrystalline silicon, the automatically dropping glue solidification equipment includes monocrystalline silicon automatic sticking machine and control system, the monocrystalline silicon automatic sticking machine includes discharge end, the automatically dropping glue solidification equipment further includes the solidification equipment to solidify the silicon wafer, the solidification equipment includes the primary solidification device being connected with the discharge end, the curing room of secondary curing is carried out to the silicon wafer after primary solidification device primary solidification and silicon wafer is moved to the indoor arm-and-hand system of solidification from primary solidification device;The primary solidification device includes the driving device of bracket, installation transport unit on the bracket and the driving transport unit, the silicon wafer from the transport unit close to one end of the discharge end run to the one end of the transport unit far from the discharge end after primary solidification complete;To realize the full-automatic production of silicon wafer, saves human cost and avoid the damage of silicon wafer, cause damages.

Description

A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon
Technical field
The present invention relates to a kind of monocrystalline silicon bonding machines more particularly to a kind of for realizing monocrystalline silicon in unmanned workshop The cured automatically dropping glue solidification equipment of automatically dropping glue and automatically dropping glue curing method.
Background technique
When manufacturing silicon wafer, need the crystal silicon fixture, resin and the monocrystalline silicon that are used to fix monocrystalline silicon passing through glue Water is bonded together in order.Currently, generally by the crystal silicon fixture, resin and monocrystalline silicon bonding being completed by manually , so that the production efficiency of silicon wafer is low, cost of labor is relatively high, it is unfavorable for realizing the large-scale production of silicon wafer.
Meanwhile when the silicon wafer is just produced, glue not yet solidifies completely, at this point, being bonded in the silicon on resin Piece is easy to the skew due to effect of external force (such as accidentally the touching of operating staff, the gently collision of handling process and other objects), Reduce the qualification rate of silicon wafer.
In view of this, it is necessary to provide a kind of automatically dropping glue solidification equipment of new monocrystalline silicon and automatically dropping glue solidification sides Method, to solve the above problems.
Summary of the invention
The purpose of the present invention is to provide a kind of automatically dropping glue solidification equipments and its operating method for realizing monocrystalline silicon.
For achieving the above object, the present invention adopts the following technical scheme: a kind of automatically dropping glue of monocrystalline silicon solidifies dress Set, including for crystal silicon fixture, resin and monocrystalline silicon to be bonded together into silicon wafer monocrystalline silicon automatic sticking machine and control System processed, the monocrystalline silicon automatic sticking machine includes discharge end, and the automatically dropping glue solidification equipment further includes described to solidify The solidification equipment of silicon wafer, the solidification equipment include the primary solidification device being connected with the discharge end, to through primary solidification Silicon wafer after device primary solidification carries out the curing room of secondary curing and silicon wafer is moved to curing room from primary solidification device Interior arm-and-hand system;The primary solidification device includes bracket, described in installation transport unit and driving on the bracket The driving device of transport unit, the silicon wafer run from the transport unit close to one end of the discharge end separate to the transport unit Primary solidification is completed behind one end of the discharge end.
Technical solution as a further improvement of that present invention, the automatically dropping glue solidification equipment include multiple be set side by side The discharge end of monocrystalline silicon automatic sticking machine, each monocrystalline silicon automatic sticking machine is connected with the transport unit.
Technical solution as a further improvement of that present invention, the extension of the extending direction of the transport unit and the discharge end Direction is perpendicular.
Technical solution as a further improvement of that present invention, the automatically dropping glue solidification equipment further include positioned at described preliminary Transition bench among solidification equipment and the curing room, the arm-and-hand system and the control system communication connection and the machine Tool hand system includes removing crystal silicon fixture on the silicon wafer after primary solidification and moving the silicon wafer after the crystal silicon fixture is removed It moves the first manipulator to transition bench and is transferred to solidification indoor the from transition bench for the silicon wafer after crystal silicon fixture is removed Two manipulators.
Technical solution as a further improvement of that present invention, the curing room are interior with multiple to place to secondary curing Silicon wafer solidification lattice, the solidification equipment include to sense it is described solidify no the first sensor in blank state of lattice, First sensor and the control system communication connection, the control system are consolidated according to what first sensor sensed The state for changing lattice controls second manipulator.
Technical solution as a further improvement of that present invention, the solidification equipment include to identify that silicon wafer secondary curing is Second sensor of no completion, the automatically dropping glue solidification equipment further include described solid to remove the silicon wafer after secondary curing Change the third manipulator of room;Second sensor and the third manipulator with the control system communication connection.
Technical solution as a further improvement of that present invention, the transport unit are made of several idler wheels, the driving device For the motor for driving several idler wheel rotations.
For achieving the above object, the present invention also provides a kind of automatically dropping glue solidification sides of automatically dropping glue solidification equipment Method, the automatically dropping glue solidification equipment are the automatically dropping glue solidification equipment of above-mentioned monocrystalline silicon, the automatically dropping glue curing method Include the following steps:
S1: crystal silicon fixture, resin and monocrystalline silicon are bonded together into silicon wafer;
S2: primary solidification 2 hours;
S3: arm-and-hand system removes the crystal silicon fixture on the silicon wafer, and the silicon wafer is transferred in curing room and is carried out Secondary curing 4h.
Technical solution as a further improvement of that present invention, the control system include to judge that fixture secondary curing is Second sensor of no completion, the automatically dropping glue solidification equipment further include described solid to remove the silicon wafer after secondary curing Change the third manipulator of room;Second sensor and the third manipulator with the control system communication connection;Institute Stating automatically dropping glue curing method further includes following steps: after the completion of secondary curing, third manipulator takes out from the curing room The silicon wafer.
Technical solution as a further improvement of that present invention, the monocrystalline silicon automatic sticking machine include monocrystalline silicon feeding system System, crystal silicon fixture feeding system, resin feeding system, operating system and discharge system, the step S1 specifically include as follows Step:
S11: the monocrystalline silicon feeding system, crystal silicon fixture feeding system, resin feeding system feeding are given;
S12: opening the dispenser system, gives the crystal silicon fixture glue spraying;
S13: it grabs a piece of resin and is placed on the crystal silicon fixture;
S14: opening the dispenser system, to glue spraying on the resin;
S15: it grabs a piece of monocrystalline silicon and is placed on the resin;
S16: the silicon wafer is delivered to discharge end through discharge system.
The beneficial effects of the present invention are: primary solidification device of the invention is by being arranged the transmission being connected with discharge end Portion is directly entered transport unit progress tentatively so that being bonded after the silicon wafer to be formed is delivered to discharge end through monocrystalline silicon automatic sticking machine Solidification, after the silicon wafer is moved to the one end of transport unit far from the discharge end, primary solidification is completed;In addition, of the invention Automatically dropping glue solidification equipment is additionally provided with the curing room to the silicon wafer progress secondary curing after primary solidification and will be through tentatively solid Silicon wafer after change is transferred to the indoor arm-and-hand system of solidification, to be moved to the transport unit far from the discharging in the silicon wafer Behind the one end at end, the silicon wafer is transferred to curing room automatically by the arm-and-hand system, and the process of entire silicon wafer is not necessarily to people Work operation, to realize automatically dropping glue and the solidification of monocrystalline silicon, i.e. the full-automatic production of silicon wafer has saved human cost and can It avoids leading to the damage of silicon wafer just produced due to artificial operation in process of production, cause damages.
Detailed description of the invention
Fig. 1 is the flow chart of automatically dropping glue curing method of the invention.
Specific embodiment
Hereinafter, the present invention will be described in detail with reference to various embodiments shown in the accompanying drawings, please refers to shown in Fig. 1, for this The better embodiment of invention.
The present invention provides a kind of automatically dropping glue solidification equipment of monocrystalline silicon, to realize the full-automatic production of silicon wafer, from And reduce human cost and avoid leading to the damage of silicon wafer just produced due to artificial operation in process of production, it makes At loss.
The automatically dropping glue solidification equipment includes that crystal silicon fixture, resin, monocrystalline silicon are bonded together into silicon wafer automatically Monocrystalline silicon automatic sticking machine, cured solidification equipment and automatic with the monocrystalline silicon is carried out to the silicon wafer produced The control system of the equal communication connection of bonding machine, solidification equipment.
The monocrystalline silicon automatic sticking machine include crystal silicon fixture feeding system, resin feeding system, monocrystalline silicon feeding system, Operating system and discharge system.The operating system and the crystal silicon fixture feeding system, resin feeding system and monocrystalline Silicon feeding system matches the automatic adhesive to realize the crystal silicon fixture, resin, monocrystalline silicon.
The crystal silicon fixture feeding system includes crystal silicon fixture stock shelf and is mounted on the crystal silicon fixture stock shelf Transmission device.The transmission device includes feed end, and the discharge system is oppositely arranged with the feed end, and the discharging System has the discharge end far from the feed end so that the silicon wafer that bonding is formed can be transferred to through the discharge system it is described Discharge end.
The resin feeding system is provided with the resin fixture for placing the resin, and operator can pass through craft Resin is placed in the resin fixture.
The operating system includes dispenser system and feeding manipulator system.The feeding manipulator system includes track Module and the first feeding manipulator being mounted on the rail module, first feeding manipulator can be along the tracks Module is slided to grab resin or monocrystalline silicon.
When using monocrystalline silicon automatic sticking machine, first respectively to the crystal silicon fixture feeding system, resin feeding system, Monocrystalline silicon feeding system feeding, it may be assumed that be placed in the monocrystalline silicon on the transmission device of monocrystalline silicon feeding system, by crystal silicon fixture It is placed in the feed end of crystal silicon fixture feeding system, the resin is placed on the resin fixture.The monocrystalline silicon is in institute The intersection that the transmission device Yu the operating system are moved under the action of the transmission device of monocrystalline silicon feeding system is stated, it is described Monocrystalline silicon fixture moves to the crystal silicon fixture feeding system and institute under the action of the transmission device of crystal silicon fixture feeding system State the intersection of operating system.Then, the dispenser system is to the crystal silicon fixture glue spraying, and then, first feeding is mechanical Hand is moved to right above the resin feeding system and catches a piece of resin, and is moved to the surface of the crystal silicon fixture again, Resin is placed on the crystal silicon fixture, in this way, resin is just bonded on the crystal silicon fixture.And then, the dispensing system For system again to the resin glue spraying, then first feeding manipulator, which is moved to right above the monocrystalline silicon, catches a piece of monocrystalline Silicon, and the monocrystalline silicon is placed on the resin, in this way, the monocrystalline silicon bonds together with the resin, thus real The sequentially bonding for having showed crystal silicon fixture, resin and monocrystalline silicon forms silicon wafer, work of the last silicon wafer in the discharge system The discharge end is moved under.
The automatically dropping glue solidification equipment includes multiple monocrystalline silicon automatic sticking machines being set side by side, with can simultaneously to more A crystal silicon fixture carries out dispensing operation to increase the working efficiency of the automatically dropping glue solidification equipment.It is described in present embodiment Automatically dropping glue solidification equipment includes three monocrystalline silicon automatic sticking machines being set side by side.
The solidification equipment includes the primary solidification device of primary solidification being carried out to bonding silicon wafer, to through primary solidification Rear silicon wafer carry out the curing room of secondary curing, the transition bench between primary solidification device and curing room and with the control System processed communicates the arm-and-hand system of connection.
The primary solidification device includes the transport unit and the driving transport unit of bracket, installation on the bracket Driving device.The discharge end of multiple monocrystalline silicon automatic sticking machines is connected with the transport unit, makes to pass through discharge system The silicon wafer to discharge end is sent to be automatically transferred to the transport unit to carry out primary solidification.
The transport unit is made of several idler wheels, and the driving device is the motor of the driving idler wheel rotation.Pass through control The velocity of rotation for making the idler wheel runs the silicon wafer to the transmission close to one end of the discharge end from the transport unit Portion needs 2 hours far from one end of the discharge end, that is, makes 2 hours of the silicon wafer primary solidification.
Specifically, the extending direction of the transport unit and the extending direction of the discharge system are perpendicular, from each described The silicon wafer that discharge end is moved to the transport unit slowly moves 2 hours in the transport unit, on the one hand, completes the silicon The primary solidification of piece;On the other hand, when the silicon wafer is just produced, glue not yet solidifies completely, avoid the silicon wafer because Movement speed is too fast, causes the silicon wafer to generate skew, reduces the qualification rate of the silicon wafer.
The arm-and-hand system include to remove the crystal silicon fixture on the silicon wafer after primary solidification and will remove described in The first manipulator and be transferred to the silicon wafer being located on the transition bench that silicon wafer after crystal silicon fixture is moved on transition bench Solidify indoor second manipulator.First manipulator, the second manipulator with the control system communication connection.
There are multiple solidification lattice to place the silicon wafer to secondary curing, the solidification equipment also wraps in the curing room It includes to sense first sensor for solidifying lattice and whether being in blank state, first sensor and the control system Communication connection.
The information of the solidification lattice in blank state sensed is fed back to the control by first sensor System, when second manipulator needs for the silicon wafer to be transferred to progress secondary curing in the solidification lattice, the control System controls second manipulator and the silicon wafer is transferred in the solidification lattice in blank state.
Further, the solidification equipment further includes the second sensing whether completed to identify the silicon wafer secondary curing Device, the automatically dropping glue solidification equipment further include mechanical the silicon wafer after secondary curing is removed the third for solidifying lattice Hand.
Second sensor and the third manipulator with the control system communication connection.Second sensing Device by identify the silicon wafer be placed into it is described solidify the time in lattice judge the silicon wafer whether secondary curing completion, that is, When the silicon wafer, which is put into the time solidified in lattice, reaches 4 hours, indicate that the silicon wafer complete by secondary curing.
After the completion of second sensor recognizes some and solidifies the silicon wafer secondary curing in lattice, feed back to described Control system, the control system controls the third manipulator for the silicon chip extracting and is placed in warehouse, in the silicon wafer After being placed in the warehouse, then silicon wafer production is completed.
As shown in Figure 1, automatically dropping glue curing method of the invention includes the following steps:
S1: crystal silicon fixture, resin and monocrystalline silicon are bonded together into silicon wafer;
S2: primary solidification 2 hours;
S3: arm-and-hand system removes the crystal silicon fixture on the silicon wafer, and the silicon wafer is transferred in curing room and is carried out Secondary curing 4h.
S4: after the completion of secondary curing, third manipulator takes out the silicon wafer from the curing room.
Above-mentioned steps S1 specifically comprises the following steps:
S11: the monocrystalline silicon feeding system, crystal silicon fixture feeding system, resin feeding system feeding are given;
S12: opening the dispenser system, gives the crystal silicon fixture glue spraying;
S13: it grabs a piece of resin and is placed on the crystal silicon fixture;
S14: opening the dispenser system, to glue spraying on the resin;
S15: it grabs a piece of monocrystalline silicon and is placed on the resin;
S16: the silicon wafer is delivered to discharge end through discharge system.
In conclusion the transport unit that primary solidification device of the invention is connected by setting with discharge end, so that through Monocrystalline silicon automatic sticking machine is bonded after the silicon wafer to be formed is delivered to discharge end and is directly entered transport unit progress primary solidification, described After silicon wafer is moved to the one end of transport unit far from the discharge end, primary solidification is completed;In addition, automatically dropping glue of the invention solidifies Device, which is additionally provided with, to carry out the curing room of secondary curing to the silicon wafer after primary solidification and turns the silicon wafer after primary solidification The indoor arm-and-hand system of solidification is moved to, with after the silicon wafer is moved to the one end of the transport unit far from the discharge end, The silicon wafer is transferred to curing room automatically by the arm-and-hand system, the process of entire silicon wafer without human intervention, with reality The automatically dropping glue of existing monocrystalline silicon and solidification, the i.e. full-automatic production of silicon wafer, have saved human cost and can be avoided and producing The damage of silicon wafer just produced is led to due to artificial operation in the process, is caused damages.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book With the other embodiments of understanding.
The series of detailed descriptions listed above only for feasible embodiment of the invention specifically Protection scope bright, that they are not intended to limit the invention, it is all without departing from equivalent implementations made by technical spirit of the present invention Or change should all be included in the protection scope of the present invention.

Claims (10)

1. a kind of automatically dropping glue solidification equipment of monocrystalline silicon, including for crystal silicon fixture, resin and monocrystalline silicon to bond together The monocrystalline silicon automatic sticking machine and control system of silicon wafer are formed, the monocrystalline silicon automatic sticking machine includes discharge end, feature Be: the automatically dropping glue solidification equipment further includes the solidification equipment to solidify the silicon wafer, the solidification equipment include with Primary solidification device that the discharge end is connected carries out secondary curing to the silicon wafer after primary solidification device primary solidification Curing room and silicon wafer is moved to the indoor arm-and-hand system of solidification from primary solidification device;The primary solidification device includes The driving device of bracket, installation transport unit on the bracket and the driving transport unit, the silicon wafer is from the transmission Portion close to one end of the discharge end run to the one end of the transport unit far from the discharge end after primary solidification complete.
2. automatically dropping glue solidification equipment as described in claim 1, it is characterised in that: the automatically dropping glue solidification equipment includes more A monocrystalline silicon automatic sticking machine being set side by side, the discharge end of each monocrystalline silicon automatic sticking machine with the transport unit phase Connection.
3. automatically dropping glue solidification equipment as claimed in claim 2, it is characterised in that: the extending direction of the transport unit with it is described The extending direction of discharge end is perpendicular.
4. automatically dropping glue solidification equipment as described in claim 1, it is characterised in that: the automatically dropping glue solidification equipment further includes Transition bench among the primary solidification device and the curing room, the arm-and-hand system and the control system communicate Connection and the arm-and-hand system include the crystal silicon fixture removed on the silicon wafer after primary solidification and will remove the crystal silicon folder The first manipulator and be transferred to the silicon wafer after dismounting crystal silicon fixture from transition bench that silicon wafer after tool is moved on transition bench Solidify indoor second manipulator.
5. automatically dropping glue solidification equipment as claimed in claim 4, it is characterised in that: have in the curing room multiple to put The solidification lattice of the silicon wafer to secondary curing are set, the solidification equipment includes to sense whether the solidification lattice are in blank state The first sensor, first sensor and the control system communication connection, the control system is according to first sense It surveys the state for solidifying lattice that device senses and controls second manipulator.
6. automatically dropping glue solidification equipment as described in claim 1, it is characterised in that: the solidification equipment includes to identify silicon The second sensor whether piece secondary curing is completed, the automatically dropping glue solidification equipment further include to by the silicon after secondary curing Piece removes the third manipulator of the curing room;Second sensor and the third manipulator with the control system Communication connection.
7. automatically dropping glue solidification equipment as described in claim 1, it is characterised in that: the transport unit is made of several idler wheels, The driving device is the motor of several idler wheel rotations of driving.
8. a kind of automatically dropping glue curing method of automatically dropping glue solidification equipment, it is characterised in that: the automatically dropping glue solidification equipment For the automatically dropping glue solidification equipment of monocrystalline silicon described in claim 1, the automatically dropping glue curing method includes the following steps:
S1: crystal silicon fixture, resin and monocrystalline silicon are bonded together into silicon wafer;
S2: primary solidification 2 hours;
S3: arm-and-hand system removes the crystal silicon fixture on the silicon wafer, and the silicon wafer is transferred in curing room carry out it is secondary Solidify 4h.
9. automatically dropping glue curing method as claimed in claim 8, it is characterised in that: the control system includes to judge to press from both sides The second sensor for whether completing of tool secondary curing, the automatically dropping glue solidification equipment further include to by the silicon after secondary curing Piece removes the third manipulator of the curing room;Second sensor and the third manipulator with the control system Communication connection;The automatically dropping glue curing method further includes following steps: after the completion of secondary curing, third manipulator is from described solid Change the indoor taking-up silicon wafer.
10. automatically dropping glue curing method as claimed in claim 8, it is characterised in that: the monocrystalline silicon automatic sticking machine includes Monocrystalline silicon feeding system, crystal silicon fixture feeding system, resin feeding system, operating system and discharge system, the step S1 Specifically comprise the following steps:
S11: the monocrystalline silicon feeding system, crystal silicon fixture feeding system, resin feeding system feeding are given;
S12: opening the dispenser system, gives the crystal silicon fixture glue spraying;
S13: it grabs a piece of resin and is placed on the crystal silicon fixture;
S14: opening the dispenser system, to glue spraying on the resin;
S15: it grabs a piece of monocrystalline silicon and is placed on the resin;
S16: the silicon wafer is delivered to discharge end through discharge system.
CN201610600935.2A 2016-07-28 2016-07-28 A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon Active CN106206379B (en)

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