CN103441120B - A kind of integrated circuit of closed assembly - Google Patents
A kind of integrated circuit of closed assembly Download PDFInfo
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- CN103441120B CN103441120B CN201310369375.0A CN201310369375A CN103441120B CN 103441120 B CN103441120 B CN 103441120B CN 201310369375 A CN201310369375 A CN 201310369375A CN 103441120 B CN103441120 B CN 103441120B
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- stem
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- closed assembly
- lower casing
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Abstract
The integrated circuit of a kind of closed assembly of the present invention, lower casing (1) substrate (E) is provided with one group through the outward extending lower stem (5) of lower casing, and the upper socket in the coupling part (3) of lower stem (5) on substrate (E) can the adapter sleeve (12) of plug-in mounting; The substrate (E) of upper shell (6) is provided with one group of upper stem (7) extended internally, and stem (7) plug-in mounting enters in adapter sleeve (12), and upper shell (6) and lower casing (1) closely sealing-in coordinate the integrated circuit forming closed assembly.The invention has the advantages that: conventional hybrid integrated circuit packaging density can be improved 100% on existing basis; The circuit carrying out closed assembly independently can be assembled separately, test, and dress connection mode is succinct, can conveniently carry out dress join-be separated-refill connection operation, be convenient to carry out test analysis to partial circuit and integrated circuit.Meanwhile, the present invention directly adopts the hybrid integration technology of existing mature and reliable, can realize High Density Stacked assembling.In addition, the closed assembly method that the present invention adopts also can realize highly reliable air-tight packaging.
Description
Technical field
The present invention relates to IC manufacturing field, particularly relate to the closed assembly integrated circuit in hybrid integrated circuit.
Background technology
A kind of conventional sectional form of hybrid integrated circuit, is first at ceramic base plate surface assembling bare chip, semiconductor device and passive component etc., then by substrate mounting on metal shell base, adopts wire bonding to realize substrate and package lead pole interconnection.Although this conventional sectional structure effectively can utilize plane space, Problems existing is that the space of vertical direction is underutilized, and is therefore unfavorable for that hybrid integrated circuit product integrated level significantly improves further.In order to improve hybrid integrated circuit product integrated level, current chip and plate level lamination assembling mode mainly adopt salient point, wire bonding realizes lamination interconnection, but connected portion can not realize completely independently assembling test, " repeatedly fill join-be separated-refill connection " lossless operation can not be realized.
Summary of the invention
Object of the present invention is exactly can not make full use of vertical space to solve hybrid integrated circuit conventional sectional method, can not significantly improve the problem of product integrated level, by providing a kind of novel laminated packaging technology method, to realize the three-dimensional perpendicular assembling of hybrid integrated circuit, significantly improve the integrated level level of product.
To achieve these goals, present invention employs following technical scheme:
Technical scheme of the present invention and key step as follows:
An integrated circuit for closed assembly, comprising:
(1) lower casing, along being provided with lower tongue and groove on lower casing,
Substrate is provided with in lower casing, substrate is provided with one group through the outward extending lower stem of lower casing, arranges through hole in a substrate, arrange pad around through hole with stem opposite position, make stem pass through hole, with between pad by weld or conductive adhesive carries out electricity interlinkage; Lower stem is provided with the coupling part of stretching out at thereon;
(2) upper shell, along being provided with tongue and groove on upper shell,
Substrate is provided with in upper shell, substrate is provided with one group of upper stem extended internally, the upper stem other end is through upper outer casing bottom, at substrate and stem correspondence position, through hole is set, around through hole, pad is set, make stem pass through hole, with between pad by weld or conductive adhesive carries out electricity interlinkage;
(3) arrange one group of adapter sleeve, the coupling part of each lower stem is connected with corresponding adapter sleeve side, and the upper stem that each and lower stem is corresponding is connected to the opposite side of this adapter sleeve, and the lower tongue and groove of the suitable for reading and lower casing of upper shell closely cooperates.
The invention has the advantages that:
By adopting a kind of lamination assemble method, on the one hand, conventional hybrid integrated circuit packaging density can be improved 100% on existing basis; On the other hand, the circuit carrying out closed assembly independently can be assembled separately, test, and dress connection mode is succinct, can conveniently carry out dress join-be separated-refill connection operation, be convenient to carry out test analysis to partial circuit and integrated circuit.Meanwhile, the present invention directly adopts the hybrid integration technology of existing mature and reliable, can realize High Density Stacked assembling.In addition, the closed assembly method that the present invention adopts also can realize highly reliable air-tight packaging.
Accompanying drawing illustrates:
Fig. 1 is the front view of shell in the present invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the left view of Fig. 1;
Fig. 4 is the front view of lower casing of the present invention;
Fig. 5 Fig. 4 vertical view;
Fig. 6 Fig. 4 left view;
Fig. 7 is the present invention by the front view of the closed assembly integrated circuit formed after upper shell and lower casing plug-in mounting;
Fig. 8 is the left view of Fig. 7.
Embodiment:
The integrated circuit of a kind of closed assembly provided by the invention, comprising:
(1) lower casing 1 of stainless steel making, as shown in Figure 1, Figure 2 and Figure 3, along being provided with lower tongue and groove 2 on lower casing,
Substrate E is provided with in lower casing, one deck insulation cushion C is provided with between substrate E and lower casing bottom surface, substrate E is provided with one group through the outward extending lower stem 5 of lower casing, lower stem 5 is provided with the coupling part 3 of stretching out on substrate E, on coupling part 3 affixed can the adapter sleeve 12(adapter sleeve 12 of plug-in mounting also can be fixed on stem 7).In a substrate stem opposite position is provided with through hole, around through hole, pad is set, make outward extending stem 5 pass through hole, with between pad by weld or conductive adhesive carries out electricity interlinkage.Lower stem 5, through the through hole of lower casing, is provided with insulator seal material 4 in through hole.
(2) the upper shell 6 of stainless steel making, as shown in Fig. 4, Fig. 5 and Fig. 6, along being provided with tongue and groove 11 on upper shell,
Substrate E is provided with in upper shell, one deck insulation cushion C is provided with between substrate E and upper enclosure bottom, substrate E is provided with one group of upper stem 7 extended internally, at substrate E and stem 7 correspondence position, through hole 8 is set, around through hole, pad is set, makes stem pass through hole, with between pad by weld or conductive adhesive carries out electricity interlinkage, upper stem 7, through the through hole of upper shell, is provided with insulator seal material 10 in through hole.
(3) as shown in Figure 7, Figure 8, after upper circuit in upper shell 6 and the lower circuit in upper shell 1 complete assembling test respectively, stem 7 plug-in mounting of upper shell 6 is entered in the adapter sleeve 12 of lower casing 1, suitable for reading 11 of upper shell 6 closely cooperate with the lower tongue and groove 2 of lower casing 1, to form the integrated circuit of closed assembly of the present invention.
In this state, entirety (lower circuit and the upper circuit) test of product can be realized, upper shell can be pulled away lower casing if desired, respectively test analysis be carried out to lower circuit and upper circuit, and again can carry out both dress connection.After lower circuit and upper circuit complete dress translocation examination, at lower circuit and upper circuit step junction surface, air-tight packaging is carried out to whole circuit.
Claims (1)
1. an integrated circuit for closed assembly, comprising:
(1). lower casing (1), along being provided with lower tongue and groove (2) on lower casing, be provided with first substrate in lower casing, first substrate is provided with one group through the outward extending lower stem (5) of lower casing, and lower stem (5) on the first substrate face is provided with the coupling part (3) of stretching out;
(2). upper shell (6), along being provided with tongue and groove (11) on upper shell, be provided with second substrate in upper shell, second substrate is provided with one group of upper stem (7) extended internally, and upper stem (7) other end is through upper outer casing bottom;
(3). one group of adapter sleeve (12) is set, the coupling part (3) of each lower stem (5) is connected with corresponding adapter sleeve (12) side, upper stem (7) corresponding to each and lower stem (5) is connected to the opposite side of this adapter sleeve (12), and the upper tongue and groove (11) of upper shell (6) and the lower tongue and groove (2) of lower casing (1) closely cooperate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310369375.0A CN103441120B (en) | 2013-08-22 | 2013-08-22 | A kind of integrated circuit of closed assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310369375.0A CN103441120B (en) | 2013-08-22 | 2013-08-22 | A kind of integrated circuit of closed assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103441120A CN103441120A (en) | 2013-12-11 |
| CN103441120B true CN103441120B (en) | 2016-01-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310369375.0A Active CN103441120B (en) | 2013-08-22 | 2013-08-22 | A kind of integrated circuit of closed assembly |
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| CN (1) | CN103441120B (en) |
Citations (4)
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| CN101419965A (en) * | 2007-09-27 | 2009-04-29 | 三洋电机株式会社 | Circuit device and method of manufacturing the same |
| CN102054826A (en) * | 2010-11-04 | 2011-05-11 | 嘉兴斯达微电子有限公司 | Novel baseplate-free power module |
| CN202523704U (en) * | 2011-12-31 | 2012-11-07 | 嘉兴斯达微电子有限公司 | Non-welding packaged power module |
| CN202839609U (en) * | 2012-08-16 | 2013-03-27 | 湖北东光电子股份有限公司 | Laminated thick film circuit module possessing shielding function |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6632997B2 (en) * | 2001-06-13 | 2003-10-14 | Amkor Technology, Inc. | Personalized circuit module package and method for packaging circuit modules |
| JP2004273683A (en) * | 2003-03-07 | 2004-09-30 | Yazaki Corp | Electronic unit with connector, and its manufacturing method |
| TW200915970A (en) * | 2007-09-27 | 2009-04-01 | Sanyo Electric Co | Circuit device, circuit module and outdoor equipment |
| JP4991467B2 (en) * | 2007-09-27 | 2012-08-01 | オンセミコンダクター・トレーディング・リミテッド | Circuit module and outdoor unit using the same |
| JP4934559B2 (en) * | 2007-09-27 | 2012-05-16 | オンセミコンダクター・トレーディング・リミテッド | Circuit device and manufacturing method thereof |
| CN102915976B (en) * | 2012-10-08 | 2015-07-29 | 华东光电集成器件研究所 | A kind of integrated circuit of resistance to high overload |
-
2013
- 2013-08-22 CN CN201310369375.0A patent/CN103441120B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101419965A (en) * | 2007-09-27 | 2009-04-29 | 三洋电机株式会社 | Circuit device and method of manufacturing the same |
| CN102054826A (en) * | 2010-11-04 | 2011-05-11 | 嘉兴斯达微电子有限公司 | Novel baseplate-free power module |
| CN202523704U (en) * | 2011-12-31 | 2012-11-07 | 嘉兴斯达微电子有限公司 | Non-welding packaged power module |
| CN202839609U (en) * | 2012-08-16 | 2013-03-27 | 湖北东光电子股份有限公司 | Laminated thick film circuit module possessing shielding function |
Also Published As
| Publication number | Publication date |
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| CN103441120A (en) | 2013-12-11 |
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