CN103435283B - Shaping inorganic adhesive of a kind of expanded silicate material and preparation method thereof - Google Patents

Shaping inorganic adhesive of a kind of expanded silicate material and preparation method thereof Download PDF

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CN103435283B
CN103435283B CN201310359723.6A CN201310359723A CN103435283B CN 103435283 B CN103435283 B CN 103435283B CN 201310359723 A CN201310359723 A CN 201310359723A CN 103435283 B CN103435283 B CN 103435283B
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inorganic adhesive
water
expanded
glue
agent
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CN103435283A (en
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刘吉平
刘凯
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Beijing Institute of Technology BIT
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Abstract

The present invention relates to shaping inorganic adhesive of a kind of expanded silicate material and preparation method thereof, belong to high-temperature resistance adhesive field.Comprise glue, solidifying agent, water-resisting agent; Mass ratio is respectively glue, the solidifying agent of 2% ~ 3%, the water-resisting agent of 1.5% ~ 2.5% of 95% ~ 96%; Expanded silicate fireproof heated board inorganic adhesive raw material resources prepared by the present invention are abundant, economical, and nontoxic, not containing volatile organic compound ingredient, environmentally friendly, and the expanded silicate fireproof heated board of preparation discharges without free formaldehyde, belongs to environmental protection shaped material; The expanded silicate fireproof heated board that the inorganic adhesive adopting the present invention to prepare manufactures, mechanical strength is high, and water resistance is good, and high temperature resistant, and combustionproperty reaches national A1 level fire-protection standard.The flue gas be detrimental to health is not produced under high-temp combustion.

Description

Shaping inorganic adhesive of a kind of expanded silicate material and preparation method thereof
Technical field
The present invention relates to a kind of inorganic adhesive, particularly shaping inorganic adhesive of the expanded silicate material of one and preparation method thereof, belongs to high-temperature resistance adhesive field.
Background technology
The application of expanded silicate fire-retardant heat-insulation material in industry with covil construction widely, can be used for fire-resistant door core, external-wall heat-insulation material and upholstery etc.Expanded silicate fireproof heated board is generally suppressed by tackiness agent and expanded silicate to form.Organic adhesion agent is added in the production of the expanded silicate fireproof heated board of a present part, and as resol, urea-formaldehyde resin etc., although enhance cohesive strength, in the process manufactured and use, the continuous release formaldehyde of meeting, is detrimental to health.And organic adhesion agent is inflammable, poor heat resistance (use temperature is below 200 DEG C), expensive, easily aging.Commercially available inorganic adhesive kind is few, cohesive strength low (cohesive strength under room temperature is lower than 20MPa), and water resistance is poor; The expanded silicate fireproof heated board of preparation is easily broken, makes moist yielding.
Summary of the invention
The object of the invention is to solve the problem now sticking with glue agent thermotolerance, water-repellancy, bad adhesion, shaping inorganic adhesive of a kind of expanded silicate material and preparation method thereof is provided.The formaldehydeless release of this inorganic adhesive, high temperature resistant (high temperature of 1100 DEG C can be born), cohesive strength high (cohesive strength under room temperature is higher than 23MPa), water resistance good (hydrophobic rate reaches 98%).
The object of the invention is to be achieved through the following technical solutions.
The shaping inorganic adhesive of a kind of expanded silicate material of object of the present invention, comprises glue, solidifying agent, water-resisting agent; Mass ratio is respectively, the glue of 95% ~ 96%, the solidifying agent of 2% ~ 3%, 1.5% ~ 2.5% water-resisting agent;
Described glue is lithium silicate, the mixture of silicon sol, water glass (modulus is 3.4) and polyvinyl alcohol, and blending ratio (mass ratio) is 10% ~ 14%, 8% ~ 12%, 70% ~ 80%, 3% ~ 5%;
Described solidifying agent is formulated by potassium primary phosphate, Calcium Chloride Powder Anhydrous, semi-hydrated gypsum and potassium silicofluoride, and allocation ratio (mass ratio) is 15% ~ 20%, 20% ~ 25%, 20% ~ 25%, 35% ~ 40%;
Described water-resisting agent is Methyl Hydrogen Polysiloxane Fluid emulsion and methylhydroxy silicone oil emulsion, and allocation ratio (mass ratio) is 1:1.
The preparation method of the shaping inorganic adhesive of a kind of expanded silicate material of object of the present invention, comprises the following steps:
Step one, prepare glue
Water glass solution and lithium silicate solution are mixed, is heated to 65 DEG C, under stirring, adds silicon sol wherein, fully stir and make it mix; Add polyvinyl alcohol gradually, continue heating 0.5-1h(long for heat-up time, glue becomes sticky thick, affects spice and plate forming; Heat-up time is not enough, and moisture residual in glue is too many, and viscosity is low), stop heating, be cooled to room temperature;
Wherein the quality of water glass, lithium silicate, silicon sol, polyvinyl alcohol accounts for 70% ~ 80%, 10% ~ 14%, 8% ~ 12%, 3% ~ 5% of total glue quality respectively;
Step 2, prepare solidifying agent
Potassium primary phosphate, Calcium Chloride Powder Anhydrous, semi-hydrated gypsum and potassium silicofluoride are added in ball mill and pulverizes, make it reach more than 1000 orders;
Wherein, potassium primary phosphate, Calcium Chloride Powder Anhydrous, semi-hydrated gypsum and potassium silicofluoride account for the mass ratio of solidifying agent is respectively 15% ~ 20%, 20% ~ 25%, 20% ~ 25%, 35% ~ 40%;
Step 3, prepare inorganic adhesive
At normal temperatures the glue prepared is mixed with solidifying agent, water-resisting agent, can inorganic adhesive be obtained; Mass ratio accounts for 95% ~ 96%, 2% ~ 3%, 1.5% ~ 2.5% of overall tackiness agent respectively.
The application of inorganic adhesive
Inorganic adhesive of the present invention is applicable to the shaping of expanded vermiculite material, fine perlite material and both mixing materials.
Utilize inorganic adhesive to prepare the method for expanded silicate fireproof heated board, concrete steps are as follows:
Drop in blender by the inorganic adhesive prepared and expanded silicate material according to mass ratio 0.6:1, be poured in mould after stirring, hot-forming, the demoulding, normal temperature to be down to, namely obtains fireproof heated board.
Beneficial effect:
1) the expanded silicate fireproof heated board inorganic adhesive raw material resources prepared of the present invention are abundant, economical, and nontoxic, not containing volatile organic compound ingredient, environmentally friendly, and the expanded silicate fireproof heated board of preparation discharges without free formaldehyde, belongs to environmental protection shaped material;
2) contain a large amount of Si-O keys in the present invention uses water glass, lithium silicate and silicon sol structure, determine its thermotolerance and flame retardancy.Main component after water glass sclerosis is Silica hydrogel and solid, and specific surface area is large, has higher cohesive force.Lithium silicate solution has from dryness, after solution moisture content testing evaporation, can generate a kind of water-fast dry film, have water non-reversibility.Further, lithium silicate and water glass used in combination, also can improve the film formation reaction of lithium silicate, thus improve the water resistance of expanded vermiculite fireproof heated board.Silicon sol cohesive force is strong, high temperature resistant.Polyvinyl alcohol can improve the toughness of expanded silicate board;
3) active Si-H key is contained in the water-resisting agent Methyl Hydrogen Polysiloxane Fluid molecule that the present invention uses, easy generation crosslinking reaction, can form waterproof membrane on expanded silicate board surface, Methyl Hydrogen Polysiloxane Fluid emulsion and methylhydroxy silicone oil emulsion share, and can greatly improve hydrophobicity;
4) the solidifying agent potassium dihydrogen phosphate aqueous solution that the present invention uses is acid, can promote that the hydrolysis of water glass is carried out to the direction generating silicon sol, thus speed the curing speed of water glass.Calcium Chloride Powder Anhydrous is used as frostproofer, strengthens the tolerance to cold of expanded silicate fireproof heated board.Semi-hydrated gypsum can accelerate solidification.Potassium silicofluoride is used as the setting accelerator of water glass, except in and except sodium hydroxide in water glass solution makes it separate out silica dioxide gel and hardens, potassium silicofluoride itself is also the source of silica dioxide gel, and potassium silicofluoride also can improve the water tolerance of water glass.Solidifying agent can with glue generation chemical reaction, net macromolecular firm in structure can be formed after solidification, improve the water tolerance of expanded silicate fireproof heated board, toughness and intensity;
5) the expanded silicate fireproof heated board that the inorganic adhesive adopting the present invention to prepare manufactures, mechanical strength is high, and water resistance is good, and high temperature resistant, and combustionproperty reaches national A1 level fire-protection standard.The flue gas be detrimental to health is not produced under high-temp combustion.
Accompanying drawing explanation
Fig. 1 is the concrete preparation flow figure of inorganic adhesive of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the present invention will be further described.
Embodiment 1
Silicon sol and lithium hydroxide powder are added reactor by weight 3:1, and hybrid reaction 1h-1.5h at 60 DEG C and under stirring, can obtain stable opalescent lithium silicate solution (reacting the lithium silicate aqueous solution used below is all that method is obtained thus).
By 100 parts of (parts by weight, as follows) moduluses be 3.4 water glass and 15 parts of lithium silicate aqueous solution add in reactor and stir, Heating temperature is 65 DEG C.Add silicon sol 15 parts and polyvinyl alcohol 2 parts, stir lower continuation and heat 0.5-1h.Stop heating, be cooled to room temperature.Then add water-resisting agent 3 parts and 4 parts, solidifying agent (solidifying agent is first more than ball mill grinding to 1000 order), stir.The modulus of tackiness agent is 3.4 ~ 3.6, solid content 38 ~ 41%, degree Beaume 38 ~ 42, and recording viscosity with coating-4 viscosity meter is 55 ~ 65s.
Drop in blender by the inorganic adhesive prepared and expanded silicate material according to mass ratio 0.6:1, be poured in mould after stirring, hot-forming, the demoulding, normal temperature to be down to, namely obtains fireproof heated board.Its performance index are as shown in table 1,2.
Table 1 expanded vermiculite fireproof heated board performance index
Table 2 fine perlite fireproof heated board performance index
Embodiment 2
By 100 parts of (parts by weight, as follows) moduluses be 3.4 water glass and 10 parts of lithium silicate aqueous solution add in reactor and stir, Heating temperature is 65 DEG C.Add silicon sol 20 parts and polyvinyl alcohol 2 parts, stir lower continuation and heat 0.5-1h.Stop heating, be cooled to room temperature.Then add water-resisting agent 3 parts and 4 parts, solidifying agent (solidifying agent is first more than ball mill grinding to 1000 order), stir.The modulus of tackiness agent is 3.4 ~ 3.6, solid content 38 ~ 41%, degree Beaume 38 ~ 42, and recording viscosity with coating-4 viscosity meter is 55 ~ 65s.
Drop in blender by the inorganic adhesive prepared and expanded vermiculite material according to mass ratio 0.6:1, be poured in mould after stirring, hot-forming, the demoulding, normal temperature to be down to, namely obtains fireproof heated board.Its performance index as shown in Table 3, 4.
Table 3 expanded vermiculite fireproof heated board performance index
Table 4 fine perlite fireproof heated board performance index
Embodiment 3
By 100 parts of (parts by weight, as follows) moduluses be 3.4 water glass and 15 parts of lithium silicate aqueous solution add in reactor and stir, Heating temperature is 65 DEG C.Add silicon sol 10 parts and polyvinyl alcohol 2 parts, stir lower continuation and heat 0.5-1h.Stop heating, be cooled to room temperature.Then add water-resisting agent 3 parts and 3.5 parts, solidifying agent (solidifying agent is first more than ball mill grinding to 1000 order), stir.The modulus of tackiness agent is 3.4 ~ 3.6, solid content 38 ~ 41%, degree Beaume 38 ~ 42, and recording viscosity with coating-4 viscosity meter is 55 ~ 65s.
Drop in blender by the inorganic adhesive prepared and expanded vermiculite material according to mass ratio 0.6:1, be poured in mould after stirring, hot-forming, the demoulding, normal temperature to be down to, namely obtains fireproof heated board.Its performance index as shown in Table 5,6.
Table 5 expanded vermiculite fireproof heated board performance index
Table 6 fine perlite fireproof heated board performance index
Embodiment 4
By 100 parts of (parts by weight, as follows) moduluses be 3.4 water glass and 10 parts of lithium silicate aqueous solution add in reactor and stir, Heating temperature is 65 DEG C.Add silicon sol 15 parts and polyvinyl alcohol 2 parts, stir lower continuation and heat 0.5-1h.Stop heating, be cooled to room temperature.Then add water-resisting agent 3 parts and 3.5 parts, solidifying agent (solidifying agent is first more than ball mill grinding to 1000 order), stir.The modulus of tackiness agent is 3.4 ~ 3.6, solid content 38 ~ 41%, degree Beaume 38 ~ 42, and recording viscosity with coating-4 viscosity meter is 55 ~ 65s.
Drop in blender by the inorganic adhesive prepared and expanded vermiculite material according to mass ratio 0.6:1, be poured in mould after stirring, hot-forming, the demoulding, normal temperature to be down to, namely obtains fireproof heated board.Its performance index are as shown in table 7,8.
Table 7 expanded vermiculite fireproof heated board performance index
Table 8 fine perlite fireproof heated board performance index
Embodiment 5
By 100 parts of (parts by weight, as follows) moduluses be 3.4 water glass and 17 parts of lithium silicate aqueous solution add in reactor and stir, Heating temperature is 65 DEG C.Add silicon sol 10 parts and polyvinyl alcohol 2 parts, stir lower continuation and heat 0.5-1h.Stop heating, be cooled to room temperature.Then add water-resisting agent 3 parts and 4 parts, solidifying agent (solidifying agent is first more than ball mill grinding to 1000 order), stir.The modulus of tackiness agent is 3.4 ~ 3.6, solid content 38 ~ 41%, degree Beaume 38 ~ 42, and recording viscosity with coating-4 viscosity meter is 55 ~ 65s.
Drop in blender by the inorganic adhesive prepared and expanded vermiculite material according to mass ratio 0.6:1, be poured in mould after stirring, hot-forming, the demoulding, normal temperature to be down to, namely obtains fireproof heated board.Its performance index are as shown in table 9,10.
Table 9 expanded vermiculite fireproof heated board performance index
Table 10 fine perlite fireproof heated board performance index
The formaldehydeless release of inorganic adhesive of the present invention, high temperature resistant, cohesive strength is high, water resistance is good, successfully solves the problem now sticking with glue agent thermotolerance, water-repellancy, bad adhesion.The expanded silicate fireproof heated board that the inorganic adhesive adopting the present invention to prepare manufactures, mechanical strength is high, and hydrophobic rate reaches more than 98%, and fire-resistance capacity is more than 1100 DEG C, do not contain hazardous substance, may be used in the fields such as building, boats and ships, metallurgy, electric power, space flight.

Claims (4)

1. the shaping inorganic adhesive of expanded silicate material, is characterized in that: comprise glue, solidifying agent, water-resisting agent; Mass ratio is respectively glue, the solidifying agent of 2% ~ 3%, the water-resisting agent of 1.5% ~ 2.5% of 95% ~ 96%; Described glue is the mixture of lithium silicate, silicon sol and water glass and polyvinyl alcohol, and mixing quality ratio is 10% ~ 14%, 8% ~ 12%, 70% ~ 80%, 3% ~ 5%; Described solidifying agent is formulated by potassium primary phosphate, Calcium Chloride Powder Anhydrous, semi-hydrated gypsum and potassium silicofluoride, and configuration quality ratio is 15% ~ 20%, 20% ~ 25%, 20% ~ 25%, 35% ~ 40%; Described water-resisting agent is the emulsion mixture of Methyl Hydrogen Polysiloxane Fluid and methylhydroxy silicone oil, and configuration quality is than being 1:1.
2. prepare the method for the shaping inorganic adhesive of a kind of expanded silicate material as claimed in claim 1, it is characterized in that: concrete steps are as follows:
Step one, prepare glue
Water glass solution and lithium silicate solution are mixed, is heated to 65 DEG C, under stirring, adds silicon sol wherein, fully stir and make it mix; Add polyvinyl alcohol gradually, continue heating 0.5-1h, stop heating, be cooled to room temperature;
Step 2, prepare solidifying agent
Potassium primary phosphate, Calcium Chloride Powder Anhydrous, semi-hydrated gypsum and potassium silicofluoride are added in ball mill and pulverizes, make it reach more than 1000 orders;
Step 3, prepare inorganic adhesive
At normal temperatures the glue prepared is mixed with solidifying agent, water-resisting agent, can inorganic adhesive be obtained; Mass ratio accounts for 95% ~ 96%, 2% ~ 3%, 1.5% ~ 2.5% of overall tackiness agent respectively.
3. the preparation method of the shaping inorganic adhesive of a kind of expanded silicate material as claimed in claim 2, is characterized in that: in step one, the quality of water glass, lithium silicate, silicon sol and polyvinyl alcohol accounts for 70% ~ 80%, 10% ~ 14%, 8% ~ 12%, 3% ~ 5% of total glue quality respectively; In step 2, potassium primary phosphate, Calcium Chloride Powder Anhydrous, semi-hydrated gypsum and potassium silicofluoride account for the mass ratio of solidifying agent is respectively 15% ~ 20%, 20% ~ 25%, 20% ~ 25%, 35% ~ 40%.
4. the shaping inorganic adhesive of a kind of expanded silicate material as claimed in claim 1, it is characterized in that: utilize inorganic adhesive to prepare the method for expanded silicate fireproof heated board, concrete steps are as follows: drop in blender by the inorganic adhesive prepared and expanded silicate material according to mass ratio 0.6:1, be poured into after stirring in mould, hot-forming, the demoulding, normal temperature to be down to, namely obtains fireproof heated board.
CN201310359723.6A 2013-08-16 2013-08-16 Shaping inorganic adhesive of a kind of expanded silicate material and preparation method thereof Active CN103435283B (en)

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CN107447984A (en) * 2017-08-02 2017-12-08 惠州鼎泰利科技有限公司 A kind of plug for plastic building template
CN107936707B (en) * 2017-10-26 2020-04-03 林小铁 Preparation method of self-healing intelligent waterproof coating
CN110330820A (en) * 2019-04-26 2019-10-15 武汉理工大学 A kind of self-curing silicate coating material and preparation method thereof that Organic-inorganic composite is modified
CN111040645A (en) * 2019-12-16 2020-04-21 常州工程职业技术学院 Metal surface oxidation-resistant high-temperature glue and preparation method thereof
CN112898904A (en) * 2021-01-25 2021-06-04 株洲世林聚合物有限公司 High-temperature-resistant inorganic adhesive and preparation method thereof
CN114031364A (en) * 2021-12-10 2022-02-11 冀威住工(河北)建材科技有限公司 Green energy-saving low-carbon environment-friendly T-series non-combustible insulation board and preparation method thereof

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Publication number Priority date Publication date Assignee Title
CN1099014A (en) * 1993-08-14 1995-02-22 核工业北京地质研究院 Light silencing and refractory mineral decoration board and working method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1099014A (en) * 1993-08-14 1995-02-22 核工业北京地质研究院 Light silencing and refractory mineral decoration board and working method thereof

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