CN103433628A - 一种液体下的激光切割加工方法及系统 - Google Patents
一种液体下的激光切割加工方法及系统 Download PDFInfo
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- CN103433628A CN103433628A CN2013103848658A CN201310384865A CN103433628A CN 103433628 A CN103433628 A CN 103433628A CN 2013103848658 A CN2013103848658 A CN 2013103848658A CN 201310384865 A CN201310384865 A CN 201310384865A CN 103433628 A CN103433628 A CN 103433628A
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- 239000007788 liquid Substances 0.000 title claims abstract description 41
- 238000003698 laser cutting Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title abstract description 11
- 238000006073 displacement reaction Methods 0.000 claims abstract description 19
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 238000003672 processing method Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 241000931526 Acer campestre Species 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000005553 drilling Methods 0.000 abstract 2
- 230000000694 effects Effects 0.000 abstract 2
- 238000003754 machining Methods 0.000 abstract 2
- 239000002184 metal Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- 208000013201 Stress fracture Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- -1 pottery Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105689893A (zh) * | 2016-03-25 | 2016-06-22 | 东南大学 | 模拟海洋环境下激光切割的试验装置 |
CN106166644A (zh) * | 2015-05-21 | 2016-11-30 | 罗伯特·博世有限公司 | 用于工件的激光钻孔或激光切割的方法以及用于激光钻孔或激光切割的系统 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201115008Y (zh) * | 2007-06-05 | 2008-09-10 | 禾宇精密科技股份有限公司 | 激光切割机 |
CN101474720A (zh) * | 2009-01-16 | 2009-07-08 | 深圳市木森科技有限公司 | 一种激光加工方法 |
CN101920398A (zh) * | 2009-06-12 | 2010-12-22 | 东捷科技股份有限公司 | 工件底面浸入液面的激光切割装置 |
CN201702507U (zh) * | 2010-08-19 | 2011-01-12 | 上海市激光技术研究所 | 不锈钢或镍薄板激光拼焊对位装夹装置 |
CN203679535U (zh) * | 2013-08-29 | 2014-07-02 | 武汉帝尔激光科技有限公司 | 一种液体下的激光切割加工系统 |
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- 2013-08-29 CN CN201310384865.8A patent/CN103433628B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201115008Y (zh) * | 2007-06-05 | 2008-09-10 | 禾宇精密科技股份有限公司 | 激光切割机 |
CN101474720A (zh) * | 2009-01-16 | 2009-07-08 | 深圳市木森科技有限公司 | 一种激光加工方法 |
CN101920398A (zh) * | 2009-06-12 | 2010-12-22 | 东捷科技股份有限公司 | 工件底面浸入液面的激光切割装置 |
CN201702507U (zh) * | 2010-08-19 | 2011-01-12 | 上海市激光技术研究所 | 不锈钢或镍薄板激光拼焊对位装夹装置 |
CN203679535U (zh) * | 2013-08-29 | 2014-07-02 | 武汉帝尔激光科技有限公司 | 一种液体下的激光切割加工系统 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106166644A (zh) * | 2015-05-21 | 2016-11-30 | 罗伯特·博世有限公司 | 用于工件的激光钻孔或激光切割的方法以及用于激光钻孔或激光切割的系统 |
CN105689893A (zh) * | 2016-03-25 | 2016-06-22 | 东南大学 | 模拟海洋环境下激光切割的试验装置 |
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CN103433628B (zh) | 2016-08-10 |
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Address after: 430000 Hubei city of Wuhan province Optics Valley Industrial Park of East Lake Development Zone, Shiyuan two Road No. four Patentee after: WUHAN DR LASER TECHNOLOGY Co.,Ltd. Address before: 430000 Hubei city of Wuhan province Optics Valley Industrial Park of East Lake Development Zone, Shiyuan two Road No. four Patentee before: WUHAN DR LASER TECHNOLOGY Co.,Ltd. |
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Address after: No. 88 Jiulonghu Street, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430000 Patentee after: WUHAN DR LASER TECHNOLOGY Co.,Ltd. Address before: 430000 Hubei city of Wuhan province Optics Valley Industrial Park of East Lake Development Zone, Shiyuan two Road No. four Patentee before: WUHAN DR LASER TECHNOLOGY Co.,Ltd. |