CN204449647U - 一种切割贴膜设备 - Google Patents
一种切割贴膜设备 Download PDFInfo
- Publication number
- CN204449647U CN204449647U CN201520031758.1U CN201520031758U CN204449647U CN 204449647 U CN204449647 U CN 204449647U CN 201520031758 U CN201520031758 U CN 201520031758U CN 204449647 U CN204449647 U CN 204449647U
- Authority
- CN
- China
- Prior art keywords
- motion platform
- axis motion
- laser instrument
- workbench
- film sticking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 27
- 230000001681 protective effect Effects 0.000 claims abstract description 10
- 239000007789 gas Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 abstract description 7
- 229910003460 diamond Inorganic materials 0.000 abstract description 5
- 239000010432 diamond Substances 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000012634 fragment Substances 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 101100373011 Drosophila melanogaster wapl gene Proteins 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 210000004483 pasc Anatomy 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520031758.1U CN204449647U (zh) | 2015-01-16 | 2015-01-16 | 一种切割贴膜设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520031758.1U CN204449647U (zh) | 2015-01-16 | 2015-01-16 | 一种切割贴膜设备 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204449647U true CN204449647U (zh) | 2015-07-08 |
Family
ID=53656594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520031758.1U Active CN204449647U (zh) | 2015-01-16 | 2015-01-16 | 一种切割贴膜设备 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204449647U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106458339A (zh) * | 2015-08-26 | 2017-02-22 | 信利光电股份有限公司 | 一种膜材全屏贴附方法 |
CN107123588A (zh) * | 2017-06-26 | 2017-09-01 | 镓特半导体科技(上海)有限公司 | 一种氮化镓晶圆片边缘处理方法 |
CN111906451A (zh) * | 2020-06-19 | 2020-11-10 | 宁波大艾激光科技有限公司 | 一种cvd的激光加工设备及操作方法 |
-
2015
- 2015-01-16 CN CN201520031758.1U patent/CN204449647U/zh active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106458339A (zh) * | 2015-08-26 | 2017-02-22 | 信利光电股份有限公司 | 一种膜材全屏贴附方法 |
WO2017031717A1 (zh) * | 2015-08-26 | 2017-03-02 | 信利光电股份有限公司 | 一种膜材全屏贴附方法 |
CN107123588A (zh) * | 2017-06-26 | 2017-09-01 | 镓特半导体科技(上海)有限公司 | 一种氮化镓晶圆片边缘处理方法 |
CN111906451A (zh) * | 2020-06-19 | 2020-11-10 | 宁波大艾激光科技有限公司 | 一种cvd的激光加工设备及操作方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9478696B2 (en) | Workpiece cutting method | |
KR100853057B1 (ko) | 레이저 가공 방법 | |
KR101802527B1 (ko) | 가공 대상물 절단 방법 | |
CN204449647U (zh) | 一种切割贴膜设备 | |
KR101721709B1 (ko) | 가공 대상물 절단 방법 | |
CN102896430A (zh) | 一种半导体材料的激光加工方法 | |
CN103299401A (zh) | 激光加工方法 | |
CN103650115A (zh) | 使用可水溶管芯附接膜的激光及等离子体蚀刻晶圆切割 | |
US20150217399A1 (en) | Workpiece cutting method | |
CN103781587A (zh) | 用于生产硅细棒的系统和方法 | |
CN111029301B (zh) | 一种碳化硅基晶圆的加工方法 | |
WO2022012069A1 (zh) | 一种用于透明材料三维轮廓加工的方法 | |
CN103949779A (zh) | 一种高效率的蓝宝石片切割工艺 | |
CN102332488A (zh) | 一种用于晶体硅太阳能电池激光边缘隔离的方法和装置 | |
JP2000247671A (ja) | ガラスの分断方法 | |
CN102456625A (zh) | 异形晶片的激光切割制造方法 | |
TW201535604A (zh) | 利用乾膜真空層疊形成用於雷射與電漿切割的水溶性遮罩 | |
CN104364208A (zh) | 玻璃基板的切割方法及玻璃基板的制造方法 | |
WO2015087290A1 (en) | Methods for substrate and device fabrications | |
CN107252982A (zh) | 一种激光加工晶圆的方法及装置 | |
CN110480161A (zh) | 晶片的切割方法及装置 | |
CN107252981B (zh) | 一种激光加工晶圆的方法及装置 | |
CN102554473B (zh) | 一种激光除锡球的方法和装置 | |
CN111900081B (zh) | 一种硅基led芯片的切割方法 | |
WO2008033135A1 (en) | System for and method of laser cutting of materials in a vacuum environment with a vacuum system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: 518000 the first floor to the third floor of No.7 Xinfa East Road, Xinqiao street, Bao'an District, Shenzhen City, Guangdong Province. The business premises are set up in No.2 workshop, zone a, xinfengze Industrial Zone, Shangnan East Road Patentee after: SHENZHEN SHICHUANGYI ELECTRONIC Co.,Ltd. Address before: 518000, Guangdong, Baoan, Shenzhen manhole street, Whampoa East Ring Road, Feng Industrial Park, 2 buildings, four floor northwest side Patentee before: SHENZHEN SHICHUANGYI ELECTRONIC Co.,Ltd. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A film cutting equipment Effective date of registration: 20210812 Granted publication date: 20150708 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: SHENZHEN SHICHUANGYI ELECTRONIC Co.,Ltd. Registration number: Y2021440020081 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230620 Granted publication date: 20150708 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: SHENZHEN SHICHUANGYI ELECTRONIC CO.,LTD. Registration number: Y2021440020081 |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 518000 floor 1, floor 2 and floor 3, No. 7, Xinfa East Road, Xiangshan community, Xinqiao street, Bao'an District, Shenzhen, Guangdong Province; No.5 1st, 2nd and 3rd floors Patentee after: Shenzhen Shi Creative Electronics Co.,Ltd. Country or region after: China Address before: 518000 business premises are set up on the first to third floors, No. 7, Xinfa East Road, Xinqiao street, Bao'an District, Shenzhen, Guangdong Province, and at plant 2, zone a, xinfengze Industrial Zone, Shangnan East Road Patentee before: SHENZHEN SHICHUANGYI ELECTRONIC CO.,LTD. Country or region before: China |