CN103426789A - Device capable of detecting leakage state of adaptive pressure controller - Google Patents

Device capable of detecting leakage state of adaptive pressure controller Download PDF

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Publication number
CN103426789A
CN103426789A CN2012101629134A CN201210162913A CN103426789A CN 103426789 A CN103426789 A CN 103426789A CN 2012101629134 A CN2012101629134 A CN 2012101629134A CN 201210162913 A CN201210162913 A CN 201210162913A CN 103426789 A CN103426789 A CN 103426789A
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CN
China
Prior art keywords
adaptive pressure
process chamber
self
pressure adjuster
pressure controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101629134A
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Chinese (zh)
Inventor
陆一鸣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Huahong Grace Semiconductor Manufacturing Corp
Original Assignee
Shanghai Huahong Grace Semiconductor Manufacturing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Huahong Grace Semiconductor Manufacturing Corp filed Critical Shanghai Huahong Grace Semiconductor Manufacturing Corp
Priority to CN2012101629134A priority Critical patent/CN103426789A/en
Publication of CN103426789A publication Critical patent/CN103426789A/en
Pending legal-status Critical Current

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  • Drying Of Semiconductors (AREA)
  • Weting (AREA)

Abstract

The invention relates to a device capable of detecting the leakage state of an adaptive pressure controller, for example, the device can be a chemical dry etching device. The device is provided with a process chamber used for processing wafers or substrates placed in the process chamber, and the device is further provided with a dry pump communicated with the process chamber through an air exhaust pipeline to conduct air exhaust. The air exhaust pipeline is provided with the adaptive pressure controller and an isolation valve in sequence so that air coming from the process chamber can flow through the adaptive pressure controller and then flow to the isolation valve. By changing the arrangement sequence of the adaptive pressure controller and the isolation valve on the air exhaust pipeline, detection of the leakage condition of the adaptive pressure controller can be completed in daily detection of the process chamber, and hidden danger of product quality caused by leakage is reduced.

Description

Can detect the equipment of self-adaptive pressure adjuster leak condition
Technical field
The present invention relates to semiconductor applications, particularly a kind of equipment that detects self-adaptive pressure adjuster leak condition.
Background technology
At present, in the manufacture process of semiconductor device, for example can use the chemical drying method etching machines of CDE200 type or CDE80 type.As shown in Figure 1, for these equipment, generally at its process chamber 10(process chamber) to dry type aspiration pump 40(dry pump) between pump-line on, be disposed with isolating valve 30(ISO valve) and self-adaptive pressure adjuster 20(APC, adoptive pressure controller).
Yet, because the air-flow in bleed-off passage, before being passed into self-adaptive pressure adjuster 20, is blocked with regard to pent isolating valve 30.Therefore, when process chamber 10 being carried out to conventional leak rate detection, just be difficult to find to appear at the leak case on pipeline after isolating valve 30, so for example due to O type circle wherein, damage the leakage caused in self-adaptive pressure adjuster 20 positions, also just be difficult to be detected.
That is, the above-mentioned design of these equipment has following defect:
1, can not carry out Real-Time Monitoring to the state of the self-adaptive pressure adjuster that wherein arranges;
2,, in the routine inspection of every day leak rate of process chamber being carried out, can't find the leak case at self-adaptive pressure adjuster place;
If 3 self-adaptive pressure adjusters occur abnormal, must, after closing the dry type aspiration pump, could carry out upkeep operation to the self-adaptive pressure adjuster.
If operation irregularity appears in the self-adaptive pressure adjuster, may occur that silicon chip the consequence such as scraps, production is caused and has a strong impact on.
Summary of the invention
The purpose of this invention is to provide a kind of equipment that detects self-adaptive pressure adjuster leak condition, by changing self-adaptive pressure adjuster and the distributing order of isolating valve on pump-line, in can detecting at the day row to process chamber, complete the detection to self-adaptive pressure adjuster leak case, reduce and reveal thus the product quality hidden danger of bringing.
In order to achieve the above object, technical scheme of the present invention is to provide a kind of equipment that detects self-adaptive pressure adjuster leak condition, described equipment is provided with wafer or the substrate that process chamber is opposite in this process chamber and processes processing, also is provided with and is communicated with the dry type aspiration pump of being bled by pump-line with described process chamber; Be disposed with self-adaptive pressure adjuster and isolating valve on described pump-line, make the gas from described process chamber, first flow through described self-adaptive pressure adjuster, then lead to described isolating valve.
Described equipment can be a kind of chemical drying method etching machines.
Compared with prior art, equipment of the present invention, its advantage is: the air-flow of the present invention in bleed-off passage, first by after the self-adaptive pressure adjuster, just by the isolation valve blocks of closing, therefore, can facilitate the overhaul of the equipments personnel to carry out Real-Time Monitoring to the state of self-adaptive pressure adjuster; When the routine of process chamber detects, also can the leak case of self-adaptive pressure adjuster be detected together; And, because isolating valve was blocked air-flow before the dry type aspiration pump, in maintenance self-adaptive pressure adjuster, just do not needed to close the dry type aspiration pump.Can effectively improve the abnormal discovery rate of self-adaptive pressure adjuster like this, reduce impact production brought by revealing, improve the quality of products.
The accompanying drawing explanation
Fig. 1 is the structural representation of existing equipment, on its pump-line, is that isolating valve first is set, then the self-adaptive pressure adjuster is set;
Fig. 2 is the structural representation of equipment of the present invention, is that the self-adaptive pressure adjuster first is set on its pump-line, then isolating valve is set.
Embodiment
As shown in Figure 2, equipment of the present invention is a kind of semiconductor manufacturing facility, is for example the chemical drying method etching machines of CDE200 type or CDE80 type.
Described equipment is at process chamber 1(process chamber) and dry type aspiration pump 4(dry pump) between with pump-line, be communicated with, self-adaptive pressure adjuster 2(APC first is set on this pump-line) isolating valve 3(ISO valve is set again), make self-adaptive pressure adjuster 2 more close process chamber 1 on pump-line, isolating valve 3 is more close dry type aspiration pump 4.In self-adaptive pressure adjuster 2, operated by rotary motion has the O type circle of sealing use.Below omit the description to these other parts of equipment.
In equipment of the present invention, the air-flow in bleed-off passage, by after self-adaptive pressure adjuster 2, just, by isolating valve 3 blocking-up of closing, therefore, can facilitate the overhaul of the equipments personnel to carry out Real-Time Monitoring to the state of self-adaptive pressure adjuster 2; When the routine of process chamber 1 detects, also can the leak case of self-adaptive pressure adjuster 2 be detected together; And, because isolating valve 3 was blocked air-flow before dry type aspiration pump 4, in maintenance self-adaptive pressure adjuster 2, just do not needed to close dry type aspiration pump 4.Can effectively improve the abnormal discovery rate of self-adaptive pressure adjuster 2 like this, reduce impact production brought by revealing, improve the quality of products.
Although content of the present invention has been done detailed introduction by above preferred embodiment, will be appreciated that above-mentioned description should not be considered to limitation of the present invention.After those skilled in the art have read foregoing, for multiple modification of the present invention with to substitute will be all apparent.For example, aspiration pump can use other similar devices, is not limited to dry type aspiration pump mentioned above; For example, equipment of the present invention also is not limited to above-described chemical drying method etching machines, can be install pipeline self-adaptive pressure adjuster between aspiration pump, process chamber and other similar devices of isolating valve; Again for example, what need detection gas leakage situation is not the self-adaptive pressure adjuster, and is arranged on other devices on the pipeline between process chamber and isolating valve, etc.Therefore, protection scope of the present invention should be limited to the appended claims.

Claims (2)

1. the equipment that can detect self-adaptive pressure adjuster leak condition, described equipment is provided with wafer or the substrate that process chamber (1) is opposite in this process chamber (1) and processes processing, also is provided with and is communicated with the dry type aspiration pump (4) of being bled by pump-line with described process chamber (1); It is characterized in that, be disposed with self-adaptive pressure adjuster (2) and isolating valve (3) on described pump-line, make the gas from described process chamber (1), first flow through described self-adaptive pressure adjuster (2), then lead to described isolating valve (3).
2. can detect as claimed in claim 1 the equipment of self-adaptive pressure adjuster leak condition, it is characterized in that, described equipment is a kind of chemical drying method etching machines.
CN2012101629134A 2012-05-24 2012-05-24 Device capable of detecting leakage state of adaptive pressure controller Pending CN103426789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012101629134A CN103426789A (en) 2012-05-24 2012-05-24 Device capable of detecting leakage state of adaptive pressure controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101629134A CN103426789A (en) 2012-05-24 2012-05-24 Device capable of detecting leakage state of adaptive pressure controller

Publications (1)

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CN103426789A true CN103426789A (en) 2013-12-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104900508A (en) * 2014-03-04 2015-09-09 上海华虹宏力半导体制造有限公司 Chemical dry etching machine equipped with pumping pipeline pressure monitoring device
CN113441449A (en) * 2020-03-27 2021-09-28 先丰通讯股份有限公司 Spray plate detection system and detection method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001295761A (en) * 2000-04-11 2001-10-26 Ebara Corp Evacuation system
CN1835200A (en) * 2005-03-16 2006-09-20 东京毅力科创株式会社 Vacuum apparatus, method for measuring a leak rate thereof, program used in measuring the leak rate and storage medium storing the program
CN101236893A (en) * 2007-01-31 2008-08-06 东京毅力科创株式会社 Substrate processing method and substrate processing device
CN101320676A (en) * 2007-06-07 2008-12-10 东京毅力科创株式会社 Evacuation method and storage medium

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001295761A (en) * 2000-04-11 2001-10-26 Ebara Corp Evacuation system
CN1835200A (en) * 2005-03-16 2006-09-20 东京毅力科创株式会社 Vacuum apparatus, method for measuring a leak rate thereof, program used in measuring the leak rate and storage medium storing the program
CN101236893A (en) * 2007-01-31 2008-08-06 东京毅力科创株式会社 Substrate processing method and substrate processing device
CN101320676A (en) * 2007-06-07 2008-12-10 东京毅力科创株式会社 Evacuation method and storage medium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104900508A (en) * 2014-03-04 2015-09-09 上海华虹宏力半导体制造有限公司 Chemical dry etching machine equipped with pumping pipeline pressure monitoring device
CN113441449A (en) * 2020-03-27 2021-09-28 先丰通讯股份有限公司 Spray plate detection system and detection method thereof

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ASS Succession or assignment of patent right

Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING

Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI

Effective date: 20140421

C41 Transfer of patent application or patent right or utility model
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Effective date of registration: 20140421

Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399

Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation

Address before: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399

Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20131204