Can detect the equipment of self-adaptive pressure adjuster leak condition
Technical field
The present invention relates to semiconductor applications, particularly a kind of equipment that detects self-adaptive pressure adjuster leak condition.
Background technology
At present, in the manufacture process of semiconductor device, for example can use the chemical drying method etching machines of CDE200 type or CDE80 type.As shown in Figure 1, for these equipment, generally at its process chamber 10(process chamber) to dry type aspiration pump 40(dry pump) between pump-line on, be disposed with isolating valve 30(ISO valve) and self-adaptive pressure adjuster 20(APC, adoptive pressure controller).
Yet, because the air-flow in bleed-off passage, before being passed into self-adaptive pressure adjuster 20, is blocked with regard to pent isolating valve 30.Therefore, when process chamber 10 being carried out to conventional leak rate detection, just be difficult to find to appear at the leak case on pipeline after isolating valve 30, so for example due to O type circle wherein, damage the leakage caused in self-adaptive pressure adjuster 20 positions, also just be difficult to be detected.
That is, the above-mentioned design of these equipment has following defect:
1, can not carry out Real-Time Monitoring to the state of the self-adaptive pressure adjuster that wherein arranges;
2,, in the routine inspection of every day leak rate of process chamber being carried out, can't find the leak case at self-adaptive pressure adjuster place;
If 3 self-adaptive pressure adjusters occur abnormal, must, after closing the dry type aspiration pump, could carry out upkeep operation to the self-adaptive pressure adjuster.
If operation irregularity appears in the self-adaptive pressure adjuster, may occur that silicon chip the consequence such as scraps, production is caused and has a strong impact on.
Summary of the invention
The purpose of this invention is to provide a kind of equipment that detects self-adaptive pressure adjuster leak condition, by changing self-adaptive pressure adjuster and the distributing order of isolating valve on pump-line, in can detecting at the day row to process chamber, complete the detection to self-adaptive pressure adjuster leak case, reduce and reveal thus the product quality hidden danger of bringing.
In order to achieve the above object, technical scheme of the present invention is to provide a kind of equipment that detects self-adaptive pressure adjuster leak condition, described equipment is provided with wafer or the substrate that process chamber is opposite in this process chamber and processes processing, also is provided with and is communicated with the dry type aspiration pump of being bled by pump-line with described process chamber; Be disposed with self-adaptive pressure adjuster and isolating valve on described pump-line, make the gas from described process chamber, first flow through described self-adaptive pressure adjuster, then lead to described isolating valve.
Described equipment can be a kind of chemical drying method etching machines.
Compared with prior art, equipment of the present invention, its advantage is: the air-flow of the present invention in bleed-off passage, first by after the self-adaptive pressure adjuster, just by the isolation valve blocks of closing, therefore, can facilitate the overhaul of the equipments personnel to carry out Real-Time Monitoring to the state of self-adaptive pressure adjuster; When the routine of process chamber detects, also can the leak case of self-adaptive pressure adjuster be detected together; And, because isolating valve was blocked air-flow before the dry type aspiration pump, in maintenance self-adaptive pressure adjuster, just do not needed to close the dry type aspiration pump.Can effectively improve the abnormal discovery rate of self-adaptive pressure adjuster like this, reduce impact production brought by revealing, improve the quality of products.
The accompanying drawing explanation
Fig. 1 is the structural representation of existing equipment, on its pump-line, is that isolating valve first is set, then the self-adaptive pressure adjuster is set;
Fig. 2 is the structural representation of equipment of the present invention, is that the self-adaptive pressure adjuster first is set on its pump-line, then isolating valve is set.
Embodiment
As shown in Figure 2, equipment of the present invention is a kind of semiconductor manufacturing facility, is for example the chemical drying method etching machines of CDE200 type or CDE80 type.
Described equipment is at process chamber 1(process chamber) and dry type aspiration pump 4(dry pump) between with pump-line, be communicated with, self-adaptive pressure adjuster 2(APC first is set on this pump-line) isolating valve 3(ISO valve is set again), make self-adaptive pressure adjuster 2 more close process chamber 1 on pump-line, isolating valve 3 is more close dry type aspiration pump 4.In self-adaptive pressure adjuster 2, operated by rotary motion has the O type circle of sealing use.Below omit the description to these other parts of equipment.
In equipment of the present invention, the air-flow in bleed-off passage, by after self-adaptive pressure adjuster 2, just, by isolating valve 3 blocking-up of closing, therefore, can facilitate the overhaul of the equipments personnel to carry out Real-Time Monitoring to the state of self-adaptive pressure adjuster 2; When the routine of process chamber 1 detects, also can the leak case of self-adaptive pressure adjuster 2 be detected together; And, because isolating valve 3 was blocked air-flow before dry type aspiration pump 4, in maintenance self-adaptive pressure adjuster 2, just do not needed to close dry type aspiration pump 4.Can effectively improve the abnormal discovery rate of self-adaptive pressure adjuster 2 like this, reduce impact production brought by revealing, improve the quality of products.
Although content of the present invention has been done detailed introduction by above preferred embodiment, will be appreciated that above-mentioned description should not be considered to limitation of the present invention.After those skilled in the art have read foregoing, for multiple modification of the present invention with to substitute will be all apparent.For example, aspiration pump can use other similar devices, is not limited to dry type aspiration pump mentioned above; For example, equipment of the present invention also is not limited to above-described chemical drying method etching machines, can be install pipeline self-adaptive pressure adjuster between aspiration pump, process chamber and other similar devices of isolating valve; Again for example, what need detection gas leakage situation is not the self-adaptive pressure adjuster, and is arranged on other devices on the pipeline between process chamber and isolating valve, etc.Therefore, protection scope of the present invention should be limited to the appended claims.