CN103645381B - Square resistance measurement equipment and sucker - Google Patents
Square resistance measurement equipment and sucker Download PDFInfo
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- CN103645381B CN103645381B CN201310631418.8A CN201310631418A CN103645381B CN 103645381 B CN103645381 B CN 103645381B CN 201310631418 A CN201310631418 A CN 201310631418A CN 103645381 B CN103645381 B CN 103645381B
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Abstract
The invention discloses a kind of Square resistance measurement equipment and sucker, belong to integrated circuit fields.Measuring equipment comprises: sucker, many vacuum air-channels are provided with in the inner chamber of described sucker, the surface of described sucker suction wafer is provided with vacuum hole, and multiple described vacuum air-channel is communicated with described vacuum hole, in described vacuum air-channel, selectively arrange gas control device; Vacuum tracheae, described vacuum tracheae communicates with the vacuum air-channel in described sucker inner chamber, then controls the vacuum pressure of described vacuum air-channel by described gas control device, the vacuum pressure needed when maintaining described sucker suction wafer.In following embodiment of the present invention, by selectively arranging a gas control device such as pneumatic valve in vacuum air-channel, for passing through on off state, control the vacuum pressure of described vacuum air-channel, maintain the vacuum pressure needed for sucker suction wafer, make wafer to be firmly adsorbed on sucker, avoid the generation of phenomenon of reporting to the police in the measurement process of wafer.
Description
Technical field
The invention belongs to integrated circuit fields, specifically, relate to a kind of Square resistance measurement equipment and sucker.
Background technology
Square resistance measurement equipment is used to the square resistance measuring silicon chip surface film, and it comprises and is fixed on pedestal and comprises sucker, vacuum tracheae, vacuum hole, vacuumizing part.After silicon chip enters measuring equipment, first need the program of carrying out aiming at, namely find the unfilled corner of silicon chip, and the direction of unfilled corner is rotated to the angle of regulation.
Not offseting during in order to ensure that silicon chip rotates on pedestal, by vacuumizing part, ensureing to there is certain negative pressure of vacuum in vacuum tracheae, make and to be arranged on sucker and the vacuum hole identical with vacuum tracheae also keeps same negative pressure of vacuum.When silicon chip is placed on after on pedestal, due to the existence of negative pressure of vacuum, silicon chip will be held firmly.Like this, in the process that silicon chip rotates along with pedestal, be completely fixed, can not offset, thus complete the operation of aligning smoothly, after guarantee, metrology operation effectively carries out.
In order to check that the abnormal conditions such as silicon chip back side is abnormal, broken ensure that silicon chip can normally measure, stress causes silicon chip to be that bowl-shape silicon chip is placed to after on pedestal, Square resistance measurement equipment can check that whether the value of the negative pressure of vacuum on pedestal is normal, if the value of negative pressure of vacuum is on the low side, Square resistance measurement equipment just has warning.Above-mentioned this warning takes place frequently usually when measurement electrical sheet resistance RS.
But, present inventor finds in reality measures, once silicon chip itself has distortion, there is tilting at the edge of such as silicon chip, the outer ring vacuum hole of pedestal just cannot to be fitted meeting with silicon chip completely, thus causes gas leakage, causes the value of negative pressure of vacuum on the low side, this improper phenomenon will produce above-mentioned warning after being arrived by Square resistance measurement equipment sensing.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of Square resistance measurement equipment and sucker, in order to partly or entirely to overcome, partly or entirely solve prior art exist above-mentioned technical matters.
In order to partly or entirely overcome, partly or entirely solve the problems of the technologies described above, the invention provides a kind of Square resistance measurement equipment, comprising:
Sucker, is provided with many vacuum air-channels in the inner chamber of described sucker, the surface of described sucker suction wafer is provided with vacuum hole, and multiple described vacuum air-channel is communicated with described vacuum hole, in described vacuum air-channel, selectively arrange gas control device;
Vacuum tracheae, described vacuum tracheae communicates with the vacuum air-channel in described sucker inner chamber, then controls the vacuum pressure of described vacuum air-channel by described gas control device, the vacuum pressure needed when maintaining described sucker suction wafer.
In order to partly or entirely overcome, partly or entirely solve the problems of the technologies described above, present invention also offers a kind of sucker, many vacuum air-channels are provided with in the inner chamber of described sucker, the surface of described sucker suction wafer is provided with vacuum hole, multiple described vacuum air-channel is communicated with described vacuum hole, in described vacuum air-channel, selectively arrange gas control device.
Preferably, in one embodiment of this invention, the possible position deformed according to wafer arranges described gas control device.
Preferably, in one embodiment of this invention, when the extension of wafer occurs to tilt distortion, then only described gas control device is set in the described vacuum air-channel that vacuum hole described in described chuck surface outermost is corresponding.
Preferably, in one embodiment of this invention, in the inner chamber of described sucker, in vacuum air-channel described in every bar, all gas control device is set.
Preferably, in one embodiment of this invention, described gas control device is a pneumatic valve, for by off state, controls the vacuum pressure of described vacuum air-channel.
Compared with existing scheme, in the present invention, by selectively arranging a gas control device such as pneumatic valve in vacuum air-channel, for passing through on off state, control the vacuum pressure of described vacuum air-channel, vacuum pressure needed for final maintenance sucker suction wafer, makes wafer to be firmly adsorbed on sucker, avoids the generation of phenomenon of reporting to the police in the measurement process of wafer.
Accompanying drawing explanation
Fig. 1 is the cut-open view of Square resistance measurement equipment in the embodiment of the present invention one;
The vertical view of Square resistance measurement equipment in Fig. 2 embodiment of the present invention one;
Fig. 3 is the cut-open view of Square resistance measurement equipment in the embodiment of the present invention two;
Fig. 4 is the cut-open view of Square resistance measurement equipment in the embodiment of the present invention three;
Fig. 5 is the cut-open view of Square resistance measurement equipment in the embodiment of the present invention four;
Fig. 6 is the cut-open view of sucker in the embodiment of the present invention five;
Fig. 7 is the cut-open view of sucker in the embodiment of the present invention six;
Fig. 8 is the cut-open view of sucker in the embodiment of the present invention seven;
Fig. 9 is the cut-open view of sucker in the embodiment of the present invention eight.
Embodiment
Graphic and embodiment below will be coordinated to describe embodiments of the present invention in detail, by this to the present invention how application technology means solve technical matters and the implementation procedure reaching technology effect can fully understand and implement according to this.
In following embodiment of the present invention, illustrate only the part body figure adsorbed wafer, other parts do not repeat them here, and those of ordinary skill in the art can with reference to prior art.
In following embodiment of the present invention, by selectively arranging a gas control device such as pneumatic valve in vacuum air-channel, for passing through on off state, control the vacuum pressure of described vacuum air-channel, vacuum pressure needed for final maintenance sucker suction wafer, make wafer to be firmly adsorbed on sucker, avoid the generation of phenomenon of reporting to the police in the measurement process of wafer.
Fig. 1 is the cut-open view of Square resistance measurement equipment in the embodiment of the present invention one; The vertical view of Square resistance measurement equipment in Fig. 2 embodiment of the present invention one, as depicted in figs. 1 and 2, it comprises: sucker 101 and vacuum tracheae 102.Wherein:
4 vacuum air-channels 111 are provided with in the inner chamber of described sucker 101, the surface that described sucker 101 adsorbs wafer is provided with 4 vacuum holes 121, article 4, described vacuum air-channel 111 is communicated with described vacuum hole, in described vacuum air-channel 111, selectively arrange gas control device 131.In the present embodiment, described gas control device is a pneumatic valve, for by off state, controls the vacuum pressure of described vacuum air-channel 111.
Described vacuum tracheae 102 communicates with the vacuum air-channel 111 in described sucker 101 inner chamber, then controls the vacuum pressure of described vacuum air-channel 111 by described gas control device 131, maintains the vacuum pressure of needs when described sucker 101 adsorbs wafer 100.
Principle, may have multiple because the improper situations such as deformation may occur wafer 100, therefore, when arranging gas control device 131, reference wafer 100 that the position of deformation may occur.May occur to tilt distortion for the edge of wafer 100 in the present embodiment, then only described gas control device 131 is set in the described vacuum air-channel 111 of vacuum hole 121 correspondence described in the surperficial outermost of described sucker 101.Like this, when detecting that the edge of wafer 100 there occurs tilting deformation, vacuum hole 121 due to the surperficial outermost of sucker 101 has gap with wafer 100 and gas leak phenomenon occurs causes whole sucker 101 cannot adsorb wafer 100, just can by closing corresponding vacuum air-channel 111, block corresponding vacuum air-channel 111 communicate with vacuum hole 121 and leak gas, and combined closely with wafer 100 by two vacuum holes 121 being positioned at sucker 101 inner edge place, coordinate the real-time vacuum pumping of vacuum tracheae 102 again, ensure that the vacuum pressure in sucker is enough to adsorb wafer 100.
Fig. 3 is the cut-open view of Square resistance measurement equipment in the embodiment of the present invention two; As shown in Figure 3, be with above-described embodiment one something in common, the Square resistance measurement equipment of the present embodiment still comprises: sucker 101 and vacuum tracheae 102.Wherein: in the inner chamber of described sucker 101, be provided with 4 vacuum air-channels 111, the surface that described sucker 101 adsorbs wafer is provided with 4 vacuum holes 121, article 4, described vacuum air-channel 111 is communicated with described vacuum hole, in described vacuum air-channel 111, selectively arrange gas control device 131.Described vacuum tracheae 102 communicates with the vacuum air-channel 111 in described sucker 101 inner chamber, then controls the vacuum pressure of described vacuum air-channel 111 by described gas control device 131, maintains the vacuum pressure of needs when described sucker 101 adsorbs wafer 100.
Be with above-mentioned difference embodiment illustrated in fig. 1, in the inner chamber of described sucker, in vacuum air-channel 111 described in every bar, gas control device 131 be all set.Like this, once find by detecting, there is deformation and cause the vacuum hole 121 sucker 101 existing gas leakage in any one position, the centre of wafer, can close the vacuum air-channel 111 of this vacuum hole 121 correspondence in time.
Fig. 4 is the cut-open view of Square resistance measurement equipment in the embodiment of the present invention three; As shown in Figure 4, in the present embodiment, only in the vacuum air-channel 111 of two vacuum hole 121 correspondences in sucker 101 surperficial inner edge place, be provided with gas control device 131.
Fig. 5 is the cut-open view of Square resistance measurement equipment in the embodiment of the present invention four; As shown in Figure 5, in the present embodiment, in the vacuum air-channel 111 that one of two vacuum holes 121 in sucker 101 surperficial inner edge place are corresponding, be provided with gas control device 131, be provided with in the vacuum air-channel 111 that one of peripheral two vacuum holes 121 are corresponding and start control structure 131.
Accordingly, in the following embodiment of the present invention, provide the sucker of corresponding above-mentioned Square resistance measurement equipment.
Fig. 6 is the cut-open view of sucker in the embodiment of the present invention five; As shown in Figure 6,4 vacuum air-channels 111 are provided with in the inner chamber of described sucker 101, the surface that described sucker 101 adsorbs wafer is provided with 4 vacuum holes 121, article 4, described vacuum air-channel 111 is communicated with described vacuum hole 121, in described vacuum air-channel 111, selectively arrange gas control device 131.In the present embodiment, described gas control device is a pneumatic valve, for by off state, controls the vacuum pressure of described vacuum air-channel 111.
Edge for wafer 100 may occur to tilt distortion, then only in the described vacuum air-channel 111 of vacuum hole 121 correspondence described in the surperficial outermost of described sucker 101, arrange described gas control device 131.Like this, when detecting that the edge of wafer 100 there occurs tilting deformation, vacuum hole 121 due to the surperficial outermost of sucker 101 has gap with wafer 100 and gas leak phenomenon occurs causes whole sucker 101 cannot adsorb wafer 100, just can by closing corresponding vacuum air-channel 111, block corresponding vacuum air-channel 111 communicate with vacuum hole 121 and leak gas, and combined closely with wafer 100 by two vacuum holes 121 being positioned at sucker 101 inner edge place, coordinate the real-time vacuum pumping of vacuum tracheae 102 again, ensure that the vacuum pressure in sucker is enough to adsorb wafer 100.
Fig. 7 is the cut-open view of sucker in the embodiment of the present invention six; As shown in Figure 7, with embodiment illustrated in fig. 6 unlike, in the inner chamber of described sucker, in vacuum air-channel 111 described in every bar, gas control device 131 is all set.Like this, once find by detecting, there is deformation and cause the vacuum hole 121 sucker 101 existing gas leakage in any one position, the centre of wafer, can close the vacuum air-channel 111 of this vacuum hole 121 correspondence in time.
Fig. 8 is the cut-open view of sucker in the embodiment of the present invention seven; As shown in Figure 8, in the present embodiment, only in the vacuum air-channel 111 of two vacuum hole 121 correspondences in sucker 101 surperficial inner edge place, be provided with gas control device 131.
Fig. 9 is the cut-open view of sucker in the embodiment of the present invention eight; As shown in Figure 9, in the present embodiment, in the vacuum air-channel 111 that one of two vacuum holes 121 in sucker 101 surperficial inner edge place are corresponding, be provided with gas control device 131, be provided with in the vacuum air-channel 111 that one of peripheral two vacuum holes 121 are corresponding and start control structure 131.
In the above-described embodiments, vacuum tracheae 102 can an external vacuum extractor (not shown), for being undertaken vacuumizing action by vacuum tracheae 102, maintaining sucker 101 and adsorbing vacuum pressure needed for wafer 100.This vacuum extractor can vacuumize air pump for automatic vacuum air pump or mechanical type, and detailed operation principle does not repeat them here.
This vacuumizes the effect that air pump can also play monitoring sucker practical vacuum air pressure simultaneously, in conjunction with the vacuum air-channel of the position correspondence closedown that the wafer monitored deforms, carrying out vacuumizing action when finding that practical vacuum air pressure does not reach the vacuum pressure of absorption wafer, making the vacuum pressure of sucker return to the vacuum pressure of absorption needed for wafer.
In an other embodiment of the present invention, it also can be factory's vacuum of factory of factory business centralizedly supply.Certainly, also can simultaneously separately configuration vacuumize air pump.Detailed process does not repeat them here.
Above-mentioned explanation illustrate and describes some preferred embodiments of the present invention, but as previously mentioned, be to be understood that the present invention is not limited to the form disclosed by this paper, should not regard the eliminating to other embodiments as, and can be used for other combinations various, amendment and environment, and can in invention contemplated scope described herein, changed by the technology of above-mentioned instruction or association area or knowledge.And the change that those skilled in the art carry out and change do not depart from the spirit and scope of the present invention, then all should in the protection domain of claims of the present invention.
Claims (10)
1. a Square resistance measurement equipment, is characterized in that, comprising:
Sucker, is provided with many vacuum air-channels in the inner chamber of described sucker, the surface of described sucker suction wafer is provided with vacuum hole, and multiple described vacuum air-channel is communicated with described vacuum hole, in described vacuum air-channel, selectively arrange gas control device;
Vacuum tracheae, described vacuum tracheae communicates with the vacuum air-channel in described sucker inner chamber, then controls the vacuum pressure of described vacuum air-channel by described gas control device, the vacuum pressure needed when maintaining described sucker suction wafer;
Wherein, once detect that any one position, centre of described wafer deformation occurs and causes sucker exists the corresponding vacuum hole of gas leakage, described gas control device closes vacuum air-channel corresponding to described vacuum hole, and control to be positioned at the vacuum hole at other position of sucker and wafer is combined closely, coordinate the real-time vacuum pumping of vacuum tracheae again, guarantee that the vacuum pressure in sucker is enough to adsorb wafer.
2. equipment according to claim 1, is characterized in that, arranges described gas control device according to the possible position that wafer deforms.
3. equipment according to claim 2, when the extension of wafer occurs to tilt distortion, then only arranges described gas control device in the described vacuum air-channel that vacuum hole described in described chuck surface outermost is corresponding.
4. equipment according to claim 2, all arranges gas control device in vacuum air-channel described in every bar in the inner chamber of described sucker.
5., according to the arbitrary described equipment of claim 1-3, it is characterized in that, described gas control device is a pneumatic valve, for by off state, controls the vacuum pressure of described vacuum air-channel.
6. one kind for the sucker in the arbitrary described Square resistance measurement equipment of claim 1-5, it is characterized in that, many vacuum air-channels are provided with in the inner chamber of described sucker, the surface of described sucker suction wafer is provided with vacuum hole, multiple described vacuum air-channel is communicated with described vacuum hole, in described vacuum air-channel, selectively gas control device is set, wherein, described gas control device causes sucker exists the corresponding vacuum hole of gas leakage according to detecting the described wafer had any one position middle that deformation occurs, close the vacuum air-channel that described vacuum hole is corresponding, and control to be positioned at the vacuum hole at other position of sucker and wafer is combined closely, coordinate the real-time vacuum pumping of vacuum tracheae again, guarantee that the vacuum pressure in sucker is enough to adsorb wafer.
7. sucker according to claim 6, is characterized in that, arranges described gas control device according to the possible position that wafer deforms.
8. sucker according to claim 6, when the extension of wafer occurs to tilt distortion, then only arranges described gas control device in the described vacuum air-channel that vacuum hole described in described chuck surface outermost is corresponding.
9. sucker according to claim 6, all arranges gas control device in vacuum air-channel described in every bar in the inner chamber of described sucker.
10., according to the arbitrary described sucker of claim 6-9, it is characterized in that, described gas control device is a pneumatic valve, for by off state, controls the vacuum pressure of described vacuum air-channel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310631418.8A CN103645381B (en) | 2013-11-29 | 2013-11-29 | Square resistance measurement equipment and sucker |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310631418.8A CN103645381B (en) | 2013-11-29 | 2013-11-29 | Square resistance measurement equipment and sucker |
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| CN103645381A CN103645381A (en) | 2014-03-19 |
| CN103645381B true CN103645381B (en) | 2016-04-06 |
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| CN201310631418.8A Active CN103645381B (en) | 2013-11-29 | 2013-11-29 | Square resistance measurement equipment and sucker |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106153218B (en) * | 2016-06-29 | 2019-04-30 | 昆山国显光电有限公司 | A kind of friction measurement device and method |
| CN106229287B (en) * | 2016-09-30 | 2019-04-05 | 厦门市三安光电科技有限公司 | For shifting the transposition head of microcomponent and the transfer method of microcomponent |
| CN113866603B (en) * | 2021-09-26 | 2024-01-30 | 安徽芯动联科微系统股份有限公司 | Wafer level testing device and method for MEMS pressure sensor chip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200921833A (en) * | 2007-11-02 | 2009-05-16 | Ever Bliss Ind Co Ltd | Automatic positioning system of wafer developing and fixing machine |
| CN201685264U (en) * | 2010-05-25 | 2010-12-29 | 无锡华润上华半导体有限公司 | Silicon chip manipulator |
| CN201868408U (en) * | 2010-11-30 | 2011-06-15 | 沈阳芯源微电子设备有限公司 | Absorbing wafer device |
| CN102765601A (en) * | 2012-07-30 | 2012-11-07 | 中国人民解放军国防科学技术大学 | Vacuum adsorption device used for carrying and position adjustment of KDP (Potassium Dihydrogen Phosphate) crystal |
| CN103367218A (en) * | 2012-03-27 | 2013-10-23 | 三菱电机株式会社 | Wafer suction method, wafer suction stage, and wafer suction system |
| CN103367217A (en) * | 2012-04-11 | 2013-10-23 | 上海微电子装备有限公司 | Silicon-chip absorption device and absorption method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009033001A (en) * | 2007-07-30 | 2009-02-12 | Kyocera Corp | Vacuum chuck and vacuum sucker and working device using the same |
-
2013
- 2013-11-29 CN CN201310631418.8A patent/CN103645381B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200921833A (en) * | 2007-11-02 | 2009-05-16 | Ever Bliss Ind Co Ltd | Automatic positioning system of wafer developing and fixing machine |
| CN201685264U (en) * | 2010-05-25 | 2010-12-29 | 无锡华润上华半导体有限公司 | Silicon chip manipulator |
| CN201868408U (en) * | 2010-11-30 | 2011-06-15 | 沈阳芯源微电子设备有限公司 | Absorbing wafer device |
| CN103367218A (en) * | 2012-03-27 | 2013-10-23 | 三菱电机株式会社 | Wafer suction method, wafer suction stage, and wafer suction system |
| CN103367217A (en) * | 2012-04-11 | 2013-10-23 | 上海微电子装备有限公司 | Silicon-chip absorption device and absorption method thereof |
| CN102765601A (en) * | 2012-07-30 | 2012-11-07 | 中国人民解放军国防科学技术大学 | Vacuum adsorption device used for carrying and position adjustment of KDP (Potassium Dihydrogen Phosphate) crystal |
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