CN104900508A - Chemical dry etching machine equipped with pumping pipeline pressure monitoring device - Google Patents
Chemical dry etching machine equipped with pumping pipeline pressure monitoring device Download PDFInfo
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- CN104900508A CN104900508A CN201410075877.7A CN201410075877A CN104900508A CN 104900508 A CN104900508 A CN 104900508A CN 201410075877 A CN201410075877 A CN 201410075877A CN 104900508 A CN104900508 A CN 104900508A
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- China
- Prior art keywords
- pumping pipeline
- pumping line
- etching machine
- pressure
- monitoring device
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Abstract
The invention discloses a chemical dry etching machine equipped with a pumping pipeline pressure monitoring device. The chemical dry etching machine comprises a craft room, an isolation valve, an automatic pressure controller and a dry pump which are connected in turn via a pumping pipeline. A digital pressure detector is arranged between the automatic pressure controller and the dry pump. The digital pressure detector is arranged at the external side of the pumping pipeline. The digital pressure detector is used for detecting change of pressure of the pumping pipeline. Multiple O-shaped circles are evenly distributed at the external side of the pumping pipeline. Change of pressure of the pumping pipeline can be monitored so that faults of a pre-APC assembly and the isolation valve of the pumping pipeline can be eliminated in real time, and leakage of the pumping pipeline can be prevented.
Description
Technical field
The present invention relates to field of semiconductor manufacture, be specifically related to a kind of chemical drying method etching machine being provided with pumping line pressure monitoring device.
Background technology
Chemical drying method etching machine of the prior art, does not arrange the device that monitoring detected pressures changes outside process chamber pumping line.If the alarm that instrument is received " exhaust cannot complete within the time of setting ", this means that gas cannot be discharged to reference pressure (lower than 7.5 millitorrs) outward by process chamber.Cause the reason of this situation as follows:
1, dry efficiency of pump decay;
2, pumping line O type circle damages;
3, APC component faults;
4, isolating valve fault etc.
Owing to not knowing the pressure of pumping line, we may waste a large amount of time and investigate the reason that may cause fault one by one.
Summary of the invention
The object of the present invention is to provide a kind of chemical drying method etching machine being provided with pumping line pressure monitoring device, the pressure change of pumping line can be monitored, eliminate the fault of pumping line prime APC assembly and isolating valve in real time, prevent pumping line from revealing.
In order to achieve the above object, the present invention is achieved through the following technical solutions: a kind of chemical drying method etching machine being provided with pumping line pressure monitoring device, be characterized in, comprise: the process chamber connected successively by pumping line, isolating valve, automatic pressure controller and dry pump;
Between above-mentioned automatic pressure controller and dry pump, digital pressure detector is set;
Above-mentioned digital pressure detector is arranged on the outside of pumping line;
Above-mentioned digital pressure detector changes for detecting pumping pipeline pressure.
Uniform multiple O type circle outside above-mentioned pumping line.
Whether the present invention compared with prior art has the following advantages: owing to being provided with digital pressure detector, can monitor the pressure change of pumping line, eliminates the fault of pumping line prime APC assembly and isolating valve in real time, detect O type circle and destroy.
Accompanying drawing explanation
Fig. 1 is a kind of chemical drying method etching machine overall structure schematic diagram being provided with pumping line pressure monitoring device of the present invention.
Embodiment
Below in conjunction with accompanying drawing, by describing a preferably specific embodiment in detail, the present invention is further elaborated.
As shown in Figure 1, a kind of chemical drying method etching machine being provided with pumping line pressure monitoring device, comprises the process chamber 1, isolating valve 4, automatic pressure controller 5 and the dry pump 2 that are connected successively by pumping line 3; Commercially available digital pressure detector 6 is set between automatic pressure controller 5 and dry pump 2; Digital pressure detector 6 is arranged on the outside of pumping line 3; Digital pressure detector 6 is for detecting pumping line 3 pressure change.Uniform multiple O type circle 31 outside pumping line 3.
Embody rule: when process chamber runs into " exhaust cannot complete within the time set ", we can block the port between automatic pressure controller 5 and pumping line 3, monitored the change in the eyes of pumping line 3 by digital pressure detector 6, thus determine whether the O type circle 31 of pumping line 3 is destroyed.
Although content of the present invention has done detailed introduction by above preferred embodiment, will be appreciated that above-mentioned description should not be considered to limitation of the present invention.After those skilled in the art have read foregoing, for multiple amendment of the present invention and substitute will be all apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (2)
1. be provided with a chemical drying method etching machine for pumping line pressure monitoring device, it is characterized in that, comprise: the process chamber (1) connected successively by pumping line (3), isolating valve (4), automatic pressure controller (5) and dry pump (2);
Between described automatic pressure controller (5) and dry pump (2), digital pressure detector (6) is set;
Described digital pressure detector (6) is arranged on the outside of pumping line (3);
Described digital pressure detector (6) is for detecting pumping line (3) pressure change.
2. chemical drying method etching machine as claimed in claim 1, is characterized in that, the described uniform multiple O type circle (31) in pumping line (3) outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410075877.7A CN104900508A (en) | 2014-03-04 | 2014-03-04 | Chemical dry etching machine equipped with pumping pipeline pressure monitoring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410075877.7A CN104900508A (en) | 2014-03-04 | 2014-03-04 | Chemical dry etching machine equipped with pumping pipeline pressure monitoring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104900508A true CN104900508A (en) | 2015-09-09 |
Family
ID=54033103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410075877.7A Pending CN104900508A (en) | 2014-03-04 | 2014-03-04 | Chemical dry etching machine equipped with pumping pipeline pressure monitoring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104900508A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09184600A (en) * | 1996-01-05 | 1997-07-15 | Ckd Corp | Official approval system of gas piping system |
| US6254720B1 (en) * | 1999-04-28 | 2001-07-03 | Winbond Electronics Corp. | Wafer-processing apparatus |
| CN1573632A (en) * | 2003-06-09 | 2005-02-02 | 东京毅力科创株式会社 | Partial pressure control system, flow rate control system and shower plate used for partial pressure control system |
| CN103426789A (en) * | 2012-05-24 | 2013-12-04 | 上海宏力半导体制造有限公司 | Device capable of detecting leakage state of adaptive pressure controller |
-
2014
- 2014-03-04 CN CN201410075877.7A patent/CN104900508A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09184600A (en) * | 1996-01-05 | 1997-07-15 | Ckd Corp | Official approval system of gas piping system |
| US6254720B1 (en) * | 1999-04-28 | 2001-07-03 | Winbond Electronics Corp. | Wafer-processing apparatus |
| CN1573632A (en) * | 2003-06-09 | 2005-02-02 | 东京毅力科创株式会社 | Partial pressure control system, flow rate control system and shower plate used for partial pressure control system |
| CN103426789A (en) * | 2012-05-24 | 2013-12-04 | 上海宏力半导体制造有限公司 | Device capable of detecting leakage state of adaptive pressure controller |
Non-Patent Citations (2)
| Title |
|---|
| （美）雪维尔（SHRIVER，D.F.）等: "《空气敏感化合物的操作》", 30 June 1990 * |
| 易平贵，郑柏树: "《物理化学实验》", 30 June 2013 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150909 |