CN103414846A - Image monitoring module with radiation function - Google Patents
Image monitoring module with radiation function Download PDFInfo
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- CN103414846A CN103414846A CN2013102425393A CN201310242539A CN103414846A CN 103414846 A CN103414846 A CN 103414846A CN 2013102425393 A CN2013102425393 A CN 2013102425393A CN 201310242539 A CN201310242539 A CN 201310242539A CN 103414846 A CN103414846 A CN 103414846A
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- motherboard
- monitoring module
- fan
- image monitoring
- image
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Abstract
The invention relates to an image monitoring module with a radiation function. The image monitoring module comprises a heat-conducting shell, a transparent outer cover, an image acquisition device, a mainboard device and a first fan, wherein the transparent outer cover is connected to the heat-conducting shell; the image acquisition device is arranged in the transparent outer cover; the mainboard device is arranged in the heat-conducting shell and electrically connected to the image acquisition device; and the first fan is arranged on the mainboard device and opposite to the heat-conducting shell, and guides the blowing of a first airflow to the heat-conducting shell. The image monitoring module provided by the invention can normally shoot and record images an either high temperature or low temperature environment, so the operating stability of the image monitoring module in actual application can be improved.
Description
It is 201110256650.9 that the application of this division is based on application number, and the applying date is on September 1st, 2011, and denomination of invention is divided an application for the Chinese patent application of " the image monitoring module with heat sinking function ".
Technical field
The present invention relates to a kind of image monitoring module, espespecially a kind of image monitoring module with heat sinking function.
Background technology
Generally speaking, the image monitoring module is mainly that the image that is applied in outdoor environment is shot with video-corder, that is to say, the image monitoring module normally operates under the environment for use of range of temperature large (approximately-40 ℃ to 50 ℃), therefore, in the image monitoring module, often be equiped with heating and heat abstractor, its common design is to dispose heater and directly over main element, dispose radiator fan on the inside of image monitoring module main element (as motherboard, image capture control board, power board etc.).Thus, when the image monitoring module can't be started shooting because of low temperature, the image monitoring module will start heater so that image monitoring module internal main element is heated, but until the internal temperature of image monitoring module is increased to the temperature (as more than-10 ℃) of its main element normal operation; Otherwise, when the image monitoring module, carry out image while shooting with video-corder under hot environment, the image monitoring module will start radiator fan, utilize the lasting air-flow front that produces to blow to element surface to take away the mode of heat energy, reduce the internal temperature of image monitoring module, use avoid its main element heat when or the situation such as fault occur.
Yet; because above-mentioned configuration lacks good heat exchange mechanism and air-flow guide design; therefore often can only reach the effect of localized heating or local heat radiation; therefore often can cause image monitoring module heat engine temperature that can operate to element promptly when ambient temperature is too low, or the problem such as when ambient temperature is too high, can't effectively dispel the heat.
Summary of the invention
Therefore, the invention provides a kind of image monitoring module with heat sinking function, to solve the above problems.
The invention provides a kind of image monitoring module with heat sinking function, it comprises: thermal conductive shell, transparent housing, image capture unit, motherboard device and the first fan.This transparent housing is connected in this thermal conductive shell; This image capture unit is arranged in this transparent housing; This motherboard device is arranged in this thermal conductive shell and is electrically connected on this image capture unit; This first fan is arranged on this motherboard device and with respect to this thermal conductive shell, and this first fan guiding first air-flow blows to this thermal conductive shell.
As optional technical scheme, this motherboard device comprises: motherboard; Power board, be electrically connected on this motherboard and be arranged at this motherboard top; At least one conducting strip, be arranged at this power board and/or this motherboard; And heater, be arranged on this conducting strip to heat this conducting strip.
As optional technical scheme, this conducting strip is arranged on this power board, this image monitoring module separately comprises: the second fan, and be arranged on this conducting strip and be positioned at a side of this heater, this second fan guiding, second air-flow is through this conducting strip and this motherboard.
As optional technical scheme, this first air-flow is parallel to this motherboard, and this second air-flow is perpendicular to this motherboard.
As optional technical scheme, this conducting strip is arranged on this motherboard, and this image monitoring module separately comprises: the second fan, be arranged at the top of this heater, and this second fan guiding, second air-flow is through this conducting strip and this motherboard.
As optional technical scheme, this first air-flow is parallel to this motherboard, and this second air-flow is perpendicular to this motherboard.
As optional technical scheme, this image capture unit comprises the image capture control board, this image monitoring module separately comprises: three fan, be arranged between this image capture control board and this motherboard device, and be used for guiding this first air-flow to blow to this image capture control board.
As optional technical scheme, this image capture unit separately comprises: lens group is electrically connected on this image capture control board to capture an image.
As optional technical scheme, this motherboard device comprises: motherboard; Conducting strip, be arranged on this motherboard; And heater, be arranged on this conducting strip to heat this conducting strip.
As optional technical scheme, described image monitoring module separately comprises: the second fan, be arranged at the top of this heater, and this second fan guiding, second air-flow is through this conducting strip and this motherboard.
In sum, the present invention utilizes the configuration that fan is relative with thermal conductive shell, so that the air-flow that the image monitoring module can utilize fan to guide blows the mode that forms impingement flow to thermal conductive shell, set up high efficiency heat exchange mechanism, by this, image monitoring module provided by the present invention not only can be when ambient temperature be too low, promptly heat engine to the element temperature that can operate is to start smoothly, and also can be when ambient temperature be too high, effectively reduce internal temperature, use avoid its main element heat when or the situation such as fault occur.Thus, no matter under high temperature or low temperature environment, image monitoring module provided by the present invention all can normally carry out shooting with video-corder of image, thereby promotes its running stability in practical application.
In the advantages and spirit of the present invention, can describe in detail and be further understood by following accompanying drawing explanation and embodiment.
The accompanying drawing explanation
Fig. 1 is the outside schematic diagram of the image monitoring module that proposes according to one embodiment of the invention.
Fig. 2 is the schematic internal view of the image monitoring module of Fig. 1.
Fig. 3 is the schematic perspective view of the motherboard device of Fig. 2.
Embodiment
Refer to Fig. 1 and Fig. 2, Fig. 1 is the outside schematic diagram of the image monitoring module 10 that proposes according to one embodiment of the invention, and Fig. 2 is the schematic internal view of the image monitoring module 10 of Fig. 1.As can be known by Fig. 1 and Fig. 2, image monitoring module 10 comprises thermal conductive shell 12, transparent housing 14, image capture unit 16, motherboard device 18, the first fan 20, the second fan 22, and three fan 24.Thermal conductive shell 12 preferably is comprised of metal material, for the use of quick conductive.Transparent housing 14 is connected in thermal conductive shell 12, and image capture unit 16 is arranged in transparent housing 14, uses to reach image capture unit 16 and can under the protection of the shade of transparent housing 14, carry out simultaneously the purpose that image is shot with video-corder.Image capture unit 16 can comprise image capture control board 26 and lens group 28, image capture control board 26 is used for controlling the running of lens group 28, as image capture, image signal transmission etc., lens group 28 is electrically connected on image capture control board 26, lens group 28 is used for capturing the outer image of transparent housing 14, as for the operating control between image capture control board 26 and lens group 28 with and relevant design, it is to be common in prior art, therefore repeat no more in this.
Below for motherboard device 18, the first fan 20, the second fan 22, and the configuration of three fan 24 and design are described.At first, aspect motherboard device 18, refer to Fig. 3, it is the schematic perspective view of the motherboard device 18 of Fig. 2.As shown in Figure 3, motherboard device 18 is arranged in thermal conductive shell 12 and is electrically connected on image capture unit 16, motherboard device 18 comprises motherboard 30, power board 32, at least one conducting strip 34(and in Fig. 2, shows one, but not limit by this), and heater 36.Power board 32 is electrically connected on motherboard 30 and is arranged at the top of motherboard 30, in order to provide 10 running of image monitoring module required electric power.In this embodiment, conducting strip 34 is arranged on power board 32, conducting strip 34 preferably is comprised of the material with high thermal conductivity coefficient, as metal etc., heater 36 is to be arranged on conducting strip 34 with heating conducting strip 34, in other words, see through heater 36 and be arranged at the design on conducting strip 34, the heat that heater 36 produces can utilize the high thermal conduction characteristic of conducting strip 34 and conduct rapidly.
Then, aspect fan, refer to Fig. 2, the first fan 20 is arranged on motherboard 30 and is relative with thermal conductive shell 12, and the first fan 20 is used for guiding the first air-flow A1 to blow to thermal conductive shell 12.The second fan 22 is arranged on conducting strip 34 and is positioned at a side of heater 36, the second fan 22 is used for guiding the second air-flow A2 to flow toward the first fan 20 through conducting strip 34 and motherboard 30, the flow direction of the first air-flow A1 corresponding with the air-out direction of the first fan 20 (namely being parallel in fact motherboard 30) wherein, the flow direction of the second air-flow A2 corresponding with the air-out direction of the second fan 22 (namely in fact perpendicular to motherboard 30).In addition, three fan 24 is arranged between image capture control board 26 and motherboard 30, in order to guide the first air-flow A1 after thermal conductive shell 12, blows to image capture control board 26.
In this heat radiation with regard to image monitoring module 10 and heating mechanism, be described in detail, please consult simultaneously Fig. 2 and Fig. 3.When the residing ambient temperature of image monitoring module 10 when too high (as more than 50 ℃), image monitoring module 10 will be controlled via the circuit of motherboard 30, start the first fan 20, the second fan 22, and three fan 24, now, the heat energy produced when power board 32 and motherboard 30 running will be rotated formed the second air-flow A2 and rotate formed the first air-flow A1 absorption and produce radiating effect via the first fan 20 via the second fan 22, and through the configuration relative with thermal conductive shell 12 of the first fan 20, make the first air-flow A1 blow to thermal conductive shell 12 in front, so that thermal conductive shell 12 is formed impingement flow and sets up good heat exchange mechanism, thereby the heat energy further the second air-flow A2 and the first air-flow A1 absorbed is got rid of to extraneous effectively via thermal conductive shell 12.In addition, above-mentioned impingement flow effect is the past current downflow of bootable the first air-flow A1 also, now, because the first air-flow A1 after carrying out heat exchange with thermal conductive shell 12 has changed cold airflow into, add the three fan 24 be arranged between image capture control board 26 and motherboard 30, the first air-flow A1 will blow to image capture control board 26 under the guiding of three fan 24, and image capture control board 26 is produced to radiating effect.
Thus, by the first fan 20 as shown in Figure 2, the second fan 22, and the air-flow guide design of three fan 24 and the configuration relative with thermal conductive shell 12 of the first fan 20, image monitoring module 10 can be when ambient temperature be too high, by image capture control board 26, motherboard 30, and the heat energy produced during power board 32 running, utilize the first air-flow A1 thermal conductive shell 12 to be formed to the mode of impingement flow, via thermal conductive shell 12, get rid of to extraneous, thereby reach the purpose of the internal temperature that reduces image monitoring module 10, by this, can effectively avoid the inner member of image monitoring module 10 because ambient temperature is too high, produce its inner member heat when or the situation such as fault occur.
On the other hand, when too low (as below-10 ℃), image monitoring module 10 will be controlled via the circuit of motherboard 30, starts the first fan 20, the second fan 22, three fan 24, and heater 36 when the residing ambient temperature of image monitoring module 10.Then, heater 36 will start to produce heat energy with heating conducting strip 34, and see through the high thermal conduction characteristic of conducting strip 34, the heat energy that heater 36 produces can conduct on power board 32 effectively, thereby but the temperature that makes power board 32 can be increased to the temperature (as more than-10 ℃) of normal operation rapidly, by this, power board 32 can successfully start, with the required electric power of inside main element (as image capture unit 16, motherboard device 18 etc.) running that image monitoring module 10 is provided.
In addition, see through the second fan 22 and be arranged at the configuration on conducting strip 34, the heat energy that heater 36 produces can be absorbed by the second air-flow A2, and conducts on motherboard 30 via the guiding of the second fan 22, and then produces the temperature of raising motherboard 30 so that its effect started smoothly.In this simultaneously, because the first fan 20 is arranged on motherboard 30 and relative with thermal conductive shell 12, therefore, the heat energy that heater 36 produces just can be after conducting to motherboard 30, by the first air-flow A1 guided via the first fan 20, absorbed further, and blow to immediately thermal conductive shell 12, so that thermal conductive shell 12 is formed impingement flow and sets up good heat exchange mechanism, so can improve rapidly the temperature of thermal conductive shell 12, and the whole interior temperature of image monitoring module 10 can be raise comprehensively.In addition, above-mentioned impingement flow effect is the past current downflow of bootable the first air-flow A1 also, add three fan 24 and be arranged at the configuration between image capture control board 26 and motherboard 30, the first air-flow A1 will blow to image capture control board 26 under the guiding of three fan 24, and image capture control board 26 is produced to heating effect, use heating image capture control board 26 to the temperature that can operate smoothly.
Thus, the heater 36 seen through as shown in Figure 2 is arranged on conducting strip 34 to conduct fast the design of heat energy, the configuration that the first fan 20 is relative with thermal conductive shell 12, and first fan 20, the second fan 22, and the air-flow guide design of three fan 24, image monitoring module 10 just can be when ambient temperature be too low, the heat energy that heater 36 is produced conducts to power board 32 rapidly, motherboard 30, and image capture control board 26, thereby reach the purpose of the internal temperature that improves image monitoring module 10, by this, can effectively avoid the situation that the inner member of image monitoring module 10 can't operate because ambient temperature is too low to occur.
It is worth mentioning that; the second fan 22 can be not limited to above-described embodiment with the configuration of conducting strip 34 and heater 36; it can change to some extent according to the radiating requirements of image monitoring module 10; that is to say; so long as the configuration that utilizes the second fan 22 and conducting strip 34 and heater 36 all belongs to protection scope of the present invention so that the heat energy that heater 36 produces can conduct to the design of conducting strip 34 and motherboard 30.For instance, conducting strip 34 can change and is arranged on motherboard 30, and the second fan 22 is to change the top that directly is arranged at heater 36 into; Or conducting strip 34 can be arranged at respectively on motherboard 30 and power board 32, the second fan 22 is can be arranged at the top of heater 36 and/or be positioned on the conducting strip 34 on power board 32.
In addition, the second fan 22 and three fan 24 are omissible element, use the structural design of simplifying image monitoring module 10, that is to say, image monitoring module 10 can only utilize the configuration that the first fan 20 is relative with thermal conductive shell 12, to produce heating and radiating effect.In addition, in actual applications, power board 32 also optionally changes and is integrated on motherboard 30, that is to say, image monitoring module 10 can change to the structural design that only has two-layer plate from the structural design with three ply board spare as shown in Figure 2, use and reach the heating and the purpose of heat dissipation design of simplifying image monitoring module 10, wherein under this designs, conducting strip 34 can change and is arranged on motherboard 30.Should be noted, under the varying environment temperature conditions, the structural design of image monitoring module 10 also can be had some change accordingly, for instance, but if the residing ambient temperature of image monitoring module 10 all higher than the equal temperature (as higher than-10 ℃) of normal operation of its inside main element, image monitoring module 10 can omit the configuration of conducting strip 34 and heater 36; Or, if the residing variation of ambient temperature of image monitoring module 10 drop on can be not overheated for image capture unit 16 scope in (as lower than 30 ℃), image monitoring module 10 can omit the configuration of three fan 24.As for other derivative configuration variation, it can be by that analogy, therefore repeat no more.
Compared to prior art, the present invention utilizes the configuration that fan is relative with thermal conductive shell, so that the air-flow that the image monitoring module can utilize fan to guide blows the mode that forms impingement flow to thermal conductive shell, set up high efficiency heat exchange mechanism, by this, image monitoring module provided by the present invention not only can be when ambient temperature be too low, promptly heat engine to the element temperature that can operate is to start smoothly, and also can be when ambient temperature be too high, effectively reduce internal temperature, use avoid its main element heat when or the situation such as fault occur.In addition, see through the first fan, the second fan, and the air-flow guide design of three fan, the image monitoring module can be when needs dispel the heat, rapidly by image capture control board, motherboard, and the heat energy produced during the power board running gets rid of to extraneous via thermal conductive shell, and when needs heat, the heat energy that heater is produced conducts to power board, motherboard rapidly, and the image capture control board.Thus, no matter under high temperature or low temperature environment, image monitoring module provided by the present invention all can normally carry out shooting with video-corder of image, thereby promotes its running stability in practical application.
The foregoing is only preferred embodiment of the present invention, all equalizations of doing according to the claims in the present invention scope change and modify, and all should belong to covering scope of the present invention.
Claims (9)
1. image monitoring module with heat sinking function is characterized in that comprising:
Thermal conductive shell;
Transparent housing, be connected in this thermal conductive shell;
Image capture unit, be arranged in this transparent housing, and this image capture unit comprises the image capture control board;
The motherboard device, be arranged in this thermal conductive shell and be electrically connected on this image capture unit;
The first fan, be arranged on this motherboard device and with respect to this thermal conductive shell, and this first fan guiding first air-flow blows to this thermal conductive shell; And
Three fan, be arranged between this image capture control board and this motherboard device, is used for guiding this first air-flow to blow to this image capture control board.
2. image monitoring module according to claim 1, is characterized in that, this motherboard device comprises:
Motherboard;
Power board, be electrically connected on this motherboard and be arranged at this motherboard top;
At least one conducting strip, be arranged at this power board and/or this motherboard; And
Heater, be arranged on this conducting strip to heat this conducting strip.
3. image monitoring module according to claim 2, it is characterized in that: this conducting strip is arranged on this power board, and this image monitoring module separately comprises:
The second fan, be arranged on this conducting strip and be positioned at a side of this heater, and this second fan guiding, second air-flow is through this conducting strip and this motherboard.
4. image monitoring module according to claim 3, it is characterized in that: this first air-flow is parallel to this motherboard, and this second air-flow is perpendicular to this motherboard.
5. image monitoring module according to claim 2, it is characterized in that: this conducting strip is arranged on this motherboard, and this image monitoring module separately comprises:
The second fan, be arranged at the top of this heater, and this second fan guiding, second air-flow is through this conducting strip and this motherboard.
6. image monitoring module according to claim 5, it is characterized in that: this first air-flow is parallel to this motherboard, and this second air-flow is perpendicular to this motherboard.
7. image monitoring module according to claim 1, it is characterized in that: this image capture unit separately comprises: lens group is electrically connected on this image capture control board to capture an image.
8. image monitoring module according to claim 1, is characterized in that, this motherboard device comprises:
Motherboard;
Conducting strip, be arranged on this motherboard; And
Heater, be arranged on this conducting strip to heat this conducting strip.
9. image monitoring module according to claim 8 is characterized in that separately comprising:
The second fan, be arranged at the top of this heater, and this second fan guiding, second air-flow is through this conducting strip and this motherboard.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110256650.9A CN102300040B (en) | 2011-09-01 | 2011-09-01 | Image monitoring module with radiation function |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110256650.9A Division CN102300040B (en) | 2011-09-01 | 2011-09-01 | Image monitoring module with radiation function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103414846A true CN103414846A (en) | 2013-11-27 |
| CN103414846B CN103414846B (en) | 2016-05-11 |
Family
ID=45360182
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110256650.9A Expired - Fee Related CN102300040B (en) | 2011-09-01 | 2011-09-01 | Image monitoring module with radiation function |
| CN201310242539.3A Expired - Fee Related CN103414846B (en) | 2011-09-01 | 2011-09-01 | There is the image monitoring module of heat sinking function |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110256650.9A Expired - Fee Related CN102300040B (en) | 2011-09-01 | 2011-09-01 | Image monitoring module with radiation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN102300040B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109004766A (en) * | 2018-08-07 | 2018-12-14 | 肇庆市高新区甜慕新能源技术有限公司 | A kind of charging electromagnetic field generation plate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102937771B (en) * | 2012-11-06 | 2015-09-09 | 浙江宇视科技有限公司 | A kind of heating of video camera and the device of heat radiation |
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- 2011-09-01 CN CN201110256650.9A patent/CN102300040B/en not_active Expired - Fee Related
- 2011-09-01 CN CN201310242539.3A patent/CN103414846B/en not_active Expired - Fee Related
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| JP2000305157A (en) * | 1999-04-19 | 2000-11-02 | Miyota Kk | Structure for dome type monitoring camera |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103414846B (en) | 2016-05-11 |
| CN102300040A (en) | 2011-12-28 |
| CN102300040B (en) | 2013-07-31 |
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