CN103414846B - There is the image monitoring module of heat sinking function - Google Patents
There is the image monitoring module of heat sinking function Download PDFInfo
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- CN103414846B CN103414846B CN201310242539.3A CN201310242539A CN103414846B CN 103414846 B CN103414846 B CN 103414846B CN 201310242539 A CN201310242539 A CN 201310242539A CN 103414846 B CN103414846 B CN 103414846B
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- motherboard
- monitoring module
- fan
- image
- image monitoring
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Abstract
The present invention is about a kind of image monitoring module with heat sinking function, and it comprises thermal conductive shell, transparent housing, image capture unit, motherboard device, and the first fan. This transparent housing is connected in this thermal conductive shell. This image capture unit is arranged in this transparent housing. This motherboard device is arranged in this thermal conductive shell and is electrically connected on this image capture unit. This first fan is arranged on this motherboard device and with respect to this thermal conductive shell, and this first fan guides the first air-flow to blow to this thermal conductive shell. No matter, under high temperature or low temperature environment, image monitoring module provided by the present invention all can normally carry out shooting with video-corder of image, thereby promotes its running stability in practical application.
Description
This divisional application is to be 201110256650.9 based on application number, and the applying date is on September 1st, 2011, denomination of inventionFor the divisional application of the Chinese patent application of " thering is the image monitoring module of heat sinking function ".
Technical field
The present invention relates to a kind of image monitoring module, espespecially a kind of image monitoring module with heat sinking function.
Background technology
Generally speaking, image monitoring module is mainly that the image that is applied in outdoor environment is shot with video-corder, and that is to say image prisonNormally under the environment for use of range of temperature large (approximately-40 DEG C to 50 DEG C), operate depending on module, therefore, image monitoring moduleInside often be equiped with heating and heat abstractor, its common design is (as main frame at the inside of image monitoring module main elementPlate, image capture control panel, power board etc.) on dispose heater and directly over main element, dispose heat radiationFan. Thus, in the time that image monitoring module cannot be started shooting because of low temperature, image monitoring module will start heater with rightImage monitoring module internal main element heats, until the internal temperature of image monitoring module be increased to its main element canTill the temperature (as more than-10 DEG C) of normal operation; Otherwise, shoot with video-corder when image monitoring module carries out image under hot environmentTime, image monitoring module will start radiator fan, utilizes to continue to produce air-flow front and blow to element surface to take away heat energyMode, reduces the internal temperature of image monitoring module, use avoid its main element heat when or the situation such as fault occur.
But, because above-mentioned configuration lacks good heat exchange mechanism and air-flow guide design, therefore often can only reachTo the effect of local heat or local heat radiation, therefore often can cause image monitoring module underground heat rapidly in the time that environment temperature is too lowThe temperature that machine can operate to element, or the problem such as in the time that environment temperature is too high, cannot effectively dispel the heat.
Summary of the invention
Therefore, the invention provides a kind of image monitoring module with heat sinking function, to solve the above problems.
The invention provides a kind of image monitoring module with heat sinking function, it comprises: thermal conductive shell, transparent housing, shadowPicture capture device, motherboard device and the first fan. This transparent housing is connected in this thermal conductive shell; This image capture unit is establishedBe placed in this transparent housing; This motherboard device is arranged in this thermal conductive shell and is electrically connected on this image capture unit; This is years oldOne fan is arranged on this motherboard device and with respect to this thermal conductive shell, and this first fan guides the first air-flow to blow to this heat conductionShell.
As optional technical scheme, this motherboard device comprises: motherboard; Power board, is electrically connected on this main framePlate and be arranged at this motherboard top; At least one conducting strip, is arranged at this power board and/or this motherboard; And heatingDevice, is arranged on this conducting strip to heat this conducting strip.
As optional technical scheme, this conducting strip is arranged on this power board, and this image monitoring module separately comprises:The second fan, is arranged on this conducting strip and is positioned at a side of this heater, and this second fan guides the second air-flow to lead through thisBacking and this motherboard.
As optional technical scheme, this first air-flow is parallel to this motherboard, and this second air-flow is perpendicular to this motherboard.
As optional technical scheme, this conducting strip is arranged on this motherboard, and this image monitoring module separately comprises: secondFan, is arranged at the top of this heater, and this second fan guides the second air-flow through this conducting strip and this motherboard.
As optional technical scheme, this first air-flow is parallel to this motherboard, and this second air-flow is perpendicular to this motherboard.
As optional technical scheme, this image capture unit comprises image capture control panel, and this image monitoring module is anotherComprise: three fan, be arranged between this image capture control panel and this motherboard device, be used for guiding this first air-flow to blowTo this image capture control panel.
As optional technical scheme, this image capture unit separately comprises: lens group, is electrically connected on this image capture controlPlate is to capture an image.
As optional technical scheme, this motherboard device comprises: motherboard; Conducting strip, is arranged on this motherboard; WithAnd heater, be arranged on this conducting strip to heat this conducting strip.
As optional technical scheme, described image monitoring module separately comprises: the second fan, is arranged at this heaterTop, this second fan guides the second air-flow through this conducting strip and this motherboard.
In sum, the present invention utilizes the configuration that fan is relative with thermal conductive shell, so that image monitoring module can utilize windThe air-flow that fan guides blows the mode that forms impingement flow to thermal conductive shell, sets up high efficiency heat exchange mechanism, by this, and thisBright provided image monitoring module not only can be in the time that environment temperature be too low, and the temperature that promptly heat engine to element can operate is with suitableProfit starts, and also can, in the time that environment temperature is too high, effectively reduce internal temperature, uses and avoids its main element heat to work as or eventThe situations such as barrier occur. Thus, no matter, under high temperature or low temperature environment, image monitoring module provided by the present invention all canNormally carry out shooting with video-corder of image, thereby promote its running stability in practical application.
Can describe in detail and obtain further by following brief description of the drawings and detailed description of the invention in the advantages and spirit of the present inventionUnderstanding.
Brief description of the drawings
The outside schematic diagram that Fig. 1 is the image monitoring module that proposes according to one embodiment of the invention.
Fig. 2 is the schematic internal view of the image monitoring module of Fig. 1.
Fig. 3 is the schematic perspective view of the motherboard device of Fig. 2.
Detailed description of the invention
Refer to Fig. 1 and Fig. 2, the outside that Fig. 1 is the image monitoring module 10 that proposes according to one embodiment of the inventionSchematic diagram, the schematic internal view of the image monitoring module 10 that Fig. 2 is Fig. 1. From Fig. 1 and Fig. 2, image monitoring module 10 wrapsContaining thermal conductive shell 12, transparent housing 14, image capture unit 16, motherboard device 18, the first fan 20, the second fan 22, withAnd three fan 24. Thermal conductive shell 12 is preferably made up of metal material, for the use of quick conductive. Transparent housing 14 connectsIn thermal conductive shell 12, and image capture unit 16 is arranged in transparent housing 14, use reach image capture unit 16 can be thoroughlyUnder the shade protection of bright outer cover 14, carry out the object that image is shot with video-corder simultaneously. Image capture unit 16 can comprise image capture control panel26 and lens group 28, image capture control panel 26 is used for controlling the running of lens group 28, as image capture, image signal transmissionDeng, lens group 28 is electrically connected on image capture control panel 26, and lens group 28 is used for capturing the image outside transparent housing 14, as for shadowOperating control between picture acquisition control panel 26 and lens group 28 with and relevant design, it is to be common in prior art, thereforeRepeat no more in this.
Below for motherboard device 18, the first fan 20, the second fan 22, and the configuration of three fan 24 and designBe described. First, aspect motherboard device 18, refer to Fig. 3, the schematic perspective view of the motherboard device 18 that it is Fig. 2.As shown in Figure 3, motherboard device 18 is arranged in thermal conductive shell 12 and is electrically connected on image capture unit 16, motherboard device 18Comprise motherboard 30, power board 32, at least one conducting strip 34(shows one, but not limit by this in Fig. 2), and heatingDevice 36. Power board 32 is electrically connected on motherboard 30 and is arranged at the top of motherboard 30, in order to image monitoring module to be providedThe required electric power of 10 running. In this embodiment, conducting strip 34 is arranged on power board 32, and conducting strip 34 is preferably by toolMaterial by high thermal conductivity coefficient is formed, and as metal etc., heater 36 is to be arranged on conducting strip 34 with heating conducting strip34, in other words, see through heater 36 and be arranged at the design on conducting strip 34, the heat that heater 36 produces can utilize and leadThe high thermal conduction characteristic of backing 34 and conducting rapidly.
Then, aspect fan, refer to Fig. 2, the first fan 20 be arranged on motherboard 30 and with thermal conductive shell 12 phasesRight, the first fan 20 is used for guiding the first air-flow A1 to blow to thermal conductive shell 12. The second fan 22 is arranged on conducting strip 34 and positionIn a side of heater 36, the second fan 22 is used for guiding the second air-flow A2 through conducting strip 34 and motherboard 30 and toward firstFan 20 flows, and wherein the flow direction of the first air-flow A1 is corresponding with the air-out direction of the first fan 20 (parallel in factIn motherboard 30), the flow direction of the second air-flow A2 is corresponding with the air-out direction of the second fan 22 (in fact perpendicular to masterMachine plate 30). In addition, three fan 24 is arranged between image capture control panel 26 and motherboard 30, in order to guide the first gasStream A1, after thermal conductive shell 12, blows to image capture control panel 26.
Be described in detail in this heat radiation with regard to image monitoring module 10 and heating mechanism, please refer to Fig. 2 andFig. 3. When the residing environment temperature of image monitoring module 10 too high (as more than 50 DEG C), image monitoring module 10 will be via masterThe circuit control of machine plate 30, starts the first fan 20, the second fan 22, and three fan 24, now, power board 32 withAnd the heat energy that produces while operating of motherboard 30 will be rotated via the second fan 22 the second air-flow A2 of being formed and viaThe first fan 20 rotates the first formed air-flow A1 and absorbs and produce radiating effect, and sees through the first fan 20 and thermal conductive shell12 relative configurations, make the first air-flow A1 blow to thermal conductive shell 12 in front, thermal conductive shell 12 is formed to impingement flow and set upGood heat exchange mechanism, thus the heat energy further the second air-flow A2 and the first air-flow A1 being absorbed is via outside heat conductionShell 12 is got rid of effectively to extraneous. In addition, above-mentioned impingement flow effect also bootable the first air-flow A1 toward current downflow, now,Be arranged at image and pick owing to having changed cold airflow at the first air-flow A1 carrying out after heat exchange with thermal conductive shell 12, having addedThree fan 24, the first air-flow A1 that get between control panel 26 and motherboard 30 will blow to shadow under the guiding of three fan 24Picture acquisition control panel 26, and image capture control panel 26 is produced to radiating effect.
Thus, by the first fan 20, the second fan 22 as shown in Figure 2, and the air-flow of three fan 24 drawsLead design and the configuration relative with thermal conductive shell 12 of the first fan 20, image monitoring module 10 can be too high in environment temperatureTime, by image capture control panel 26, motherboard 30, and the heat energy that produces while operating of power board 32, the first air-flow utilizedA1 forms the mode of impingement flow to thermal conductive shell 12, get rid of to extraneous, thereby reach reduction image monitoring via thermal conductive shell 12The object of the internal temperature of module 10, by this, can avoid the inner member of image monitoring module 10 because of environment temperature effectivelyToo high and produce its inner member heat when or the situation such as fault occur.
On the other hand, when the residing environment temperature of image monitoring module 10 too low (as below-10 DEG C), image monitoring mouldGroup 10 will, via the circuit control of motherboard 30, start the first fan 20, the second fan 22, three fan 24, and heatingDevice 36. Then, heater 36 will start to produce heat energy with heating conducting strip 34, and sees through the high thermal conduction characteristic of conducting strip 34,The heat energy that heater 36 produces can conduct on power board 32 effectively, thereby makes the temperature of power board 32 can be fastBe increased to fastly can normal operation temperature (as more than-10 DEG C), by this, power board 32 can successfully start, to carryInside main element (as image capture unit 16, motherboard device 18 etc.) for image monitoring module 10 operates required electricityPower.
In addition, see through the second fan 22 and be arranged at the configuration on conducting strip 34, the heat energy that heater 36 produces canAbsorbed by the second air-flow A2, and conduct on motherboard 30 via the guiding of the second fan 22, and then produce raising main frameThe temperature of plate 30 is so that its effect starting smoothly. In this simultaneously, due to the first fan 20 is arranged on motherboard 30 and with leadHot shell 12 is relative, and therefore, the heat energy that heater 36 produces just can conduct to after motherboard 30, further by viaThe first air-flow A1 that the first fan 20 guides absorbs, and blows to immediately thermal conductive shell 12, so that thermal conductive shell 12 is formed and to be impactedFlow and set up good heat exchange mechanism, so can improve rapidly the temperature of thermal conductive shell 12, and make image monitoring module10 whole interior temperature can comprehensively raise. In addition, above-mentioned impingement flow effect also bootable the first air-flow A1 toward current downflow,Add three fan 24 and be arranged at the configuration between image capture control panel 26 and motherboard 30, the first air-flow A1 will beUnder the guiding of three fan 24, blow to image capture control panel 26, and image capture control panel 26 is produced to heating effect, use and addThermal imagery acquisition control panel 26 is to the temperature that can operate smoothly.
Thus, see through heater 36 be as shown in Figure 2 arranged on conducting strip 34 design to conduct fast heat energy,The configuration relative with thermal conductive shell 12 of the first fan 20, and the first fan 20, the second fan 22, and the gas of three fan 24Stream guide design, image monitoring module 10 just can be in the time that environment temperature be too low, and the heat energy that heater 36 is produced is rapidlyConduct to power board 32, motherboard 30, and image capture control panel 26, improve image monitoring module 10 thereby reachThe object of internal temperature, by this, can avoid the inner member of image monitoring module 10 because of the too low nothing of environment temperature effectivelyThe situation of method running occurs.
It is worth mentioning that, the second fan 22 can be not limited to above-mentioned enforcement with the configuration of conducting strip 34 and heater 36Example, it can be according to the radiating requirements of image monitoring module 10 and change to some extent, that is to say, as long as utilize the second fan 22 withThe configuration of conducting strip 34 and heater 36 is so that the heat energy that heater 36 produces can conduct to conducting strip 34 and motherboard30 design, all belongs to protection scope of the present invention. For instance, conducting strip 34 can change and is arranged on motherboard 30, and the second windFanning 22 is to change the top that is directly arranged at heater 36 into; Or, conducting strip 34 can be arranged at respectively motherboard 30 withAnd on power board 32, the second fan 22 is can be arranged at the top of heater 36 and/or be positioned at power board 32On conducting strip 34 on.
In addition, the second fan 22 and three fan 24 are omissible element, use and simplify image monitoring module10 structural design, that is to say, image monitoring module 10 can only utilize the configuration relative with thermal conductive shell 12 of the first fan 20,To produce heating and radiating effect. In addition, in actual applications, power board 32 also optionally changes and is integrated in motherboardOn 30, that is to say, image monitoring module 10 can only change to and have from the structural design with three ply board part as shown in Figure 2The structural design of two-layer plate, uses to reach and simplifies the heating of image monitoring module 10 and the object of heat dissipation design, wherein at thisUnder design, conducting strip 34 can change and is arranged on motherboard 30. Should be noted, under varying environment temperature conditions, image monitoringThe structural design of module 10 also can be had some change accordingly, for instance, if the residing environment temperature of image monitoring module 10Degree all can normal operation higher than its inside main element temperature (as higher than-10 DEG C), image monitoring module 10 can omitThe configuration of conducting strip 34 and heater 36; Or, right if the residing variation of ambient temperature of image monitoring module 10 drops onImage capture unit 16 can be not overheated scope in (as lower than 30 DEG C), image monitoring module 10 can omit three fan24 configuration. As for other derivative configuration variation, it can be by that analogy, therefore repeat no more.
Compared to prior art, the present invention utilizes the configuration that fan is relative with thermal conductive shell, so that image monitoring module canUtilize the air-flow that fan guides to blow the mode that forms impingement flow to thermal conductive shell, set up high efficiency heat exchange mechanism, matThis, image monitoring module provided by the present invention not only can be in the time that environment temperature be too low, and promptly heat engine to element can operateTemperature to be to start smoothly, and also can, in the time that environment temperature is too high, effectively reduce internal temperature, uses and avoids its main elementHeat when or the situation such as fault occur. In addition, see through the first fan, the second fan, and the air-flow guide design of three fan, shadowPicture monitors that module can be in the time that needs dispel the heat, and rapidly by image capture control panel, motherboard, and produces when power board runningRaw heat energy is got rid of to extraneous via thermal conductive shell, and in the time that needs heat, the heat energy that heater is produced passes rapidlyBe directed at power board, motherboard, and image capture control panel. Thus, no matter under high temperature or low temperature environment, thisThe image monitoring module that invention provides all can normally carry out shooting with video-corder of image, thereby promotes its running in practical applicationStability.
The foregoing is only preferred embodiment of the present invention, all equalizations of doing according to the claims in the present invention scope change withModify, all should belong to covering scope of the present invention.
Claims (9)
1. an image monitoring module with heat sinking function, comprises:
Thermal conductive shell;
Transparent housing, is connected in this thermal conductive shell;
Image capture unit, is arranged in this transparent housing;
Motherboard device, is arranged in this thermal conductive shell and is electrically connected on this image capture unit; And
The first fan, this first fan guides the first air-flow to blow to this thermal conductive shell;
It is characterized in that, this image capture unit comprises image capture control panel, and this first fan is arranged at this motherboard deviceUpper and with respect to this thermal conductive shell, and this image monitoring module also comprises:
Three fan, is arranged between this image capture control panel and this motherboard device, is used for guiding this first air-flow to blowTo this image capture control panel.
2. image monitoring module according to claim 1, is characterized in that, this motherboard device comprises:
Motherboard;
Power board, is electrically connected on this motherboard and is arranged at this motherboard top;
At least one conducting strip, is arranged at this power board and/or this motherboard; And
Heater, is arranged on this conducting strip to heat this conducting strip.
3. image monitoring module according to claim 2, is characterized in that: this conducting strip is arranged at this power boardUpper, this image monitoring module separately comprises:
The second fan, is arranged on this conducting strip and is positioned at a side of this heater, and this second fan guides the second air-flow processThis conducting strip and this motherboard.
4. image monitoring module according to claim 3, is characterized in that: this first air-flow is parallel to this motherboard, shouldThe second air-flow is perpendicular to this motherboard.
5. image monitoring module according to claim 2, is characterized in that: this conducting strip is arranged on this motherboard, shouldImage monitoring module separately comprises:
The second fan, is arranged at the top of this heater, and this second fan guides the second air-flow through this conducting strip and this masterMachine plate.
6. image monitoring module according to claim 5, is characterized in that: this first air-flow is parallel to this motherboard, shouldThe second air-flow is perpendicular to this motherboard.
7. image monitoring module according to claim 1, is characterized in that: this image capture unit separately comprises: lens group,Be electrically connected on this image capture control panel to capture an image.
8. image monitoring module according to claim 1, is characterized in that, this motherboard device comprises:
Motherboard;
Conducting strip, is arranged on this motherboard; And
Heater, is arranged on this conducting strip to heat this conducting strip.
9. image monitoring module according to claim 8, is characterized in that separately comprising:
The second fan, is arranged at the top of this heater, and this second fan guides the second air-flow through this conducting strip and this masterMachine plate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110256650.9A CN102300040B (en) | 2011-09-01 | 2011-09-01 | Image monitoring module with radiation function |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110256650.9A Division CN102300040B (en) | 2011-09-01 | 2011-09-01 | Image monitoring module with radiation function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103414846A CN103414846A (en) | 2013-11-27 |
| CN103414846B true CN103414846B (en) | 2016-05-11 |
Family
ID=45360182
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310242539.3A Expired - Fee Related CN103414846B (en) | 2011-09-01 | 2011-09-01 | There is the image monitoring module of heat sinking function |
| CN201110256650.9A Expired - Fee Related CN102300040B (en) | 2011-09-01 | 2011-09-01 | Image monitoring module with radiation function |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110256650.9A Expired - Fee Related CN102300040B (en) | 2011-09-01 | 2011-09-01 | Image monitoring module with radiation function |
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| Country | Link |
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| CN (2) | CN103414846B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102937771B (en) * | 2012-11-06 | 2015-09-09 | 浙江宇视科技有限公司 | A kind of heating of video camera and the device of heat radiation |
| CN109004766A (en) * | 2018-08-07 | 2018-12-14 | 肇庆市高新区甜慕新能源技术有限公司 | A kind of charging electromagnetic field generation plate |
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- 2011-09-01 CN CN201310242539.3A patent/CN103414846B/en not_active Expired - Fee Related
- 2011-09-01 CN CN201110256650.9A patent/CN102300040B/en not_active Expired - Fee Related
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| JP2000305157A (en) * | 1999-04-19 | 2000-11-02 | Miyota Kk | Structure for dome type monitoring camera |
| JP2006245431A (en) * | 2005-03-04 | 2006-09-14 | Sony Corp | Electric apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103414846A (en) | 2013-11-27 |
| CN102300040B (en) | 2013-07-31 |
| CN102300040A (en) | 2011-12-28 |
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