CN102300040A - Image monitoring module with radiation function - Google Patents
Image monitoring module with radiation function Download PDFInfo
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- CN102300040A CN102300040A CN2011102566509A CN201110256650A CN102300040A CN 102300040 A CN102300040 A CN 102300040A CN 2011102566509 A CN2011102566509 A CN 2011102566509A CN 201110256650 A CN201110256650 A CN 201110256650A CN 102300040 A CN102300040 A CN 102300040A
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- monitoring module
- motherboard
- fan
- image monitoring
- image
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Abstract
The invention relates to an image monitoring module with a radiation function. The image monitoring module comprises a heat-conducting shell, a transparent outer cover, an image acquisition device, a mainboard device and a first fan, wherein the transparent outer cover is connected to the heat-conducting shell; the image acquisition device is arranged in the transparent outer cover; the mainboard device is arranged in the heat-conducting shell and electrically connected to the image acquisition device; and the first fan is arranged on the mainboard device and opposite to the heat-conducting shell, and guides the blowing of a first airflow to the heat-conducting shell. The image monitoring module provided by the invention can normally shoot and record images an either high temperature or low temperature environment, so the operating stability of the image monitoring module in actual application can be improved.
Description
Technical field
The present invention relates to a kind of image monitoring module, refer to a kind of image monitoring module especially with heat sinking function.
Background technology
Generally speaking, the image monitoring module mainly is that the image that is applied in outdoor environment is shot with video-corder, that is to say, the image monitoring module normally operates under the environment for use of range of temperature big (-40 ℃ to 50 ℃ approximately), therefore, often be equiped with heating and heat abstractor in the image monitoring module, its common design is to dispose heater and dispose radiator fan directly over main element on the inside of image monitoring module main element (as motherboard, image capture control board, power board etc.).Thus, when the image monitoring module can't be started shooting because of low temperature, the image monitoring module will start heater so that image monitoring module internal main element is heated, but is increased to up to the internal temperature of image monitoring module till the temperature (as more than-10 ℃) of its main element normal operation; Otherwise, when the image monitoring module carries out image when shooting with video-corder under hot environment, the image monitoring module will start radiator fan, utilize the lasting air-flow front that produces to blow to element surface to take away the mode of heat energy, reduce the internal temperature of image monitoring module, use avoid its main element heat when or situation such as fault take place.
Yet; because above-mentioned configuration lacks good heat exchange mechanism and air-flow guide design; therefore often can only reach the effect of localized heating or local heat radiation; so regular meeting causes the image monitoring module to cross when low the temperature that underground heat machine rapidly can operate to element in ambient temperature, or problem such as when ambient temperature is too high, can't dispel the heat effectively.
Summary of the invention
Therefore, the invention provides a kind of image monitoring module, to solve the above problems with heat sinking function.
The invention provides a kind of image monitoring module with heat sinking function, it comprises: thermal conductive shell, transparent housing, image capture unit, motherboard device and first fan.This transparent housing is connected in this thermal conductive shell; This image capture unit is arranged in this transparent housing; This motherboard device is arranged in this thermal conductive shell and is electrically connected on this image capture unit; This first fan is arranged on this motherboard device and with respect to this thermal conductive shell, and this first fan guides first air-flow to blow to this thermal conductive shell.
As optional technical scheme, this motherboard device comprises: motherboard; Power board is electrically connected on this motherboard and is arranged at this motherboard top; At least one conducting strip is arranged at this power board and/or this motherboard; And heater, be arranged on this conducting strip to heat this conducting strip.
As optional technical scheme, this conducting strip is arranged on this power board, this image monitoring module comprises in addition: second fan, and be arranged on this conducting strip and be positioned at a side of this heater, this second fan guides second air-flow through this conducting strip and this motherboard.
As optional technical scheme, this first air-flow is parallel to this motherboard, and this second air-flow is perpendicular to this motherboard.
As optional technical scheme, this conducting strip is arranged on this motherboard, and this image monitoring module comprises in addition: second fan, be arranged at the top of this heater, and this second fan guides second air-flow through this conducting strip and this motherboard.
As optional technical scheme, this first air-flow is parallel to this motherboard, and this second air-flow is perpendicular to this motherboard.
As optional technical scheme, this image capture unit comprises the image capture control board, this image monitoring module comprises in addition: three fan, be arranged between this image capture control board and this motherboard device, and be used for guiding this first air-flow to blow to this image capture control board.
As optional technical scheme, this image capture unit comprises in addition: lens group is electrically connected on this image capture control board to capture an image.
As optional technical scheme, this motherboard device comprises: motherboard; Conducting strip is arranged on this motherboard; And heater, be arranged on this conducting strip to heat this conducting strip.
As optional technical scheme, described image monitoring module comprises in addition: second fan, be arranged at the top of this heater, and this second fan guides second air-flow through this conducting strip and this motherboard.
In sum, the present invention utilizes the fan configuration relative with thermal conductive shell, so that the air-flow that the image monitoring module can utilize fan to guide blows the mode that forms impingement flow to thermal conductive shell, set up high efficiency heat exchange mechanism, by this, image monitoring module provided by the present invention not only can be crossed when low in ambient temperature, the temperature that rapid underground heat machine to element can operate is with smooth startup, and also can be when ambient temperature be too high, reduce internal temperature effectively, use avoid its main element heat when or situation such as fault take place.Thus, no matter under high temperature or low temperature environment, image monitoring module provided by the present invention all can normally carry out shooting with video-corder of image, thereby promotes its running stability in practical application.
Can be further understood by following description of drawings and embodiment detailed description in the advantages and spirit of the present invention.
Description of drawings
Fig. 1 is the outside schematic diagram according to the image monitoring module that one embodiment of the invention proposed.
Fig. 2 is the schematic internal view of the image monitoring module of Fig. 1.
Fig. 3 is the schematic perspective view of the motherboard device of Fig. 2.
Embodiment
See also Fig. 1 and Fig. 2, Fig. 1 is the outside schematic diagram according to the image monitoring module 10 that one embodiment of the invention proposed, and Fig. 2 is the schematic internal view of the image monitoring module 10 of Fig. 1.By Fig. 1 and Fig. 2 as can be known, image monitoring module 10 comprises thermal conductive shell 12, transparent housing 14, image capture unit 16, motherboard device 18, first fan 20, second fan 22, and three fan 24.Thermal conductive shell 12 preferably is made up of metal material, for the usefulness of quick conductive.Transparent housing 14 is connected in thermal conductive shell 12, and image capture unit 16 is arranged in the transparent housing 14, uses to reach image capture unit 16 and can carry out the purpose that image is shot with video-corder simultaneously under the protection of the shade of transparent housing 14.Image capture unit 16 can comprise image capture control board 26 and lens group 28, image capture control board 26 is used for the running of controls lens group 28, as image capture, image signal transmission etc., lens group 28 is electrically connected on image capture control board 26, lens group 28 is used for capturing the image outside the transparent housing 14, as for the running between image capture control board 26 and the lens group 28 control with and relevant design, it is to be common in the prior art, so repeat no more in this.
Below at motherboard device 18, first fan 20, second fan 22, and the configuration of three fan 24 and design are described.At first, aspect motherboard device 18, see also Fig. 3, it is the schematic perspective view of the motherboard device 18 of Fig. 2.As shown in Figure 3, motherboard device 18 is arranged in the thermal conductive shell 12 and is electrically connected on image capture unit 16, motherboard device 18 comprises motherboard 30, power board 32, at least one conducting strip 34 (show in Fig. 2, but not limit by this), and heater 36.Power board 32 is electrically connected on motherboard 30 and is arranged at the top of motherboard 30, in order to provide 10 runnings of image monitoring module required electric power.In this embodiment, conducting strip 34 is arranged on the power board 32, conducting strip 34 preferably is made up of the material with high thermal conductivity coefficient, as metal etc., heater 36 then is to be arranged on the conducting strip 34 with heating conducting strip 34, in other words, see through heater 36 and be arranged at design on the conducting strip 34, the heat that heater 36 produced can utilize the high thermal conduction characteristic of conducting strip 34 and conduct apace.
Then, aspect fan, see also Fig. 2, first fan 20 is arranged on the motherboard 30 and is relative with thermal conductive shell 12, and first fan 20 is used for guiding first air current A 1 to blow to thermal conductive shell 12.Second fan 22 is arranged on the conducting strip 34 and is positioned at a side of heater 36, second fan 22 is used for guiding second air current A 2 to flow toward first fan 20 through conducting strips 34 and motherboard 30, the flow direction of first air current A 1 corresponding with the air-out direction of first fan 20 (promptly being parallel to motherboard 30 in fact) wherein, the flow direction of second air current A 2 corresponding with the air-out direction of second fan 22 (promptly in fact perpendicular to motherboard 30).In addition, three fan 24 is arranged between image capture control board 26 and the motherboard 30, in order to guide first air current A 1 through behind the thermal conductive shell 12, blows to image capture control board 26.
Be described in detail in this heat radiation and heating mechanism, please consult Fig. 2 and Fig. 3 simultaneously with regard to image monitoring module 10.When image monitoring module 10 residing ambient temperatures when too high (as more than 50 ℃), image monitoring module 10 will be via the circuit control of motherboard 30, start first fan 20, second fan 22, and three fan 24, at this moment, the heat energy that produces when power board 32 and motherboard 30 runnings will be rotated formed second air current A 2 and rotate 1 absorption of formed first air current A and produce radiating effect via first fan 20 via second fan 22, and see through the relative configuration of first fan 20 and thermal conductive shell 12, make first air current A 1 blow to thermal conductive shell 12 in the front, so that thermal conductive shell 12 is formed impingement flow and sets up good heat exchange mechanism, thereby the heat energy that further second air current A 2 and first air current A 1 is absorbed is got rid of to the external world effectively via thermal conductive shell 12.In addition, also bootable first air current A 1 of above-mentioned impingement flow effect is toward current downflow, at this moment, because first air current A 1 after carrying out heat exchange with thermal conductive shell 12 has changed cold airflow into, add the three fan 24 that is arranged between image capture control board 26 and the motherboard 30, first air current A 1 will blow to image capture control board 26 under the guiding of three fan 24, and image capture control board 26 is produced radiating effect.
Thus, by first fan 20 as shown in Figure 2, second fan 22, and the relative configuration of the air-flow guide design of three fan 24 and first fan 20 and thermal conductive shell 12, image monitoring module 10 can be when ambient temperature be too high, with image capture control board 26, motherboard 30, and the heat energy that produces during power board 32 running, utilize 1 pair of thermal conductive shell of first air current A 12 to form the mode of impingement flow, get rid of to extraneous via thermal conductive shell 12, thereby reach the purpose of the internal temperature that reduces image monitoring module 10, by this, can avoid effectively the inner member of image monitoring module 10 produce because of ambient temperature is too high its inner member heat when or situation such as fault take place.
On the other hand, when image monitoring module 10 residing ambient temperatures when low excessively (as below-10 ℃), image monitoring module 10 will start first fan 20, second fan 22, three fan 24 via the circuit control of motherboard 30, and heater 36.Then, heater 36 will begin to produce heat energy with heating conducting strip 34, and see through the high thermal conduction characteristic of conducting strip 34, the heat energy that heater 36 is produced can conduct on the power board 32 effectively, thereby but the temperature that makes power board 32 can be increased to the temperature (as more than-10 ℃) of normal operation apace, by this, power board 32 can successfully start, with the required electric power of inside main element (as image capture unit 16, motherboard device 18 etc.) running that image monitoring module 10 is provided.
In addition, see through second fan 22 and be arranged at configuration on the conducting strip 34, the heat energy that heater 36 produced can be absorbed by second air current A 2, and conducts on the motherboard 30 via the guiding of second fan 22, and then produces the temperature of raising motherboard 30 so that its effect that starts smoothly.In this simultaneously, because first fan 20 is arranged on the motherboard 30 and is relative with thermal conductive shell 12, therefore, the heat energy that heater 36 is produced just can be after conducting to motherboard 30, first air current A 1 that is guided via first fan 20 further absorbs, and blow to thermal conductive shell 12 immediately, so that thermal conductive shell 12 is formed impingement flow and sets up good heat exchange mechanism, so can improve the temperature of thermal conductive shell 12 apace, and the whole interior temperature of image monitoring module 10 can be raise comprehensively.In addition, also bootable first air current A 1 of above-mentioned impingement flow effect is toward current downflow, add three fan 24 and be arranged at configuration between image capture control board 26 and the motherboard 30, first air current A 1 will blow to image capture control board 26 under the guiding of three fan 24, and image capture control board 26 is produced heats, use heating image capture control board 26 to the temperature that can operate smoothly.
Thus, see through as shown in Figure 2 heater 36 and be arranged on the conducting strip 34 design with quick conduction heat energy, the configuration that first fan 20 and thermal conductive shell 12 are relative, and first fan 20, second fan 22, and the air-flow guide design of three fan 24, image monitoring module 10 just can be crossed when low in ambient temperature, the heat energy that heater 36 is produced conducts to power board 32 apace, motherboard 30, and image capture control board 26, thereby reach the purpose of the internal temperature that improves image monitoring module 10, by this, can avoid the inner member of image monitoring module 10 to cross the low situation generation that can't operate effectively because of ambient temperature.
What deserves to be mentioned is; second fan 22 can be not limited to the foregoing description with the configuration of conducting strip 34 and heater 36; it can change to some extent according to the radiating requirements of image monitoring module 10; that is to say; so long as the configuration that utilizes second fan 22 and conducting strip 34 and heater 36 all belongs to protection scope of the present invention so that the heat energy that heater 36 is produced can conduct to the design of conducting strip 34 and motherboard 30.For instance, conducting strip 34 can change and is arranged on the motherboard 30, and second fan 22 then is to change the top that directly is arranged at heater 36 into; Or conducting strip 34 can be arranged at respectively on motherboard 30 and the power board 32, and second fan 22 then is can be arranged at the top of heater 36 and/or be positioned on the conducting strip 34 on the power board 32.
In addition, second fan 22 and three fan 24 are omissible element, use the structural design of simplifying image monitoring module 10, that is to say, image monitoring module 10 can only utilize the relative configuration of first fan 20 and thermal conductive shell 12, to produce heating and radiating effect.In addition, in actual applications, power board 32 also optionally changes and is integrated on the motherboard 30, that is to say, image monitoring module 10 can change to the structural design that only has two-layer plate from the structural design with three ply board spare as shown in Figure 2, use and reach the heating and the purpose of heat dissipation design of simplifying image monitoring module 10, wherein under this designs, conducting strip 34 can change and is arranged on the motherboard 30.Be noted that, under the varying environment temperature conditions, the structural design of image monitoring module 10 also can be had some change accordingly, for instance, if but image monitoring module 10 residing ambient temperatures all are higher than all temperature (as being higher than-10 ℃) of normal operation of its inner main element, then image monitoring module 10 can omit the configuration of conducting strip 34 and heater 36; Or, if image monitoring module 10 residing variation of ambient temperature drop on can be not overheated for image capture unit 16 scope in (as being lower than 30 ℃), then image monitoring module 10 can omit the configuration of three fan 24.As for other configuration variation of deriving, it can be by that analogy, so repeat no more.
Compared to prior art, the present invention utilizes the fan configuration relative with thermal conductive shell, so that the air-flow that the image monitoring module can utilize fan to guide blows the mode that forms impingement flow to thermal conductive shell, set up high efficiency heat exchange mechanism, by this, image monitoring module provided by the present invention not only can be crossed when low in ambient temperature, the temperature that rapid underground heat machine to element can operate is with smooth startup, and also can be when ambient temperature be too high, reduce internal temperature effectively, use avoid its main element heat when or situation such as fault take place.In addition, see through first fan, second fan, and the air-flow guide design of three fan, the image monitoring module can be when needs dispel the heat, apace with image capture control board, motherboard, and the heat energy that produces during the power board running gets rid of to extraneous via thermal conductive shell, and when needs heat, the heat energy that heater produced is conducted to power board, motherboard apace, and the image capture control board.Thus, no matter under high temperature or low temperature environment, image monitoring module provided by the present invention all can normally carry out shooting with video-corder of image, thereby promotes its running stability in practical application.
The above only is preferred embodiment of the present invention, and all equalizations of being done according to claim scope of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (10)
1. image monitoring module with heat sinking function is characterized in that comprising:
Thermal conductive shell;
Transparent housing is connected in this thermal conductive shell;
Image capture unit is arranged in this transparent housing;
The motherboard device is arranged in this thermal conductive shell and is electrically connected on this image capture unit; And
First fan is arranged on this motherboard device and with respect to this thermal conductive shell, and this first fan guides first air-flow to blow to this thermal conductive shell.
2. image monitoring module according to claim 1 is characterized in that, this motherboard device comprises:
Motherboard;
Power board is electrically connected on this motherboard and is arranged at this motherboard top;
At least one conducting strip is arranged at this power board and/or this motherboard; And
Heater is arranged on this conducting strip to heat this conducting strip.
3. image monitoring module according to claim 2 is characterized in that: this conducting strip is arranged on this power board, and this image monitoring module comprises in addition:
Second fan is arranged on this conducting strip and is positioned at a side of this heater, and this second fan guides second air-flow through this conducting strip and this motherboard.
4. image monitoring module according to claim 3 is characterized in that: this first air-flow is parallel to this motherboard, and this second air-flow is perpendicular to this motherboard.
5. image monitoring module according to claim 2 is characterized in that: this conducting strip is arranged on this motherboard, and this image monitoring module comprises in addition:
Second fan is arranged at the top of this heater, and this second fan guides second air-flow through this conducting strip and this motherboard.
6. image monitoring module according to claim 5 is characterized in that: this first air-flow is parallel to this motherboard, and this second air-flow is perpendicular to this motherboard.
7. image monitoring module according to claim 1 is characterized in that: this image capture unit comprises the image capture control board, and this image monitoring module comprises in addition:
Three fan is arranged between this image capture control board and this motherboard device, is used for guiding this first air-flow to blow to this image capture control board.
8. image monitoring module according to claim 7 is characterized in that: this image capture unit comprises in addition: lens group is electrically connected on this image capture control board to capture an image.
9. image monitoring module according to claim 1 is characterized in that, this motherboard device comprises:
Motherboard;
Conducting strip is arranged on this motherboard; And
Heater is arranged on this conducting strip to heat this conducting strip.
10. image monitoring module according to claim 9 is characterized in that comprising in addition:
Second fan is arranged at the top of this heater, and this second fan guides second air-flow through this conducting strip and this motherboard.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310242539.3A CN103414846B (en) | 2011-09-01 | 2011-09-01 | There is the image monitoring module of heat sinking function |
| CN201110256650.9A CN102300040B (en) | 2011-09-01 | 2011-09-01 | Image monitoring module with radiation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110256650.9A CN102300040B (en) | 2011-09-01 | 2011-09-01 | Image monitoring module with radiation function |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310242539.3A Division CN103414846B (en) | 2011-09-01 | 2011-09-01 | There is the image monitoring module of heat sinking function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102300040A true CN102300040A (en) | 2011-12-28 |
| CN102300040B CN102300040B (en) | 2013-07-31 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310242539.3A Expired - Fee Related CN103414846B (en) | 2011-09-01 | 2011-09-01 | There is the image monitoring module of heat sinking function |
| CN201110256650.9A Expired - Fee Related CN102300040B (en) | 2011-09-01 | 2011-09-01 | Image monitoring module with radiation function |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310242539.3A Expired - Fee Related CN103414846B (en) | 2011-09-01 | 2011-09-01 | There is the image monitoring module of heat sinking function |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN103414846B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102937771A (en) * | 2012-11-06 | 2013-02-20 | 浙江宇视科技有限公司 | Device for heating and radiating camera |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109004766A (en) * | 2018-08-07 | 2018-12-14 | 肇庆市高新区甜慕新能源技术有限公司 | A kind of charging electromagnetic field generation plate |
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| CN201118843Y (en) * | 2007-11-19 | 2008-09-17 | 航天科工哈尔滨风华有限公司航天产品分公司 | Monitoring device for night vision panorama camera |
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| CN201615981U (en) * | 2009-12-16 | 2010-10-27 | 天津三星电子有限公司 | Heating and radiating device of camera |
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| KR100676537B1 (en) * | 2005-08-05 | 2007-01-30 | 엘지전자 주식회사 | Projection system and cooling system for the same |
| CN201523417U (en) * | 2009-04-24 | 2010-07-07 | 吴立江 | Surveillance camera |
| CN201491121U (en) * | 2009-07-30 | 2010-05-26 | 梅红坤 | Infrared high-speed sphere circulating air heat-conducting device |
| CN102098426B (en) * | 2009-12-09 | 2014-07-30 | 天津天地伟业数码科技有限公司 | Temperature control structure for infrared high-speed spherical camera |
| CN201876649U (en) * | 2010-11-11 | 2011-06-22 | 徐象贤 | Infrared ball of integrated video camera |
| CN201937729U (en) * | 2010-12-16 | 2011-08-17 | 天津市嘉杰电子有限公司 | 24-hour intelligent high-speed multi-light-source integral video monitoring equipment |
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2011
- 2011-09-01 CN CN201310242539.3A patent/CN103414846B/en not_active Expired - Fee Related
- 2011-09-01 CN CN201110256650.9A patent/CN102300040B/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5926367A (en) * | 1997-12-09 | 1999-07-20 | Intel Corporation | Method and apparatus for the thermal management of electronic devices |
| CN201118843Y (en) * | 2007-11-19 | 2008-09-17 | 航天科工哈尔滨风华有限公司航天产品分公司 | Monitoring device for night vision panorama camera |
| CN201126519Y (en) * | 2007-11-22 | 2008-10-01 | 王志厚 | Ball type horizontal stage |
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| CN102937771A (en) * | 2012-11-06 | 2013-02-20 | 浙江宇视科技有限公司 | Device for heating and radiating camera |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103414846A (en) | 2013-11-27 |
| CN102300040B (en) | 2013-07-31 |
| CN103414846B (en) | 2016-05-11 |
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Granted publication date: 20130731 Termination date: 20200901 |