CN103412627A - Novel CPU (central processing unit) cooling fin - Google Patents
Novel CPU (central processing unit) cooling fin Download PDFInfo
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- CN103412627A CN103412627A CN2013103280508A CN201310328050A CN103412627A CN 103412627 A CN103412627 A CN 103412627A CN 2013103280508 A CN2013103280508 A CN 2013103280508A CN 201310328050 A CN201310328050 A CN 201310328050A CN 103412627 A CN103412627 A CN 103412627A
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- square groove
- novel
- cooling fin
- heat sink
- sink body
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Abstract
The invention discloses a novel CPU (central processing unit) cooling fin which comprises a cooling fin body in the shape of an H-shaped plate. A plurality of vertically-communicated first through holes are formed in the cooling fin body. The novel CPU cooling fin is characterized in that at least one square groove parallel to one side of the cooling fin body is formed in the upper surface of the cooling fin body, two sliding pieces are arranged in each square groove face to face and can horizontally slide in the corresponding square groove so as to adjust the distance between the two square grooves, and horizontally-communicated second through holes are formed in the sliding pieces. A cooling pipe is clamped between the two sliding pieces, the distance between the two sliding pieces is adjusted to tightly clamp the cooling pipe, bolts are utilized to penetrate the second through holes and are screw down through nuts, so that the cooling pipe is fixed; due to the clamping mode, the cooling pipes are convenient to demount, and convenient to replace when damaged, interchangeability requirements are met, and connection strength is not affected by heating as compared with that of other connection modes like welding.
Description
Technical field
The present invention relates to a kind of cooling device, relate in particular to the heat radiator that a kind of computer CPU is used.
Background technology
In recent years, along with the transfer capability of power circuit constantly increases, power consumption increases thereupon, therefore various electronic components have also produced very huge heat, brought heat dissipation problem, produced heat abstractor thereupon, with regard to current CPU element, the raising of its integrated level and frequency of operation, also will improve the requirement of heat radiator.
Radiating tube of the prior art waits the mode of being fixedly connected with to be connected on heat radiator by welding, and this mode is dismantled inconvenience, and junction is subjected to thermally labile, the phenomenon such as likely cause thawing, come off.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of convenient disassembly and is subjected to heat-staple heat radiator.
For addressing the above problem, the invention provides a kind of novel C PU heat radiator, comprise work shape plate-shaped fin main body, described heat sink body is provided with the first through hole of some vertical perforations, it is characterized in that, described heat sink body upper surface also is provided with at least one square groove parallel with its one side, in described square groove, be provided with face-to-face two slide plates, described slide plate can horizontal slip in described square groove, thereby regulates the distance between two described square grooves, on described slide plate, is equipped with the second through hole that level connects.
As a further improvement on the present invention, described square groove has two, and arranges respectively on two opposite side of described heat sink body upper surface.
As a further improvement on the present invention, described the first through hole be four its be arranged on four angles of described heat sink body.
As a further improvement on the present invention, in described the first through hole all riveted joint the one colored tooth rivet that is provided with internal thread is arranged.
As a further improvement on the present invention, the lower surface of described heat sink body also is provided with a spatial accommodation snapped in be used to holding described cpu chip.
As a further improvement on the present invention, described heat sink body is aluminium matter.
Beneficial effect of the present invention is, radiating tube is snapped onto between two slide plates, regulate the distance between two slide plates, make it to clamp this radiating tube, re-use bolt and pass this second through hole, and pass through nut screwing clamping, thereby fix radiating tube, this clamping mode is convenient to dismounting, radiating tube damages to be convenient to change, meet the interchangeability requirement, and can as the connected modes such as welding, not affect its strength of joint because being heated.
The accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Wherein: the 2-square groove; 4-the second through hole; The 6-slide plate; The 8-heat sink body; 10-flower tooth rivet; 12-the first through hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further details.
As shown in Figure 1, the present invention includes work shape plate-shaped fin main body 8, heat sink body 8 is provided with the first through hole 12 of some vertical perforations, heat sink body 8 upper surfaces also are provided with at least one square groove 2 parallel with its one side, interior two slide plates 6 that are provided with face-to-face of square groove 2, slide plate 6 can horizontal slip in square groove 2, thereby the distance of regulating 2 of two square grooves is equipped with the second through hole 4 that level connects on slide plate 6.
Radiating tube is snapped onto between two slide plates 6, regulate the distance of 6 of two slide plates, make it to clamp this radiating tube, re-use bolt and pass this second through hole 4, and by nut screwing clamping, thereby radiating tube fixed, this clamping mode is convenient to dismounting, radiating tube damages to be convenient to change, and meets the interchangeability requirement, and can as the connected modes such as welding, not affect its strength of joint because being heated.
Square groove 2 has two, and arranges respectively on two opposite side of heat sink body 8 upper surfaces.Two square grooves 2 are set, in each square groove 2, are equipped with two slide plates 6, thereby the clamping area of increase and radiating tube improves chuck strength.
The first through hole 12 be four its be arranged on four angles of heat sink body 8.The first through hole 12 is four, the contact point of enhancing and pcb board, thus strengthen strength of joint.
The interior all riveted joints of the first through hole 12 have a colored tooth rivet 10 that is provided with internal thread.Be threaded connection, for convenience detach.
The lower surface of heat sink body 8 also is provided with a spatial accommodation snapped in be used to holding cpu chip.Adopt the mode of inlay card, simple in structure, easy to operate and be convenient to dismounting.
Above-described embodiment is preferably embodiment of the present invention; but embodiments of the present invention are not limited by the examples; other any do not deviate from change, the modification done under Spirit Essence of the present invention and principle, substitutes, combination, simplify and all should be equivalent substitute mode, within being included in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claim was defined.
Claims (6)
1. novel C PU heat radiator, comprise work shape plate-shaped fin main body, described heat sink body is provided with the first through hole of some vertical perforations, it is characterized in that, described heat sink body upper surface also is provided with at least one and its parallel square groove on one side, in described square groove, is provided with face-to-face two slide plates, and described slide plate can horizontal slip in described square groove, thereby regulate the distance between two described square grooves, on described slide plate, be equipped with the second through hole that level connects.
2. a kind of novel C PU heat radiator as claimed in claim 1, is characterized in that, described square groove has two, and arrange respectively on two opposite side of described heat sink body upper surface, in described square groove.
3. a kind of novel C PU heat radiator as claimed in claim 2, is characterized in that, described the first through hole be four its be arranged on four angles of described heat sink body.
4. a kind of novel C PU heat radiator as claimed in claim 3, is characterized in that, in described the first through hole all riveted joint the one colored tooth rivet that is provided with internal thread is arranged.
5. a kind of novel C PU heat radiator as claimed in claim 4, is characterized in that, the lower surface of described heat sink body also is provided with a spatial accommodation snapped in be used to holding described cpu chip.
6. a kind of novel C PU heat radiator as claimed in claim 5, is characterized in that, described heat sink body is aluminium matter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103280508A CN103412627A (en) | 2013-07-31 | 2013-07-31 | Novel CPU (central processing unit) cooling fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103280508A CN103412627A (en) | 2013-07-31 | 2013-07-31 | Novel CPU (central processing unit) cooling fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103412627A true CN103412627A (en) | 2013-11-27 |
Family
ID=49605648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103280508A Pending CN103412627A (en) | 2013-07-31 | 2013-07-31 | Novel CPU (central processing unit) cooling fin |
Country Status (1)
| Country | Link |
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| CN (1) | CN103412627A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2507139Y (en) * | 2001-09-10 | 2002-08-21 | 曜越科技股份有限公司 | Upper and lower clamping type CPU sink fastener |
| TWM311237U (en) * | 2006-09-15 | 2007-05-01 | Cooler Master Co Ltd | Fixing plate of heat sink |
| CN201436836U (en) * | 2009-06-26 | 2010-04-07 | 惠州鑫长风电子有限公司 | Backplate for radiator fastener |
| US20110127006A1 (en) * | 2009-12-02 | 2011-06-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| CN102958327A (en) * | 2011-08-31 | 2013-03-06 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN203377213U (en) * | 2013-07-31 | 2014-01-01 | 昆山维金五金制品有限公司 | Novel CPU (central processing unit) radiating fin |
-
2013
- 2013-07-31 CN CN2013103280508A patent/CN103412627A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2507139Y (en) * | 2001-09-10 | 2002-08-21 | 曜越科技股份有限公司 | Upper and lower clamping type CPU sink fastener |
| TWM311237U (en) * | 2006-09-15 | 2007-05-01 | Cooler Master Co Ltd | Fixing plate of heat sink |
| CN201436836U (en) * | 2009-06-26 | 2010-04-07 | 惠州鑫长风电子有限公司 | Backplate for radiator fastener |
| US20110127006A1 (en) * | 2009-12-02 | 2011-06-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| CN102958327A (en) * | 2011-08-31 | 2013-03-06 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN203377213U (en) * | 2013-07-31 | 2014-01-01 | 昆山维金五金制品有限公司 | Novel CPU (central processing unit) radiating fin |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131127 |