CN103396755A - Hot melt adhesive - Google Patents
Hot melt adhesive Download PDFInfo
- Publication number
- CN103396755A CN103396755A CN201310281859XA CN201310281859A CN103396755A CN 103396755 A CN103396755 A CN 103396755A CN 201310281859X A CN201310281859X A CN 201310281859XA CN 201310281859 A CN201310281859 A CN 201310281859A CN 103396755 A CN103396755 A CN 103396755A
- Authority
- CN
- China
- Prior art keywords
- hot melt
- melt adhesive
- bonding
- parts
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004831 Hot glue Substances 0.000 title claims abstract description 44
- 229910002651 NO3 Inorganic materials 0.000 claims abstract description 7
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000012188 paraffin wax Substances 0.000 claims abstract description 7
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 8
- 125000005456 glyceride group Chemical group 0.000 claims description 6
- 239000002904 solvent Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 abstract 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 1
- 230000002950 deficient Effects 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a hot melt adhesive. The hot melt adhesive consists of the following materials in parts by weight: 89-92 parts of polyamide resin, 3-7 parts of paraffin, 3-7 parts of rosin ester-rosin glycerol resin, less than 0.5 part of organic silicon and less than 0.5 part of nitrate. The hot melt adhesive has the following advantages that firstly, the curing speed is quick, and the bonding strength and the flexibility are better; the hot melt adhesive can be used for curing and bonding within a fraction of second to a few seconds, and has the characteristics of being molten while being heated up and being bonded while being cooled, so that a packer using the hot melt adhesive can adopt a production line with higher speed, the yield can be increased while the defective goods are reduced, the continuous and automatic high-speed operation is convenient, and the cost is lower; secondly, the bonding power of the hot melt adhesive is very stable and not affected by morning-evening temperature and humidity changes in a working environment, so that the bonding firmness is ensured, and a bonding exposure problem of a packing machine is eliminated; and thirdly, the hot melt adhesive does not contain water and any other solvent. Besides, the hot melt adhesive is easy to transport and store, long in service life, capable of eliminating damages and waste, and convenient to use.
Description
Technical field:
The invention belongs to polymeric material field, refer in particular to a kind of hot melt adhesive.
Background technology:
Hot melt adhesive is a kind ofly under melting condition, to be coated with, and through sclerosis or crystallization, produces the sizing agent of intensity.The coating of hot melt adhesive does not need solvent, and the market demand of hot melt adhesive is in continuous increase.
Existing thermosol has the following disadvantages:
1, curing speed is slow, and bonding strength is not good and snappiness is not good, and substandard products are many, yield poorly, and cost is higher.
2, the cohesive force of hot melt adhesive is unstable, the impact that changed by temperature and humidity sooner or later, and this just can not guarantee firmness, and has the intrinsic bonding problem that exhumes of wrapping mechanism.
Be directed to this, so the inventor designs the present invention.
Summary of the invention:
The object of the invention is to overcome above-mentioned existing deficiency, the hot melt adhesive that a kind of curing speed is fast, cohesive force is stable is provided.
The present invention realizes that the technical scheme that its purpose adopts is: a kind of hot melt adhesive, and formation raw material and the weight proportion of this hot melt adhesive are: polyamide resin 89-92 part; Paraffin 3-7 part; Staybelite glyceride 3-7 part; Organosilicon<0.5 part; Nitrate<0.5 part.
Formation raw material and the weight proportion of described hot melt adhesive are: 90.3 parts of polyamide resins; 5 parts, paraffin; 4 parts of staybelite glyceride; 0.3 part of organosilicon; 0.4 part, nitrate.
Or formation raw material and the weight proportion of described hot melt adhesive are: 89.4 parts of polyamide resins; 4 parts, paraffin; 6 parts of staybelite glyceride; 0.4 part of organosilicon; 0.2 part, nitrate.
Advantage of the present invention is mainly manifested in following several aspect:
1, curing speed is fast, and bonding strength and snappiness are preferably arranged.Hot melt adhesive can solidify bonding in 1/tens seconds to several seconds, have molten, cooling characteristic of gluing of heating.This makes to pack the business and uses hot melt adhesive can adopt the production line of more speed, and when reducing substandard products, increases output, be convenient to serialization, automatic high-speed operation, and cost is lower.
2, the cohesive force of hot melt adhesive is very stable, the impact that not changed by temperature and humidity sooner or later, and this has just guaranteed firmness, and has eliminated the intrinsic bonding problem that exhumes of wrapping mechanism.
3, not moisture and other any solvents of hot melt adhesive.Be easy to transportation, store.Long service life, and eliminated and damaged and waste, easy to use.
4, hot melt adhesive does not contain solvent and can not send the register toxic smog yet, and nonflammable, blast, have security, and can not cause to environment the health of secondary pollution and harmful to human.
5, the water-fast moisture-resistant of glue-line of hot melt adhesive formation, even also can form in a humid environment bonding reliably.
6, hot melt adhesive can repeatedly melt bonding, if the hot melt adhesive that is coated on adherend, can reheat and carry out bonding operation can not be bonding the time because of cooling curing, thus be specially adapted to the bonding of some special process requirement members, as the reparation of some historical relics.
But 7 adhering objects are extensive, and are not only bonding but also seal, and do not need drying process, and technique for sticking simply produces, and is good in economic efficiency.
Embodiment:
The present invention is further described below in conjunction with specific embodiment.
Embodiment mono-
In the present embodiment, the formation raw material of hot melt adhesive and weight are:
Embodiment bis-
In the present embodiment, the formation raw material of hot melt adhesive and weight are:
The present invention has the following advantages:
1, curing speed is fast, and bonding strength and snappiness are preferably arranged.Hot melt adhesive can solidify bonding in 1/tens seconds to several seconds, have molten, cooling characteristic of gluing of heating.This makes to pack the business and uses hot melt adhesive can adopt the production line of more speed, and when reducing substandard products, increases output, be convenient to serialization, automatic high-speed operation, and cost is lower.
2, the cohesive force of hot melt adhesive is very stable, the impact that not changed by temperature and humidity sooner or later, and this has just guaranteed firmness, and has eliminated the intrinsic bonding problem that exhumes of wrapping mechanism.
3, not moisture and other any solvents of hot melt adhesive.Be easy to transportation, store.Long service life, and eliminated and damaged and waste, easy to use.
4, hot melt adhesive does not contain solvent and can not send the register toxic smog yet, and nonflammable, blast, have security, and can not cause to environment the health of secondary pollution and harmful to human.
5, the water-fast moisture-resistant of glue-line of hot melt adhesive formation, even also can form in a humid environment bonding reliably.
6, hot melt adhesive can repeatedly melt bonding, if the hot melt adhesive that is coated on adherend, can reheat and carry out bonding operation can not be bonding the time because of cooling curing, thus be specially adapted to the bonding of some special process requirement members, as the reparation of some historical relics.
But 7 adhering objects are extensive, and are not only bonding but also seal, and do not need drying process, and technique for sticking simply produces, and is good in economic efficiency.
Above-mentioned embodiment is only the preferred embodiment of the present invention; can not limit the scope of protection of the invention with this, the variation of those skilled in the art does on basis of the present invention any unsubstantiality and replacement all belong to the present invention's scope required for protection.
Claims (3)
1. hot melt adhesive, it is characterized in that: formation raw material and the weight proportion of this hot melt adhesive are: polyamide resin 89-92 part; Paraffin 3-7 part; Staybelite glyceride 3-7 part; Organosilicon<0.5 part; Nitrate<0.5 part.
2. hot melt adhesive according to claim 1, it is characterized in that: formation raw material and the weight proportion of described hot melt adhesive are: 90.3 parts of polyamide resins; 5 parts, paraffin; 4 parts of staybelite glyceride; 0.3 part of organosilicon; 0.4 part, nitrate.
3. hot melt adhesive according to claim 1, it is characterized in that: formation raw material and the weight proportion of described hot melt adhesive are: 89.4 parts of polyamide resins; 4 parts, paraffin; 6 parts of staybelite glyceride; 0.4 part of organosilicon; 0.2 part, nitrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310281859.XA CN103396755B (en) | 2013-06-28 | 2013-06-28 | Hot melt adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310281859.XA CN103396755B (en) | 2013-06-28 | 2013-06-28 | Hot melt adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103396755A true CN103396755A (en) | 2013-11-20 |
| CN103396755B CN103396755B (en) | 2015-07-22 |
Family
ID=49560490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310281859.XA Active CN103396755B (en) | 2013-06-28 | 2013-06-28 | Hot melt adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103396755B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107663441A (en) * | 2017-11-17 | 2018-02-06 | 东莞市诚信兴智能卡有限公司 | A kind of IC-card encapsulates PUR |
| CN107964386A (en) * | 2017-12-05 | 2018-04-27 | 江苏江永新材料科技有限公司 | A kind of hot melt adhesive |
| CN109439270A (en) * | 2018-09-29 | 2019-03-08 | 太仓斯迪克新材料科技有限公司 | A kind of thermosol |
| CN109777348A (en) * | 2018-12-26 | 2019-05-21 | 衢州市富星和宝黏胶工业有限公司 | A kind of hot melt adhesive |
| CN111809408A (en) * | 2020-07-22 | 2020-10-23 | 陈猛 | Spandex-free cloth composite high-elastic film flocking and preparation method thereof |
| CN113930211A (en) * | 2021-11-26 | 2022-01-14 | 常州立铭材料科技有限公司 | Hot melt adhesive for ultrathin stretch-proof polyester belt |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265396A (en) * | 2008-05-06 | 2008-09-17 | 上海爱世博有机硅材料有限公司 | Method for preparing water-soluble hot-melt adhesive glue |
| US20100063173A1 (en) * | 2008-09-05 | 2010-03-11 | Italo Corzani | Hot melt adhesive composition |
| CN101838511A (en) * | 2010-03-31 | 2010-09-22 | 鲁泰纺织股份有限公司 | Heat-resistant clothing hot melt adhesive and preparation method thereof |
| CN102559128A (en) * | 2010-12-20 | 2012-07-11 | 深圳市宏商材料科技股份有限公司 | Formula of oil-resistant hot melt adhesive and production process of hot melt adhesive |
| CN102618204A (en) * | 2012-04-01 | 2012-08-01 | 江阴市诺科科技有限公司 | Hot-melt adhesive for bonding layer of artificial leather and preparation method as well as application thereof |
| CN102676083A (en) * | 2011-03-08 | 2012-09-19 | 株式会社五公 | Hot melt glue composition having fewer volatile organic compound |
-
2013
- 2013-06-28 CN CN201310281859.XA patent/CN103396755B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265396A (en) * | 2008-05-06 | 2008-09-17 | 上海爱世博有机硅材料有限公司 | Method for preparing water-soluble hot-melt adhesive glue |
| US20100063173A1 (en) * | 2008-09-05 | 2010-03-11 | Italo Corzani | Hot melt adhesive composition |
| CN101838511A (en) * | 2010-03-31 | 2010-09-22 | 鲁泰纺织股份有限公司 | Heat-resistant clothing hot melt adhesive and preparation method thereof |
| CN102559128A (en) * | 2010-12-20 | 2012-07-11 | 深圳市宏商材料科技股份有限公司 | Formula of oil-resistant hot melt adhesive and production process of hot melt adhesive |
| CN102676083A (en) * | 2011-03-08 | 2012-09-19 | 株式会社五公 | Hot melt glue composition having fewer volatile organic compound |
| CN102618204A (en) * | 2012-04-01 | 2012-08-01 | 江阴市诺科科技有限公司 | Hot-melt adhesive for bonding layer of artificial leather and preparation method as well as application thereof |
Non-Patent Citations (1)
| Title |
|---|
| 张忠厚: "《制鞋与皮革胶黏剂》", 28 February 2009, 化学工业出版社 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107663441A (en) * | 2017-11-17 | 2018-02-06 | 东莞市诚信兴智能卡有限公司 | A kind of IC-card encapsulates PUR |
| CN107964386A (en) * | 2017-12-05 | 2018-04-27 | 江苏江永新材料科技有限公司 | A kind of hot melt adhesive |
| CN109439270A (en) * | 2018-09-29 | 2019-03-08 | 太仓斯迪克新材料科技有限公司 | A kind of thermosol |
| CN109777348A (en) * | 2018-12-26 | 2019-05-21 | 衢州市富星和宝黏胶工业有限公司 | A kind of hot melt adhesive |
| CN111809408A (en) * | 2020-07-22 | 2020-10-23 | 陈猛 | Spandex-free cloth composite high-elastic film flocking and preparation method thereof |
| CN113930211A (en) * | 2021-11-26 | 2022-01-14 | 常州立铭材料科技有限公司 | Hot melt adhesive for ultrathin stretch-proof polyester belt |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103396755B (en) | 2015-07-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: DONGGUAN SFWZ INTELLIGENT TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: DONGGUAN?SHICHUANG ELECTRONIC?CO., LTD. Effective date: 20141209 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20141209 Address after: 523000 Xin'an City, Dongguan province Changan Town Community Road, No. 3 middle road, No. Applicant after: Big intelligent Science and Technology Ltd. of the dark side of Dongguan City Address before: 523000, Changan Town, Guangdong City, Xin'an province Dongguan community road Applicant before: Dongguan Shichuang Hardware Electronics Co., Ltd. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170203 Address after: 523000 Guangdong city in Dongguan Province town of Changan Sand Village Fifth Industrial Zone No. 6 spring Patentee after: Dongguan three smart card technology Co., Ltd. Address before: 523000 Xin''an City, Dongguan province Changan Town Community Road, No. 3 middle road, No. Patentee before: Big intelligent Science and Technology Ltd. of the dark side of Dongguan City |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Hot melt adhesive Effective date of registration: 20220112 Granted publication date: 20150722 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: DONGGUAN SANCHUANG SMART CARD TECHNOLOGY CO.,LTD. Registration number: Y2022980000448 |