CN109439270A - A kind of thermosol - Google Patents
A kind of thermosol Download PDFInfo
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- CN109439270A CN109439270A CN201811147818.0A CN201811147818A CN109439270A CN 109439270 A CN109439270 A CN 109439270A CN 201811147818 A CN201811147818 A CN 201811147818A CN 109439270 A CN109439270 A CN 109439270A
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- hot melt
- melt adhesive
- chitosan
- radiation
- thermosol
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- 239000004831 Hot glue Substances 0.000 claims abstract description 54
- 230000005855 radiation Effects 0.000 claims abstract description 28
- 229920001661 Chitosan Polymers 0.000 claims abstract description 23
- 239000000654 additive Substances 0.000 claims abstract description 23
- 230000000996 additive effect Effects 0.000 claims abstract description 23
- -1 as frame structure Substances 0.000 claims abstract description 22
- 108010010803 Gelatin Proteins 0.000 claims abstract description 13
- 239000008273 gelatin Substances 0.000 claims abstract description 13
- 229920000159 gelatin Polymers 0.000 claims abstract description 13
- 235000019322 gelatine Nutrition 0.000 claims abstract description 13
- 235000011852 gelatine desserts Nutrition 0.000 claims abstract description 13
- 229920003063 hydroxymethyl cellulose Polymers 0.000 claims abstract description 12
- 229940031574 hydroxymethyl cellulose Drugs 0.000 claims abstract description 12
- 150000003839 salts Chemical class 0.000 claims abstract description 9
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 14
- 229920002338 polyhydroxyethylmethacrylate Polymers 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000000499 gel Substances 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 239000011261 inert gas Substances 0.000 claims description 10
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- 239000000017 hydrogel Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 230000035484 reaction time Effects 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 5
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000004090 dissolution Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- 239000012164 animal wax Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 125000005456 glyceride group Chemical group 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000013049 sediment Substances 0.000 claims description 3
- 239000006228 supernatant Substances 0.000 claims description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 239000012178 vegetable wax Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000010894 electron beam technology Methods 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 238000004132 cross linking Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011257 shell material Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000000787 lecithin Substances 0.000 description 1
- 235000010445 lecithin Nutrition 0.000 description 1
- 229940067606 lecithin Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000011833 salt mixture Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The present invention relates to a kind of thermosol, including hot melt adhesive and hot melt adhesive additive, the hot melt adhesive additive includes chitosan or chitosan salt, hydroxymethyl cellulose, polyethylene glycol oxide, gelatin, SAP.The hot melt adhesive additive being prepared in this programme is blended in hot melt adhesive, it is improved after hot melt adhesive have many advantages, such as that curing rate is fast, cementitiousness is strong；In use, hot melt adhesive additive, as frame structure, hot melt adhesive is filled in hot melt adhesive additive, the hot melt adhesive additive being prepared using crosslinking with radiation technology has good structural strength, it is ensured that the structural strength of hot melt adhesive after bonding；In addition hot melt adhesive is filled in frame structure, that is, is divided into several fritters, increases the contact area with air, i.e. increase curing rate.
Description
Technical field
The present invention relates to a kind of adhesive, in particular to a kind of thermosol.
Background technique
Adhesive refers to the technology that homogeneous or heterogeneous surface is linked together with adhesive, and there is stress distribution to connect
The features such as continuous, light-weight, technological temperature is low.It is glued especially suitable for different materials, different thicknesses, ultra-thin specification and complex component
Connection.Splicing RECENT DEVELOPMENTS is most fast, and application industry is extremely wide.There are many classification method of adhesive, can be divided into heat by application method
Curable type, heat molten type, room temperature curing type, pressure sensitive etc.；It is divided into structural, non-configuration or special glue by application；Connecing form can
It is divided into water-soluble, emulsion type, solvent type and various solid-state versions etc.；Traditional adhesive production cost is high, and using effect is bad.
Hot melt adhesive is a kind of adhesive of plasticity, and room temperature is in solid state, energy rapid link, feature after heating and melting
It is:
(1) bonding is usually cemented from gluing to cooling rapidly, it is only necessary to Ji Shimiao or even several seconds time；
(2) bonding range glues material (such as polyolefin, paraffin paper, carbon paper) extensively to many materials, or even to generally acknowledged difficulty
It can also be bonded, especially with the connector of hot melt adhesive bonding, 105~106 times or more bendings can be subjected to without cracking；
(3) it can heat, repeatedly be bonded repeatedly；
(4) performance is stablized convenient for storage transport；
(5) hot melt adhesive low in cost does not have solvent consumption, avoids the presence because of solvent, and deforms adherend.Dislocation
With the disadvantages such as shrink, help to reduce cost, improve product quality.However, there is also some disadvantages are mainly heat-resisting for hot melt adhesive
Property and adhesive strength are lower, are not suitable for using as sqtructural adhesive.Hot melt adhesive in certain temperature range its physical state with
Temperature changes and changes, and chemical characteristic is constant, non-toxic and tasteless, belongs to environmental-protecting chemical product.
Existing thermosol has the disadvantage that 1, curing rate is slow, and adhesive strength is bad and flexibility is bad, substandard products
It is more, low output, higher cost；2, the cohesive force of hot melt adhesive is unstable, the shadow changed by morning and evening temperature in working environment and humidity
It rings, this cannot guarantee firmness, and there are problems that the intrinsic bonding of package packing machine exhumes；3, hot melt adhesive one kind is poisonous and harmful
Substance also not environmentally, contain certain formaldehyde substance.
We provide that a kind of curing rate is very fast herein, and the more stable hot melt adhesive of viscous ability.
Summary of the invention
The object of the present invention is to provide a kind of thermosols.
Above-mentioned technical purpose of the invention has the technical scheme that a kind of thermosol, including
Hot melt adhesive and hot melt adhesive additive, the hot melt adhesive additive include chitosan or chitosan salt, hydroxymethyl cellulose, polyoxy
Change ethylene, gelatin, SAP.
Preferably, silica gel, the replacement of nanometer Silica hydrogel can be used in the polyoxyethylene.
Preferably, the hot melt adhesive additive mainly includes following preparation step:
Step 1: heating up and stir after chitosan, PHEMA and sufficient solvent are mixed, the ratio of chitosan and PHEMA are
1-1.5:9 temperature is 92-105 DEG C；
Step 2: polyoxyethylene being put into the mixture into step 1, is uniformly mixed；
Step 3: supernatant liquor will be extracted out after the mixture centrifugal treating in step 2, to lower sediment thing vacuumize process
Repeatedly；
Step 4: nitrogen or inert gas are poured into reaction environment as protective gas, radiation treatment, dose of radiation is
30-40KGy, radiated time are 40-100 hours formation high-molecular gel A, inert gas shielding；
Step 5: in the hot water by hydroxymethyl cellulose, gelatin, chitosan quaternary ammonium salt dissolution, persistently stirring 1-2 hours；
Step 6: the Macromolecule that the mixed solution even application being prepared in step 5 is prepared in step 4
The surface glue A, radiation treatment, dose of radiation 40-60KGy, reaction temperature are higher than 65 DEG C, and the reaction time is to be formed for 40-100 hours
High-molecular gel B, inert gas shielding；
Step 7: SAP powder being sprayed in step 6, high-molecular gel B surface, radiation treatment, dose of radiation is prepared
For 60-120KGy, the reaction time is that high-molecular gel C, inert gas shielding are formed after 60-140 hours.
Preferably, the electron beam uses 60Co gamma ray projector.
Preferably, the hot melt adhesive include polyamide, rosin glycerides, organosilicon, inorganic salts, tetrahydrofuran,
Vegetable wax or animal wax, dispersing agent, opening agent,
Preferably, following components is by weight:
Preferably, the mixed proportion of hot melt adhesive additive and hot melt adhesive is 0.5-2.5%%:97.5%-99.5%.
In conclusion the invention has the following advantages:
1. 1. the high-molecular hydrogel dressing main component in this programme is chitosan or chitosan salt, hydroxylmethyl cellulose
Element, polyethylene glycol oxide, PHEMA, gelatin, SAP；During the preparation process, it is divided into multi-step, multiple crosslinking with radiation, and each time
Inert gas shielding is all made of when crosslinking with radiation；The gel fraction of high-molecular hydrogel dressing and crosslinking journey after preparing can be enhanced
Degree, while avoiding generation oxidation of polymer substance during crosslinking with radiation that mechanical strength is caused to reduce；
2. when preparation, in advance by chitosan-PHEMA, polyoxyethylene reaction, main frame being used as after being cross-linked with each other, is had good
Good mechanical strength and oxygen permeability；Again chitosan-will be sprayed on after hydroxymethyl cellulose, gelatin, chitosan quaternary ammonium salt dissolution
On the main frame that PHEMA, polyoxyethylene are formed, continue crosslinking with radiation reaction；Finally by SAP powder or SAP, lecithin cosmetics
End, which is spilt, is placed on its surface；When crosslinking with radiation reaction vacuumize process occurs, surface macromolecule in netted, other substance sprays it
After be connected in grid, be conducive to cross-linking reaction；
3. the hot melt adhesive additive being prepared in this programme is blended in hot melt adhesive, it is improved after hot melt adhesive have
The advantages that curing rate is fast, cementitiousness is strong；In use, hot melt adhesive additive, as frame structure, hot melt adhesive is filled in hot melt
In glue additive, the hot melt adhesive additive being prepared using crosslinking with radiation technology has good structural strength, it is ensured that
The structural strength of hot melt adhesive after bonding；In addition hot melt adhesive is filled in frame structure, that is, is divided into several fritters, increase with
The contact area of air, i.e. increase curing rate.
Specific embodiment
This specific embodiment is only explanation of the invention, is not limitation of the present invention, those skilled in the art
Member can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but as long as at this
All by the protection of Patent Law in the scope of the claims of invention.
Embodiment:
A kind of thermosol includes mainly hot melt adhesive and hot melt adhesive additive, and hot melt adhesive additive includes chitosan
Or chitosan salt, hydroxymethyl cellulose, polyethylene glycol oxide, gelatin, SAP；Hot melt adhesive include polyamide, rosin glycerides,
Organosilicon, inorganic salts, tetrahydrofuran, vegetable wax or animal wax, dispersing agent, opening agent；Chitosan or chitosan salt use hydroxyl first
Silica gel, the replacement of nanometer Silica hydrogel can be used in base enclosure glycan and chitosan quaternary ammonium salt mixture, polyoxyethylene.
Preparation method, as follows:
Step 1: heating up and stir after chitosan, PHEMA and sufficient solvent are mixed, the ratio of chitosan and PHEMA are
1-1.5:9 temperature is 92-105 DEG C；
Step 2: polyoxyethylene being put into the mixture into step 1, is uniformly mixed；
Step 3: supernatant liquor will be extracted out after the mixture centrifugal treating in step 2, to lower sediment thing vacuumize process
Repeatedly；
Step 4: nitrogen or inert gas are poured into reaction environment as protective gas, radiation treatment, dose of radiation is
30-40KGy, radiated time are 40-100 hours；
Step 5: in the hot water by hydroxymethyl cellulose, gelatin, chitosan quaternary ammonium salt dissolution, persistently stirring 1-2 hours；
Step 6: the mixed solution even application being prepared in step 5 being prepared into material surface in step 4, at radiation
Reason, dose of radiation 40-60KGy, reaction temperature are higher than 65 DEG C, and the reaction time is 40-100 hours formation high-molecular gel B；
Step 7: SAP powder being sprayed in step 6, high-molecular gel B surface, radiation treatment, dose of radiation is prepared
For 60-120KGy, the reaction time is that hot melt adhesive additive is formed after 60-140 hours.
Embodiment 1- embodiment 4 is as shown in table 1 below about design parameter in step 1；
Table 1:
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | |
| Ratio | 1:9 | 1.2:9 | 1.4:9 | 1.5:9 |
| Temperature (DEG C) | 92 | 96 | 100 | 105 |
Embodiment 5- embodiment 8 is as shown in table 2 below about design parameter in step 4；
Table 2:
| Embodiment 5 | Embodiment 6 | Embodiment 7 | Embodiment 8 | |
| Dose of radiation | 30 | 40 | 34 | 38 |
| Radiated time | 40 | 100 | 80 | 60 |
Embodiment 9- embodiment 12 is as shown in table 3 below about design parameter in step 6；
Table 3:
| Embodiment 9 | Embodiment 10 | Embodiment 11 | Embodiment 12 | |
| Dose of radiation | 40 | 46 | 53 | 60 |
| Reaction temperature | 65 | 68 | 72 | 75 |
| Radiated time | 40 | 60 | 80 | 100 |
Embodiment 13- embodiment 16 is as shown in table 4 below about design parameter in step 7；
Table 4:
| Embodiment 13 | Embodiment 14 | Embodiment 15 | Embodiment 16 | |
| Dose of radiation | 60 | 85 | 105 | 120 |
| Radiated time | 60 | 80 | 100 | 140 |
When the data in table 1, table 2, table 3, table 4 change, data are remained unchanged in other tables.
The ratio of polyoxyethylene and chitosan-PHEMA are 1-3:0.8, hydroxymethyl cellulose, gelatin, shell in embodiment 17
The proportionate relationship of glycan quaternary ammonium salt is 1-3:1-3:1.2.
The ratio of polyoxyethylene and chitosan-PHEMA are 1-3:0.8, hydroxymethyl cellulose, gelatin, shell in embodiment 18
The proportionate relationship of glycan quaternary ammonium salt is 1-3:1-3:1.2.
The ratio of polyoxyethylene and chitosan-PHEMA are 1-3:0.8, hydroxymethyl cellulose, gelatin, shell in embodiment 19
The proportionate relationship of glycan quaternary ammonium salt is 1-3:1-3:1.2.
The ratio of polyoxyethylene and chitosan-PHEMA are 1-3:0.8, hydroxymethyl cellulose, gelatin, shell in embodiment 20
The proportionate relationship of glycan quaternary ammonium salt is 1-3:1-3:1.2.
Polyoxyethylene is replaced with silica gel in embodiment 21.
Polyoxyethylene is replaced using nanometer Silica hydrogel in embodiment 22.
Proportionate relationship between hot melt adhesive and the above-mentioned hot melt adhesive additive being prepared is 0.5-2.5%:97.5-
99.5%.
Improved hot melt adhesive is tested for the property, conclusion can be obtained:
1. hot melt adhesive additive can be mixed preferably with hot melt adhesive, it is uniformly mixed；Newly improved is formed after mixing
Hot melt adhesive adhesive；In use, curing rate is faster compared to hot melt adhesive common on the market.
Claims (7)
1. a kind of thermosol, it is characterised in that: including hot melt adhesive and hot melt adhesive additive, the hot melt adhesive additive packet
Include chitosan or chitosan salt, hydroxymethyl cellulose, polyethylene glycol oxide, gelatin, SAP.
2. a kind of thermosol according to claim 1, it is characterised in that: the polyoxyethylene can be used silica gel, receive
Rice Silica hydrogel replacement.
3. a kind of thermosol according to claim 2, which is characterized in that the hot melt adhesive additive mainly include with
Lower preparation step:
Step 1: heating up and stir after chitosan, PHEMA and sufficient solvent are mixed, the ratio of chitosan and PHEMA are 1-
1.5:9, temperature are 92-105 DEG C；
Step 2: polyoxyethylene being put into the mixture into step 1, is uniformly mixed；
Step 3: supernatant liquor will be extracted out after the mixture centrifugal treating in step 2, it is multiple to lower sediment thing vacuumize process；
Step 4: nitrogen or inert gas are poured into reaction environment as protective gas, radiation treatment, dose of radiation 30-
40KGy, radiated time are 40-100 hours formation high-molecular gel A, inert gas shielding；
Step 5: in the hot water by hydroxymethyl cellulose, gelatin, chitosan quaternary ammonium salt dissolution, persistently stirring 1-2 hours；
Step 6: the high-molecular gel A table that the mixed solution even application being prepared in step 5 is prepared in step 4
Face, radiation treatment, dose of radiation 40-60KGy, reaction temperature are higher than 65 DEG C, and the reaction time is 40-100 hours formation high scores
Sub- gel B, inert gas shielding；
Step 7: SAP powder being sprayed in step 6, high-molecular gel B surface, radiation treatment is prepared, dose of radiation is
60-120KGy, reaction time are that high-molecular gel C, inert gas shielding are formed after 60-140 hours.
4. a kind of thermosol according to claim 3, it is characterised in that: the electron beam uses 60Co gamma-rays
Source.
5. a kind of thermosol according to claim 4, it is characterised in that: the hot melt adhesive include polyamide,
Rosin glycerides, organosilicon, inorganic salts, tetrahydrofuran, vegetable wax or animal wax, dispersing agent, opening agent.
6. a kind of thermosol according to claim 5, which is characterized in that following components by weight:
7. a kind of thermosol according to claim 6, it is characterised in that: the mixing of hot melt adhesive additive and hot melt adhesive
Ratio is 0.5-2.5%%:97.5%-99.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811147818.0A CN109439270A (en) | 2018-09-29 | 2018-09-29 | A kind of thermosol |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811147818.0A CN109439270A (en) | 2018-09-29 | 2018-09-29 | A kind of thermosol |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109439270A true CN109439270A (en) | 2019-03-08 |
Family
ID=65544813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811147818.0A Pending CN109439270A (en) | 2018-09-29 | 2018-09-29 | A kind of thermosol |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109439270A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103396755A (en) * | 2013-06-28 | 2013-11-20 | 东莞市实创五金电子有限公司 | Hot melt adhesive |
| CN105670524A (en) * | 2016-02-02 | 2016-06-15 | 平湖展鹏热熔胶膜有限公司 | Preparation method of high-quality breathable hot melt adhesive film |
| CN108192555A (en) * | 2018-02-12 | 2018-06-22 | 中山爵邦时装科技有限公司 | A kind of adhesive composition and its application in clothing |
-
2018
- 2018-09-29 CN CN201811147818.0A patent/CN109439270A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103396755A (en) * | 2013-06-28 | 2013-11-20 | 东莞市实创五金电子有限公司 | Hot melt adhesive |
| CN105670524A (en) * | 2016-02-02 | 2016-06-15 | 平湖展鹏热熔胶膜有限公司 | Preparation method of high-quality breathable hot melt adhesive film |
| CN108192555A (en) * | 2018-02-12 | 2018-06-22 | 中山爵邦时装科技有限公司 | A kind of adhesive composition and its application in clothing |
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Application publication date: 20190308 |
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