CN207845551U - A kind of high temperature resistant conductive hot melt adhesive tape - Google Patents
A kind of high temperature resistant conductive hot melt adhesive tape Download PDFInfo
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- CN207845551U CN207845551U CN201820005215.6U CN201820005215U CN207845551U CN 207845551 U CN207845551 U CN 207845551U CN 201820005215 U CN201820005215 U CN 201820005215U CN 207845551 U CN207845551 U CN 207845551U
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- layer
- hot melt
- melt adhesive
- adhesive tape
- conductive
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Abstract
The utility model belongs to tape technology field, disclose a kind of high temperature resistant conductive hot melt adhesive tape, including the release film set gradually from top to bottom, hot melt adhesive layer, vinyl chloride-vinyl acetate resin layer, stretch-resistant layer, conductive layer, fibrous layer, substrate layer, the lower surface of the release film is bonded with the upper surface of the hot melt adhesive layer, the lower surface of the hot melt adhesive layer is bonded with the upper surface of the vinyl chloride-vinyl acetate resin layer, the lower surface of the vinyl chloride-vinyl acetate resin layer is bonded with the upper surface of the stretch-resistant layer, the lower surface of the stretch-resistant layer is bonded with the upper surface of the conductive layer, the lower surface of the conductive layer is bonded with the upper surface of the fibrous layer, the lower surface of the fibrous layer is bonded with the upper surface of the substrate layer.The conductive energy of Hot melt adhesive tape of the utility model, and sticky good, stretch-proof, high temperature resistant.
Description
Technical field
The utility model belongs to tape technology field, and in particular to a kind of high temperature resistant conductive hot melt adhesive tape.
Background technology
With automobile, the development of electronics industry, the application of high-performance adhesive is more and more extensive, and hot melt adhesive is as adhesive
In an important kind, characteristic makes its effect be not easy to be substituted.Hot melt adhesive has the following advantages that：（1）Hot melt adhesive has
There is itself softening point, when use is heated to it certain temperature and can be used；（2）Once heating uses, thermosol plays at once
Its stealthy high adhesion, with affixed object tight bond, be not readily separated.
In actual production life, Hot melt adhesive tape is very common, and the Hot melt adhesive tape generally used in industry includes mainly base
Layer and hot melt adhesive layer, initial Hot melt adhesive tape are mainly used for apparel industry, and main component is PU adhesive stickers, has the work(of waterproof
Can, but poorly conductive.Such as in industrial dedusting, generally use is adhesively fixed between filtrate, according to existing hot melt adhesive or
Hot melt adhesive tape is fixed, when high-temperature flue gas by when, filtrate is filtered the flying dust, the flue dust that are generated in industrial production, powder
Collision and friction between dirt particle will produce a large amount of electrostatic, these dust for carrying electrostatic can be adsorbed on Hot melt adhesive tape,
Due to the poorly conductive of Hot melt adhesive tape, charge is accumulated on adhesive tape, is made troubles to the replacement of filtrate.In other field, hot melt
The low problem of adhesive tape electric conductivity also restricts its application.
Another problem of existing Hot melt adhesive tape is to use PET film as substrate layer, but hot melt adhesive layer is in pet layer more
On adhesive force it is often bad；And intensity difference, it is easy to moisture absorption, be easy breakage, especially winter be easy embrittlement after crack, cause object
Material leaks, and waste is very big.
Invention content
The purpose of this utility model is to provide a kind of high temperature resistant conductive hot melt adhesive tape, cannot to solve existing hot melt adhesive adhesive tape
The problems such as conductive, sticky inadequate.
In order to achieve the above objectives, the utility model uses following technical scheme：
A kind of high temperature resistant conductive hot melt adhesive tape, including the release film, hot melt adhesive layer, the vinyl chloride-vinyl acetate resin that set gradually from top to bottom
Layer, stretch-resistant layer, conductive layer, fibrous layer, substrate layer, the upper table face paste of the lower surface of the release film and the hot melt adhesive layer
Close, the lower surface of the hot melt adhesive layer is bonded with the upper surface of the vinyl chloride-vinyl acetate resin layer, the lower surface of the vinyl chloride-vinyl acetate resin layer and
The upper surface of the stretch-resistant layer is bonded, and the lower surface of the stretch-resistant layer is bonded with the upper surface of the conductive layer, described to lead
The lower surface of electric layer is bonded with the upper surface of the fibrous layer, the upper table face paste of the lower surface of the fibrous layer and the substrate layer
It closes.
Further, the thickness of the release film is 15 ~ 30 μm.
Further, the hot melt adhesive layer is polyethylene layer；Its thickness is 100 ~ 300 μm.
Further, the thickness of the vinyl chloride-vinyl acetate resin layer is 10 ~ 20 μm.
Further, the stretch-resistant layer is bidirectional stretching polypropylene film.
Further, the thickness of the stretch-resistant layer is 20 ~ 40 μm.
Further, conductive black or metallic particles are dispersed in the conductive layer.
Further, the thickness of the conductive layer is 8 ~ 25 μm.
Further, the fibrous layer is glass fiber tape, PP belt or PET strip, and thickness is 30 ~ 40 μm.
Further, the substrate layer is polytetrafluoroethylene film, and thickness is 200 ~ 400 μm.
The utility model has the advantages that：
1, the utility model is by being arranged conductive layer, and evenly dispersed conductive black or metallic particles all have in conductive layer
Good conductive capability, makes adhesive tape have electric conductivity, prevents electrostatic from heaping.
2, the substrate layer of the utility model uses polytetrafluoroethylene (PTFE), polytetrafluoroethylene (PTFE) itself to have high-temperature stability, make glue
Band can adapt to hot environment, widen the use scope of adhesive tape significantly.
3, the addition of stretch-resistant layer so that Hot melt adhesive tape has the advantages that good intensity, good airproof performance, not moisture-inhibiting, tension effect
Fruit is good, and tensile strength >=150N/in does not have phenomenon of rupture, thoroughly solves the problems, such as material leakage.
4, the utility model increases vinyl chloride-vinyl acetate resin layer, and Hot melt adhesive tape adhesion strength >=25N/in, firm pasting can be made to keep
Property is good.
Description of the drawings
Fig. 1 is the structural schematic diagram of high temperature resistant conductive hot melt adhesive tape provided by the utility model.
Specific implementation mode
Utility model will be further described in detail below with reference to the attached drawings and specific embodiments.
As shown in Figure 1, the high temperature resistant conductive hot melt adhesive tape of the utility model, including the release film that sets gradually from top to bottom
1, hot melt adhesive layer 2, vinyl chloride-vinyl acetate resin layer 3, stretch-resistant layer 4, conductive layer 5, fibrous layer 6, substrate layer 7, the lower surface of the release film 1
It is bonded with the upper surface of the hot melt adhesive layer 2, the upper table face paste of the lower surface of the hot melt adhesive layer 2 and the vinyl chloride-vinyl acetate resin layer 3
Close, the lower surface of the vinyl chloride-vinyl acetate resin layer 3 is bonded with the upper surface of the stretch-resistant layer 4, the lower surface of the stretch-resistant layer 4 and
The upper surface of the conductive layer 5 is bonded, and the lower surface of the conductive layer 5 is bonded with the upper surface of the fibrous layer 6, the fiber
The lower surface of layer 6 is bonded with the upper surface of the substrate layer 7.
The thickness of release film is 15 ~ 30 μm, and in a specific embodiment, thickness is 15 μm.
Release film is PET release films, and the binding face of PET release films and hot melt adhesive layer is frosting.
Hot melt adhesive layer is polyethylene layer；Its thickness is 100 ~ 300 μm, and in a specific embodiment, thickness is 150 μ
m。
Polyethylene is a kind of aggregated thermoplastic resin obtained of ethylene, odorless, nontoxic, with excellent heat-resisting quantity
Energy.
The thickness of vinyl chloride-vinyl acetate resin layer is 10 ~ 20 μm, and in a specific embodiment, thickness is 20 μm.
Vinyl chloride-vinyl acetate resin layer can make Hot melt adhesive tape adhesion strength >=25N/in, firm pasting, and retentivity is good.
Stretch-resistant layer is bidirectional stretching polypropylene film.
The thickness of stretch-resistant layer is 20 ~ 40 μm, and in a specific embodiment, thickness is 30 μm.
The addition of stretch-resistant layer so that Hot melt adhesive tape has the advantages that good intensity, good airproof performance, not moisture-inhibiting, tension effect
Good, tensile strength >=150N/in does not have phenomenon of rupture, thoroughly solves the problems, such as material leakage.
Conductive black or metallic particles are dispersed in conductive layer.
The thickness of conductive layer is 8 ~ 25 μm, and in a specific embodiment, thickness is 18 μm.
By setting conductive layer, evenly dispersed conductive black or metallic particles all have good conductive energy in conductive layer
Power makes adhesive tape have electric conductivity, prevents electrostatic from heaping.
Fibrous layer is glass fiber tape, PP belt or PET strip, and thickness is 30 ~ 40 μm, in a specific embodiment,
Thickness is 35 μm.
Substrate layer is polytetrafluoroethylene film, and thickness is 200 ~ 400 μm, in a specific embodiment, thickness 300
μm。
Polytetrafluoroethylene (PTFE) itself has high-temperature stability, so that adhesive tape is can adapt to hot environment, has widened adhesive tape significantly
Use scope.
The Hot melt adhesive tape of the utility model has conductive characteristic, and stretching resistance greatly reinforces, and ductility is good, impact force
By force, not easy to break, there is good corrosion resistance, weatherability, and hardness is low, flexibility is good, will not damage packed article, make packet
The danger being hurt at dress object stress minimizes, more sharp environmental protection.
The description of the embodiments and the specification only illustrate the principle of the present utility model and most preferred embodiment, is not taking off
Under the premise of from the spirit and scope of the utility model, the utility model also has various changes and improvements, these changes and improvements
It both falls in claimed the scope of the utility model.
Claims (10)
1. a kind of high temperature resistant conductive hot melt adhesive tape, which is characterized in that including set gradually from top to bottom release film, hot melt adhesive
Layer, vinyl chloride-vinyl acetate resin layer, stretch-resistant layer, conductive layer, fibrous layer, substrate layer, the lower surface of the release film and the hot melt adhesive layer
Upper surface fitting, the lower surface of the hot melt adhesive layer is bonded with the upper surface of the vinyl chloride-vinyl acetate resin layer, the vinyl chloride-vinyl acetate resin layer
Lower surface be bonded with the upper surface of the stretch-resistant layer, the upper table face paste of the lower surface of the stretch-resistant layer and the conductive layer
It closes, the lower surface of the conductive layer is bonded with the upper surface of the fibrous layer, the lower surface of the fibrous layer and the substrate layer
Upper surface fitting.
2. Hot melt adhesive tape according to claim 1, which is characterized in that the thickness of the release film is 15 ~ 30 μm.
3. Hot melt adhesive tape according to claim 1, which is characterized in that the hot melt adhesive layer is polyethylene layer；Its thickness is
100~300μm。
4. Hot melt adhesive tape according to claim 1, which is characterized in that the thickness of the vinyl chloride-vinyl acetate resin layer is 10 ~ 20 μm.
5. Hot melt adhesive tape according to claim 1, which is characterized in that the stretch-resistant layer is that Biaxially oriented polypropylene is thin
Film.
6. Hot melt adhesive tape according to claim 1, which is characterized in that the thickness of the stretch-resistant layer is 20 ~ 40 μm.
7. Hot melt adhesive tape according to claim 1, which is characterized in that be dispersed with conductive black or metal in the conductive layer
Particle.
8. Hot melt adhesive tape according to claim 1, which is characterized in that the thickness of the conductive layer is 8 ~ 25 μm.
9. Hot melt adhesive tape according to claim 1, which is characterized in that the fibrous layer is glass fiber tape, PP belt or PET
Band, thickness are 30 ~ 40 μm.
10. Hot melt adhesive tape according to claim 1, which is characterized in that the substrate layer is polytetrafluoroethylene film, thickness
It is 200 ~ 400 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820005215.6U CN207845551U (en) | 2018-01-03 | 2018-01-03 | A kind of high temperature resistant conductive hot melt adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820005215.6U CN207845551U (en) | 2018-01-03 | 2018-01-03 | A kind of high temperature resistant conductive hot melt adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207845551U true CN207845551U (en) | 2018-09-11 |
Family
ID=63416899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820005215.6U Expired - Fee Related CN207845551U (en) | 2018-01-03 | 2018-01-03 | A kind of high temperature resistant conductive hot melt adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207845551U (en) |
-
2018
- 2018-01-03 CN CN201820005215.6U patent/CN207845551U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180911 Termination date: 20220103 |