CN204820561U - Compound SMD heat -seal upper cover area - Google Patents
Compound SMD heat -seal upper cover area Download PDFInfo
- Publication number
- CN204820561U CN204820561U CN201520525136.4U CN201520525136U CN204820561U CN 204820561 U CN204820561 U CN 204820561U CN 201520525136 U CN201520525136 U CN 201520525136U CN 204820561 U CN204820561 U CN 204820561U
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- layer
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Abstract
The utility model provides a compound SMD heat -seal upper cover area belongs to the SMD lid and leads the territory. Including substrate layer, bond line, heat -seal layer and extinction layer, the substrate layer is the high polymerization membrane of PET, and the substrate layer lower surface even has the heat -seal layer through bond line A is glutinous, and SEBS thermoplastic elastomer has been chooseed for use on the heat -seal layer, and bond line A is antistatic glue film, the substrate layer upper surface has extinction layer through bond line B glutinous the company, and this extinction layer is the PE membrane of the mute light in surface. The utility model discloses a compound SMD heat -seal upper cover area is good with heat -seal, the sealing performance of carrier band to have good anti static electricity effect, extinction effect, withstand voltage effect etc. Can regard as photosensitive, temperature sensing, multiple electronic components's such as pressure -sensitive upper cover area.
Description
Technical field
The utility model relates to SMD cover strip field, is specifically related to cover strip in a kind of compound SMD heat-sealing.
Background technology
The envelope tape of electronic devices and components moving belt is by auto zero assembly chip mounter etc., electronic components is inserted in the groove on the carrier band coordinated with original paper, then on carrier band, cover cover strip on one deck, allow upper cover strip and carrier band involution exist by hot knife, transport after being rolled into rolling plate-like.
The upper cover strip covered above electronic devices and components carrier band, must have good heat-sealing effect, and have higher requirement to its antistatic behaviour, resistance to compression, corrosion resistance etc.Meanwhile, be photosensitive, temperature-sensitive class components and parts for part components and parts, in requirement, cover strip also needs to have certain extinction effect and high-temperature resistant result.Described develop there is above-mentioned characteristic SMD on cover strip be major issue urgently to be resolved hurrily.
Utility model content
The purpose of this utility model is for solving the problem, and provides a kind of heat-sealing rapidly, and cover strip in the compound SMD heat-sealing that all can have good protected effect to all kinds of electronic devices and components.
For achieving the above object, the technical scheme that the utility model adopts is:
Cover strip in a kind of compound SMD heat-sealing, comprise substrate layer, adhesive layer, hot sealing layer and extinction layer, it is characterized in that: described substrate layer is PET high polymeric membrane, substrate layer lower surface has been adhered hot sealing layer by adhesive layer A, described hot sealing layer selects SEBS thermoplastic elastomer, and described adhesive layer A is antistatic glue-line; Substrate layer upper surface has been adhered extinction layer by adhesive layer B, and this extinction layer is the PE film of matte surface.
Described adhesive layer B is pressure-sensitive adhesive layer, and this pressure sensitive adhesive, with a gluey arrangement bonding, not only has good cohesive, also can increase upper cover strip compression resistance.
The Thickness Ratio of described substrate layer, hot sealing layer and extinction layer is 2: 1: 1.
Cover strip in compound SMD heat-sealing of the present utility model, with heat-sealing, the favorable sealing property of carrier band, and has good antistatic effect, extinction effect, withstand voltage effect etc., can be used as the upper cover strip of photosensitive, temperature-sensitive, the multiple electronic devices and components such as pressure-sensitive.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Illustrate: 1-substrate layer, 2-adhesive layer A, 3-hot sealing layer, 4-adhesive layer B, 5-extinction layer.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is further described.
Cover strip in compound SMD heat-sealing as shown in the figure, on this, cover strip is made up of substrate layer (1), adhesive layer A (2), adhesive layer B (4), hot sealing layer (3) and extinction layer (5), and the Thickness Ratio of substrate layer (1), hot sealing layer (3) and extinction layer (5) is 2: 1: 1.
What substrate layer (1) was selected is PET high polymeric membrane, and such base material has good mechanical property, excellent high-and low-temperature resistance performance, and impact strength is 3-5 times of other films, and folding resistance is good, also has good corrosion resistance, resistance to most of solvent simultaneously.
Hot sealing layer (3) is connected to substrate layer (1) lower surface, and what select is SEBS thermoplastic elastomer, and it has excellent weatherability, heat resistance, compression resistant morphotropism and mechanical property, and softening point is lower simultaneously, seals effective.Be adhered by adhesive layer A (2) between substrate layer (1) and hot sealing layer (3), this adhesive layer A (2) is antistatic glue-line, also has good antistatic effect to make upper cover strip.
Extinction layer (5) is covered in the upper surface of substrate layer (1), and what select is PE film, and this film has good tension force and toughness, and this PE film surface is through matte management, makes it also have good extinction.Extinction layer (5) and substrate layer (1) are adhered by adhesive layer B (4), this adhesive layer B (4) is pressure-sensitive adhesive layer, this pressure sensitive adhesive, with a gluey arrangement bonding, not only has good cohesive, also can increase upper cover strip compression resistance.
The above only have expressed preferred embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion, improvement and substitute, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (3)
1. cover strip in a compound SMD heat-sealing, comprise substrate layer, adhesive layer, hot sealing layer and extinction layer, it is characterized in that: described substrate layer is PET high polymeric membrane, substrate layer lower surface has been adhered hot sealing layer by adhesive layer A, described hot sealing layer selects SEBS thermoplastic elastomer, and described adhesive layer A is antistatic glue-line; Substrate layer upper surface has been adhered extinction layer by adhesive layer B, and this extinction layer is the PE film of matte surface.
2. cover strip in the compound SMD heat-sealing of one according to claim 1, is characterized in that: described adhesive layer B is pressure-sensitive adhesive layer, and this pressure sensitive adhesive is with a gluey arrangement bonding.
3. cover strip in the compound SMD heat-sealing of one according to claim 1, is characterized in that: the Thickness Ratio of described substrate layer, hot sealing layer and extinction layer is 2:1:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520525136.4U CN204820561U (en) | 2015-07-20 | 2015-07-20 | Compound SMD heat -seal upper cover area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520525136.4U CN204820561U (en) | 2015-07-20 | 2015-07-20 | Compound SMD heat -seal upper cover area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204820561U true CN204820561U (en) | 2015-12-02 |
Family
ID=54678196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520525136.4U Expired - Fee Related CN204820561U (en) | 2015-07-20 | 2015-07-20 | Compound SMD heat -seal upper cover area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204820561U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105905433A (en) * | 2016-07-06 | 2016-08-31 | 成都格虹电子科技有限责任公司 | Cover tape |
| CN106346885A (en) * | 2016-08-22 | 2017-01-25 | 浙江洁美电子科技股份有限公司 | Upper cover tape for carrier tape |
-
2015
- 2015-07-20 CN CN201520525136.4U patent/CN204820561U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105905433A (en) * | 2016-07-06 | 2016-08-31 | 成都格虹电子科技有限责任公司 | Cover tape |
| CN106346885A (en) * | 2016-08-22 | 2017-01-25 | 浙江洁美电子科技股份有限公司 | Upper cover tape for carrier tape |
| CN106346885B (en) * | 2016-08-22 | 2019-02-12 | 浙江洁美电子科技股份有限公司 | A kind of carrier band upper cover band |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20170720 |