CN102399510A - Anti-welding adhesive tape - Google Patents
Anti-welding adhesive tape Download PDFInfo
- Publication number
- CN102399510A CN102399510A CN2011103662429A CN201110366242A CN102399510A CN 102399510 A CN102399510 A CN 102399510A CN 2011103662429 A CN2011103662429 A CN 2011103662429A CN 201110366242 A CN201110366242 A CN 201110366242A CN 102399510 A CN102399510 A CN 102399510A
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- base material
- adhesive tape
- film layer
- layer
- material film
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Abstract
The invention discloses an anti-welding adhesive tape. The anti-welding adhesive tape comprises a base material film layer, a reinforcing belt and a pressure-sensitive layer and is characterized in that: the reinforcing belt is coated on the surface of one side of the base material film layer; and the pressure-sensitive layer is coated on the surface of the other side of the base material film layer. The base material film layer is combined with the reinforcing belt structure, so that the original single-layer base material structure is changed into a double-layer composite structure, and the anti-welding adhesive tape has ideal high temperature resistance, is not shrunk and deformed during use at high temperature, is soft and comfortable and has high tearability.
Description
Technical field
The present invention relates to electronic product and components and parts thereof and make applied technical field, particularly relate to a kind of anti-welding adhesive tape.
Background technology
At present; Make in the object work flow of high temperature engineering in field at electronic product; Need to use of the protection of various adhesive tapes as covering; For example: in printed substrate being sent into tin stove wave soldering process, need to use anti-welding adhesive tape that the aperture on the printed substrate is carried out shutoff and cover protection.Existing anti-welding adhesive tape forms by applying varistor layer on the base material film layer; The adhesive band base of this structure is a single layer structure; Use this type adhesive tape to adhere on the aperture of printed substrate as covering protection, and when printed substrate sent into tin stove wave soldering, occur easily shrinking and obscission; Can cause the aperture on the printed substrate exposed, thereby cause scrapping of printed substrate.
Summary of the invention
The technical problem that the present invention mainly solves is: to the deficiency of prior art; A kind of anti-welding adhesive tape is provided,, makes original single layer of substrate material structure become the composite structured of bilayer through on the base material film layer, combining the reinforcing band structure; Has the ideal resistance to elevated temperatures; Do not shrink when it is at high temperature used, indeformable, and soft docile, tearable property is good.
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is: a kind of anti-welding adhesive tape is provided; Comprise base material film layer, reinforcing band and varistor layer; Said reinforcing band is coated in a side surface of said base material film layer, and said varistor layer is coated in the opposite side surface of said base material film layer.
In preferred embodiment of the present invention, said base material film layer is a polyimide film layer.
In preferred embodiment of the present invention, said reinforcing band is high temperature resistant wrinkle beautifying paper tape.
In preferred embodiment of the present invention, said varistor layer is the silicone glue-line.
In preferred embodiment of the present invention, the thickness of said varistor layer is 0.03-0.05mm.
The invention has the beneficial effects as follows: the present invention has disclosed a kind of anti-welding adhesive tape; Through on the base material film layer, combining the reinforcing band structure; It is double-deck composite structured that original single layer of substrate material structure is become, and has the ideal resistance to elevated temperatures, do not shrink when it is at high temperature used, indeformable; And soft docile, tearable property is good.
Description of drawings
Fig. 1 is the structural representation of anti-welding adhesive tape one preferred embodiment of the present invention;
The mark of each parts is following in the accompanying drawing: 1, varistor layer, 2, the base material film layer, 3, reinforcing band.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
See also shown in Figure 1ly, the embodiment of the invention comprises:
A kind of anti-welding adhesive tape comprises base material film layer 2, reinforcing band 3 and varistor layer 1, it is characterized in that, said reinforcing band 3 is coated in a side surface of said base material film layer 2, and said varistor layer 1 is coated in the opposite side surface of said base material film layer 2.
Said base material film layer 2 is a polyimide film layer, has outstanding high temperature resistant, radiation hardness, resistance to chemical attack and electrical insulation capability, can use in that 250-280 ℃ of air is medium-term and long-term.
Said reinforcing band 3 is high temperature resistant wrinkle beautifying paper tape, has wet tenacity or solvent resistance preferably, good temperature tolerance, barrier properties, absorptivity, elongation and tensile strength.
Said varistor layer 1 is the silicone glue-line, and its bonding force is strong, and tensile strength is big, has weathering resistance, vibration resistance simultaneously again, the moistureproof and big characteristics of the cold and hot variation of adaptation.
The thickness of said varistor layer 1 is 0.03-0.05mm.
The present invention has disclosed a kind of anti-welding adhesive tape; Through on the polyimide base material thin film layer, combining high temperature resistant U.S. line paper as the reinforcing band structure; It is double-deck composite structured that original single layer of substrate material structure is become, and has the ideal resistance to elevated temperatures, and do not shrink when it is at high temperature used, indeformable; And soft docile, tearable property is good.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification sheets of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (5)
1. anti-welding adhesive tape comprises: base material film layer, reinforcing band and varistor layer, it is characterized in that said reinforcing band is coated in a side surface of said base material film layer, and said varistor layer is coated in the opposite side surface of said base material film layer.
2. anti-welding adhesive tape according to claim 1 is characterized in that, said base material film layer is a polyimide film layer.
3. anti-welding adhesive tape according to claim 1 is characterized in that, said reinforcing band is high temperature resistant wrinkle beautifying paper tape.
4. anti-welding adhesive tape according to claim 1 is characterized in that, said varistor layer is the silicone glue-line.
5. anti-welding adhesive tape according to claim 1 is characterized in that, the thickness of said varistor layer is 0.03-0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103662429A CN102399510A (en) | 2011-11-18 | 2011-11-18 | Anti-welding adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103662429A CN102399510A (en) | 2011-11-18 | 2011-11-18 | Anti-welding adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102399510A true CN102399510A (en) | 2012-04-04 |
Family
ID=45882177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103662429A Pending CN102399510A (en) | 2011-11-18 | 2011-11-18 | Anti-welding adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102399510A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103937424A (en) * | 2014-04-03 | 2014-07-23 | 苏州华周胶带有限公司 | High-durability textured adhesive tape |
| CN107805463A (en) * | 2017-12-18 | 2018-03-16 | 常熟市长江胶带有限公司 | A kind of high-strength high adhesive tape |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1691299A (en) * | 2004-04-28 | 2005-11-02 | 日东电工株式会社 | Imaging sensor mounting method and adhesive tape used thereby |
| CN202039019U (en) * | 2011-03-31 | 2011-11-16 | 季亚芳 | Composite type high-temperature resistant adhesive tape |
-
2011
- 2011-11-18 CN CN2011103662429A patent/CN102399510A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1691299A (en) * | 2004-04-28 | 2005-11-02 | 日东电工株式会社 | Imaging sensor mounting method and adhesive tape used thereby |
| CN202039019U (en) * | 2011-03-31 | 2011-11-16 | 季亚芳 | Composite type high-temperature resistant adhesive tape |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103937424A (en) * | 2014-04-03 | 2014-07-23 | 苏州华周胶带有限公司 | High-durability textured adhesive tape |
| CN107805463A (en) * | 2017-12-18 | 2018-03-16 | 常熟市长江胶带有限公司 | A kind of high-strength high adhesive tape |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120404 |