CN103396755B - Hot melt adhesive - Google Patents
Hot melt adhesive Download PDFInfo
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- CN103396755B CN103396755B CN201310281859.XA CN201310281859A CN103396755B CN 103396755 B CN103396755 B CN 103396755B CN 201310281859 A CN201310281859 A CN 201310281859A CN 103396755 B CN103396755 B CN 103396755B
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- hot melt
- melt adhesive
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Abstract
The invention discloses a hot melt adhesive. The hot melt adhesive consists of the following materials in parts by weight: 89-92 parts of polyamide resin, 3-7 parts of paraffin, 3-7 parts of rosin ester-rosin glycerol resin, less than 0.5 part of organic silicon and less than 0.5 part of nitrate. The hot melt adhesive has the following advantages that firstly, the curing speed is quick, and the bonding strength and the flexibility are better; the hot melt adhesive can be used for curing and bonding within a fraction of second to a few seconds, and has the characteristics of being molten while being heated up and being bonded while being cooled, so that a packer using the hot melt adhesive can adopt a production line with higher speed, the yield can be increased while the defective goods are reduced, the continuous and automatic high-speed operation is convenient, and the cost is lower; secondly, the bonding power of the hot melt adhesive is very stable and not affected by morning-evening temperature and humidity changes in a working environment, so that the bonding firmness is ensured, and a bonding exposure problem of a packing machine is eliminated; and thirdly, the hot melt adhesive does not contain water and any other solvent. Besides, the hot melt adhesive is easy to transport and store, long in service life, capable of eliminating damages and waste, and convenient to use.
Description
Technical field:
The invention belongs to polymeric material field, refer in particular to a kind of hot melt adhesive.
Background technology:
Hot melt adhesive is that one is coated with under melting condition, produces the sizing agent of intensity through sclerosis or crystallization.The coating of hot melt adhesive does not need solvent, and the market demand of hot melt adhesive is in continuous increase.
Existing thermosol has the following disadvantages:
1, curing speed is slow, and bonding strength is not good and snappiness is not good, and substandard products are many, yield poorly, and cost is higher.
2, the cohesive force of hot melt adhesive is unstable, and by the impact of temperature and humidity change sooner or later in Working environment, this just can not ensure firmness, and there is the intrinsic bonding problem that exhumes of wrapping mechanism.
Be directed to this, so the present inventor designs the present invention.
Summary of the invention:
The object of the invention is to overcome above-mentioned existing deficiency, the hot melt adhesive that a kind of curing speed is fast, cohesive force is stable is provided.
The technical scheme that the present invention realizes the employing of its object is: a kind of hot melt adhesive, and the formation raw material of this hot melt adhesive and weight proportion are: polyamide resin 89-92 part; Paraffin 3-7 part; Staybelite glyceride 3-7 part; Organosilicon < 0.5 part; Nitrate < 0.5 part.
The formation raw material of described hot melt adhesive and weight proportion are: polyamide resin 90.3 parts; 5 parts, paraffin; Staybelite glyceride 4 parts; Organosilicon 0.3 part; 0.4 part, nitrate.
Or the formation raw material of described hot melt adhesive and weight proportion are: polyamide resin 89.4 parts; 4 parts, paraffin; Staybelite glyceride 6 parts; Organosilicon 0.4 part; 0.2 part, nitrate.
Advantage of the present invention is mainly manifested in following several aspect:
1, curing speed is fast, has good bonding strength and snappiness.Hot melt adhesive can solidify bonding in 1/tens seconds to a few second, had the characteristic that heating is then melted, cooling is then sticky.This enables packaging business use hot melt adhesive to adopt the production line of more speed, and minimizing substandard products while increase yield, be convenient to serialization, automatic high-speed operation, and cost is lower.
2, the cohesive force of hot melt adhesive is very stable, not by the impact of temperature and humidity change sooner or later in Working environment, this guarantees firmness, and eliminates the intrinsic bonding problem that exhumes of wrapping mechanism.
3, not moisture and other any solvents of hot melt adhesive.Be easy to transport, store.Long service life, and eliminate damage and waste, easy to use.
4, hot melt adhesive also can not send register toxic smog containing solvent, and nonflammable, blast, has security, and can not cause the health of secondary pollution and harmful to human to environment.
5, the water-fast moisture-resistant of glue-line of hot melt adhesive formation, even if also can be formed bonding reliably in a humid environment.
6, hot melt adhesive can melt bonding repeatedly, if the hot melt adhesive be coated on adherend because of cooling curing can not bonding time, can reheat and carry out bonding operation, therefore be specially adapted to the bonding of some special process requirement components, as the reparation of some historical relics.
7, can adhering object extensive, not only bonding but also seal, do not need drying process, technique for sticking simply produces, good in economic efficiency.
Embodiment:
Below in conjunction with specific embodiment, the present invention is further described.
Embodiment one
In the present embodiment, the formation raw material of hot melt adhesive and weight are:
Embodiment two
In the present embodiment, the formation raw material of hot melt adhesive and weight are:
The present invention has the following advantages:
1, curing speed is fast, has good bonding strength and snappiness.Hot melt adhesive can solidify bonding in 1/tens seconds to a few second, had the characteristic that heating is then melted, cooling is then sticky.This enables packaging business use hot melt adhesive to adopt the production line of more speed, and minimizing substandard products while increase yield, be convenient to serialization, automatic high-speed operation, and cost is lower.
2, the cohesive force of hot melt adhesive is very stable, not by the impact of temperature and humidity change sooner or later in Working environment, this guarantees firmness, and eliminates the intrinsic bonding problem that exhumes of wrapping mechanism.
3, not moisture and other any solvents of hot melt adhesive.Be easy to transport, store.Long service life, and eliminate damage and waste, easy to use.
4, hot melt adhesive also can not send register toxic smog containing solvent, and nonflammable, blast, has security, and can not cause the health of secondary pollution and harmful to human to environment.
5, the water-fast moisture-resistant of glue-line of hot melt adhesive formation, even if also can be formed bonding reliably in a humid environment.
6, hot melt adhesive can melt bonding repeatedly, if the hot melt adhesive be coated on adherend because of cooling curing can not bonding time, can reheat and carry out bonding operation, therefore be specially adapted to the bonding of some special process requirement components, as the reparation of some historical relics.
7, can adhering object extensive, not only bonding but also seal, do not need drying process, technique for sticking simply produces, good in economic efficiency.
Above-mentioned embodiment is only the preferred embodiment of the present invention; can not limit the scope of protection of the invention with this, change and the replacement of any unsubstantiality that those skilled in the art does on basis of the present invention all belong to the present invention's scope required for protection.
Claims (3)
1. a hot melt adhesive, is characterized in that: the formation raw material of this hot melt adhesive and weight proportion are: polyamide resin 89-92 part; Paraffin 3-7 part; Staybelite glyceride 3-7 part; Organosilicon 0.3-0.5 part; Nitrate 0.2-0.5 part.
2. hot melt adhesive according to claim 1, is characterized in that: the formation raw material of described hot melt adhesive and weight proportion are: polyamide resin 90.3 parts; 5 parts, paraffin; Staybelite glyceride 4 parts; Organosilicon 0.3 part; 0.4 part, nitrate.
3. hot melt adhesive according to claim 1, is characterized in that: the formation raw material of described hot melt adhesive and weight proportion are: polyamide resin 89.4 parts; 4 parts, paraffin; Staybelite glyceride 6 parts; Organosilicon 0.4 part; 0.2 part, nitrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310281859.XA CN103396755B (en) | 2013-06-28 | 2013-06-28 | Hot melt adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310281859.XA CN103396755B (en) | 2013-06-28 | 2013-06-28 | Hot melt adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103396755A CN103396755A (en) | 2013-11-20 |
| CN103396755B true CN103396755B (en) | 2015-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310281859.XA Active CN103396755B (en) | 2013-06-28 | 2013-06-28 | Hot melt adhesive |
Country Status (1)
| Country | Link |
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| CN (1) | CN103396755B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107663441A (en) * | 2017-11-17 | 2018-02-06 | 东莞市诚信兴智能卡有限公司 | A kind of IC-card encapsulates PUR |
| CN107964386A (en) * | 2017-12-05 | 2018-04-27 | 江苏江永新材料科技有限公司 | A kind of hot melt adhesive |
| CN109439270A (en) * | 2018-09-29 | 2019-03-08 | 太仓斯迪克新材料科技有限公司 | A kind of thermosol |
| CN109777348A (en) * | 2018-12-26 | 2019-05-21 | 衢州市富星和宝黏胶工业有限公司 | A kind of hot melt adhesive |
| CN111809408A (en) * | 2020-07-22 | 2020-10-23 | 陈猛 | Spandex-free cloth composite high-elastic film flocking and preparation method thereof |
| CN113930211A (en) * | 2021-11-26 | 2022-01-14 | 常州立铭材料科技有限公司 | Hot melt adhesive for ultrathin stretch-proof polyester belt |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265396A (en) * | 2008-05-06 | 2008-09-17 | 上海爱世博有机硅材料有限公司 | Method for preparing water-soluble hot-melt adhesive glue |
| CN101838511A (en) * | 2010-03-31 | 2010-09-22 | 鲁泰纺织股份有限公司 | Heat-resistant clothing hot melt adhesive and preparation method thereof |
| CN102559128A (en) * | 2010-12-20 | 2012-07-11 | 深圳市宏商材料科技股份有限公司 | Formula of oil-resistant hot melt adhesive and production process of hot melt adhesive |
| CN102618204A (en) * | 2012-04-01 | 2012-08-01 | 江阴市诺科科技有限公司 | Hot-melt adhesive for bonding layer of artificial leather and preparation method as well as application thereof |
| CN102676083A (en) * | 2011-03-08 | 2012-09-19 | 株式会社五公 | Hot melt glue composition having fewer volatile organic compound |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2321368B1 (en) * | 2008-09-05 | 2014-01-22 | The Procter and Gamble Company | Hot melt adhesive composition |
-
2013
- 2013-06-28 CN CN201310281859.XA patent/CN103396755B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265396A (en) * | 2008-05-06 | 2008-09-17 | 上海爱世博有机硅材料有限公司 | Method for preparing water-soluble hot-melt adhesive glue |
| CN101838511A (en) * | 2010-03-31 | 2010-09-22 | 鲁泰纺织股份有限公司 | Heat-resistant clothing hot melt adhesive and preparation method thereof |
| CN102559128A (en) * | 2010-12-20 | 2012-07-11 | 深圳市宏商材料科技股份有限公司 | Formula of oil-resistant hot melt adhesive and production process of hot melt adhesive |
| CN102676083A (en) * | 2011-03-08 | 2012-09-19 | 株式会社五公 | Hot melt glue composition having fewer volatile organic compound |
| CN102618204A (en) * | 2012-04-01 | 2012-08-01 | 江阴市诺科科技有限公司 | Hot-melt adhesive for bonding layer of artificial leather and preparation method as well as application thereof |
Non-Patent Citations (1)
| Title |
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| 张忠厚.聚酰胺类热熔胶.《制鞋与皮革胶黏剂》.化学工业出版社,2009, * |
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| Publication number | Publication date |
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| CN103396755A (en) | 2013-11-20 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: DONGGUAN SFWZ INTELLIGENT TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: DONGGUAN?SHICHUANG ELECTRONIC?CO., LTD. Effective date: 20141209 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20141209 Address after: 523000 Xin'an City, Dongguan province Changan Town Community Road, No. 3 middle road, No. Applicant after: Big intelligent Science and Technology Ltd. of the dark side of Dongguan City Address before: 523000, Changan Town, Guangdong City, Xin'an province Dongguan community road Applicant before: Dongguan Shichuang Hardware Electronics Co., Ltd. |
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Effective date of registration: 20170203 Address after: 523000 Guangdong city in Dongguan Province town of Changan Sand Village Fifth Industrial Zone No. 6 spring Patentee after: Dongguan three smart card technology Co., Ltd. Address before: 523000 Xin''an City, Dongguan province Changan Town Community Road, No. 3 middle road, No. Patentee before: Big intelligent Science and Technology Ltd. of the dark side of Dongguan City |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Hot melt adhesive Effective date of registration: 20220112 Granted publication date: 20150722 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: DONGGUAN SANCHUANG SMART CARD TECHNOLOGY CO.,LTD. Registration number: Y2022980000448 |