CN107964386A - A kind of hot melt adhesive - Google Patents
A kind of hot melt adhesive Download PDFInfo
- Publication number
- CN107964386A CN107964386A CN201711268851.4A CN201711268851A CN107964386A CN 107964386 A CN107964386 A CN 107964386A CN 201711268851 A CN201711268851 A CN 201711268851A CN 107964386 A CN107964386 A CN 107964386A
- Authority
- CN
- China
- Prior art keywords
- hot melt
- melt adhesive
- parts
- polyamide
- paraffin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of hot melt adhesive, the composition raw material and weight proportion of a kind of hot melt adhesive are：89 92 parts of polyamide；48 parts of paraffin；48 parts of hydrogenated rosin glyceride；1 part of organosilicon ＜；1 part of nitrate ＜, and weight proportion is：90.3 parts of polyamide；5 parts of paraffin；4 parts of hydrogenated rosin glyceride；0.3 part of organosilicon；0.4 part of nitrate, a kind of hot melt adhesive add microchemistry fiber element, content 0.03%~0.05%.The present invention uses natural biological raw material, it instead of the use of traditional glue containing aldehyde completely, formaldehydeless release, has excellent adhesive strength and nail-holding ability, good machining property, curing rate is fast at the same time, has preferable adhesive strength and pliability, micro fiber element improves cementability, cohesive force is very stable, the influence changed from morning and evening temperature in working environment and humidity, this guarantees firmness, and eliminates the intrinsic bonding of package packing machine and exhumes problem.
Description
Technical field
The present invention relates to technical field of polymer materials, more particularly to a kind of hot melt adhesive.
Background technology
Hot melt adhesive is a kind of adhesive of plasticity, and room temperature is in solid state, after heating and melting can rapid link, it is special
Point；(1) bonding usually cements rapidly from gluing to cooling, it is only necessary to Ji Shimiao, or even the time of several seconds；(2) it is wide to be bonded scope
To many materials, or even the difficulty to generally acknowledging is glued material (such as polyolefin, paraffin paper, carbon paper) and can also be bonded, particularly
The connector being bonded using hot melt adhesive, can be subjected to the bending of more than 105~106 times without cracking；(3) can heat repeatedly, conducting repeated adhesion
Connect；(4) performance is stablized easy to storage transport；(5) hot melt adhesive of low cost does not have solvent consumption, avoids the presence because of solvent,
And deform adherend.The disadvantage such as dislocation and contraction, helps to reduce cost, improves product quality.However, hot melt adhesive there is also
Some shortcomings are mainly that heat resistance and adhesive strength are relatively low, are not suitable for using as sqtructural adhesive.Hot melt adhesive is in certain temperature
In the range of its physical state change with temperature and change, and chemical characteristic is constant, its is nonpoisonous and tasteless, belongs to environmental-protecting chemical product.
Existing thermosol has the following disadvantages：1st, curing rate is slow, and adhesive strength is bad and pliability is bad, substandard products
More, low output, cost is higher；2nd, the cohesive force of hot melt adhesive is unstable, morning and evening temperature and the shadow of humidity change in by working environment
Ring, this cannot ensure firmness, and there are problems that the intrinsic bonding of package packing machine exhumes；3rd, hot melt adhesive one kind is poisonous and harmful
Material also not environmentally, contain certain formaldehydes material.
The content of the invention
A kind of the defects of the technical problem to be solved in the present invention is the prior art is overcome, there is provided hot melt adhesive.
In order to solve the above technical problem, the present invention provides following technical solution：
A kind of hot melt adhesive of the present invention, the composition raw material and weight proportion of a kind of hot melt adhesive are：Polyamide 89-92
Part；4-8 parts of paraffin；4-8 parts of hydrogenated rosin glyceride；1 part of organosilicon ＜；1 part of nitrate ＜, and weight proportion is：Polyamide
90.3 parts of resin；5 parts of paraffin；4 parts of hydrogenated rosin glyceride；0.3 part of organosilicon；0.4 part of nitrate.
As a preferred technical solution of the present invention, it is 2~5 that a kind of hot melt adhesive, which includes weight ratio,:1~3:3~
5:2~6 Corvic, polyamide, polyethylene butyl ester and polybutadiene, Corvic, polyamide, polyethylene fourth
The weight ratio of ester and polybutadiene is 2.8:1.8:3.9:3.8.
As a preferred technical solution of the present invention, a kind of hot melt adhesive adds microchemistry fiber element, content
0.1%~0.3%.
As a preferred technical solution of the present invention, a kind of hot melt adhesive is by Corvic, polyamide, poly- second
Alkene butyl ester in proportion, and is stirred and evenly mixed at 35 DEG C~55 DEG C, adds polybutadiene, natural cooling after mixing.
The beneficial effect that is reached of the present invention is：The present invention uses natural biological raw material, instead of traditional contain aldehyde completely
The use of glue, formaldehydeless release, has excellent adhesive strength and nail-holding ability, good machining property, while cures speed
Degree is fast, has preferable adhesive strength and pliability, micro fiber element improves cementability, and cohesive force is very stable, from work
Make the influence of morning and evening temperature and humidity change in environment, this guarantees firmness, and eliminate intrinsic viscous of package packing machine
Connect the problem of exhuming.
Embodiment
Following embodiments illustrate the preferred embodiment of the present invention, it will be appreciated that described herein to be preferable to carry out
Example is merely to illustrate and explain the present invention, and is not intended to limit the present invention.
Embodiment 1
The present invention provides a kind of hot melt adhesive, and the composition raw material and weight proportion of the hot melt adhesive are：Polyamide 89-92
Part；4-8 parts of paraffin；4-8 parts of hydrogenated rosin glyceride；1 part of organosilicon ＜；1 part of nitrate ＜, and weight proportion is：Polyamide
90.3 parts of resin；5 parts of paraffin；4 parts of hydrogenated rosin glyceride；0.3 part of organosilicon；0.4 part of nitrate.
Embodiment 2
It is 2~5 that a kind of hot melt adhesive, which includes weight ratio,:1~3:3~5:2~6 Corvic, polyamide, polyethylene
Butyl ester and polybutadiene, Corvic, polyamide, the weight ratio of polyethylene butyl ester and polybutadiene are 2.8:1.8:3.9:
3.8。
Embodiment 3
A kind of hot melt adhesive adds microchemistry fiber element, content 0.1%~0.3%.
Embodiment 4
A kind of hot melt adhesive hot melt adhesive by Corvic, polyamide, polyethylene butyl ester in proportion, and at 35 DEG C~55 DEG C
Stir and evenly mix, add polybutadiene, natural cooling after mixing.
The characteristic of above-described embodiment product：
1st, without aldehyde, benzene, phenol, amine and other volatile solvents.
2nd, curing rate is fast, there is preferable adhesive strength and pliability.Hot melt adhesive can be at 1/tens seconds to several seconds
Cure bonding in clock, there is heating then to melt, cool down then viscous characteristic.This enables packaging business to use more speed using hot melt adhesive
Production line, and increase yield while substandard products are reduced, easy to serialization, automatic high-speed operation, and cost is relatively low.
3rd, micro fiber element improves the cementability of hot melt adhesive, and cohesive force is very stable, from sooner or later warm in working environment
Degree and the influence of humidity change, this guarantees firmness, and eliminate the intrinsic bonding of package packing machine and exhume problem.
4th, hot melt adhesive is not aqueous and other any solvents.It is easy to transport, stores.Service life grow, and eliminate damage and
Waste, it is easy to use.
5th, there is excellent adhesive strength and ageing-resistant, the anti-grease property of oil resistant after curing.
6th, the water-fast moisture-resistant of glue-line that hot melt adhesive is formed, even if can also form reliable bonding in a humid environment.
The beneficial effect that is reached of the present invention is：The present invention uses natural biological raw material, instead of traditional contain aldehyde completely
The use of glue, formaldehydeless release, has excellent adhesive strength and nail-holding ability, good machining property, while cures speed
Degree is fast, has preferable adhesive strength and pliability, micro fiber element improves cementability, and cohesive force is very stable, from work
Make the influence of morning and evening temperature and humidity change in environment, this guarantees firmness, and eliminate intrinsic viscous of package packing machine
Connect the problem of exhuming.
Finally it should be noted that：The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention,
Although the present invention is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still may be used
To modify to the technical solution described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic.
Within the spirit and principles of the invention, any modification, equivalent replacement, improvement and so on, should be included in the present invention's
Within protection domain.
Claims (4)
1. a kind of hot melt adhesive, it is characterised in that the composition raw material and weight proportion of the hot melt adhesive be：Polyamide 89-92
Part；4-8 parts of paraffin；4-8 parts of hydrogenated rosin glyceride；1 part of organosilicon ＜；1 part of nitrate ＜, and weight proportion is：Polyamide
90.3 parts of resin；5 parts of paraffin；4 parts of hydrogenated rosin glyceride；0.3 part of organosilicon；0.4 part of nitrate.
2. a kind of hot melt adhesive according to claim 1, it is characterised in that it is 2~5 that the hot melt adhesive, which includes weight ratio,:1~
3:3~5:2~6 Corvic, polyamide, polyethylene butyl ester and polybutadiene, Corvic, polyamide, gather
The weight ratio of ethene butyl ester and polybutadiene is 2.8:1.8:3.9:3.8.
3. a kind of hot melt adhesive according to claim 2, it is characterised in that the hot melt adhesive adds microchemistry fiber element method
Element, content 0.03%~0.05%.
4. a kind of hot melt adhesive according to claim 3, it is characterised in that the hot melt adhesive is by Corvic, polyamides
Amine, polyethylene butyl ester in proportion, and are stirred and evenly mixed at 35 DEG C~55 DEG C, add polybutadiene, natural cooling after mixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711268851.4A CN107964386A (en) | 2017-12-05 | 2017-12-05 | A kind of hot melt adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711268851.4A CN107964386A (en) | 2017-12-05 | 2017-12-05 | A kind of hot melt adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107964386A true CN107964386A (en) | 2018-04-27 |
Family
ID=61998045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711268851.4A Pending CN107964386A (en) | 2017-12-05 | 2017-12-05 | A kind of hot melt adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107964386A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060029820A1 (en) * | 2004-08-05 | 2006-02-09 | Miller Richard A | Polyamide adhesive and articles including the same |
| CN103214996A (en) * | 2013-03-21 | 2013-07-24 | 马鞍山市中澜橡塑制品有限公司 | Hot melt adhesive containing modified nano-pottery clay and preparation method thereof |
| CN103396755A (en) * | 2013-06-28 | 2013-11-20 | 东莞市实创五金电子有限公司 | Hot melt adhesive |
| CN106189948A (en) * | 2016-07-21 | 2016-12-07 | 柳州市五源科技有限公司 | Pur |
| CN106479400A (en) * | 2016-10-16 | 2017-03-08 | 合肥太通制冷科技有限公司 | A kind of for being pasted onto the PUR on cold preservation plate |
-
2017
- 2017-12-05 CN CN201711268851.4A patent/CN107964386A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060029820A1 (en) * | 2004-08-05 | 2006-02-09 | Miller Richard A | Polyamide adhesive and articles including the same |
| CN103214996A (en) * | 2013-03-21 | 2013-07-24 | 马鞍山市中澜橡塑制品有限公司 | Hot melt adhesive containing modified nano-pottery clay and preparation method thereof |
| CN103396755A (en) * | 2013-06-28 | 2013-11-20 | 东莞市实创五金电子有限公司 | Hot melt adhesive |
| CN106189948A (en) * | 2016-07-21 | 2016-12-07 | 柳州市五源科技有限公司 | Pur |
| CN106479400A (en) * | 2016-10-16 | 2017-03-08 | 合肥太通制冷科技有限公司 | A kind of for being pasted onto the PUR on cold preservation plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102181248B (en) | Hot-melt pressure-sensitive adhesive for polyethylene materials and preparation method thereof | |
| US5169889A (en) | Poly hydroxybutyrate/hydroxyvalerate based hot melt adhesive | |
| CN103184022B (en) | Temporary bonding adhesive composition in being prepared for silicon chip | |
| EP1592756B1 (en) | Hot melt adhesive composition | |
| CN103694934B (en) | A kind of hot-fusible pressure-sensitive adhesive and preparation method thereof | |
| JPH02173081A (en) | Hot-melt adhesive which can be sprayed for covering case and carton | |
| CN101709201A (en) | Method for preparing polystyrene-polyisoprene-polystyrene ternary segmented copolymer hot melt pressure-sensitive adhesive | |
| CN102504725B (en) | Book side glue and production method thereof | |
| CN105219324A (en) | A kind of hot melt adhesive for automobile filter and preparation method thereof | |
| CN103666293B (en) | Heat resistance instant dry adhesive and preparation method thereof | |
| CN1590488A (en) | Hot melt adhesive | |
| CN104559860A (en) | Low-temperature hot melt adhesive | |
| CN105623556A (en) | Formula of hot melt adhesive for furniture edge sealing | |
| JP2005133084A (en) | Hot melt adhesive composition | |
| CN103396755B (en) | Hot melt adhesive | |
| CN104762032A (en) | High and low temperature-resistant and fat oil-resistant hot melt adhesive and preparation method thereof | |
| CN105315933B (en) | A kind of antistripping instant drying adhesive and preparation method thereof | |
| CN106833514B (en) | A kind of hot melt adhesive and preparation method thereof | |
| CN107964386A (en) | A kind of hot melt adhesive | |
| Onusseit | Starch in industrial adhesives: new developments | |
| KR101299422B1 (en) | Intermediate softening point resin-based hot melt psas | |
| CN102618212B (en) | Hot melt adhesive and preparation process and application thereof | |
| CN104119807B (en) | A kind of gluing hot melt adhesive special of notebook of the gluing hot melt adhesive special of notebook containing multiple fiber | |
| CN103773295B (en) | A kind of for PE thin film back painting pressure sensitive adhesive and preparation method thereof | |
| CN105111968B (en) | Low-density packaging hot melt adhesive and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180427 |