CN103392093A

CN103392093A - Light emitting module and lighting device for vehicle

Info

Publication number: CN103392093A
Application number: CN2012800089512A
Authority: CN
Inventors: 堤康章; 水野正宣; 小松元弘
Original assignee: Koito Manufacturing Co Ltd
Current assignee: Koito Manufacturing Co Ltd
Priority date: 2011-02-15
Filing date: 2012-02-10
Publication date: 2013-11-13
Anticipated expiration: 2032-02-10
Also published as: EP2677232A4; KR20130124569A; WO2012111292A1; JP2012169189A; CN103392093B; US20130329440A1; EP2677232A1

Abstract

A light emitting module (50) comprises: a substrate (54); semiconductor light emitting elements (52a-52d) mounted on the substrate (54) and arrayed in a matrix; a fluorescent material layer (58) provided so as to face the light emitting surfaces (56a-56d) of the semiconductor light emitting elements; and light shielding sections (60a-60d) provided so as to surround the light emitting surfaces of at least some of the semiconductor light emitting elements.

Description

Light emitting module and lamps apparatus for vehicle

Technical field

The present invention relates to possess the light emitting module of the light-emitting components such as light emitting diode.

Background technology

At night, while with lamp for automobile, shining the road surface of relative broad range, the most use forms the lamp units of distance light with light distribution patterns.And such distance light may cause dazzle to subtend car and front truck with light distribution patterns, therefore further improvement of what one hopes or wishes for.

For example, considered to have by will form dipped beam with the lamp unit of light distribution patterns to the left and right direction rotate (swivel), enlarge the lamps apparatus for vehicle (with reference to patent documentation 1) of range of exposures.But such light fixture need to be used for the mechanism element that rotates, and the device meeting is complicated, maximization, and is difficult for instantaneous switching luminous intensity distribution.

On the other hand, in recent years, performance is improved more significant white light-emitting diode (below be called LED(Light Emitting Diode).) exploitation that is used for the lamps apparatus for vehicle of light source also making progress.For example, considered to have the light source (with reference to citing document 2) that configures a plurality of White LEDs rectangularly.

(formerly technical literature)

(patent documentation)

(patent documentation 1) TOHKEMY 2007-30739 communique

(patent documentation 2) TOHKEMY 2009-134965 communique

Summary of the invention

(inventing problem to be solved)

The present invention researches and develops in view of such situation, and its purpose is to provide a kind of and has considered illumination and to the applicable light emitting module of light fixture.

(being used for solving the means of problem)

For solving above-mentioned problem, the light emitting module of a scheme of the present invention comprises: substrate; A plurality of light-emitting components, be assemblied in substrate, also arranging rectangularly; Fluorescence part, be set to relative with the light-emitting area of light-emitting component; And light shielding part, be set to surround at least a portion light-emitting component in a plurality of light-emitting components light-emitting area around.

, according to this scheme,, by light shielding part, can suppress the light leak between light-emitting component.

A plurality of light-emitting components can have the 1st relatively high light-emitting component of luminosity while lighting and the 2nd relatively low light-emitting component of luminosity while lighting.Light shielding part can mainly be arranged between the 1st light-emitting component and the light-emitting component adjacent to the 1st light-emitting component.Can suppress thus from the light leak of the 1st light-emitting component and reduce the light shielding part that light emitting module integral body is used, therefore can seek the reduction of cost.

Light-emitting component can be the element of flip-chip (flip chip) type.Thus, for example with the light-emitting component that is assemblied in substrate by Bonding, compare, do not need for wiring being connected in the zone of substrate, therefore the interval between energy constriction light-emitting component.Its result, can suppress to result from gap, shadow that produce in light distribution patterns between adjacent light-emitting component.

Fluorescence part can be tabular fluorophor.Thus, the processing of fluorophor becomes easy.Especially can carry out for the various Surface Machining that improve brightness.

The thermal coefficient of expansion of substrate can be in the scope of thermal coefficient of expansion ± 5ppm/ ℃ of light-emitting component.Thus, can suppress the decline of the connection reliability that variations in temperature repeatedly that the light on and off lamp because of light-emitting component causes produces.

The light source that can also possess the light that will penetrate from light-emitting component and fluorescence part looks like to be projected in the lens on the imaginary vertical screen in direction of illumination the place ahead.Lens can directly be engaged in light-emitting component or fluorescence part.Thus, come the light of self-emission device or the light by fluorescence part to become and be difficult for being absorbed, reflecting at the interface with lens, the luminous flux that penetrates from light emitting module increases.

Another program of the present invention is lamps apparatus for vehicle.This lamps apparatus for vehicle possesses light emitting module and controls the control circuit of the light on and off lamp of light emitting module, when the state of the vehicle parking that lamps apparatus for vehicle is installed being detected, control circuit is controlled the light on and off lamp state of light emitting module, so that it becomes the low car-parking model of irradiation mode power consumption when travelling.

, according to this scheme, can not need driver's the province's electrification that operatively realizes lamps apparatus for vehicle.

, with any combination of above inscape, the embodiment of the form of expression of the present invention after conversion between method, device, system etc., as the solution of the present invention, be also effective.

(invention effect)

, by the present invention, can provide a kind of and consider illumination and to the applicable light emitting module of light fixture.

Description of drawings

Fig. 1 is the summary section of the lamps apparatus for vehicle of present embodiment.

Fig. 2 means the stereogram of the major part of lamp unit shown in Figure 1.

Fig. 3 is the front view of light emitting module shown in Figure 1.

Fig. 4 means the figure of an example of the light distribution patterns that the lamps apparatus for vehicle by present embodiment forms.

Fig. 5 means the summary section of an example of the light emitting module of present embodiment.

(a) of Fig. 6 means the schematic diagram of structure of the LED chip of comparative example for (b) of schematic diagram, Fig. 6 of LED chip structure that explanation is fit to the light emitting module of present embodiment.

Fig. 7 means the schematic diagram of the state after the LED chip of different sizes is arranged rectangularly.

Fig. 8 means the schematic diagram of the state of arranging difform LED chip rectangularly.

The electrode part that (a) of Fig. 9 means LED chip is stem for stem the schematic diagram of situation longitudinally, and the electrode part that (b) of Fig. 9 means LED chip is stem for stem the schematic diagram of situation laterally.

Figure 10 means the schematic diagram of state that makes the interval variation of LED chip according to position.

Figure 11 means the schematic diagram of the state of the multiple LED chip that is arranged with different emission wavelengths.

Figure 12 means and will be formed on a plurality of LED chips on an extension (Epitaxial) substrate and be assemblied in the schematic diagram of the state on mounting substrate.

(a) of Figure 13 means the schematic diagram of the state that the LED chip of the part row (OK) in the LED chip that will arrange has staggered rectangularly, and (b) of Figure 13 means the schematic diagram of the state of a plurality of LED chips that also are arranged with rectangle rectangularly.

Figure 14 means the schematic diagram that only is provided with the state of masking frame around a part of LED chip.

(a) of Figure 15 is formed with the summary section of the light emitting module of photomask in a part of zone of the side of masking frame, (b) of Figure 15 is the enlarged drawing in the part zone of the masking frame shown in (a) of Figure 15, and (c) of Figure 15 means the figure of variation in the part zone of the masking frame shown in (b) of Figure 15.

Figure 16 means the schematic diagram of the state after the reduced thickness in the part zone of masking frame.

Figure 17 means that changing masking frame according to chip surrounds the schematic diagram of state of area in the zone of LED chip.

Figure 18 is formed with the summary section of the light emitting module of photomask in the side of fluorophor.

Figure 19 means the schematic diagram that is formed with the state of reflectance coating at the part place of masking frame.

Figure 20 uses the luminescence-utraviolet chip to be used as the summary section of the light emitting module of LED chip.

Figure 21 means the schematic diagram that is shaped as hexagonal light emitting module in the zone that frame marks off.

The size that Figure 22 means the luminescent coating that marks off is according to position and the schematic diagram of different states.

(g) of (a)～Figure 23 of Figure 23 is the summary section for the shape of explanation luminescent coating.

(f) of (a)～Figure 24 of Figure 24 is the summary section for the configuration of the luminescent coating of explanation light emitting module.

(a) of Figure 25 mean by potting (potting) method and make respectively the schematic diagram of the state of luminescent coating for each dividing regions, and (b)～Figure 25 of Figure 25 (d) means the schematic diagram that carrys out the state of disposable making luminescent coating by print process.

Figure 26 means the summary section of an example of mounting substrate.。

Figure 27 means the schematic diagram of the mounting substrate of two sides wiring.

(a) of Figure 28 is the summary section of the light emitting module of comparative example 1, and (b) of Figure 28 means the figure of chart of Luminance Distribution of the light emitting module of comparative example 1.

(a) of Figure 29 is the figure of chart of the Luminance Distribution of (b) of summary section, Figure 29 of the light emitting module of embodiment 1 light emitting module that means embodiment 1.

(a) of Figure 30 is the summary section of the light emitting module of embodiment 2, and (b) of Figure 30 means the figure of chart of Luminance Distribution of the light emitting module of embodiment 2.。

(a) of Figure 31 is the figure of chart of the Luminance Distribution of (b) of summary section, Figure 31 of the light emitting module of embodiment 3 light emitting module that means embodiment 3.

(a) of Figure 32 is the summary section of the light emitting module of embodiment 4, and (b) of Figure 32 means the figure of chart of Luminance Distribution of the light emitting module of embodiment 4.

(a) of Figure 33 is the summary section of the light emitting module of embodiment 5, and (b) of Figure 33 means the figure of chart of Luminance Distribution of the light emitting module of embodiment 5.

(a) of Figure 34 is the summary section of the light emitting module of embodiment 6, and (b) of Figure 34 means the figure of chart of Luminance Distribution of the light emitting module of embodiment 6.

(a) of Figure 35 is the summary section of the light emitting module of embodiment 7, and (b) of Figure 35 means the figure of chart of Luminance Distribution of the light emitting module of embodiment 7.

(a) of Figure 36 is the summary section of the light emitting module of embodiment 8, and (b) of Figure 36 means the figure of chart of Luminance Distribution of the light emitting module of embodiment 8.

The specific embodiment

, referring to accompanying drawing, for being used for implementing the solution of the present invention, be elaborated.In addition, in the description of the drawings, the label identical to identical element annotation, and suitably the repetitive description thereof will be omitted.

The light emitting module of present embodiment except lamps apparatus for vehicle, can be applicable to all illuminations and light fixture.Especially, the light emitting module of present embodiment is adapted to pass through part or all lightness, the illumination that realizes a plurality of light distribution patterns and the light fixture of controlling a plurality of light-emitting components that light emitting module possesses.

(lamps apparatus for vehicle)

At first, an example as the light fixture of the light emitting module of applicable present embodiment, illustrate lamps apparatus for vehicle.Fig. 1 is the summary section of the lamps apparatus for vehicle of present embodiment.

Lamps apparatus for vehicle 10 comprises lamp main body 12, diffuser 14, be housed in lamp unit 18 in the lamp house 16 that is formed by lamp main body 12 and diffuser 14, and as the carriage 20 of the support unit at lamp house 16 internal support lamp units 18.Lamp unit 18 is projection type lamp units of direct projection mode, comprises the light emitting module 22 that possesses a plurality of semiconductor light-emitting elements, projecting lens 24, and is used for the connecting member 26 that projecting lens 24 and carriage 20 are linked.

Light emitting module 22 possesses LED chip 22a as semiconductor light-emitting elements, and the heat conductivity insulated substrate 22b that formed by pottery etc.Light emitting module 22 with its irradiation axis towards the state of the vehicle front of the direction of illumination with lamp unit 18 (left in Figure 10 to) almost parallel, be positioned on carriage 20.

Connecting member 26 has by the planar portions 26a of approximate horizontal ground configuration and is in the bend 26b in zone more on the front than this planar portions 26a.The shape of bend 26b is constituted as and does not reflect the light that penetrates from light emitting module 22.

Projecting lens 24 are the light projections that will penetrate from light emitting module 22 to light fixture the place ahead, the front side surface is the plano-convex non-spherical lens on plane for convex surface, rear side surface, be configured in along on the optical axis Ax of vehicle fore-and-aft direction extension, and be fixed in the vehicle front side leading section of connecting member 26.Near the focus of the rear of projecting lens 24, dispose the LED chip 22a of light emitting module 22.The light that penetrates from light emitting module 22 is directly incident on projecting lens 24.After the light that incides projecting lens 24 is projected lens 24 light harvestings, as the irradiation of almost parallel forwards.

Fig. 2 means the stereogram of the major part of lamp unit shown in Figure 1 18.Fig. 3 is the front view of light emitting module 22 shown in Figure 1.Such as shown in Figure 2 and Figure 3, light emitting module 22 has a plurality of LED chip 22a.In the light emitting module 22 of present embodiment, upper 6 of horizontal direction H, upper 2 of vertical direction V, amount to 12 LED chip 22a and be arranged on heat conductivity insulated substrate 22b rectangularly.

In addition, such as shown in Figure 1, Figure 3, be formed with screwed hole 28 at the predetermined edge part (3 bights) of dimetric carriage 20.At the intrinsic school of the interior spiral shell of screwed hole 28

light screw

30,32, and an end of certain one of levelling shaft 34.In addition,

school light screw

30,32, and the other end of levelling shaft 34 is fixed at the screwed hole (not shown) of lamp main body 12.Thus, carriage 20 leaves the state of a section with the rear face forward from lamp main body 12 and is installed in lamp main body 12.Lamps apparatus for vehicle 10 is configured and makes by

school light screw

30,32, levelling shaft 34 and leveling actuator 36, the optical axis of lamp unit 18 can be adjusted on horizontal direction or vertical direction.

In addition, on the face of carriage 20 rear sides, be provided with fin 38.In addition, between fin 38 and lamp main body 12, be provided with to fin 38 and carry air to carry out the fan 40 of cold sink 38.

Fig. 4 means the figure of an example of the light distribution patterns that the lamps apparatus for vehicle 10 by present embodiment forms.Lamps apparatus for vehicle 10 shown in Figure 1 can, by extinguishing a part of LED chip 22a of light emitting module 22, form a part of zone that makes vehicle front and become unirradiated light distribution patterns PH as shown in Figure 4.In addition, the zone that the zone of 12 rectangles shown in Figure 4 is shone separately corresponding to LED chip, the region representation that oblique line is represented the state of just illuminated light.

Therefore, lamps apparatus for vehicle 10, by extinguishing with the regional corresponding LED chip that has pedestrian 42, front truck 44, subtend car 46, can suppress the dazzle to pedestrian 42, front truck 44, subtend car 46.

(light emitting module)

Next, the preferred example of light emitting module is described.Fig. 5 means the summary section of an example of the light emitting module of present embodiment.As shown in Figure 5, the light emitting module 50 of present embodiment comprises the 1st luminescence unit 51a～the 4th luminescence unit 51d.The 1st luminescence unit 51a comprises semiconductor light-emitting elements 52a.The 2nd luminescence unit 51b comprises semiconductor light-emitting elements 52b.The 3rd luminescence unit 51c comprises semiconductor light-emitting elements 52c.The 4th luminescence unit 51d comprises semiconductor light-emitting elements 52d.Semiconductor light-emitting elements 52a～the 52d that is arranging is installed in substrate 54 rectangularly.

In addition, relatively be provided with luminescent coating 58 with the light-emitting area 56a of each semiconductor light-emitting elements 52a～52d～56d.The light that luminescent coating 58 sends as the semiconductor light-emitting elements 52a～52d with relative carries out the optical wavelength conversion parts that shoot out after wavelength conversion and plays a role.In addition, in the situation that do not use luminescent coating 58 just can obtain the light of required color, wavelength, light emitting module 50 also can not possess luminescent coating 58.

Preferred luminescence unit interval W1 each other is less than the width W 2 of luminescence unit.On one side consider to make not produce gap between the zone that each luminescence unit shines separately, with experiment and before this knowledge suitably design interval W1 and get final product on one side.When light emitting module was used for lamps apparatus for vehicle (vehicle headlamp apparatus), for example luminescence unit interval W1 each other can be set in 10～500 μ m scopes.In addition, each luminescence unit can penetrate versicolor light by the combination of semiconductor light-emitting elements and fluorophor.Can be for example by semiconductor light-emitting elements and the absorption blue light that sends blue light and the luminescence unit of it combination that is transformed into the fluorophor of sodium yellow being realized white light.Can also be to be transformed into the 1st fluorophor of blue light, the luminescence unit that absorbs ultraviolet light and it combination that is transformed into the 2nd fluorophor of sodium yellow is realized white light by the semiconductor light-emitting elements that sends ultraviolet light with the absorption ultraviolet light and with it.

Semiconductor light-emitting elements 52a～52d is provided with the side of each semiconductor light-emitting elements of covering and following light shielding part 60a～60d.Light shielding part 60a～60d can be separated from one another, also can be integrally formed as shown in Figure 5.In addition, light shielding part 60a～60d can be set such that to surround at least a portion semiconductor light-emitting elements in a plurality of semiconductor light-emitting elements light-emitting area around.

In the light emitting module 50 that possesses such light shielding part 60a～60d, even the irradiation of the part of the light of semiconductor light-emitting elements 52a, to the luminescent coating 58 at the relative regional 62b place of the light-emitting area 56b of the semiconductor light-emitting elements 52b with adjacent, also can be sheltered from by light shielding part 60a.In addition, even the irradiation of the part of the light of semiconductor light-emitting elements 52b also can be sheltered from by light shielding part 60b to the luminescent coating 58 at the relative regional 62a of light-emitting area 56a, the 56c of semiconductor light-emitting elements 52a, 52c with adjacent, 62c place.In addition, even the irradiation of the part of the light of semiconductor light-emitting elements 52c also can be sheltered from by light shielding part 60c to the luminescent coating 58 at the relative regional 62b of light-emitting area 56b, the 56d of semiconductor light-emitting elements 52b, 52d with adjacent, 62d place.In addition, even the irradiation of the part of the light of semiconductor light-emitting elements 52d also can be sheltered from by light shielding part 60d to the luminescent coating 58 at the relative regional 62c place of the light-emitting area 56c of the semiconductor light-emitting elements 52c with adjacent.

Like this, the light emitting module 50 of present embodiment can suppress to make because of the light that sends from least one semiconductor light-emitting elements the luminous situation of luminescent coating 58 of the location relative with the light-emitting area of adjacent semiconductor light-emitting elements.Its result, for example, in the situation that luminescence unit 51a is lit, adjacent to the luminescence unit 51b of luminescence unit 51a, extinguished, can suppress the irradiation object zone of luminescence unit 51b by the situation of non-intention ground irradiation.In addition, even the part of the light of at least one semiconductor light-emitting elements is shone the irradiation area to adjacent semiconductor light-emitting elements, the light shielding part that also can be capped the side of semiconductor light-emitting elements shelters from.

Therefore, in the situation that the semiconductor light-emitting elements adjacent with the semiconductor light-emitting elements that just is being lit extinguished, can suppress to have the semiconductor light-emitting elements that has extinguished luminescence unit the irradiation object zone by non-intention situation about shining.That is, suppressed light leak between a plurality of semiconductor light-emitting elements.Thus, possess the lamps apparatus for vehicle 10 of light emitting module of present embodiment in the situation that formed light distribution patterns as shown in Figure 4, can suppress the automotive occupant that is present in the zone corresponding with the semiconductor light-emitting elements that has extinguished and the situation that the pedestrian causes dazzle.

In addition, aforesaid what is called " is arranged " rectangularly, comprises that at least a plurality of light-emitting components are take m * 1(m as the integer more than 2), 1 * n(n is the integer more than 2), m * n(m, n be the integer more than 2) the mode situation of arranging.Two unnecessary phase quadratures of orientation, also can be arranged as parallelogram or trapezoidal zone on the whole.In addition, a plurality of light-emitting components can not all belong to single kind, can make up multiple light-emitting component.

But, in the lamps apparatus for vehicle that possesses the light source that disposes a plurality of White LEDs in the past rectangularly, sometimes the gap between a plurality of White LEDs side by side be projected as darker shadow in light distribution patterns.When steering vehicle under such situation, the driver may be fed up with to shadow.

Therefore, after the invention people concentrate on studies and discuss, if the clear and definite light emitting module of present embodiment, can improve such problem by various improvement and the structure of suitable employing the following stated.Can also with high levels take into account the gap that results between semiconductor light-emitting elements etc., be created in light distribution patterns shadow and to the inhibition of the light leak that extinguishes zone in light distribution patterns.

An example enumerating the improvement that will narrate in the following embodiments is as follows.

(1) structure of light-emitting component (LED chip), size, shape etc.

(2) material of light shielding part, shape, surface configuration etc.

(3) material of fluorescence part, shape, surface treatment etc.

(4) physical property of mounting substrate, shape etc.

(5) structure of lens, material, shape etc.

(6) control circuit

In addition, in the following description, describe centered by the structure that is subjected to improvement, other structure does not illustrate, and suitably description thereof is omitted.

(1:LED chip)

［ chip structure ］

(a) of Fig. 6 is fit to the schematic diagram of structure of LED chip of the light emitting module of present embodiment for explanation, (b) of Fig. 6 means the schematic diagram of structure of the LED chip of comparative example.When a plurality of LED chip being installed on substrate 54, can consider to adopt (b) of the LED chip 66(of the LED chip 64 of electrode face down type (flip chip type) (with reference to (a) of Fig. 6) or electrode face up type with reference to Fig. 6) rectangularly.

But, as shown in Fig. 6 (b), when adopting the LED chip 66 of electrode face up type,, for the top 66a that connects chip and the Bonding (Wire Bonding) 68 of substrate 54, need to vacate street.Its result, easily produce shadow in light distribution patterns.On the other hand, as shown in Fig. 6 (a), if the LED chip of flip chip type 64, the projected electrode (not shown) that is situated between below chip is connected with substrate, therefore do not need the such zone that is used for wiring is connected in substrate of Bonding, therefore the interval between energy constriction LED chip.Its result, can suppress to result from the appearance of gap, the shadow that produce in light distribution patterns between adjacent LED chip 64.

［ chip size ］

Fig. 7 means the schematic diagram of the state after the LED chip of different sizes is arranged rectangularly.When light emitting module is applicable to lamps apparatus for vehicle, in the light distribution patterns of headlamp, exist be known as hot-zone, require high luminosity (for example more than 80,000 cd.) zone.Therefore, the large-scale (1mm * 1mm for example of hot-zone will be used to form.) LED chip 70 be arranged in central portion on substrate.And, for reducing costs, at its periphery, arrange small-sized (0.3mm * 0.3mm for example.) LED chip 72.Thus, hot-zone can be formed, the light emitting module of cost can be realized having reduced again.

［ chip form ］

Fig. 8 means the schematic diagram of the state of having arranged difform LED chip rectangularly.When light emitting module is applicable to lamps apparatus for vehicle, sometimes be required to form in the part zone on the top of light distribution patterns the dipped beam light distribution patterns of the "cut-off"line with inclination.Therefore, arrange the leg-of-mutton LED chip 74 of the "cut-off"line that is used to form inclination on a part of zone of substrate.And at its periphery, arrange common LED chip 70.The hypotenuse of preferred LED chip 74 has the angle that becomes 10 °～60 ° of degree with respect to horizontal direction.More preferably 15 °, 30 °, 45 ° etc.

［ electrode direction in chip ］

The electrode part that (a) of Fig. 9 means LED chip is stem for stem the schematic diagram of situation longitudinally, and the electrode part that (b) of Fig. 9 means LED chip is stem for stem the schematic diagram of situation laterally.In LED chip 70, relatively low in electrode part 70a brightness, the middle body brightness between electrode 70a becomes relatively high, therefore produced brightness disproportionation in light-emitting area.In addition, have gap (100～300 μ m degree) between LED chip, therefore the brightness of this part has also descended certainly, light emitting module has produced brightness disproportionation on the whole.Sometimes such brightness disproportionation is expressed as shadow (black line) in light distribution patterns.

Therefore, when wanting to suppress the black line of left and right (level) direction, arrange LED chip 70 as shown in Fig. 9 (a), electrode direction is become vertically.And when wanting to suppress the black line of up and down (vertical) direction, arrange LED chip 70 as shown in Fig. 9 (b), make electrode direction become laterally.

［ street ］

Figure 10 means the schematic diagram of state that makes the interval variation of LED chip according to position.For example, at the central portion that is arranged with the LED chip 70 that forms aforesaid hot-zone, the interval C1 constriction between chip, and the configuration density of chip uprises, therefore can improve the luminosity of the hot-zone in light distribution patterns.And at the periphery that is arranged with LED chip 76, the interval C2 broadening between chip, and the configuration density step-down of chip, thus can reduce the irradiation light distribution patterns periphery chip quantity, can realize the cost of light emitting module integral body.

［ combination of the multiple LED chip that emission wavelength (illuminant colour) is different ］

Figure 11 means the schematic diagram of the state of the multiple LED chip that is arranged with different emission wavelengths.Light emitting module shown in Figure 11 possesses the LED chip 70 that sends white light and the LED chip 78 that sends amber light.Thus, can realize with head lamp and steering indicating light integrated lamps apparatus for vehicle.In addition, by reinstalling the LED chip 80 that sends ultraviolet ray (UV), the LED chip 82 that sends infrared ray (IR), the light source function that night-vision camera can also be used is attached in light emitting module.

［ cutting apart of epitaxial layer ］

Figure 12 means and will be formed on a plurality of LED chips on an epitaxial substrate and be assemblied in the schematic diagram of the state on mounting substrate., by when being installed on substrate, can produce the gap of 100 μ m left and right when the LED chip with scattered on the precision that puts together machines between chip.Therefore, form a plurality of LED chips on an epitaxial substrate 84, will be in epitaxial substrate between chip and carry out hemisection with cutter (dicing blade) and carry out TURP and break (physically one), be divided into thus LED chip one by one.Thus, the gap between chip can be dwindled, and indivedual light modulations of each LED chip can be carried out.

［ chip configuration ］

(a) of Figure 13 means the schematic diagram of the state that the LED chip of the part row (OK) in the LED chip that will arrange has staggered rectangularly, and (b) of Figure 13 means the schematic diagram of the state of a plurality of LED chips that also are arranged with rectangle rectangularly.As shown in Figure 13 (a), the LED chip 86 that is disposed at central array is with respect to the LED chip 88 of the row that are configured in nearly body or body side far away, to the right of the figure distance C 3 that staggered.Thus, LED chip 86 gap each other that is disposed at central array and LED chip 88 gap each other of the row that are disposed at nearly body or the body side far away distance C 3 that staggered, therefore the black line of vertical (vertical direction) of the light distribution patterns that light emitting module forms becomes not obvious.

In addition, as shown in Figure 13 (b), so that rectangular and be arranged with obliquely each LED chip 90 with the become mode that tilts of the gap of adjacent LED chip 90.Therefore, the black line of vertical (vertical direction) of the light distribution patterns of light emitting module formation and horizontal (horizontal direction) becomes not obvious.

(2: light shielding part)

Partly arrange

Figure 14 means the schematic diagram that only is provided with the state of masking frame around a part of LED chip.Such as the aforementioned,, for preventing the light leak from adjacent LED chip, preferably surround light-emitting area masking frame is set peripherally.But,, if too widen gap between LED chip, can go out darker shadow at a part of region projection of light distribution patterns, therefore can not widen very much the gap between LED chip, thickness that also must the attenuate masking frame.In addition, if between all LED chips, masking frame is set, part can maximize.Making thinner masking frame needs microfabrication,, if masking frame is maximized, has difficulty rising, decrease in yield, the manufacturing time of manufacturing to increase, therefore may cause the rising of manufacturing cost.

What easily produce light leak is for example central portion, the LED chip 70 that form hot-zone that is arranged in as shown in Figure 14 on substrate.For forming hot-zone, the luminosity when such LED chip 70 is lighted is relatively high.And around LED chip 70, dispose the relatively low LED chip 92 of luminosity while lighting.And masking frame 94 mainly is located between LED chip 70 and the LED chip 92 adjacent with LED chip 70.Thus, can suppress the light leak from LED chip 70, and masking frame 94 simplifications, miniaturization that light emitting module integral body is used, therefore can seek the reduction of cost.

［ side of frame is painted ］

(a) of Figure 15 formed the summary section of the light emitting module of photomask in a part of zone of the side of masking frame, (b) of Figure 15 is the enlarged drawing in the part zone of the masking frame shown in (a) of Figure 15, and (c) of Figure 15 means the figure of variation in the part zone of the masking frame shown in (b) of Figure 15.Light emitting module 100 comprises substrate 102, is arranged in the LED chip 104a～104d of the flip-chip variety on substrate 102 and is configured in each LED unit masking frame 106a～106e on every side.

As shown in Figure 15 (b), be called masking frame 106 below masking frame 106a～106e() formed by transparent materials such as glass, and have painted 110 of a side being formed laminal body 108 and being formed at body 108.About painted 110, as long as can play a role as the photomask of shading, its material and thickness are not specially limited.Thus, the width of the part that plays a role as light shielding part in masking frame 106 can be suppressed, the appearance of the shadow in light distribution patterns can be suppressed to be created in.In addition, also can only in the crown of body 108 one, be formed with the masking frame of painted 112 as shown in Figure 15 (c).About painted section, as long as can play a role as light shielding part in fact, its structure is not specially limited.For example so long as the part reflection of light or the member of decay are got final product.

［ partly changing the thickness of frame ］

Figure 16 means the schematic diagram of the state after the reduced thickness in the part zone of masking frame.The thickness of attenuate masking frame 114 can be with the difficulty on making.Therefore,, from the viewpoint of light leak, only will need the reduced thickness of part of the thickness of special attenuate masking frame, and make part beyond it become the thickness of easy manufacturing.As shown in Figure 16, the central portion on substrate, be arranged with the LED chip 70 that forms hot-zone.Therefore, the reduced thickness of the masking frame 114a by will be disposed at the gap between LED chip 70 must be thinner than other parts 114b, can reduce the manufacturing cost of masking frame 114 integral body.

［ partly changing the size of frame ］

Figure 17 means that changing masking frame according to chip surrounds the schematic diagram of state of area in the zone of LED chip.As shown in Figure 17, the area in the zone of a LED chip 70 of encirclement formation hot-zone is in the area in the zone of LED chip 70 LED chip 116 on every side less than encirclement.That is the masking frame 118 that, surrounds LED chip 70 be configured make a plurality of zones that mark off size according to position and difference.Its result, can configure the LED chip 70 that forms hot-zone more thick and fast, can improve the maximum luminosity of hot-zone.

［ photomask ］

Figure 18 is formed with the summary section of the light emitting module of photomask in the side of fluorophor.Light emitting module 120 comprises substrate 122, be arranged in the LED chip 124a～124d of the flip-chip variety on substrate 122, be disposed at the masking frame 126a～126e around each LED unit and be located at the luminescent coating 128a～128d of the top of each LED unit.

Each side at luminescent coating 128a～128d, be formed with photomask 130a～130e.Photomask 130a～130e for example consists of metal or alloy.In light emitting module 120, by masking frame 126a～126e and photomask 130a～130e, form light shielding part.Thus, can make the simple shape of masking frame.

［ being formed with the masking frame of reflectance coating ］

Figure 19 means the schematic diagram that is formed with the state of reflectance coating in a part of zone of masking frame.Light emitting module 132 is respectively equipped with masking frame 134a～134e between its LED chip 124a～124d and luminescent coating 128a～128d.Be called masking frame 134 below masking frame 134a～134e() have the vertical portion 136a adjacent with the sidepiece of LED chip 124a～124d, reach upper end, adjacent with the sidepiece of luminescent coating 128a～128d tapering 136b as vertical portion 136a.

Usually, by at all masking frames 134, forming reflectance coating, the achieved luminosity of light emitting module can improve.But if at tapering 136b, form reflectance coating, main reflection is from the fluorescence of luminescent coating 128a～128d, therefore can produce the color inequality.Therefore, light emitting module 132 is in tapering 136b(luminescent coating section) be not formed with reflectance coating, and only in the side of vertical portion 136a, be formed with reflectance coating 138.Thus, can realize the light emitting module that color is uneven less.

［ luminescence-utraviolet chip ］

Figure 20 uses the summary section of luminescence-utraviolet chip as the light emitting module of LED chip.White LED consists of blue-light-emitting LED chip and yellow fluorophor usually.In this structure, blue transmitted light easily separates, therefore easily produce the color inequality.Therefore, as shown in Figure 20, light emitting module 140 has and sends ultraviolet LED chip 142a～142d and be set to the luminescent coating 144a～144d relative with the light-emitting area of LED chip 142a～142d.Luminescent coating 144a～144d comprise by ultraviolet ray excited and send the blue emitting phophor of blue light, and by ultraviolet ray excited and send the yellow fluorophor of yellow light.In addition, between each LED chip 142a～142d and luminescent coating 144a～144d, be respectively equipped with masking frame 146a～146e.

Light emitting module 140 has used the chip of luminescence-utraviolet type to be used as LED chip, therefore it is uneven to be difficult for producing color.Therefore, can form reflectance coating 148 in the whole zone of the side of masking frame 146a～146e, with only in the part zone of the side of masking frame the situation of formation reflectance coating compare, it is easy that structure becomes simply, the manufacturing of masking frame becomes.

［ shape in the zone that frame marks off ］

Figure 21 means the schematic diagram that is shaped as hexagonal light emitting module in the zone that frame marks off.Such as shown in figure 21, the masking frame 152 that light emitting module 150 possesses surround a LED chip 70 zone be shaped as hexagon.When the partition wall of masking frame be shaped as quadrangle the time, the direction that is projected in the shadow in light distribution patterns is vertically (vertical direction) and laterally (horizontal direction).And when the partition wall of masking frame be shaped as hexagon the time, formed shadow also can be created in vertically (vertical direction) and laterally on (horizontal direction) direction in addition in light distribution patterns.Therefore, the shadow that produces in light distribution patterns becomes not obvious.In addition, the shape in the zone that marks off of frame can also be the polygonals such as pentagon or octagonal.

(3: luminescent coating)

［ material of fluorophor ］

, about the structure of luminescent coating,, as long as can be applicable to aforesaid various light emitting module, just be not specially limited.For example, can list the resin combination that is dispersed with fluorophor or glass component, fluorescence ceramics.Below exemplified as the structure of fluorophor preferred several modes.

Uneven for the brightness disproportionation, the color that reduce between white LED chip, blue light is very important with mixing of blue light and green light with sodium yellow or red light.For this reason, preferably make the fluorophor in luminescent coating spread equably (dispersion).Therefore, enumerate following structure.

(1) make the particle diameter (median diameter: median diameter) below 20 μ m of powder shaped fluorophor.

(2) fluorophor that uses UV to excite.

(3) add silica, aluminium oxide particles as dispersant at luminescent coating.

(4) add bubble (void: space) as dispersant.

(5) make the YAG(garnet layer) in sneak into the YAP(Perovskite Phase).

［ size of luminescent coating ］

The size that Figure 22 means the luminescent coating that marks off is according to position and the schematic diagram of different states.Luminescent coating 154 makes the regional R(dot area relative with the LED chip that forms hot-zone) in the size of a dividing regions 156 less than the dividing regions 158 in the zone beyond it.Thus, can improve the luminosity of the hot-zone in the light distribution patterns that light emitting module forms.

［ shape of luminescent coating ］

(g) of (a)～Figure 23 of Figure 23 is the summary section for the shape of explanation luminescent coating.In the light emitting module shown in each figure, luminescent coating is that shading is formed in masking frame.In addition, for the manufacturing of luminescent coating, the high accuracy machining control of shape and size is very important.Therefore, preferred luminescent coating is tabular fluorophor.Thus, the processing of fluorophor is easy.Especially, can carry out for the various Surface Machining (for example concavo-convex formation) that improve brightness.

Luminescent coating 160 shown in Figure 23 (a) is trapezoidal shape.Luminescent coating 162 shown in Figure 23 (b) is the Y-shaped shape.Luminescent coating 166 shown in Figure 23 (c) is formed with reflecting part 168 in its side.Luminescent coating 170 shown in Figure 23 (d) is formed with light shielding part 172 in its side.Luminescent coating 174 shown in Figure 23 (e) is trapezoidal shape, in its side and bottom surface be formed with wavelength selectivity filter 176.Therefore, the light of the wavelength by 176 selections of wavelength selectivity filter from the light that LED chip 178 penetrates can arrive luminescent coating 174.

Luminescent coating 180 shown in Figure 23 (f) is provided with light diffusion phase 182 above its exit facet 180a.Thus, can reduce from the brightness disproportionation of the light of luminescent coating 180 ejaculations.Luminescent coating 184 shown in Figure 23 (g) is provided with light diffusion phase 186 below its plane of incidence 184a.Thus, after being weakened brightness disproportionation by light diffusion phase 186, the light that penetrates from LED chip 188 incides luminescent coating 184.In addition, preferably not with binding agent but by methods such as thermo-compressed, normal temperature joints, engage light diffusion phase and luminescent coating.Thus, can prevent scattering and decay when light passes through adhesive layer, therefore the light of light emitting module integral body takes out efficiency, can improve.

［ configuration of luminescent coating ］

(f) of (a)～Figure 24 of Figure 24 is the summary section for the configuration of the luminescent coating of explanation light emitting module.Consider the raising of brightness and the inhibition of color inequality, for LED chip, separating, or with the combinations such as lens, light conductor, anti-She Mirror, luminescent coating can adopt various configurations.

Luminescent coating 190 shown in Figure 24 (a) is disposed at the position that is separated with LED chip 192.Thus, the thermal diffusivity of LED chip 192 and luminescent coating 190 can improve, and the characteristic of light emitting module integral body can be improved.In addition, luminescent coating 190 is surrounded by masking frame 194, and has the little exit facet 190a of light-emitting area 192a of Area Ratio LED chip 192.Thus, the brightness meeting of light emitting module improves.

Luminescent coating 196 shown in Figure 24 (b) is provided with lens 198 in the place ahead of its exit facet 196a.Thus, can collect the light that penetrates from luminescent coating 196.Luminescent coating 200De center 200a shown in Figure 24 (c) is set to stagger with respect to LED chip 202De center 202a.

Luminescent coating 204 shown in Figure 24 (d) is disposed at the top of the exit facet 206a of light conductor 206.The plane of incidence 206b of light conductor is relative with the light-emitting area 208a of LED chip 208.Like this, the light that LED chip 208 sends incides in luminescent coating 204 after by light conductor 206, thereby the range of exposures of light is limited.Thus, the light leak between a plurality of LED chips is suppressed.

In addition, light conductor 206 has light transmission (transparent) material that can make the light transmission that LED chip sends.As translucent material, such as the mixture that can list the organic materials such as transparent resin material, the transparent inorganic material such as unorganic glass, organic material and inorganic material, sol gel film etc.As resin material, such as listing acrylic resin, polycarbonate resin, epoxy resin etc.

Light emitting module shown in Figure 24 (e) is characterised in that and disposes lens 210 this point between luminescent coating 190 and LED chip 192.Thus, incide in luminescent coating 190 after the emitted light of LED chip 192 is collected by lens 210.Light emitting module shown in Figure 24 (f) is characterised in that with the anti-Mirror of penetrating 212 and carrys out the light of boundling towards LED chip 192 belows, and makes it towards luminescent coating 190 this point.

［ the formation method of luminescent coating ］

(a) of Figure 25 mean and make respectively the schematic diagram of the state of luminescent coating by the potting method for each dividing regions, and (b)～Figure 25 of Figure 25 (d) means the schematic diagram that carrys out the state of disposable making luminescent coating by print process.(b) of Figure 25 represented the situation that print direction is printed along cornerwise direction of each dividing regions corresponding with LED chip, the situation that Figure 25 (c) has represented to make print direction to print along the direction of the longitudinal edge of each dividing regions corresponding with LED chip, the situation that (d) of Figure 25 represented to make print direction to print along the horizontal edge of each dividing regions corresponding with LED chip.

As shown in Figure 25 (a), luminescent coating 214 disposes a plurality of fluorophor 214a that mark off accordingly with each LED chip rectangularly.When by the potting method, for each dividing regions, forming luminescent coating 214 respectively, can produce the color spot 214b of rectangle in the inboard on each limit of dividing regions, therefore can take notice of when visual.

As the formation method of luminescent coating, also have by printing powder fluorophor and mixed with resin and make it to become paste after material form the method for luminescent coating.Therefore, as shown in (b)～Figure 25 of Figure 25 (d), by making the print direction unification, be a direction, the uneven 214c～214e of color can be controlled on certain orientation.

(4: mounting substrate)

［ linear expansion coefficient ］

Light emitting module assembles a plurality of LED chips on 1 mounting substrate.Therefore, for mounting substrate is produced, do not break (crack), the linear expansion coefficient of mounting substrate is defined in the scope of thermal coefficient of expansion ± 5ppm/ ℃ of LED chip.Thus, can suppress the connection reliability that variations in temperature repeatedly that the light on and off lamp because of LED chip causes produces reduces.In addition, when LED chip was GaN, its thermal coefficient of expansion S was about 7ppm/ ℃.Preferential oxidation aluminium, AlN, Si, SiO2 etc. are used as the principal component of mounting substrate.

［ pyroconductivity ］

Such as the aforementioned, light emitting module is equipped with a plurality of LED chips on 1 mounting substrate.Therefore, can improve the pyroconductivity of mounting substrate in the scope of other performance that does not have influence on significantly light emitting module.In addition, the part of the LED chip in the zone that the assembling irradiation of mounting substrate is corresponding with hot-zone, can adopt the mounting substrate higher than other parts pyroconductivity.

［ etching of mounting substrate ］

Figure 26 means the summary section of an example of mounting substrate.Light emitting module 216 possesses mounting substrate 218, be disposed at mounting substrate 218 each recess 218a LED chip 220 and be disposed at the luminescent coating 222 on the top of LED chip.Each recess 218a forms by etching mounting substrate 218.Therefore, surround each recess 218a ground and form simultaneously light shielding part 218b.Like this, etching mounting substrate 218 and form recess 218a, thus, just do not need with masking frame as other component configuration on substrate.Its result, can reduce the assembling procedure number of light emitting module, realizes cost.In addition, for example can use silicon to be used as the material of mounting substrate.

［ wiring pattern ］

Figure 27 means the schematic diagram of the mounting substrate of two sides wiring.Such as shown in figure 27,, when LED chip has 3 row when above, preferably use the mounting substrate 224 of two sides wiring.Such as shown in figure 27, the wiring 228a that is connected with LED chip 226a near in the row of body side and the wiring 228c that is connected with LED chip 226c in leaning on the row of body side far away are formed on the surperficial 224a of mounting substrate 224.On the other hand, the wiring 228b that is connected with LED chip 226b in Centromedian row is formed on the back side 224b of mounting substrate 224.Thus, can dwindle substrate area.

［ reflecting part ］

Can make light reflection surface part in addition in aforesaid reflecting part, more closer to the top than the light-emitting area of LED chip become light absorbing color (black etc.), suppress veiling glare.

(5: lens)

［ joint methods of lens ］

As shown in Figure 24 (b), there is the situation that lens is engaged in luminescent coating.Also lens can be engaged in LED chip.Such lens can be that the light source of the light that will penetrate from LED chip and luminescent coating looks like to be projected in the lens on the imaginary vertical screen in direction of illumination the place ahead.In this situation, preferably do not use organic system bonding agent ground to engage.If this is that the possibility that produces scattering, refraction on layer interface each other can become large because increase unnecessary layer.Therefore, by normal temperature engage, the whole bag of tricks binder free ground such as interfacial activity joint, anodic bonding engage lens and fluorophor etc.Thus, from the light of LED chip or the light by luminescent coating, be difficult for being absorbed, reflecting at the interface with lens, the luminous flux that penetrates from light emitting module increases.

［ anodic bonding ］

When substrate, masking frame are silicon systems, when the glass that is used for lens contains alkali metal, substrate, masking frame and lens can be carried out anodic bonding (by imposing 500 ℃, the heating of 500V degree, apply voltage the alkali metal in glass is diffused in silicon, the technology that engages).Thus, can realize the hermetic seal of light emitting module.

［ linear expansion coefficient ］

When carrying out aforesaid anodic bonding, preferably make the linear expansion coefficient of glass level off to 3ppm/ ℃ as the linear expansion coefficient of silicon.Specifically, as the glass that is used for lens, preferred linear expansion coefficient is at the material of 1～10ppm/ ℃ of scope.

［ lens arra ］

Can array (matrix) shape be arranged with mounted lens array on the above-mentioned light emitting module of LED chip.Lens arra is a plurality of lens shaped corresponding with each LED chip to be formed in the structure of tabular parts., as such lens arra, for example be disclosed in Japanese Unexamined Patent Application Publication 2006-520518.Even the light emitting module of present embodiment uses such lens arra, because it possesses light shielding part, therefore also can suppress light leak.In addition, can, by the integrally formed lens arra of making of resin, reduce costs.

［ CPC lens ］

A kind of as lens arra, can utilize the CPC lens.Thus, the color that can eliminate in each luminescence unit is uneven.

［ atomizations of lens ］

Can be only lens be longitudinally added atomization.When LED array has all been lighted, in the situation that the dark section that produces between luminescence unit (1 LED chip+1 fluorophor) is projected as black line longitudinally, can be at the projecting lens 24(PES lens shown in Figure 1 as final exit lens) etc. vertically on add atomization.

Also can only to horizontal lens, add atomization.When LED array is all lighted, in the situation that the dark section that produces between luminescence unit is projected as horizontal black line, can be to projecting lens shown in Figure 1 24 laterally add atomization.

Also can only in an inclined direction to lens, add atomization.When LED array is all lighted, in the situation that the dark section that produces between luminescence unit is projected as oblique black line, can add atomization on the incline direction of projecting lens shown in Figure 1 24.The atomization of in addition, can appropriate combination longitudinal and transverse, tilted direction.

［ fiber array ］

Can weaken brightness disproportionation, color inequality with fiber array., by on LED chip or on luminescent coating, the light conductor layer that makes the optical fiber bunchy being set, can weaken brightness disproportionation, color inequality.

［ dull and stereotyped lenticule (micro lens) ］

Dull and stereotyped lenticule can be set.Also can, by making high index of refraction or low-refraction component distributing in the tabular transparent body, form optical lens (grin lens).

［ space-filling ］

In lamps apparatus for vehicle shown in Figure 1 10, the light that penetrates from LED chip 22a can pass through air layer until arrive projecting lens 24.Therefore, because of boundary reflection, the leeway that is improved on the taking-up efficiency of luminous flux.Therefore, preferably be not situated between the structure of such air layer is arranged.For example, can fill between projecting lens 24 and light emitting module 22 with silicon gel (silicone gel).

Like this,, in the situation that gel etc. is filled between lens and light emitting module and is connected optically and mechanically engages (being adjacent to), light emitting module can be applicable to design upper different lamps apparatus for vehicle (headlamp).

［ fluorophor lens ］

Fluorophor itself can be processed as lens shape, be used as being installed on the light emitting module of LED chip.Fluorophor is lens-shaped, therefore the light sealing that does not have critical angle to cause, light emitting module luminous flux on the whole increases.

(6: control circuit)

［ the province's electrification during parking ］

When vehicle is just stopping because of waiting signal lamp etc., do not need to shine road surface, but be by other car cognitive to, need a some bright light.In addition, in the vehicle of the light source of in the past use bulb type, if exist, extinguish head lamp, the bulb life-span problem that can shorten when stopping.But, in the light emitting module of present embodiment, used LED light source, therefore the light on and off lamp is less on the impact of light source life.Therefore,, for taking into account security and power saving, can be set in the battery saving mode that weakens or block electric current in the process of parking.

Lamps apparatus for vehicle 10 shown in Figure 1 comprises light emitting module 22, reaches the control circuit (not shown) of the light on and off lamp of controlling light emitting module 22.Control circuit is in the situation that the state of the vehicle stop that lamps apparatus for vehicle is installed detected, and the light on and off lamp state of light emitting module controlled the lower car-parking model of irradiation mode power consumption that becomes when travelling.The province's electrification that operatively realizes lamps apparatus for vehicle that can not need thus, the driver.

［ adding of communication function ］

Aforesaid control circuit can carry out the light on and off lamp of the LED of light emitting module and control.The light on and off lamp speed of LED, therefore can light transmission information by making it pulse.Therefore, control circuit can not only possess ADB(Adaptive Driving Beam: the self adaptation light beam is adjusted) the light on and off lamp of use controls function, also possesses between the car car communication control function of (semaphore and automobile etc.) between (Ben Che and his car) and bus.

［ flash lamp during collision ］

In recent years, centered by vehicle in use, the installation of drive recorder advances.But the performance that the camera of installing etc. are taken means is lower, particularly at night, become not distinct because of the deficiency in light quantity image sometimes.Therefore, when the control circuit of lamps apparatus for vehicle 10 detects impact moment based on the information of the detection means from collision detection moment, improve the light quantity of light emitting module 22.Thus, the vehicle shooting means that can pass through to possess are recorded accident brightly.

［ control during the light on and off lamp ］

In the situation that the ADB distribution controls in lamps apparatus for vehicle 10 when other car occurring,, if the LED chip in other existing zone of car of irradiation is extinguished instantaneously, causes dazzle can for other car.On the other hand,, if in the moment that other car disappears, just light the LED chip that is extinguishing before this always, can make the driver feel awkward.Therefore, in the situation that the LED chip that is extinguishing is before this lighted always, control circuit is controlled the electric current (voltage) to LED chip, so that light quantity increases gradually.

［ spotlight ］

The main purpose of the distribution controls of ADB is for preventing a part that dazzle makes a plurality of LED chips extinguishing partly.But in the situation that pedestrian etc. detected, for causing driver's attention, control circuit can carry out increasing in the mode of optically focused the control of the light quantity of the LED chip that shines the existing zone of pedestrian.

(embodiment)

Below narrate in more detail light emitting module with embodiment and comparative example.At first, make on the mounting substrate of the nitrogenize aluminum that can carry out to each LED light modulation connecting up, the assembling size is that 1 * 1mm, peak luminous wavelength are 4 blue led chips of 450nm.Then, install silicon is carried out masking frame after microfabrication, and luminescent coating is installed, is produced the LED encapsulation (below be called " light emitting module ").

This light emitting module is loaded on the radiator of aluminium diecasting (aluminum die-cast) system, make the electric current of 700mA flow through 4 LED chips, made it to stablize 10 minutes.Measure brightness with the two-dimentional chroma-luminance meter CA1500 that the Konica Minolta produces, be measured to the Luminance Distribution of the length direction of light emitting module from the front (above light emitting module) of the light-emitting face of light emitting module.At this, length direction is the direction of approximate centre that connects the light-emitting area of each LED chip.

After this, the electric current of 1 LED chip of blocking-up is measured Luminance Distribution, and measures the brightness of the section of extinguishing.The brightness of extinguishing section is enough low, and the light emitting module of energy shading has been arranged on and has possessed focal length 40mm's

The light fixture of planoconvex spotlight.Light light emitting module, it projection on the screen at 25m place, the place ahead, has been measured photometric distribution.After this, the same during with brightness measuring, the electric current of 1 LED of blocking-up, measured photometric distribution again.For not causing dazzle for subtend car and front truck, pedestrian, need the luminosity in zone that will be corresponding with the LED chip that has extinguished to remain on below 625cd.

(comparative example 1)

(a) of Figure 28 is the summary section of the light emitting module of comparative example 1, and (b) of Figure 28 means the figure of chart of Luminance Distribution of the light emitting module of comparative example 1.In (b) of Figure 28, curve S 1 has represented that 4 LED all put the Luminance Distribution of the state of light yellow, and curve S 2 has only represented the Luminance Distribution of the state that 1 LED chip is extinguished.In addition, the Luminance Distribution below in each embodiment is also the same.

The luminescent coating 306 that the light emitting module 300 of comparative example 1 comprises a plurality of LED chips 304 that substrate 302, substrate 302 assemble, consist of a YAG sintered body of the size that covers a plurality of LED chips 304 and be held in substrate 302 and support the housing 308 of the peripheral part of luminescent coating 306.

In light emitting module 300, each LED chip 304 does not have for the structure (structure) that separates optically (shading) adjacent luminous component (light-emitting area) with luminescent coating 306.Therefore, even extinguish 1 of 1 LED chip, the brightness of this part (lowermost portion of the curve S 2 shown in Figure 28 (b)) is also that 1.5cd/mm2, shading are not enough.

(embodiment 1)

(a) of Figure 29 is the figure of chart of the Luminance Distribution of (b) of summary section, Figure 29 of the light emitting module of embodiment 1 light emitting module that means embodiment 1.In addition, in the light emitting module of embodiment 1, for the structure mark identical label the same with comparative example 1, and suitably description thereof is omitted.

In light emitting module 310, be not provided for the structure of shading between LED chip 304.On the other hand, each luminescent coating 312 consists of 1 YAG sintered plate that covers the size of LED chip 304,, in its side, is coated with silver slurry 314.Thus, from the light of adjacent luminescent coating 312 by shading.Its result, after extinguishing 1 LED chip, the brightness of this part (lowermost portion of the curve S 2 shown in Figure 29 (b)) is reduced to 0.3cd/mm2 significantly, shaded effect occurred.

(embodiment 2)

(a) of Figure 30 is the summary section of the light emitting module of embodiment 2, and (b) of Figure 30 means the figure of chart of Luminance Distribution of the light emitting module of embodiment 2.In addition, in the light emitting module of embodiment 2, to aforementioned the same structure, marking identical label, and suitably description thereof is omitted.

In light emitting module 320, be provided with between LED chip 304 and silicon has been carried out the triangle frame 321 after the microfabrication carry out shading.Thus, block light from adjacent LED chip 304.On the other hand, luminescent coating 322 consists of 1 YAG sintered plate that covers the size of LED chip 304, but in its side, uncoated has any material.Its result, after extinguishing 1 LED chip, the brightness of this part (lowermost portion of the curve S 2 shown in Figure 30 (b)) is reduced to 0.6cd/mm2 significantly, shaded effect occurred.

Therefore, pack light emitting module 320 into and after measuring photometric distribution, the minimum luminosity while extinguishing as can be known 1 LED chip is 500cd in light fixture, lower than causing the 625cd of dazzle may for subtend car and front truck, pedestrian.Based on the result of embodiment 2, if the brightness of the section of extinguishing of light emitting module is below 0.6cd/mm2 as can be known, the generation of the dazzle in the time of suppressing to be applicable to light fixture.

(embodiment 3)

(a) of Figure 31 is the figure of chart of the Luminance Distribution of (b) of summary section, Figure 31 of the light emitting module of embodiment 3 light emitting module that means embodiment 3.In addition, in the light emitting module of embodiment 3, to aforementioned the same structure, marking identical label, and suitably description thereof is omitted.

In light emitting module 330, being set between LED chip 304, the triangle frame 321 after silicon is carried out microfabrication carries out shading.Thus, the light from adjacent LED chip 304 is blocked.On the other hand, each luminescent coating 312 consists of the YAG sintered plate of the size that covers 1 LED chip 304,, in its side, is coated with silver slurry 314.Thus, the light from adjacent luminescent coating 312 is blocked.Like this, by separating optically between LED chip and between luminescent coating, after extinguishing 1 LED chip, the brightness of this part (lowermost portion of the curve S 2 shown in Figure 31 (b)) is reduced to 0.3cd/mm2 significantly, shaded effect occurred.

(embodiment 4)

(a) of Figure 32 is the figure of chart of the Luminance Distribution of (b) of summary section, Figure 32 of the light emitting module of embodiment 4 light emitting module that means embodiment 4.In addition, at the light emitting module of embodiment 4, to aforementioned the same structure, marking identical label, and suitably description thereof is omitted.

In light emitting module 340, at the triangle frame 342 that arranges between LED chip 304 after silicon is carried out microfabrication, carry out shading.Thus, the light from adjacent LED chip 304 is blocked.The summit of triangle frame 342 has arrived the near surface of luminescent coating 344.Each luminescent coating 344 consists of the YAG sintered plate of the size that covers 1 LED chip 304.Thus, the light from adjacent luminescent coating 344 is blocked.Like this, by separating optically between LED chip and between luminescent coating, after extinguishing 1 LED chip, the brightness of this part (lowermost portion of the curve S 2 shown in Figure 32 (b)) is reduced to 0cd/mm2 significantly, shaded effect occurred.

Therefore, pack light emitting module 340 into and after measuring photometric distribution, the minimum luminosity that confirms while extinguishing 1 LED chip is 300cd in light fixture, lower than causing the 625cd of dazzle may for subtend car and front truck, pedestrian.

(embodiment 5)

(a) of Figure 33 is the summary section of the light emitting module of embodiment 5, and (b) of Figure 33 means the figure of chart of Luminance Distribution of the light emitting module of embodiment 5.In (b) of Figure 33, only represented that 4 LED put the Luminance Distribution (curve S 1) of the state of light yellow.In addition, in the light emitting module of embodiment 5, to aforementioned the same structure, marking identical label, and suitably description thereof is omitted.

In light emitting module 350, being set between LED chip 304, the triangle frame 342 after silicon is carried out microfabrication carried out shading.Thus, the light from adjacent LED chip 304 is blocked.Expose from the surface of luminescent coating 352 on the summit of triangle frame 342.By with rubber, rolling, the cream after being blended in the YAG powder in the dimethyl-silicon ketone resin by 12 volume % is printed on LED chip 304 and has formed luminescent coating 352.At this moment, adjust, make the front end of triangle frame 342 expose.Thus, the light from adjacent luminescent coating 352 is blocked.Like this, by separating optically between LED chip and between luminescent coating, and after extinguishing 1 LED chip, the brightness of this part is reduced to 0cd/mm2 significantly, shaded effect occurred.

Therefore, pack light emitting module 340 into and after measuring photometric distribution in light fixture, confirm minimum luminosity while extinguishing 1 LED chip below 300cd, lower than causing the 625cd of dazzle may for subtend car and front truck, pedestrian.

(embodiment 6)

(a) of Figure 34 is the summary section of the light emitting module of embodiment 6, and (b) of Figure 34 means the figure of chart of Luminance Distribution of the light emitting module of embodiment 6.In (b) of Figure 34, only represented that 4 LED put the Luminance Distribution (curve S 1) of the state of light yellow.In addition, in the light emitting module of embodiment 6, to aforementioned the same structure, marking identical label, and suitably description thereof is omitted.

In light emitting module 360, being set between LED chip 304, the vertical frame 362 after silicon is carried out microfabrication carried out shading.The side of vertical frame 362 is set to surperficial substantially vertical with respect to substrate 302.Thus, obtained action effect in the same manner as in Example 5.

(embodiment 7)

(a) of Figure 35 is the summary section of the light emitting module of embodiment 7, and (b) of Figure 35 means the figure of chart of Luminance Distribution of the light emitting module of embodiment 7.In (b) of Figure 35, only represented that 4 LED put the Luminance Distribution (curve S 1) of the state of light yellow.In addition, in the light emitting module of embodiment 7, to aforementioned the same structure, marking identical label, and suitably description thereof is omitted.

In light emitting module 370, being set between LED chip 304, the frame 372 after silicon is carried out microfabrication carried out shading.The side of close substrate 302 sides of frame 372 (bottom shown in Figure 35 (a)) is set to surperficial substantially vertical with respect to substrate 302, and its side near the side (top shown in Figure 35 (a)) on the surface of luminescent coating 352 is set to the surface tilt with respect to substrate 302.Thus, obtained action effect in the same manner as in Example 5.

(embodiment 8)

(a) of Figure 36 is the summary section of the light emitting module of embodiment 8, and (b) of Figure 36 means the figure of chart of Luminance Distribution of the light emitting module of embodiment 8.In (b) of Figure 36, only represented that 4 LED put the Luminance Distribution (curve S 1) of the state of light yellow.In addition, in the light emitting module of embodiment 8, to aforementioned the same structure, marking identical label, and suitably description thereof is omitted.

In light emitting module 380, being set between LED chip 304, the frame 372 after silicon is carried out microfabrication carried out shading.The luminescent coating 382 that the YAG sintered plate that cut off by the shape along frame 372 forms has been installed on LED chip 304.About the YAG sintered plate, preferably in the straight line light time of the wavelength by the incident fluorescence zone (600nm), the light more than 40% is as diffused light and the sintered plate of outgoing.

After the Luminance Distribution of measuring the light emitting module 380 that forms like this, photometric distribution, the dark section (brightness is than lower curtate) between LED chip is considerably less, and the variation of the Luminance Distribution in the LED chip face is also less, and the even sense while having lighted all LED has significantly improved.

Embodiment and each embodiment that above reference is above-mentioned have illustrated the present invention, but the present invention is not limited to above-mentioned embodiment and embodiment, and the scheme of the structure of appropriate combination and displacement embodiment and embodiment comprises in the present invention too.In addition, the order of combination in embodiment and each embodiment and processing of can also suitably recombinating based on those skilled in the art's knowledge and to the in addition distortion such as various design alterations of embodiment and each embodiment, the embodiment that is carried out such distortion is also contained in scope of the present invention.

(label declaration)

10 lamps apparatus for vehicle, 12 lamp main bodies, 14 diffusers, 18 lamp units, 22 light emitting modules, 22a LED chip, 24 projecting lens, 50 light emitting modules, 54 substrates, 56a light-emitting area, 58 luminescent coatings, 60a light shielding part, 64LED chip.

(industrial utilizability)

Light emitting module of the present invention can be applicable to various light fixtures, such as lighting lamp, display, lamps apparatus for vehicle, semaphore etc.

Claims

1. a light emitting module, is characterized in that, comprising:

Substrate,

A plurality of light-emitting components, be assemblied in aforesaid substrate, also arranging rectangularly,

Fluorescence part, be set to relative with the light-emitting area of above-mentioned light-emitting component, and

Light shielding part, be set to surround at least a portion light-emitting component in above-mentioned a plurality of light-emitting component light-emitting area around.

2. light emitting module as claimed in claim 1, is characterized in that,

Above-mentioned a plurality of light-emitting component comprises the 1st light-emitting component that the luminosity while lighting is relatively high and the 2nd relatively low light-emitting component of luminosity while lighting;

Above-mentioned light shielding part mainly is arranged between above-mentioned the 1st light-emitting component and the light-emitting component adjacent to the 1st light-emitting component.

3. light emitting module as claimed in claim 1 or 2, is characterized in that,

Above-mentioned light-emitting component is the element of flip chip type.

4. light emitting module as described in any one of claims 1 to 3, is characterized in that,

Above-mentioned fluorescence part is tabular fluorophor.

5. light emitting module as described in any one of claim 1 to 4, is characterized in that,

The thermal coefficient of expansion of aforesaid substrate is in the scope of thermal coefficient of expansion ± 5ppm/ ℃ of above-mentioned light-emitting component.

6. light emitting module as described in any one of claim 1 to 5, is characterized in that, also comprises:

Lens, the light source of the light that will penetrate from light-emitting component and fluorescence part looks like to be projected on the imaginary vertical screen in direction of illumination the place ahead;

Said lens directly is engaged in above-mentioned light-emitting component or above-mentioned fluorescence part.

7. a lamps apparatus for vehicle, is characterized in that, comprising:

Light emitting module as described in any one of claim 1 to 6, and

Control circuit, the light on and off lamp of the above-mentioned light emitting module of control;

Wherein, above-mentioned control circuit when the state of the vehicle parking that lamps apparatus for vehicle is installed being detected, is controlled the light on and off lamp state of above-mentioned light emitting module, makes it to become the low car-parking model of irradiation mode power consumption when travelling.