CN109031504A - Light guide with heat-resisting incident section - Google Patents
Light guide with heat-resisting incident section Download PDFInfo
- Publication number
- CN109031504A CN109031504A CN201810554904.7A CN201810554904A CN109031504A CN 109031504 A CN109031504 A CN 109031504A CN 201810554904 A CN201810554904 A CN 201810554904A CN 109031504 A CN109031504 A CN 109031504A
- Authority
- CN
- China
- Prior art keywords
- light guide
- incident section
- transparent material
- protection portion
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V2200/00—Use of light guides, e.g. fibre optic devices, in lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention does not make to reduce and protect the incident section of light guide so that not influenced by the fever of semiconductor light source with light efficiency.The light guide (11) of lamps apparatus for vehicle has the light guide (12) guided to the light generated by semiconductor light source (3).Light guide (12) includes: incident section (13) make the luminous injection of semiconductor light source (3)；And protection portion (16), incident section (13) are protected so that not influenced by the fever of semiconductor light source (3).Incident section (13) are formed by the 1st transparent material, protection portion (16) is formed by softening point the 2nd transparent material higher than the 1st transparent material.1st transparent material uses acrylic acid or polycarbonate resin, and the 2nd transparent material uses glass.Or the 1st transparent material use acrylic resin, the 2nd transparent material use polycarbonate resin.
Description
Technical field
The present invention relates to the luminous light guides (light guide) guided by light guide to semiconductor light source, in detail
It carefully says, is related to protecting the incident section of light guide so that the technology not influenced by the fever of semiconductor light source.
Background technique
In lamps apparatus for vehicle, this light guide is widely used in using semiconductor light-emitting elements such as LED, LD as light source
Indirect lighting.For example, light guide 11 has the bar-shaped light guide of transparent resin in the lamps apparatus for vehicle 1 shown in Fig. 8 (a)
12, the incident section 13 for being set as the light guide 12 is opposite with the semiconductor light source 3 on light source unit 2, the exit portion of light guide 12
14 along radiator grille 4 inner surface extend.
As shown in Fig. 8 (b), incident section 13 is generally disposed in 3 close position of semiconductor light source (preferably by light distribution angle θ
The position of covering), it enables to efficiently carry out light distribution to the light beam generated by semiconductor light source 3.Therefore, in semiconductor light
When 3 lighting of source, sometimes due to softening the end face 15 of light guide 12 with the associated fever that shines and deforming.Especially in recent years,
In following trend, that is, be easy to happen thermal damage in incident section 13 with the high brightness of semiconductor light-emitting elements.
Therefore, the technology for improving the heat resistance of light guide incident section is proposed in the past.For example, proposing in patent document 1
A kind of light guide 51, that is, as shown in figure 9, the entirety of the retainer 54 that the incident section 53 to light guide 52 is kept, utilizes
Transparent heat resistant resin material with the softening point higher than incident section 53 is formed, and 55 He of end face positioned at light guide 52 is made
A part of retainer 54 between semiconductor light source 56 works as insulation part 57.
Patent document 1: Japanese Unexamined Patent Publication 2016-4705 bulletin
But according to existing light guide 51, there are following problems, that is, even 57 heat stable resin system of insulation part, it is also desirable to
It separates and configures with semiconductor light source 56, therefore the distance between the end face 55 of light guide 52 and semiconductor light source 56 are elongated, enter
Light distribution angle θ can not be covered by penetrating portion 53, a large amount of BEAM SQUINT incident sections 53, and light guide 51 is reduced with light efficiency, and deviate
Light beam makes retainer 54 shine on the periphery of incident section 53.In addition, incident section 53 and the gap (air layer) 58 of retainer 54 have
Adverse effect may be caused to the light distribution characteristic of light guide 52.
Summary of the invention
Therefore, the object of the present invention is to provide one kind do not make with light efficiency reduce and can be to the incident section of light guide
It is protected so that the light guide not influenced by the fever of semiconductor light source.
In order to solve the above problems, light guide of the invention is characterized in that, is arranged by the molding light guide of transparent material
Have: incident section makes the luminous injection of semiconductor light source；And protection portion, incident section is protected so that not by half
The fever of conductor light source influences.
Herein, the shape of light guide is not limited especially, is bar-like, is band-like, plate etc., can fit depending on the application
Locality selection.In the case where rodlike or band-like strip light guide, an end face of length direction is acted as the plane of incidence
With opposite with semiconductor light source.In carrying out the present invention, the plane of incidence of light guide can be used as the end face of incident section, also can
Enough as the end face of protection portion.
In several embodiments of the invention, the end face of protection portion is worked as the plane of incidence of light guide, semiconductor
Shining for light source is incident upon incident section via protection portion.In such a situation it is preferred that incident section is formed by the 1st transparent material,
Protection portion is formed by softening point the 2nd transparent material higher than the 1st transparent material.
Specifically, synthetic resin can be set as the 1st transparent material of incident section, by the 2nd transparent material of protection portion
It is set as glass.In addition, the relatively low acrylic resin of softening point (PMMA) can be set as the 1st transparent material, by the 2nd transparent material
Material is set as the relatively high polycarbonate resin of softening point (PC).
It is further possible to by incident section by transparent thermoplastic resin molded, by protection portion by transparent thermosetting resin
Molding.As transparent thermosetting resin, it is able to use the resin material that silicone, epoxy resin etc. do not have softening point.
In other embodiments of the invention, the end face of incident section is worked as the plane of incidence of light guide, semiconductor
The luminous of light source is emitted directly toward to incident section.In this case, the circumferential surface of incident section is coated by heat dissipating housing, this can be provide with for
The protection portion of light guide.It, can it is preferable to use the material that can absorb the thermal-storage efficient of incident section, examples as heat dissipating housing
Such as, the high material of thermal conductivitys such as aluminium, CNT (carbon nanotube).
In other embodiments of the invention, incident section includes the hypertrophy integrally formed in the cardinal extremity of light guide
Portion, protection portion include the curved surface recessed in the end face in loose portion.According to this structure, the thermal capacitance of incident section can be made to increase, and
And the concave curved surface (plane of incidence of light guide) of protection portion can be made to separate from semiconductor light source.
In addition, in an embodiment of the invention, being protected to separate the plane of incidence of light guide from semiconductor light source
Shield portion includes the lid in the tubular of incident section installation, is formed in the inner circumferential of lid the light direction from semiconductor light source is incident
The reflecting surface of portion's reflection.
The effect of invention
Light guide according to the present invention, light guide itself have protection portion, there is no need to light guide and semiconductor light source it
Between sandwiched other component.Therefore, there are following effects, that is, the incident section of light guide and semiconductor light source can be made close, it will be partly
The luminous of conductor light source efficiently carries out light distribution, and is protected to incident section so that not by the fever shadow of semiconductor light source
It rings.
Detailed description of the invention
Fig. 1 is the mian part oblique view for indicating the light guide of the embodiment of the present invention 1.
Fig. 2 is the incident section for indicating light guide and the cross-sectional view of protection portion.
Fig. 3 is the oblique view for indicating the connecting structure of incident section and protection portion.
Fig. 4 is the cross-sectional view for indicating other connecting structure of incident section and protection portion.
Fig. 5 is the mian part oblique view for indicating the light guide of the embodiment of the present invention 2.
Fig. 6 is the mian part strabismus and cross-sectional view for indicating the light guide of the embodiment of the present invention 3.
Fig. 7 is the cross-sectional view of a main portion for indicating the light guide of the embodiment of the present invention 4.
Fig. 8 is the skeleton diagram for indicating the light guide of lamps apparatus for vehicle.
Fig. 9 is the cross-sectional view for indicating existing light guide retainer.
The explanation of label
1 lamps apparatus for vehicle, 3 semiconductor light sources, 11 light guides, 12 light guides, 13 incident sections, 16 protection portion, 21 heat dissipating housings, 23
Loose portion, 24 curved surfaces, the lid of the 26 wide bottoms, 26a reflecting surface with the level, 27 columnar lids, 27a reflecting surface
Specific embodiment
In the following, being based on attached drawing, the embodiment for the light guide that the present invention is embodied as lamps apparatus for vehicle is illustrated.It should
Light guide 11 such as shown in Fig. 8 (a), has and is shaped to rodlike light guide 12 by transparent material.Light guide 12 includes incident section 13,
It makes the luminous injection of semiconductor light source 3；Exit portion 14 projects incident light to the front of lamps apparatus for vehicle 1；And protection
Portion (not shown in fig. 8) protects incident section 13 from the fever of semiconductor light source 3.
In the following, the structure about protection portion, enumerates several embodiments and is described in detail.In addition, in FIG. 1 to FIG. 8
In, identical label is labeled with to same or similar structural element.
[embodiment 1]
FIG. 1 to FIG. 4 shows the embodiment of the present invention 1.As shown in Figure 1, the light guide 11 of embodiment 1 is in bar-shaped light guide 12
Incident section 13 and the protection portion 16 of same diameter are respectively provided on length-wise axis or optical axis A.Protection portion 16 is located at leaded light
The cardinal extremity of body 12, the end face (end face 15 of light guide 12) of protection portion 16 and semiconductor light source 3 are opposite, protection portion 16 it is another
End face 16a is connect (referring to Fig. 2) in a manner of touching with an end face 13a of incident section 13.
As shown in Fig. 2 (a), (b), incident section 13 is formed by the 1st transparent material identical with exit portion 14 (referring to Fig. 8),
Protection portion 16 is formed by softening point the 2nd transparent material higher than the 1st transparent material.For example, as shown in Fig. 2 (a), incident section 13
1st transparent material uses PMMA (acrylic resin) or PC (polycarbonate resin), and the 2nd transparent material of protection portion 16 uses
Glass.Alternatively, being also possible to the 1st transparent material using PMMA, the 2nd transparent material uses PC as shown in Fig. 2 (b).Fig. 2 (c) institute
The incident section 13 shown by PMMA perhaps PC etc. transparent thermoplastic resin molded protection portion 16 by silicone (SI) or epoxy resin
(EP) the transparent thermosetting resin molding such as.
Incident section 13 and such as Fig. 3 (a) of protection portion 16 are shown, respective end face 13a, 16a (referring to Fig.1) are passed through transparent viscous
The connection of agent 17 is connect, or can also be connected respective circumferential surface by connector 18 as shown in Fig. 3 (b).Alternatively, can also incite somebody to action
Incident section 13 and such as Fig. 4 (a) of protection portion 16 are shown, are formed by dual-color forming method, can also be made as shown in Fig. 4 (b) simultaneously
It is combined with screw component 19.In above-mentioned each situation, all with no optical axis deviation, the not mode of sandwiched air layer between end face
Touch the two 13,16.
According to the light guide 11 of the embodiment 1 constituted as noted above, protection portion is configured in base end side compared with incident section 13
16, form the protection portion 16 by the softening point transparent material higher than incident section 13, there is no need in light guide 12 and semiconductor
The heat-insulated other component of sandwiched between light source 3.Therefore, the end face 15 of light guide 12 can be made close with semiconductor light source 3
Position and semiconductor light source 3 it is directly opposite, light distribution angle θ (referring to Fig. 2) can properly be covered using end face 15, make partly to lead
Shining for body light source 3 efficiently carries out light distribution to lamps and lanterns front.In addition, as shown in figure 4, can also make protection portion 16 and multiple half
Conductor light source 3 is opposite.
[embodiment 2]
Fig. 5 shows the embodiment of the present invention 2.In the light guide 11, the end face of incident section 13 is equal to the end face of light guide 12
15, the circumferential surface of incident section 13 locally or is by entire surface coated by heat dissipating housing 21.Heat dissipating housing 21 is the protection portion of incident section 13, example
Such as, as shown in Fig. 5 (a), by the sheet of CNT, perhaps film-like members are wound in incident section 13 or as shown in Fig. 5 (b), will
The cylindrical part of aluminum is plugged in incident section 13, or metal deposition film is coated on to the circumferential surface etc. of incident section 13, to incident section
13 are protected so that not influenced by the fever of semiconductor light source (illustration omitted).Therefore, according to the light guide 11 of embodiment 2,
Especially tool has the advantage that, that is, can form inexpensively light guide 12 by a kind of transparent resin material in length range.
[embodiment 3]
Fig. 6 shows the embodiment of the present invention 3.In the light guide 11, egg shape is formed in the cardinal extremity of light guide 12
Loose portion 23.Loose portion 23 is the incident section for entering the light emission from semiconductor light source 3, and acting on is the thermal capacitance for making incident section
Increase.It is recessed with the curved surface 24 as protection portion in the end face (end face 15 of light guide 12) in loose portion 23, makes loose portion 23
Transparent resin is separated from semiconductor light source 3, is protected on loose portion 23 so that not influenced by the fever of semiconductor light source 3.
Therefore, according to the light guide 11 of embodiment 3, especially tool is had the advantage that, that is, only changes the shape of the base end part of light guide 12, just
The thermal damage of incident section can simply be inhibited.
[embodiment 4]
Fig. 7 shows the embodiment of the present invention 4.The light guide 11 is equipped in incident section 13 as the metal of protection portion or resistance to
The lid 26,27 of hot resin is provided with shining semiconductor light source 3 towards incident section by aluminium-vapour deposition in respective inner circumferential
Reflecting surface 26a, 27a of 13 reflections.Lid 26 shown in Fig. 7 (a) is formed as the tubular of the wide bottom, and inner circumferential is provided with step
Reflecting surface 26a.Lid 27 shown in Fig. 7 (b) is formed as cylinder-shaped, and flat reflecting surface 27a is provided in inner circumferential.Therefore, according to
The light guide 11 of embodiment 4, especially tool have the advantage that, that is, separate the end face 15 of light guide 12 from semiconductor light source 3, and make
Lid 26,27 works as optically focused and thermal component, can effectively inhibit the thermal damage of incident section 13.
In addition, the present invention is not limited to above-described embodiments, for example, can will be shown in embodiment 1 and Fig. 5 shown in Fig. 2
Embodiment 2 combine, or the loose portion 23 etc. for making the heat dissipating housing 21 of embodiment 2 be coated on embodiment 3 shown in fig. 6 will implement
Example 1~4 is appropriately combined and implements, in addition, light guide of the invention can be also applied to the various light other than lamps apparatus for vehicle
Learning device can also suitably change the shape, structure in each portion and be implemented in the range for not departing from purport of the invention.
Claims (8)
1. a kind of light guide, which is characterized in that
Incident section is being provided with by the molding light guide of transparent material, is making the luminous injection of semiconductor light source；And protection
Portion protects incident section from the fever of semiconductor light source.
2. light guide according to claim 1, wherein
The incident section is formed by the 1st transparent material, the protection portion 2nd transparent material higher than the 1st transparent material by softening point
Material molding.
3. light guide according to claim 2, wherein
1st transparent material includes synthetic resin, and the 2nd transparent material includes glass.
4. light guide according to claim 2, wherein
1st transparent material includes acrylic resin, and the 2nd transparent material includes polycarbonate resin.
5. light guide according to claim 1, wherein
By transparent thermoplastic resin molded, the protection portion is formed by transparent thermosetting resin for the incident section.
6. light guide according to any one of claim 1 to 5, wherein
The protection portion includes the heat dissipating housing for coating the circumferential surface of the incident section.
7. light guide according to any one of claim 1 to 6, wherein
The incident section includes the loose portion integrally formed in the cardinal extremity of light guide, and the protection portion includes in loose portion
The recessed curved surface in end face.
8. light guide according to any one of claim 1 to 7, wherein
The protection portion includes the lid in the tubular of incident section installation, and being formed in the inner circumferential of lid will be from semiconductor light
The reflecting surface that the light in source is reflected towards incident section.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-113964 | 2017-06-09 | ||
| JP2017113964A JP2018205651A (en) | 2017-06-09 | 2017-06-09 | Light guide with heat-resistant incoming part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109031504A true CN109031504A (en) | 2018-12-18 |
| CN109031504B CN109031504B (en) | 2021-08-31 |
Family
ID=64611941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810554904.7A Active CN109031504B (en) | 2017-06-09 | 2018-06-01 | Light guide with heat resistant entry |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2018205651A (en) |
| CN (1) | CN109031504B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114901994A (en) * | 2020-01-22 | 2022-08-12 | 株式会社利富高 | LED lighting device |
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| CN114901994B (en) * | 2020-01-22 | 2024-05-07 | 株式会社利富高 | LED lighting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109031504B (en) | 2021-08-31 |
| JP2018205651A (en) | 2018-12-27 |
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