CN109031504B - Light guide with heat resistant entry - Google Patents
Light guide with heat resistant entry Download PDFInfo
- Publication number
- CN109031504B CN109031504B CN201810554904.7A CN201810554904A CN109031504B CN 109031504 B CN109031504 B CN 109031504B CN 201810554904 A CN201810554904 A CN 201810554904A CN 109031504 B CN109031504 B CN 109031504B
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- China
- Prior art keywords
- light guide
- incident
- transparent material
- light source
- semiconductor light
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V2200/00—Use of light guides, e.g. fibre optic devices, in lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
Abstract
The invention protects the incident part of the light guide body from the heat generated by the semiconductor light source without reducing the light distribution efficiency. A light guide (11) of a vehicle lamp has a light guide body (12) that guides light generated by a semiconductor light source (3). The light guide body (12) includes: an incident section (13) for allowing light emitted from the semiconductor light source (3) to enter; and a protection unit (16) that protects the incident unit (13) from heat generated by the semiconductor light source (3). The incident part (13) is molded from a 1 st transparent material, and the protective part (16) is molded from a 2 nd transparent material having a higher softening point than the 1 st transparent material. The 1 st transparent material is made of acrylic or polycarbonate resin, and the 2 nd transparent material is made of glass. Or the 1 st transparent material uses acrylic resin, and the 2 nd transparent material uses polycarbonate resin.
Description
Technical Field
The present invention relates to a light guide (light guide) for guiding light emitted from a semiconductor light source by a light guide, and more particularly, to a technique for protecting an incident portion of the light guide from heat generated by the semiconductor light source.
Background
In a vehicle lamp, such a light guide is widely used for indirect lighting using a semiconductor light emitting element such as an LED or an LD as a light source. For example, in the vehicle lamp 1 shown in fig. 8(a), the light guide 11 has a rod-shaped light guide 12 made of a transparent resin, an incident portion 13 of the light guide 12 is provided so as to face the semiconductor light source 3 on the light source unit 2, and an emission portion 14 of the light guide 12 extends along the inner surface of the front cover 4.
As shown in fig. 8 b, the incident portion 13 is generally disposed at a position close to the semiconductor light source 3 (preferably, at a position covering the light distribution angle θ) so as to efficiently distribute the light flux generated by the semiconductor light source 3. Therefore, when the semiconductor light source 3 is turned on, the end face 15 of the light guide 12 may be softened and deformed by heat generation associated with light emission. In particular, in recent years, there is a tendency that thermal damage is likely to occur in incident portion 13 with an increase in luminance of the semiconductor light emitting element.
Therefore, a technique for improving the heat resistance of the light guide incident portion has been proposed. For example, patent document 1 proposes a light guide 51 in which, as shown in fig. 9, the entire holder 54 holding the incident portion 53 of the light guide 52 is molded with a transparent heat-resistant resin material having a higher softening point than the incident portion 53, and a part of the holder 54 located between the end face 55 of the light guide 52 and the semiconductor light source 56 functions as a heat insulating portion 57.
Patent document 1: japanese patent laid-open publication No. 2016-
However, according to the conventional light guide 51, since the heat insulating portion 57 needs to be disposed apart from the semiconductor light source 56 even if it is made of heat-resistant resin, the distance between the end face 55 of the light guide 52 and the semiconductor light source 56 becomes long, the incident portion 53 cannot cover the light distribution angle θ, a large amount of light fluxes deviate from the incident portion 53, the light distribution efficiency of the light guide 51 is lowered, and the deviated light fluxes cause the holder 54 to emit light around the incident portion 53. Further, there is a possibility that a gap (air layer) 58 between the incident portion 53 and the holder 54 may adversely affect the light distribution characteristics of the light guide 52.
Disclosure of Invention
Therefore, an object of the present invention is to provide a light guide that can protect an incident portion of a light guide from heat generated by a semiconductor light source without reducing light distribution efficiency.
In order to solve the above problem, a light guide according to the present invention is a light guide formed of a transparent material, comprising: an incident portion for allowing light emitted from the semiconductor light source to be incident thereon; and a protection section that protects the incident section from heat generation of the semiconductor light source.
Here, the shape of the light guide is not particularly limited, and may be a rod, a belt, a plate, or the like, and may be appropriately selected according to the application. In the case of a bar-shaped or strip-shaped long light guide, one end surface in the longitudinal direction thereof functions as an incident surface and faces the semiconductor light source. In the present invention, the incident surface of the light guide may be an end surface of the incident portion or an end surface of the protective portion.
In some embodiments of the present invention, an end surface of the protection portion functions as an incident surface of the light guide, and light emitted from the semiconductor light source is incident on the incident portion via the protection portion. In this case, it is preferable that the incident portion is molded of a 1 st transparent material, and the protective portion is molded of a 2 nd transparent material having a higher softening point than the 1 st transparent material.
Specifically, the 1 st transparent material of the incident portion may be a synthetic resin, and the 2 nd transparent material of the protective portion may be glass. In addition, the 1 st transparent material may be an acrylic resin (PMMA) having a relatively low softening point, and the 2 nd transparent material may be a polycarbonate resin (PC) having a relatively high softening point.
Further, the incident portion may be molded from a transparent thermoplastic resin, and the protective portion may be molded from a transparent thermosetting resin. As the transparent thermosetting resin, a resin material having no softening point such as silicone or epoxy resin can be used.
In another embodiment of the present invention, the end surface of the incident portion functions as an incident surface of the light guide, and the light emitted from the semiconductor light source is directly incident on the incident portion. In this case, the peripheral surface of the incident portion is covered with the heat radiation cover, and the cover can be provided as a protection portion of the light guide body. As the heat radiation cover, a material capable of efficiently absorbing heat stored in the incident portion, for example, a material having high thermal conductivity such as aluminum or CNT (carbon nanotube) can be preferably used.
In another embodiment of the present invention, the incident portion includes a fat portion integrally formed at the base end of the light guide, and the protective portion includes a curved surface recessed in an end surface of the fat portion. According to this configuration, the heat capacity of the incident portion can be increased, and the concave curved surface of the protective portion (the incident surface of the light guide) can be separated from the semiconductor light source.
In order to separate the incident surface of the light guide from the semiconductor light source, in one embodiment of the present invention, the protection portion includes a cylindrical cover attached to the incident portion, and a reflection surface that reflects light from the semiconductor light source toward the incident portion is formed on an inner periphery of the cover.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the light guide of the present invention, since the light guide itself has the protective portion, it is not necessary to interpose another member between the light guide and the semiconductor light source. Therefore, the incident portion of the light guide body can be brought close to the semiconductor light source, the light emitted from the semiconductor light source can be distributed efficiently, and the incident portion can be protected from the heat generated by the semiconductor light source.
Drawings
Fig. 1 is a principal oblique view showing a light guide of embodiment 1 of the present invention.
Fig. 2 is a cross-sectional view showing an incident portion and a protection portion of the light guide.
Fig. 3 is a perspective view showing a connection structure of the incident portion and the protection portion.
Fig. 4 is a cross-sectional view showing another connection structure of the incident portion and the protection portion.
Fig. 5 is a main part oblique view showing a light guide of embodiment 2 of the present invention.
Fig. 6 is a principal part oblique view and a cross-sectional view showing a light guide according to embodiment 3 of the present invention.
Fig. 7 is a main part sectional view showing a light guide of embodiment 4 of the present invention.
Fig. 8 is a schematic view showing a light guide of a vehicle lamp.
Fig. 9 is a sectional view showing a conventional light guide holder.
Description of the reference numerals
1 vehicle lamp, 3 semiconductor light source, 11 light guide, 12 light guide, 13 incident portion, 16 protection portion, 21 heat dissipation cover, 23 fat portion, 24 curved surface, 26 wide downward swing cover, 26a with step reflection surface, 27 cylindrical cover, 27a reflection surface
Detailed Description
Embodiments of a light guide embodying the present invention as a vehicle lamp will be described below with reference to the drawings. As shown in fig. 8(a), the light guide 11 includes a light guide 12 formed of a transparent material into a rod shape. The light guide 12 has: an incident portion 13 for allowing light emitted from the semiconductor light source 3 to enter; an emission portion 14 that emits incident light to the front of the vehicle lamp 1; and a protection unit (not shown in fig. 8) that protects the incident unit 13 from heat generated by the semiconductor light source 3.
Next, the structure of the protection portion will be described in detail by referring to several examples. In fig. 1 to 8, the same or similar components are denoted by the same reference numerals.
[ example 1 ]
Fig. 1 to 4 show embodiment 1 of the present invention. As shown in fig. 1, the light guide 11 of example 1 has an incident portion 13 and a protection portion 16 having the same diameter on the longitudinal axis or optical axis a of the rod-shaped light guide 12. The protection portion 16 is located at the base end of the light guide 12, one end face of the protection portion 16 (the end face 15 of the light guide 12) faces the semiconductor light source 3, and the other end face 16a of the protection portion 16 is closely connected to the one end face 13a of the incident portion 13 (see fig. 2).
As shown in fig. 2(a) and (b), the incident portion 13 is molded of the same 1 st transparent material as the emission portion 14 (see fig. 8), and the protection portion 16 is molded of a 2 nd transparent material having a higher softening point than the 1 st transparent material. For example, as shown in fig. 2(a), PMMA (acrylic resin) or PC (polycarbonate resin) is used as the 1 st transparent material of the incident part 13, and glass is used as the 2 nd transparent material of the protection part 16. Alternatively, as shown in fig. 2(b), PMMA may be used as the 1 st transparent material, and PC may be used as the 2 nd transparent material. The incident portion 13 shown in fig. 2(c) is molded from a transparent thermoplastic resin such as PMMA or PC, and the protection portion 16 is molded from a transparent thermosetting resin such as Silicone (SI) or Epoxy (EP).
As shown in fig. 3a, the incident portion 13 and the protection portion 16 are connected by a transparent adhesive 17 at their respective end surfaces 13a and 16a (see fig. 1), or as shown in fig. 3 b, their respective peripheral surfaces may be connected by a coupler 18. Alternatively, the incident portion 13 and the protective portion 16 may be molded simultaneously by a two-color molding method as shown in fig. 4(a), or may be coupled by using a screw member 19 as shown in fig. 4 (b). In each of the above cases, the two members 13 and 16 are brought into close contact without optical axis displacement and without an air layer interposed between the end surfaces.
According to the light guide 11 of example 1 configured as described above, since the protection portion 16 is disposed on the proximal end side of the incident portion 13 and the protection portion 16 is molded from a transparent material having a higher softening point than the incident portion 13, it is not necessary to interpose another member for heat insulation between the light guide 12 and the semiconductor light source 3. Therefore, the end face 15 of the light guide 12 can be directly opposed to the semiconductor light source 3 at a position close to the semiconductor light source 3, and the light distribution angle θ (see fig. 2) can be appropriately covered with the end face 15, so that the light emitted from the semiconductor light source 3 can be distributed efficiently in front of the lamp. As shown in fig. 4, the protection unit 16 may be opposed to the plurality of semiconductor light sources 3.
[ example 2 ]
Fig. 5 shows embodiment 2 of the present invention. In the light guide 11, the end surface of the incident portion 13 is equal to the end surface 15 of the light guide 12, and the circumferential surface of the incident portion 13 is partially or entirely covered with the heat radiation cover 21. The heat radiation cover 21 is a protection part of the incident part 13, and for example, as shown in fig. 5(a), a sheet-like or film-like member made of CNT is wound around the incident part 13, or as shown in fig. 5(b), an aluminum cylindrical member is inserted into the incident part 13, or a metal deposition film is coated on the circumferential surface of the incident part 13, so that the incident part 13 is protected from heat generated by a semiconductor light source (not shown). Therefore, the light guide 11 according to embodiment 2 has an advantage that the light guide 12 can be molded inexpensively from one kind of transparent resin material over the entire length.
[ example 3 ]
Fig. 6 shows embodiment 3 of the present invention. In the light guide 11, an egg-shaped enlarged portion 23 is integrally formed at the base end of the light guide 12. The fertilizer portion 23 is an incident portion into which light from the semiconductor light source 3 is incident, and functions to increase the heat capacity of the incident portion. A curved surface 24 as a protective portion is recessed in an end surface of the enlarged portion 23 (end surface 15 of the light guide 12), and the transparent resin of the enlarged portion 23 is separated from the semiconductor light source 3 to protect the enlarged portion 23 from heat generated by the semiconductor light source 3. Therefore, the light guide 11 according to embodiment 3 has an advantage that thermal damage to the incident portion can be easily suppressed particularly by changing the shape of the base end portion of the light guide 12.
[ example 4 ]
Fig. 7 shows embodiment 4 of the present invention. In the light guide 11, covers 26 and 27 made of metal or heat-resistant resin as a protective portion are attached to the incident portion 13, and reflection surfaces 26a and 27a for reflecting light emitted from the semiconductor light source 3 toward the incident portion 13 are provided on the inner peripheries of the covers by aluminum vapor deposition. The lid 26 shown in fig. 7(a) is formed in a wide-skirt cylindrical shape, and has a stepped reflection surface 26a on the inner periphery. The cap 27 shown in fig. 7(b) is formed in a cylindrical shape, and has a flat reflecting surface 27a on the inner periphery. Therefore, the light guide 11 according to embodiment 4 has an advantage that, in particular, the end face 15 of the light guide 12 is separated from the semiconductor light source 3, and the covers 26 and 27 function as light collecting and heat radiating members, thereby effectively suppressing thermal damage to the incident portion 13.
The present invention is not limited to the above-described embodiments, and for example, the present invention can be implemented by combining the embodiment 1 shown in fig. 2 and the embodiment 2 shown in fig. 5, or by coating the heat dissipation cover 21 of the embodiment 2 on the fertilizer part 23 of the embodiment 3 shown in fig. 6, or the like, and by appropriately combining the embodiments 1 to 4, and the light guide of the present invention can be applied to various optical devices other than the vehicle lamp, and the shape and structure of each part can be appropriately modified without departing from the scope of the present invention.
Claims (6)
1. A light guide, characterized in that,
a light guide body molded from a transparent material is provided with: an incident portion for allowing light emitted from the semiconductor light source to be incident thereon; and a protection part for protecting the incident part from the heat generated by the semiconductor light source,
the protection portion includes a cylindrical cover attached to the incident portion, a reflecting surface is formed on an inner periphery of the cover, a part of the cover extends from an end surface of the incident portion toward the semiconductor light source, and light from the semiconductor light source is reflected toward the end surface of the incident portion directly opposed to the semiconductor light source by the reflecting surface formed on the inner periphery of the part of the cover,
the incident portion is molded by a 1 st transparent material, and the protection portion is molded by a 2 nd transparent material having a higher softening point than the 1 st transparent material.
2. The light guide according to claim 1,
the 1 st transparent material includes a synthetic resin, and the 2 nd transparent material includes glass.
3. The light guide according to claim 1,
the 1 st transparent material includes an acrylic resin, and the 2 nd transparent material includes a polycarbonate resin.
4. The light guide according to any one of claims 1 to 3,
the protection part includes a heat dissipation cover that covers the circumferential surface of the incident part.
5. The light guide according to any one of claims 1 to 3,
the incident portion includes a fat portion integrally formed at a base end of the light guide, and the protective portion includes a curved surface recessed in an end surface of the fat portion.
6. The light guide according to claim 4,
the incident portion includes a fat portion integrally formed at a base end of the light guide, and the protective portion includes a curved surface recessed in an end surface of the fat portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017113964A JP2018205651A (en) | 2017-06-09 | 2017-06-09 | Light guide with heat-resistant incoming part |
| JP2017-113964 | 2017-06-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109031504A CN109031504A (en) | 2018-12-18 |
| CN109031504B true CN109031504B (en) | 2021-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810554904.7A Active CN109031504B (en) | 2017-06-09 | 2018-06-01 | Light guide with heat resistant entry |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2018205651A (en) |
| CN (1) | CN109031504B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114901994A (en) * | 2020-01-22 | 2022-08-12 | 株式会社利富高 | LED lighting device |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2018205651A (en) | 2018-12-27 |
| CN109031504A (en) | 2018-12-18 |
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