CN103375707B - A kind of LED light source board structure of improvement and the LED light source containing this structure - Google Patents
A kind of LED light source board structure of improvement and the LED light source containing this structure Download PDFInfo
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- CN103375707B CN103375707B CN201210124734.1A CN201210124734A CN103375707B CN 103375707 B CN103375707 B CN 103375707B CN 201210124734 A CN201210124734 A CN 201210124734A CN 103375707 B CN103375707 B CN 103375707B
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Abstract
The present invention relates to a kind of LED light source board structure of improvement, it comprises: a lower surface has the circuit board of thin metal layer; One be arranged on the upper surface of this circuit board can solderability copper glue-line; One is formed at this can soldering-tin layer on solderability copper glue-line; One is arranged at this can LED luminescence component on solderability copper glue-line; One is close to the metallic heat dissipating part on the thin metal layer of this circuit board lower surface; And one deck is sprayed on the heat radiation coating of this metallic heat dissipating part lower surface; Wherein, this soldering-tin layer being formed at this can on solderability copper glue-line, and then this LED luminescence component being arranged at this can solderability copper glue-line, and fixes this LED luminescence component by this soldering-tin layer; This can conduct electricity to this LED luminescence component through this soldering-tin layer by solderability copper glue-line, luminous after making this LED luminescence component receive electric power, and is left by the heat produced during this LED luminescence component luminescence by this metallic heat dissipating part and heat radiation coating.LED light source of the present invention has that cost is low, structure is simple, security advantages of higher.
Description
Technical field
The present invention relates to a kind of light-emitting device, particularly relate to a kind of LDE light source that there is the low and LED light source board structure of excellent radiation performance of cost and manufactured by it.
Background technology
In recent years because the manufacturing technology of LED reaches its maturity, and LED has that power consumption is low, heating degree is low, long service life, startup speed fast, rich color and the good advantage of brightness, can save the power consumption of lighting in a large number.Also therefore, today that environmental protection ideas comes into one's own increasingly, LED replaces the main flow that conventional lamp becomes future market gradually.
Although LED has above-mentioned various advantages, but when LED is used in lighting use, LED lamp is formed with multiple LED modularity, required illumination is provided by modular LED lamp, and LED lamp also can produce heat energy while luminescence provides illumination, if its heat energy produced cannot effectively dissipation, get off for a long time and will affect the service life of LED lamp.
In existing LED heat dissipation technology, be all generally dispel the heat with ceramic heat sink or dispel the heat with aluminium fin; Wherein, the radiating fin of aluminum is installed in the surface of LED module by the radiating mode of aluminium fin, when LED module is luminous, by the radiating fin of aluminum, the heat that LED module produces is given dissipation.Although such radiating mode can distribute the heat that LED module produces, but the radiating fin of aluminum is except can dispelling the heat, also there is the function of conduction, therefore must carry out the work of insulation between LED module and radiating fin, occur to prevent situation about shocking by electricity.
And circuit is printed on ceramic heat sink with elargol by traditional ceramic heat sink, and sinter for a long time with the high temperature of more than 700 degree after having printed, circuit is solidified in ceramic heat sink.But such production method not only expends time in long, manufacture process also quite repeatedly, and the equipment used in manufacture process and energy cost all quite high.
Therefore, the problem produced for existing LED radiator and deficiency, design and a kind ofly can be badly in need of a problem solving at present by the lower and simple LED light source board structure of structure of quick heat radiating, cost.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of good heat dissipation effect, the LED light source board structure that cost is low, structure is simple, easy to make and the LED light source containing this structure.
Solving a kind of technical scheme that technical problem of the present invention adopts is: the LED light source board structure providing a kind of improvement, and it comprises:
One LED light source substrate radiator;
One be arranged on a surface of this LED light source substrate radiator can solderability copper glue-line;
One is formed at this can soldering-tin layer on solderability copper glue-line;
One is arranged at this can LED luminescence component on solderability copper glue-line; And
One deck is sprayed on the heat radiation coating on another surface of this LED light source substrate radiator;
Wherein, when this can attach after this LED light source substrate radiator by solderability copper glue-line, circuit is solidified to form via low temperature barbecue, and this soldering-tin layer being formed at this can on solderability copper glue-line, then this LED luminescence component being arranged at this can solderability copper glue-line, and fixes this LED luminescence component by this soldering-tin layer; This can conduct electricity to this LED luminescence component through this soldering-tin layer by solderability copper glue-line, luminous after making this LED luminescence component receive electric power, and is left by the heat produced during this LED luminescence component luminescence by this LED light source substrate radiator and heat radiation coating.
In the present invention, this heat radiation coating is the epoxy resin that surface distributed has nano particle.
In the present invention, the shape of this LED light source substrate radiator is square, circular or strip.
In the present invention, this can be formed at another surface of this LED light source substrate radiator by solderability copper glue-line with screen painting, steel plate printing, spraying, transfer modes.
In the present invention, this can solderability copper glue-line with can solderability copper cream or can solderability copper slurry substitute.
Solving the another kind of technical scheme that technical problem of the present invention adopts is: the LED light source board structure providing a kind of improvement, and it comprises:
A lower surface has the circuit board of thin metal layer;
One be arranged on the upper surface of this circuit board can solderability copper glue-line;
One is formed at this can soldering-tin layer on solderability copper glue-line;
One is arranged at this can LED luminescence component on solderability copper glue-line;
One is close to the metallic heat dissipating part on the thin metal layer of this circuit board lower surface; And
One deck is sprayed on the heat radiation coating of this metallic heat dissipating part lower surface;
Wherein, this soldering-tin layer being formed at this can on solderability copper glue-line, and then this LED luminescence component being arranged at this can solderability copper glue-line, and fixes this LED luminescence component by this soldering-tin layer; This can conduct electricity to this LED luminescence component through this soldering-tin layer by solderability copper glue-line, luminous after making this LED luminescence component receive electric power, and is left by the heat produced during this LED luminescence component luminescence by this metallic heat dissipating part and heat radiation coating.
In the present invention, this heat radiation coating is the epoxy resin that surface distributed has nano particle.
In the present invention, this metallic heat dissipating part is made up of the sheet metal that two-layer material is different.
In the present invention, the shape of this metallic heat dissipating part is square, circular or strip.
Solving another technical scheme that technical problem of the present invention adopts is: provide a kind of LED light source, it comprises lamp housing, base, also comprise the LED light source board structure according to above-mentioned a kind of improvement, described lamp housing covers described LED light source board structure, described LED light source board structure arranges in described base, and described LED light source board structure is electrically connected with described base by wire.
Compared with prior art, LED light source board structure of the present invention and LED light source have good heat dissipation effect, and cost is low, structure is simple, save material, owing to not needing larger metal heat sink to make, weight and volume reduces, security also higher, not easily breaking out of fire, not easily electric leakage and meet the advantages such as international standard.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the stereogram of LED light source board structure first embodiment of a kind of improvement of the present invention;
Fig. 2 is the sectional view of Fig. 1;
Fig. 3 is the stereogram of LED light source board structure second embodiment of a kind of improvement of the present invention;
Fig. 4 is the sectional view of Fig. 3;
Fig. 5 is the stereogram of LED light source board structure the 3rd embodiment of a kind of improvement of the present invention;
Fig. 6 is the front view of the LED light source of the preparation of LED light source board structure according to a modification of the present invention;
Fig. 7 is the epoxy resin of the first painting method in the present invention and the schematic diagram of nano particle after mixing;
Fig. 8 is the sectional view of the LED light source substrate radiator in first embodiment of the invention;
Fig. 9 is the epoxy resin of the second painting method in the present invention and the schematic diagram of nano particle after mixing;
Figure 10 is the enlarged diagram that the nanoscale inertia bubble in the present invention is attached to around nano particle;
Figure 11 is the sectional view of the LED light source substrate radiator in first embodiment of the invention.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
As shown in Figures 1 and 2, Fig. 1 and Fig. 2 shows the first embodiment of the LED light source board structure of a kind of improvement of the present invention, and it comprises: a LED light source substrate radiator 10 (this substrate radiator is not only used as substrate but also be used as radiator); One be arranged on this LED light source substrate radiator 10 1 surface (upper surface) can solderability copper glue-line 20; One is formed at this can soldering-tin layer 30 on solderability copper glue-line 20; Being arranged at this can LED luminescence component 40 on solderability copper glue-line 20; And one deck is sprayed on the heat radiation coating 50 on another surface (lower surface) of this LED light source substrate radiator 10.This heat radiation coating is the liquid state of heat conduction or solid-state heat radiation coating.The shape of this LED light source substrate radiator 10 is square, circular or strip, and its material is the metal material that the thermal diffusivities such as copper, aluminium or albronze are good, chooses according to actual needs.This can solderability copper glue-line 20 be the surfaces being formed at this LED light source substrate radiator 10 with screen painting, steel plate printing, spraying, transfer modes.This can solderability copper glue-line 20 with can solderability copper cream or can solderability copper slurry substitute.In order to prevent electric leakage, can insulating materials between solderability copper glue-line 20 and this LED light source substrate radiator 10 at this, this can the outer surface of solderability copper glue-line 20 and this outer surface of LED light source substrate radiator 10 at solderability copper glue-line 20 place can be provided with insulating materials (as spray insulated paint) equally.
When this can attach after this LED light source substrate radiator 10 by solderability copper glue-line 20, circuit is solidified to form via low temperature barbecue, in the present first embodiment, the optimum temperature of this barbecue solidification is 100 DEG C to 200 DEG C, and this soldering-tin layer 30 being formed at this can on solderability copper glue-line 20, then this LED luminescence component 40 being arranged at this can solderability copper glue-line 20, and fixes this LED luminescence component 40 by this soldering-tin layer 30; Wherein, this can conduct electricity to this LED luminescence component 40 through this soldering-tin layer 30 by solderability copper glue-line 20, luminous after making this LED luminescence component 40 receive electric power, and by this LED light source substrate radiator 10 and heat radiation coating 50, the heat produced during this LED luminescence component 40 luminescence is left.
As shown in Figures 3 and 4, Fig. 3 and Fig. 4 shows the second embodiment of the LED light source board structure of a kind of improvement of the present invention, and it comprises: a lower surface is provided with the LED light source circuit board 210 (pcb board) of thin metal layer; One be arranged on this LED light source circuit board 210 upper surface can solderability copper glue-line 220; One is formed at this can soldering-tin layer 230 on solderability copper glue-line 220; Being arranged at this can LED luminescence component 240 on solderability copper glue-line 220; One is close to the heat radiation coating 250 that metallic heat dissipating part 260 on the thin metal layer of this LED light source circuit board 10 lower surface and one deck are sprayed on this metallic heat dissipating part 260 lower surface.This heat radiation coating is the liquid state of heat conduction or solid-state heat radiation coating.The shape of this metallic heat dissipating part 260 and circuit board 210 is square, circular or strip, and the material of this metallic heat dissipating part 260 is the metal material that the thermal diffusivities such as copper, aluminium or albronze are good, chooses according to actual needs.This can solderability copper glue-line 20 with can solderability copper cream or can solderability copper slurry substitute.In order to prevent electric leakage, insulating materials can be provided with between solderability copper glue-line 220 and this circuit board 210 at this, this can the outer surface of solderability copper glue-line 220 and this outer surface of circuit board 210 at solderability copper glue-line 220 place can be provided with insulating materials (as spray insulated paint) equally.
As shown in Figure 5, Fig. 5 shows the 3rd embodiment of the LED light source board structure of a kind of improvement of the present invention, the difference of the 3rd embodiment and the second embodiment is: between this metallic heat dissipating part 260, increase layer of metal fin 360, and this heat radiation coating 250 is sprayed on this metal fin 360 lower surface.This metal fin 360 is corresponding with this metallic heat dissipating part 260 shape.The material of this metal fin 360 is identical from the material of this metallic heat dissipating part 260 or different, chooses according to actual needs.In like manner, for the first embodiment, LED light source substrate radiator 10 also can be made up of two-layer different metal level.
As shown in Figure 6, a kind of LED light source is produced according to the LED light source board structure of above-mentioned improvement.The LED light source board structure of this improvement is arranged in transparent or translucent spherical lamp housing 60, is connected to base 80 by the wire 70 connecting LED luminescence component.The material of this base 80 is that plastics, metal material or plastics and metal material combine.This LED light source structure is simple, save material, cost is low, owing to not needing larger metal heat sink to make, weight and volume reduces, security also higher, not easily breaking out of fire, not easily electric leakage and meet international standard.
See Fig. 7 and Fig. 8, present invention also offers a kind of method that surface at tool bossed LED light source substrate radiator 10 (or metallic heat dissipating part 210 or metal fin 360) forms one deck heat radiation coating, first it comprise the steps:, as shown in Figure 7 and Figure 8, by nano particle 18 and epoxy resin 16 fully mix and blend, add the associated materials that can carry out electrostatic painting process simultaneously, and stir after repeatedly hot melt, plastotype forms uniform heat radiation coating, this nano particle 18 is selected from carborundum, boron nitride, aluminium nitride, aluminium oxide, one or more of titanium dioxide or carbon, again, this heat radiation coating is coated in the surface of this LED light source substrate radiator 10 (or metallic heat dissipating part 210 or metal fin 360), and put into heating furnace or baking box and be heated to 180 DEG C ~ 220 DEG C and keep 20 ~ 30 minutes, the first half section epoxy resin of baking period has heat fusing phenomenon, there is the nano particle of high-heating radiation because floating on the outermost layer of epoxy resin after proportion change, the second half section epoxy resin of baking period has solidification phenomenon, the outermost nano particle with high-heating radiation now floating on epoxy resin then can not deposition in epoxy inner, as long as epoxy skins is without destruction aging phenomenon, then can possess thermolysis for a long time, this technique is called high hot melt coating process, after cooling, nano particle is formed in the surface of this epoxy resin.
Further, in order to increase area of dissipation, multiple projection can be provided with on the surface of this LED light source substrate radiator 10 (or metallic heat dissipating part 210 or metal fin 360).
Refer to Fig. 9 to Figure 11, present invention also offers the method that the another kind of surface at tool bossed LED light source substrate radiator 10 (or metallic heat dissipating part 210 or metal fin 360) forms one deck heat radiation coating, first it comprise the steps:, as shown in Figure 9, by nano particle 18 and liquid-state epoxy resin 16 fully mix and blend, add the material such as suspending agent, dispersant simultaneously, after repeatedly stirring, can be made into the heat radiation coating of liquid spraying coating process.This can be avoided nano particle to produce nanometer agglomeration, therefore can preserve for a long time after sealed cans again.When this heat radiation coating sprays, be limited by the material behaviors such as suspending agent, even if with high-temperature baking, nano particle still has no idea to be suspended in the top layer of fin totally, therefore to produce and possess heat radiation usefulness fin, nanoscale inertia bubble 22 must be injected (as nitrogen in this heat radiation coating with nano bubble machine, air etc.), nanoscale inertia bubble 22 is attached to be had on the nano particle of radiating effect, thus, by the buoyancy of nanoscale inertia bubble, nano particle floated in spraying simultaneously or be suspended in the outermost layer of fin, as long as epoxy skins is without destruction aging phenomenon, then can possess heat radiation usefulness for a long time, this technique is called nano bubble suspension method.
This dispersant mainly lipophilic group and hydrophilic group composition surfactant, as LCFA, softex kw (CTAB) etc.; The inorganic electrolyte of small-molecular-weight or inorganic polymer, as sodium metasilicate, calgon etc.; The polymer of macromolecule and polyelectrolyte, as gelatin, carboxymethyl cellulose, poly-methyl acrylate, PEI etc.Adding of dispersant wants appropriate, and unsuitable excessive and not enough, no person can cause flocculation.This suspending agent is selected from the suspending agent of existing nano particle.
The flat-shaped substrate radiator 10 (or metallic heat dissipating part 210 or metal fin 360) possessing the nano particle of radiating effect possesses certain heat dissipation, but want to promote more heat radiation usefulness, then must change the shape of substrate radiator 10 (or metallic heat dissipating part 210 or metal fin 360).Therefore on flat-shaped substrate radiator 10 (or metallic heat dissipating part 210 or metal fin 360), be also provided with projection, with increasing heat radiation area, these projections can form square, circular and oval shape.Further, suitably the projection of height can promote heat radiation usefulness, and can reduce the interference of heat radiation straight line, under thermal shock minimum state, can produce the highest heat-radiation heat-dissipating usefulness.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. the LED light source board structure improved, it is characterized in that, it comprises:
One surperficial tool bossed LED light source substrate radiator;
One be arranged on a surface of this LED light source substrate radiator can solderability copper glue-line;
One is formed at this can soldering-tin layer on solderability copper glue-line;
One is arranged at this can LED luminescence component on solderability copper glue-line; And
One deck is sprayed on the heat radiation coating on another surface of this LED light source substrate radiator, and described heat radiation coating is the epoxy resin that surface distributed has nano particle;
Wherein, when this can attach after this LED light source substrate radiator by solderability copper glue-line, circuit is solidified to form via low temperature barbecue, and this soldering-tin layer being formed at this can on solderability copper glue-line, then this LED luminescence component being arranged at this can solderability copper glue-line, and fixes this LED luminescence component by this soldering-tin layer; This can conduct electricity to this LED luminescence component through this soldering-tin layer by solderability copper glue-line, luminous after making this LED luminescence component receive electric power, and is left by the heat produced during this LED luminescence component luminescence by this LED light source substrate radiator and heat radiation coating.
2. the LED light source board structure of a kind of improvement as claimed in claim 1, is characterized in that: the shape of this LED light source substrate radiator is square, circular or strip.
3. the LED light source board structure of a kind of improvement as claimed in claim 1, is characterized in that: this can be formed at the surface of this LED light source substrate radiator by solderability copper glue-line with screen painting, steel plate printing, spraying, transfer modes.
4. the LED light source board structure of a kind of improvement as claimed in claim 1, is characterized in that: this can solderability copper glue-line with can solderability copper cream or can solderability copper slurry substitute.
5. the LED light source board structure improved, it is characterized in that, it comprises:
A lower surface has the circuit board of thin metal layer;
One be arranged on the upper surface of this circuit board can solderability copper glue-line;
One is formed at this can soldering-tin layer on solderability copper glue-line;
One is arranged at this can LED luminescence component on solderability copper glue-line;
One is close to the metallic heat dissipating part on the thin metal layer of this circuit board lower surface; And
One deck is sprayed on the heat radiation coating of this metallic heat dissipating part lower surface, and described heat radiation coating is the epoxy resin that surface distributed has nano particle;
Wherein, this soldering-tin layer being formed at this can on solderability copper glue-line, and then this LED luminescence component being arranged at this can solderability copper glue-line, and fixes this LED luminescence component by this soldering-tin layer; This can conduct electricity to this LED luminescence component through this soldering-tin layer by solderability copper glue-line, luminous after making this LED luminescence component receive electric power, and is left by the heat produced during this LED luminescence component luminescence by this metallic heat dissipating part and heat radiation coating.
6. the LED light source board structure of a kind of improvement as claimed in claim 5, is characterized in that: this metallic heat dissipating part is made up of the sheet metal that two-layer material is different.
7. the LED light source board structure of a kind of improvement as claimed in claim 5, is characterized in that: the shape of this metallic heat dissipating part is square, circular or strip.
8. a LED light source, it comprises lamp housing, base, it is characterized in that, also comprise the LED light source board structure according to a kind of improvement as described in claim 1-7 any one, described lamp housing covers described LED light source board structure, described LED light source board structure arranges in described base, and described LED light source board structure is electrically connected with described base by wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210124734.1A CN103375707B (en) | 2012-04-25 | 2012-04-25 | A kind of LED light source board structure of improvement and the LED light source containing this structure |
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| CN201210124734.1A CN103375707B (en) | 2012-04-25 | 2012-04-25 | A kind of LED light source board structure of improvement and the LED light source containing this structure |
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| CN103375707A CN103375707A (en) | 2013-10-30 |
| CN103375707B true CN103375707B (en) | 2016-03-02 |
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| CN105528969B (en) | 2016-03-03 | 2019-03-15 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display device |
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| US20090008671A1 (en) * | 2007-07-06 | 2009-01-08 | Lustrous Technology Ltd. | LED packaging structure with aluminum board and an LED lamp with said LED packaging structure |
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| CN101075590A (en) * | 2006-05-17 | 2007-11-21 | 台湾积体电路制造股份有限公司 | Package component |
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| CN201428972Y (en) * | 2009-07-12 | 2010-03-24 | 王学邦 | Light-emitting diode lamp cluster |
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Inventor after: Liu Jingsong Inventor after: Liang Yifan Inventor before: Liang Yifan |
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Address after: 27D, Sea View Plaza, No. 18 Taizi Road, Shekou, Nanshan District, Shenzhen City, Guangdong Province, 518067 Patentee after: Aixin Environmental Protection Materials (Shenzhen) Co.,Ltd. Address before: 27D, Sea View Plaza, No. 18 Taizi Road, Shekou, Nanshan District, Shenzhen City, Guangdong Province, 518067 Patentee before: PROVENCE TECHNOLOGY (SHENZHEN) Co.,Ltd. |