CN202736979U - Improved LED light source substrate structure and LED light source comprising same - Google Patents
Improved LED light source substrate structure and LED light source comprising same Download PDFInfo
- Publication number
- CN202736979U CN202736979U CN2012202506921U CN201220250692U CN202736979U CN 202736979 U CN202736979 U CN 202736979U CN 2012202506921 U CN2012202506921 U CN 2012202506921U CN 201220250692 U CN201220250692 U CN 201220250692U CN 202736979 U CN202736979 U CN 202736979U
- Authority
- CN
- China
- Prior art keywords
- light source
- led light
- board structure
- solderability
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to an improved LED light source substrate structure. The substrate structure comprises the following components of: an LED light source substrate heat dissipation body; a tin-weldable copper adhesive layer arranged on one surface of the LED light source substrate heat dissipation body; a tin-welded layer formed on the tin-weldable copper adhesive layer; an LED light-emitting assembly arranged on the tin-weldable copper adhesive layer; a heat dissipation coating sprayed on the other surface of the LED light source substrate heat dissipation body; and through holes penetrating the LED light source substrate structure. Current can be conducted to the LED light-emitting assembly from the tin-weldable copper adhesive layer through the tin-welded layer; heat produced when the LED light-emitting assembly emits light can be dissipated through the LED light source substrate heat dissipation body and the heat dissipation coating; and the light emitted by the LED light-emitting assembly penetrates the through holes through reflecting. The improved LED light source substrate structure provided by the utility model has the advantages of low cost, simple structure and high security.
Description
Technical field
The utility model relates to a kind of light-emitting device, relates in particular to a kind of led light source board structure with the low and excellent radiation performance of cost and by the LDE light source of its manufacturing.
Background technology
In recent years since the manufacturing technology of LED lamp reach its maturity, and LED has that power consumption is low, heating degree is low, long service life, startup speed soon, rich color and the good advantage of brightness, can save in a large number the power consumption of lighting.Also therefore, today that environmental protection ideas comes into one's own increasingly, LED replaces the main flow that conventional lamp becomes the future market gradually.
Although LED has above-mentioned various advantages, but when LED is used in lighting use, form the LED light fixture with a plurality of LED lamp modularities, provide required illumination by modular LED light fixture, and the LED light fixture also can produce heat energy luminous when illumination is provided, if its effectively dissipation of heat energy that produces, getting off for a long time to affect the useful life of LED light fixture.
In existing LED heat dissipation technology, generally all be to dispel the heat with the ceramic heat sink heat radiation or with aluminium fin; Wherein, the radiating mode of aluminium fin is installed in the surface of LED module with the radiating fin of aluminum, when the LED module is luminous, by the radiating fin of aluminum the heat that the LED module produces is given dissipation.Although such radiating mode can distribute the heat that the LED module produces, but the radiating fin of aluminum is except can dispelling the heat, therefore the function that also has conduction must carry out the work of insulation between LED module and radiating fin, occur with the situation that prevents from shocking by electricity.
And traditional ceramic heat sink is printed on ceramic heat sink with elargol with circuit, and after printing is finished with 700 the degree more than the long-time sintering of high temperature, circuit is solidified in ceramic heat sink.Yet such production method not only expends time in long, manufacture process also quite repeatedly, and employed equipment and energy cost are all quite high in the manufacture process.
Therefore, for problem and the deficiency that existing LED radiator produces, design a kind of can quick heat radiating, a cost led light source board structure lower and simple in structure problem being badly in need of at present solving.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of good heat dissipation effect, the led light source board structure that cost is low, simple in structure, easy to make and contain the led light source of this structure.
Solving a kind of technical scheme that technical problem of the present utility model adopts is: a kind of improved led light source board structure is provided, and it comprises: a led light source substrate radiator; But one is arranged on the solderability copper glue-line on a surface of this led light source substrate radiator; But one is formed at the soldering-tin layer on this solderability copper glue-line; But one is arranged at the LED luminescence component on this solderability copper glue-line, this led light source board structure comprises that also one deck is sprayed on another surperficial heat radiation coating of this led light source substrate radiator, and at least one runs through the through hole that is arranged on this led light source board structure; Wherein, but when pasting, pays behind this led light source substrate radiator this solderability copper glue-line, be solidified to form circuit via the low temperature barbecue, and but this soldering-tin layer is formed on this solderability copper glue-line, but then this LED luminescence component is arranged at this solderability copper glue-line, and fixes this LED luminescence component by this soldering-tin layer; But should see through this soldering-tin layer conduction to this LED luminescence component by solderability copper glue-line, it is luminous that this LED luminescence component is received behind electric power, and the heat that produces when by this led light source substrate radiator and heat radiation coating that this LED luminescence component is luminous leaves, and the light that this LED luminescence component sends is by reflecting through this through hole.
In the utility model, this heat radiation coating is the epoxy resin that surface distributed has nano particle.
In the utility model, being shaped as of this led light source substrate radiator is square, circle or strip.
In the utility model, this through hole is circular, square, ellipse or regular polygon.
Solving the another kind of technical scheme that technical problem of the present utility model adopts is: a kind of improved led light source board structure is provided, and it comprises: a lower surface has the circuit board of thin metal layer; But one is arranged on the solderability copper glue-line of the upper surface of this circuit board; But one is formed at the soldering-tin layer on this solderability copper glue-line; But one is arranged at the LED luminescence component on this solderability copper glue-line; One is close to the metallic heat dissipating part on the thin metal layer of this circuit board lower surface; This led light source board structure comprises that also one deck is sprayed on the heat radiation coating of this metallic heat dissipating part lower surface, and at least one runs through the through hole that is arranged on this led light source board structure; Wherein, but this soldering-tin layer is formed on this solderability copper glue-line, but then this LED luminescence component is arranged at this solderability copper glue-line, and fix this LED luminescence component by this soldering-tin layer; But should see through this soldering-tin layer conduction to this LED luminescence component by solderability copper glue-line, it is luminous that this LED luminescence component is received behind electric power, and the heat that produces when by this metallic heat dissipating part and heat radiation coating that this LED luminescence component is luminous leaves, and the light that this LED luminescence component sends is by reflecting through this through hole.
In the utility model, this through hole is circular, square, ellipse or regular polygon.
In the utility model, this heat radiation coating is the epoxy resin that surface distributed has nano particle.
In the utility model, this metallic heat dissipating part is made of the different sheet metal of two-layer material.
In the utility model, being shaped as of this metallic heat dissipating part is square, circle or strip.
Solving another technical scheme that technical problem of the present utility model adopts is: a kind of led light source is provided, it comprises lamp housing, base, it also comprises according to above-mentioned improved led light source board structure, this lamp housing covers this led light source board structure, this led light source board structure arranges in this base, and this led light source board structure is electrically connected with this base by wire.
Compared with prior art, led light source board structure of the present utility model and led light source have good heat dissipation effect, cost is low, simple in structure, save material, because do not need larger metal heat sink so that weight and volume reduces, fail safe also higher, be difficult for breaking out of fire, be difficult for electric leakage and meet the advantage such as international standard; And owing to be provided with through hole at the led light source board structure, the light that this LED luminescence component sends sees through this through hole so that the back side of this led light source board structure is illuminated, thereby so that this led light source all is illuminated arbitrarily angled, thereby make this led light source more attractive in appearance.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the stereogram of a kind of improved led light source board structure the first execution mode of the utility model;
Fig. 2 is the sectional view of Fig. 1;
Fig. 3 is the stereogram of a kind of improved led light source board structure the second execution mode of the utility model;
Fig. 4 is the sectional view of Fig. 3;
Fig. 5 is the stereogram of a kind of improved led light source board structure the 3rd execution mode of the utility model;
Fig. 6 is the front view according to a kind of led light source of the preparation of improved led light source board structure of the present utility model;
Fig. 7 is the sectional view according to the another kind of led light source of the preparation of improved led light source board structure of the present utility model;
Fig. 8 is the sectional view according to another led light source of the preparation of improved led light source board structure of the present utility model;
Fig. 9 is epoxy resin and the schematic diagram of nano particle after mixing of the first painting method in the utility model;
Figure 10 is the sectional view of the led light source substrate radiator in the utility model the first execution mode;
Figure 11 is epoxy resin and the schematic diagram of nano particle after mixing of the second painting method in the utility model;
Figure 12 is that the nanoscale inertia bubble in the utility model is attached to nano particle enlarged diagram on every side;
Figure 13 is the sectional view of the led light source substrate radiator in the utility model the first execution mode.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
As shown in Figures 1 and 2, Fig. 1 and Fig. 2 have shown the first execution mode of a kind of improved led light source board structure of the utility model, and it comprises: this substrate radiator of led light source substrate radiator 10(not only is used as substrate but also be used as radiator); One be arranged on these led light source substrate radiator 10 1 surfaces (upper surface) but solderability copper glue-line 20; But one is formed at the soldering-tin layer 30 on this solderability copper glue-line 20; But be arranged at the LED luminescence component 40 on this solderability copper glue-line 20; And one deck is sprayed on the heat radiation coating 50 on another surface (lower surface) of this led light source substrate radiator 10.Also be provided with one, two or surpass two through holes 19 that run through this led light source board structure on this led light source board structure.Being shaped as of this through hole 19 is circular, square, ellipse or regular polygon.
But when pasting, pays behind this led light source substrate radiator 10 this solderability copper glue-line 20, be solidified to form circuit via the low temperature barbecue, in this first execution mode, the optimum temperature that this barbecue solidifies is 100 ℃ to 200 ℃, and but this soldering-tin layer 30 is formed on this solderability copper glue-line 20, but then this LED luminescence component 40 is arranged at this solderability copper glue-line 20, and fixes this LED luminescence component 40 by this soldering-tin layer 30; Wherein, but should see through these soldering-tin layer 30 conductions to this LED luminescence component 40 by solderability copper glue-line 20, it is luminous that this LED luminescence component 40 is received behind electric power, and the heat that produces when by this led light source substrate radiator 10 and heat radiation coating 50 that this LED luminescence component 40 is luminous leaves.The light that this LED luminescence component 40 sends is by reflecting through this through hole 19 so that the back side of this led light source board structure is illuminated, thereby so that this led light source all be illuminated arbitrarily angled, thereby make this led light source more attractive in appearance.
This heat radiation coating is the liquid or solid-state heat radiation coating of heat conduction.Being shaped as of this led light source substrate radiator 10 is square, circle or strip, and its material is the good metal materials of thermal diffusivity such as copper, aluminium or albronze, chooses according to actual needs.But should solderability copper glue-line 20 be the surfaces that are formed at this led light source substrate radiator 10 with screen painting, steel plate printing, spraying, transfer printing mode.But but but these solderability copper glue-line 20 usefulness solderability copper cream or solderability copper slurry substitute.In order to prevent electric leakage, but insulating material between this solderability copper glue-line 20 and this led light source substrate radiator 10, but but be provided with equally insulating material (such as spray insulating varnish) at the outer surface of the outer surface of this solderability copper glue-line 20 and led light source substrate radiator 10 that should solderability copper glue-line 20 places.
As shown in Figures 3 and 4, Fig. 3 and Fig. 4 have shown the second execution mode of a kind of improved led light source board structure of the utility model, and it comprises: a lower surface is provided with the led light source circuit board 210(PCB plate of thin metal layer); But one is arranged on the solderability copper glue-line 220 of these led light source circuit board 210 upper surfaces; But one is formed at the soldering-tin layer 230 on this solderability copper glue-line 220; But be arranged at the LED luminescence component 240 on this solderability copper glue-line 220; One is close to the heat radiation coating 250 that metallic heat dissipating part 260 on the thin metal layer of these led light source circuit board 10 lower surfaces and one deck are sprayed on these metallic heat dissipating part 260 lower surfaces.Also be provided with one, two or surpass two through holes 219 that run through this led light source board structure on this led light source board structure.This heat radiation coating is the liquid or solid-state heat radiation coating of heat conduction.Being shaped as of this metallic heat dissipating part 260 and circuit board 210 is square, circle or strip, and the material of this metallic heat dissipating part 260 is the good metal materials of thermal diffusivity such as copper, aluminium or albronze, chooses according to actual needs.But but but these solderability copper glue-line 20 usefulness solderability copper cream or solderability copper slurry substitute.In order to prevent electric leakage, but between this solderability copper glue-line 220 and this circuit board 210, be provided with insulating material, but but be provided with equally insulating material (such as spray insulating varnish) at the outer surface of the outer surface of this solderability copper glue-line 220 and circuit board 210 that should solderability copper glue-line 220 places.
As shown in Figure 5, Fig. 5 has shown the 3rd execution mode of a kind of improved led light source board structure of the utility model, the difference of the 3rd execution mode and the second execution mode is: increase layer of metal fin 360 between this metallic heat dissipating part 260, this heat radiation coating 250 is sprayed on this metal fin 360 lower surfaces.This metal fin 360 is corresponding with these metallic heat dissipating part 260 shapes.The material of this metal fin 360 is identical or different from the material of this metallic heat dissipating part 260, chooses according to actual needs.In like manner, for the first execution mode, led light source substrate radiator 10 also can be made of two-layer different metal level.
As shown in Figure 6, produce a kind of led light source (ball alveolitoid) according to above-mentioned improved led light source board structure.This improved led light source board structure is arranged in the transparent or translucent spherical lamp housing 60, is connected to base 80 by the wire 70 that connects the LED luminescence component.The material of this base 80 is that plastics, metal material or plastics and metal material combine, and the upper part 81 of this base 80 generally is to make with transparent or translucent material.This led light source is simple in structure, save material, cost is low, because do not need larger metal heat sink so that weight and volume reduces, fail safe also higher, be difficult for breaking out of fire, be difficult for electric leakage and meet international standard.Shown in the band arrow dotted line among Fig. 6, the light that this LED luminescence component sends by reflecting through through hole so that the back side of this led light source board structure be illuminated, thereby so that this led light source all is illuminated arbitrarily angled, thereby make the brightness of this led light source better, appearance is more attractive in appearance.
Similar with the led light source of a kind of ball alveolitoid among Fig. 6, Fig. 7 and Fig. 8 are the sectional views according to other two kinds of led light sources (fluorescent lamp cast) of the preparation of improved led light source board structure of the present utility model.Shown in the band arrow dotted line among Fig. 7 and Fig. 8, the light that this LED luminescence component sends by reflecting through these through holes so that the back side of this led light source board structure be illuminated, thereby so that this led light source all is illuminated arbitrarily angled, thereby make the brightness of this led light source better, appearance is more attractive in appearance.
Referring to Fig. 9 and Figure 10, it is a kind of at the bossed led light source substrate of tool radiator 10(or metallic heat dissipating part 210 or metal fin 360 that the utility model also provides) the surface form the method for one deck heat radiation coating, it comprises the steps: at first, as shown in Figure 9 and Figure 10, with nano particle 18 and epoxy resin 16 abundant mix and blends, add simultaneously the associated materials that can carry out electrostatic painting process, and repeatedly stirring behind the hot melt, plastotype forms uniform heat radiation coating, and this nano particle 18 is selected from carborundum, boron nitride, aluminium nitride, aluminium oxide, one or more of titanium dioxide or carbon; Again, this heat radiation coating is coated in this led light source substrate radiator 10(or metallic heat dissipating part 210 or metal fin 360) the surface, and put into heating furnace or baking box and be heated to 180 ℃ ~ 220 ℃ and kept 20 ~ 30 minutes, the first half section epoxy resin of baking period has the heat fusing phenomenon, nano particle with high-heating radiation floats on the outermost layer of epoxy resin after changing because of proportion, the second half section epoxy resin of baking period has the curing phenomenon, it is inner in epoxy resin that the outermost nano particle with high-heating radiation that floats on epoxy resin this moment then can deposition, as long as epoxy skins is without destroying aging phenomenon, then can possess for a long time thermolysis, this technique is called high hot melt coating process; Nano particle is formed on the surface of this epoxy resin after the cooling.
Be appreciated that as further improvement of the utility model, in order to increase area of dissipation, can be at this led light source substrate radiator 10(or metallic heat dissipating part 210 or metal fin 360) the surface be provided with a plurality of projections.
See also Figure 11 to Figure 13, it is another kind of at the bossed led light source substrate of tool radiator 10(or metallic heat dissipating part 210 or metal fin 360 that the utility model also provides) the surface form the method for one deck heat radiation coating, it comprises the steps: at first, as shown in figure 11, with nano particle 18 and liquid-state epoxy resin 16 abundant mix and blends, add simultaneously the materials such as suspending agent, dispersant, can be made into the heat radiation coating of liquid spraying coating process after repeatedly stirring.This can be avoided nano particle to produce the nanometer agglomeration, but therefore long preservation after the sealed cans again.When this heat radiation coating sprays; be limited by the material behaviors such as suspending agent; even if with high-temperature baking; nano particle still have no idea totally the to be suspended in top layer of fin; therefore to produce and possess thermal radiation usefulness fin; must in this heat radiation coating, inject nanoscale inertia bubble 22 (such as nitrogen with the nano bubble machine; air etc.); nanoscale inertia bubble 22 is attached on the nano particle with radiating effect; thereby; buoyancy by nanoscale inertia bubble makes the nano particle come-up or is suspended in the outermost layer of fin simultaneously in spraying; as long as epoxy skins is without destroying aging phenomenon; then can possess for a long time thermal radiation usefulness, this technique is called the nano bubble suspension method.
This dispersant mainly is the surfactant that lipophilic group and hydrophilic group form, such as LCFA, softex kw (CTAB) etc.; The inorganic electrolyte of small-molecular weight or inorganic polymer are such as sodium metasilicate, calgon etc.; The polymer of macromolecule and polyelectrolyte are such as gelatin, carboxymethyl cellulose, poly-methyl acrylate, PEI etc.It is an amount of that the adding of dispersant is wanted, and unsuitable excessive and not enough, no person can cause flocculation.This suspending agent is selected from the suspending agent of existing nano particle.
The flat-shaped substrate radiator 10(or metallic heat dissipating part 210 or the metal fin 360 that possess the nano particle of radiating effect) possessed certain heat dissipation, but want to promote more thermal radiation usefulness, then must change substrate radiator 10(or metallic heat dissipating part 210 or metal fin 360) shape.Therefore at flat-shaped substrate radiator 10(or metallic heat dissipating part 210 or metal fin 360) on also be provided with projection, with increasing heat radiation area, square, circular and oval shape that these projections can form.And suitably the projection of height can promote thermal radiation usefulness, and can reduce the thermal radiation straight line and disturb, and under the thermal shock minimum state, can produce the highest heat-radiation heat-dissipating usefulness.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (10)
1. improved led light source board structure, it comprises: a led light source substrate radiator; But one is arranged on the solderability copper glue-line on a surface of this led light source substrate radiator; But one is formed at the soldering-tin layer on this solderability copper glue-line; But one is arranged at the LED luminescence component on this solderability copper glue-line, it is characterized in that, this led light source board structure comprises that also one deck is sprayed on another surperficial heat radiation coating of this led light source substrate radiator, and at least one runs through the through hole that is arranged on this led light source board structure;
Wherein, but when pasting, pays behind this led light source substrate radiator this solderability copper glue-line, be solidified to form circuit via the low temperature barbecue, and but this soldering-tin layer is formed on this solderability copper glue-line, but then this LED luminescence component is arranged at this solderability copper glue-line, and fixes this LED luminescence component by this soldering-tin layer; But should see through this soldering-tin layer conduction to this LED luminescence component by solderability copper glue-line, it is luminous that this LED luminescence component is received behind electric power, and the heat that produces when by this led light source substrate radiator and heat radiation coating that this LED luminescence component is luminous leaves, and the light that this LED luminescence component sends is by reflecting through this through hole.
2. a kind of improved led light source board structure as claimed in claim 1, it is characterized in that: this heat radiation coating is the epoxy resin that surface distributed has nano particle.
3. a kind of improved led light source board structure as claimed in claim 1 is characterized in that: being shaped as of this led light source substrate radiator is square, circle or strip.
4. a kind of improved led light source board structure as claimed in claim 1 is characterized in that: this through hole is circular, square, ellipse or regular polygon.
5. improved led light source board structure, it comprises: a lower surface has the circuit board of thin metal layer; But one is arranged on the solderability copper glue-line of the upper surface of this circuit board; But one is formed at the soldering-tin layer on this solderability copper glue-line; But one is arranged at the LED luminescence component on this solderability copper glue-line; One is close to the metallic heat dissipating part on the thin metal layer of this circuit board lower surface; It is characterized in that this led light source board structure comprises that also one deck is sprayed on the heat radiation coating of this metallic heat dissipating part lower surface, and at least one runs through the through hole that is arranged on this led light source board structure;
Wherein, but this soldering-tin layer is formed on this solderability copper glue-line, but then this LED luminescence component is arranged at this solderability copper glue-line, and fix this LED luminescence component by this soldering-tin layer; But should see through this soldering-tin layer conduction to this LED luminescence component by solderability copper glue-line, it is luminous that this LED luminescence component is received behind electric power, and the heat that produces when by this metallic heat dissipating part and heat radiation coating that this LED luminescence component is luminous leaves, and the light that this LED luminescence component sends is by reflecting through this through hole.
6. a kind of improved led light source board structure as claimed in claim 5 is characterized in that: this through hole is circular, square, ellipse or regular polygon.
7. a kind of improved led light source board structure as claimed in claim 5, it is characterized in that: this heat radiation coating is the epoxy resin that surface distributed has nano particle.
8. a kind of improved led light source board structure as claimed in claim 5, it is characterized in that: this metallic heat dissipating part is made of the different sheet metal of two-layer material.
9. a kind of improved led light source board structure as claimed in claim 5 is characterized in that: being shaped as of this metallic heat dissipating part is square, circle or strip.
10. led light source, it comprises lamp housing, base, it is characterized in that, also comprise a kind of improved led light source board structure that is somebody's turn to do according to such as claim 1-9 any one, this lamp housing covers this led light source board structure, this led light source board structure arranges in this base, and this led light source board structure is electrically connected with this base by wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202506921U CN202736979U (en) | 2012-05-30 | 2012-05-30 | Improved LED light source substrate structure and LED light source comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202506921U CN202736979U (en) | 2012-05-30 | 2012-05-30 | Improved LED light source substrate structure and LED light source comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202736979U true CN202736979U (en) | 2013-02-13 |
Family
ID=47662648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202506921U Expired - Lifetime CN202736979U (en) | 2012-05-30 | 2012-05-30 | Improved LED light source substrate structure and LED light source comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202736979U (en) |
-
2012
- 2012-05-30 CN CN2012202506921U patent/CN202736979U/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103574344B (en) | Light-emitting diode bulb and manufacturing method thereof | |
| US20130094201A1 (en) | Heat Dissipating Structure Of LED Circuit Board And LED Lamp Tube Comprised Thereof | |
| CN103608622A (en) | Heat sink assembly for opto-electronic components and a method for producing the same | |
| CN201526914U (en) | LED lamp housing | |
| CN202501252U (en) | No-screw type LED bulb lamp | |
| CN201764312U (en) | LED bulb and illuminating system | |
| CN204083920U (en) | A kind of all-round smooth LEDbulb lamp | |
| CN104791736B (en) | A kind of LED light module of liquid-cooling heat radiation | |
| CN203167425U (en) | Metal printed circuit board | |
| CN202708919U (en) | Tower-shaped light-emitting diode (LED) automobile lamp | |
| CN201741694U (en) | Ceramic radiator | |
| CN202736979U (en) | Improved LED light source substrate structure and LED light source comprising same | |
| CN103375707B (en) | A kind of LED light source board structure of improvement and the LED light source containing this structure | |
| CN202252967U (en) | Lighting device | |
| CN203628576U (en) | Led wall lamp radiator | |
| CN203757669U (en) | Liquid-cooled LED (light-emitting diode) light module | |
| CN102661591A (en) | Novel heat radiating device with thin film circuit for light emitting diode (LED) street lamp | |
| CN202452213U (en) | Light emitting diode bulb with high radiating efficiency | |
| CN201731301U (en) | Powerful radiation type high-power LED explosion-proof lamp | |
| CN202432317U (en) | LED (light emitting diode) bulb | |
| CN202905789U (en) | High reflectivity heat dissipation line substrate and LED device thereof | |
| CN202678403U (en) | Light emitting diode (LED) device | |
| CN201420994Y (en) | Dewing proof LED street lamp | |
| CN204573674U (en) | LEDbulb lamp | |
| CN104110590A (en) | Low-thermal-resistance radiating LED lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHONGQING AIXINKE TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: PROVENCE TECHNOLOGY (SHENZHEN) CO., LTD. Effective date: 20150202 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518067 SHENZHEN, GUANGDONG PROVINCE TO: 400000 JIULONGPO, CHONGQING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150202 Address after: 400000 street is Chongqing Jiulongpo District Yangjiaping 24 of 1 No. 21-5-2 Patentee after: Chongqing Ai Xin Technology Co. Ltd. Address before: 518067 27D, Seaview Plaza, 18 Prince Edward Road, Shekou, Guangdong, Shenzhen, Nanshan District Patentee before: Provence Technology (Shenzhen) Co., Ltd. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151215 Address after: Two road 523000 Guangdong city of Dongguan Province Huang Zhen She Bei pearl 9 Building No. two Patentee after: Dongguan Ai Xin Electronic Technology Co., Ltd. Address before: 400000 street is Chongqing Jiulongpo District Yangjiaping 24 of 1 No. 21-5-2 Patentee before: Chongqing Ai Xin Technology Co. Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130213 |
|
| CX01 | Expiry of patent term |