CN103574344B - Light-emitting diode bulb and manufacturing method thereof - Google Patents
Light-emitting diode bulb and manufacturing method thereof Download PDFInfo
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- CN103574344B CN103574344B CN201210429026.9A CN201210429026A CN103574344B CN 103574344 B CN103574344 B CN 103574344B CN 201210429026 A CN201210429026 A CN 201210429026A CN 103574344 B CN103574344 B CN 103574344B
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- lamp housing
- plastic cement
- cement lamp
- metal
- plastic
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- 241000258971 Brachiopoda Species 0.000 abstract 7
- 238000001746 injection moulding Methods 0.000 abstract 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
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- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
A light-emitting diode (LED) bulb and a manufacturing method thereof comprise a substrate, wherein at least one LED chip, a lampshade, a metal joint and a plastic lamp shell are arranged on the substrate, and the plastic lamp shell is integrally formed, has high surface impedance (insulation) and can be formed by injection molding. The contact position of the plastic lamp shell and the substrate is provided with at least one hole, and metal can be embedded to promote the heat conduction of the plastic radiating fins to the substrate. The invention uses the heat-conducting plastic with high surface impedance as the lamp shell, so that the LED driving element can conduct heat to the heat-conducting plastic lamp shell in a contact or air heat transfer mode without covering the plastic, and the inner side of the plastic lamp shell is the heat-conducting plastic instead of metal, thereby achieving the effects of promoting the heat dissipation of the LED driving element, prolonging the service life and safety, and the plastic lamp shell is made of the plastic and is easy to process or mold, thereby not only being light, but also reducing the cost and selling price.
Description
Technical field
The present invention has about a kind of LED lamp, refers to light emitting diode bulb and the manufacture method thereof of a kind of tool plastic cement lamp housing and plastic cement radiating fin especially.
Background technology
Carbon reduction subject under discussion and the two subject under discussion that rises of oil electricity are had a fever recently, China's Lighting Industry also continually develops new technology, except fluorescent tube universal already and city account for except the more and more high Electricity-saving lamp bulb of rate, there is the life-span up to 20, the LED of more than 000 hour and unit wattage height lumen characteristic is that people can expect one of leading candidate resisting high electricity price naturally.
LED has longer service life relative to traditional tube and fluorescent lamp, but will have long prerequisite in service life is that the heat radiation of LED driving element, wafer and substrate is good.Although the wafer of LED lamp belongs to chemiluminescence.But, LED lamp or fluorescent tube is usual must reach area source by plurality of LEDs, again because the typical practice LED wafer is attached at a printed circuit board (PCB) (PCB), the back side of printed circuit board (PCB) is affixed on aluminium sheet again and connects aluminium extruded type or die-casting die radiating fin.Therefore, as long as the heat spreader difficulty that LED wafer Injection Current produces, the heat that LED will be made to produce is accumulated in lamp housing, and does sth. in advance light decay.Therefore, LED bulb nearly all contains aluminium extruded type or aluminium die-casting die radiating fin to provide heat radiation, and above-mentioned is all, is the main cause that LED price is still high.
As previously mentioned, LED illumination at present mainly with die-casting die radiating fin as heat dissipation element, though aluminium is relative light metal, but, this material make radiating fin still quite have deal, in addition, machine-shaping is not easily as previously mentioned, another aluminium itself be also electricity good conductor.Therefore, although the driving voltage of single LEDs is less than 4V, and in use, majority is used by plurality of LEDs wafer series and parallel, to reach the lumen needed for illumination use.Therefore, the driving element overall current voltage (power) of LED is not low.For considering there is the problem in the safety such as electric shock, part manufacturer is the safety guaranteeing that electrical equipment uses, and takes the coated or isolated driving element of plastic cement that insulate.Please refer to the sectional view of the LED big gun of Fig. 1-1.From top to bottom comprise: lampshade 10, LED wafer 20, ceramic substrate (or PCB) 30, electric wire 40, insulating wrapped plastic cement 50, LED driving element (transformer) 60, aluminium lamp housing 80 (comprising aluminum radiating fin 81) and metal joint (lamp holder) 70.
Such structure, (the insulating wrapped plastic cement 50 of packaging LED driving element is improved except causing expense, aluminium lamp housing 80 (comprising aluminum radiating fin 81) material and manufacturing expense) also easily to make LED driving element dispel the heat bad, the area maybe must strengthening aluminum radiating fin service life of the LED driving element that causes detracting.Above-mentioned all be all the LED price still high main cause not easily significantly glided.
Separately just like the sectional view of the LED bulb of Fig. 1-2 and Fig. 1-3, though by plastic cement as lamp housing, but be sheet metal, becket or metal collar 92 inside plastic cement lamp housing 85, this sheet metal, becket or metal collar 92 can for managing in pipe or π type in ring-type, when substrate 30 temperature of LED is higher than LED driving element 60, thermograde is produced between substrate 30 and LED driving element 60, heat energy passes to LED driving element 60 by by the metal inside plastic cement lamp housing 85, instead easily causes LED driving element 60 temperature raise and reduce service life.
Summary of the invention
Object of the present invention is for providing a kind of light emitting diode bulb, with the heat conduction plastic cement of high surface impedance as lamp housing, make LED driving element not must coated plastic cement and can with contact or by the mode that air conducts heat, heat is reached heat conduction plastic cement lamp housing, and the inner side of plastic cement lamp housing is heat conduction plastic cement, instead of metal, promote the heat radiation of LED driving element, the effect of continuity service life and safety to reach, and because plastic cement lamp housing is the easily processing or shaping of plastic cement composition, not only light weight also can reduce costs and price.
Another object of the present invention is to provide a kind of manufacture method of light emitting diode bulb, the light emitting diode bulb that the method is made, with the heat conduction plastic cement of high surface impedance as lamp housing, make LED driving element not must coated plastic cement and can with contact or by the mode that air conducts heat, heat is reached heat conduction plastic cement lamp housing, and the inner side of plastic cement lamp housing is heat conduction plastic cement, instead of metal, the heat radiation of LED driving element is promoted to reach, the effect of continuity service life and safety, and because plastic cement lamp housing is the easily processing or shaping of plastic cement composition, not only light weight also can reduce costs and price.
The invention provides a kind of light emitting diode bulb, comprising:
One substrate, it has LED circuit pattern;
More than one LED wafer, it is positioned on the LED circuit pattern on this substrate;
One LED driving element, it connects an external power source, and the conversion of this LED driving element exports this external power source for the input power on this LED circuit pattern needed for the driving of those LED wafers;
One plastic cement lamp housing, this substrate accommodating and this LED driving element in it, this plastic cement lamp housing is made up of the electric insulation material of flame-retarded heat-conducting, this plastic cement lamp housing has plane on one and the lamp housing that fits of this substrate, and on this lamp housing, plane is provided with wire hole, and the power supply output line of this LED driving element connects this substrate through this wire hole, on this lamp housing, plane is also provided with hole, imbed sheet metal, becket or metal collar in this hole, increase heat-sinking capability, the inner side of this plastic cement lamp housing is plastic cement;
One lampshade, it is connected in this plastic cement lamp housing top, and is positioned at above those LED wafers, to provide bright dipping; And
One metal joint, it is connected in this plastic cement lamp housing bottom, and this external power source is inputted by this metal joint, and is input into the input of this LED driving element.
In a preferred embodiment, the material of described plastic cement lamp housing comprises plastic material and packing material, wherein plastic material is selected from Merlon (PC) and polyolefin (polyolefin) one wherein, any one during packing material selects free metal, metal oxide, nonmetal oxide, non-metallic carbide, non-metal nitride powder and mixes arbitrarily the group that forms, this plastic cement lamp housing possesses the fire retardancy of more than UL94 V2, surface impedance reaches and is greater than 1E+9 Ω/sq, thermal conductivity is more than 1W/m-K, and insulation proof voltage is greater than 4KV.
In a preferred embodiment, described plastic cement lamp housing also comprises multiple plastic cement radiating fin formed thereon, this plastic cement lamp housing and those plastic cement radiating fins one-body molded, have the cylinder height of more than 0.1 centimetre between this plastic cement radiating fin lower edge and this metal joint.
In a preferred embodiment, described sheet metal, becket or metal collar to be embedded in plastic cement lamp housing and to be less than the vertical face height of plastic cement lamp housing.
In a preferred embodiment, there is the fin promoting to dispel the heat or thermal paste between described LED driving element and plastic cement lamp housing.
The present invention also provides a kind of manufacture method of light emitting diode bulb, at least comprises following steps:
Particles is provided, those particles are mixed by plastic material and packing material powder to process from strand, wherein, the weight ratio of plastic material and packing material powder at least can reach the fire retardancy of more than UL94V2 according to plastic cement lamp housing, surface impedance reaches and is greater than 1E+9 Ω/sq, and thermal conductivity is at least greater than the requirement of 1W/m-K and selectes;
There is provided a plastic cement lamp housing mould, preset first sheet metal is in the default place of this mould, and the section of this first sheet metal is selected from the one in the group be made up of ㄇ font and π font;
With this plastic cement lamp housing mould for mould, ejection forming technique is imposed to those particles, with the one-body molded plastic cement lamp housing (burying forming/in-molded) containing this first sheet metal;
Plane on the lamp housing that the substrate comprising LED wafer by is installed on this plastic cement lamp housing;
By a LED driving element, be installed on this plastic cement lamp housing by plastic cement lamp housing lower part outlet inner, and a power line is connected this substrate through plane on this lamp housing;
Be connected a metal joint in this plastic cement lamp housing bottom, an external power source is input into the power input of this LED driving element by this metal joint; And
Connect lampshade plane on the lamp housing of this plastic cement lamp housing, to form this light emitting diode bulb.
In a preferred embodiment, also comprise mixed dye in the step of this particles, to make this shaping plastic cement lamp housing, there is predetermined color.
In a preferred embodiment, any one with Merlon (PC) and polyolefin (polyolefin) one wherein for main material, during this packing material selects free metal, metal oxide, nonmetal oxide, non-metallic carbide, non-metal nitride powder and mixes arbitrarily the group that forms of described plastic material and packing material powder
The present invention also provides a kind of manufacture method of light emitting diode bulb, at least comprises following steps:
Particles is provided, those particles are by plastic material, packing material powder, and dyestuff mixes, wherein, the weight ratio of plastic material and packing material powder at least can reach the fire retardancy of more than UL94V2 according to plastic cement lamp housing, surface impedance reaches 1E+9 Ω/sq, and thermal conductivity is at least greater than the requirement of 1W/m-K and selectes, and this dyestuff provides the color of end product;
There is provided a plastic cement lamp housing mould, this plastic cement lamp housing mould includes heat radiation fin structure, and this heat radiation fin structure is shaped in this plastic cement lamp housing mould, is reserved with hole at the book office of this plastic cement lamp housing mould;
With this plastic cement lamp housing mould for mould, ejection formation is imposed to those particles, with this plastic cement lamp housing one-body molded;
Plane on the lamp housing that the substrate comprising LED wafer by is installed on this plastic cement lamp housing;
By a LED driving element, be installed on this plastic cement lamp housing by plastic cement lamp housing lower part outlet inner, and a power line is connected this substrate through plane on this lamp housing;
Be connected a metal joint in this plastic cement lamp housing bottom, an external power source is input into the power input of this LED driving element by this metal joint; And
Connect lampshade plane on the lamp housing of this plastic cement lamp housing, to form this light emitting diode bulb.
In a preferred embodiment, also comprise the step of one first sheet metal being suppressed hole place reserved on this plastic cement lamp housing, to increase heat-sinking capability, this first sheet metal is selected from the one in a becket, multiple sheet metal and group that both form.
Feature and the advantage of light emitting diode bulb of the present invention and manufacture method thereof are: this light emitting diode bulb comprises an aluminium base, substrate has a light emitting diode (LED) wafer at least, lampshade, metal joint and a plastic cement lamp housing, this plastic cement lamp housing has the effect of heat conductive insulating, therefore not need on LED driving element extra coated insulation material, this plastic cement lamp housing even can reach excellent heat dissipation property and flame retardant effect (more than UL94V1, this plastic cement lamp housing can fill metal by Merlon (PC) or polyolefin (polyolefin), metal oxide powder or other nonmetal oxides are formed, plastic cement lamp housing has plane and substrate contacts on a lamp housing to fit, on the lamp housing of plastic cement lamp housing, plane puts into sheet metal in forming process, becket or metal collar in the mould for establishing position after, plastic cement injection is made sheet metal, becket or metal collar imbed (burying forming/in-molded insert molding) in plastic cement lamp housing, form one-body molded metallic plastic cement lamp housing, on lamp housing, plane can be coated with thermal grease, thermal paste or use fin are to strengthen heat radiation and to be close contact in substrate ability.On lamp housing, plane also selectively can imbed sheet metal, becket or metal collar in plastic cement lamp housing is shaping afterwards.Described sheet metal, becket or the metal collar face of indulging are embedded in plastic cement lamp housing (not arriving plastic cement lamp housing bottom surface).In addition, the upper lateral wall alternative of plastic cement lamp housing imbeds sheet metal to promote that plastic cement lamp housing is to the heat transfer of substrate, no matter this plastic cement lamp housing comprises plastic cement radiating fin can be one-body molded and have high surface impedance (insulation), by ejection formation, and recyclablely to reuse; Lampshade is that plane, concave surface or convex surface or illumination are contained angle and can be arrived 270 degree (full circular lampshades), and tool light transmission can be cloudy surface or transparent.
Feature of the present invention is to utilize plastic cement lamp housing to replace general metal aluminum hull and aluminium matter radiating fin, LED driving element must coated insulation material, the bad problem so do not dispel the heat, and there is the advantages such as easy machine-shaping, quality are light, low cost, personalized color, environmental protection recycling.
Accompanying drawing explanation
Fig. 1-1 shows existing LED lamp profile.
Fig. 1-2 shows existing LED lamp profile.
Fig. 1-3 shows existing LED lamp profile.
Fig. 2 shows the light emitting diode bulb profile according to the tool plastic cement lamp housing manufactured by the present invention.
Fig. 3 shows the light emitting diode bulb profile according to the tool plastic cement lamp housing manufactured by the present invention.
Fig. 4 shows the light emitting diode bulb profile according to the tool plastic cement lamp housing manufactured by the present invention.
Fig. 5 shows the light emitting diode bulb profile according to the tool plastic cement lamp housing manufactured by the present invention.
Fig. 6 shows the light emitting diode bulb profile according to the tool plastic cement lamp housing manufactured by the present invention.
Fig. 7 shows the schematic perspective view of the tool plastic cement lamp housing of foundation manufactured by the present invention to illustrate the annular hole of plane on lamp housing.
Fig. 8 shows the schematic perspective view according to the tool plastic cement lamp housing manufactured by the present invention.
Fig. 9 shows the profile according to the tool plastic cement lamp housing manufactured by the present invention, shows the sheet metal in annular hole or pothole, becket or metal collar.
Component symbol explanation
10 ... lampshade 20 ... LED wafer
30 ... substrate 40 ... electric wire
50 ... insulating wrapped plastic cement 60 ... LED driving element
80 ... aluminium lamp housing 81 ... aluminium matter radiating fin
85 ... plastic cement lamp housing 90 ... annular hole
86 ... plastic cement radiating fin 88 ... wire hole
92 ... sheet metal, becket or metal collar 87 ... screw hole
91 ... cylinder 70 ... metal joint
85A ... plane on lamp housing
Detailed description of the invention
Refer to the LED lamp profile of the tool plastic cement lamp housing of the present invention shown in Fig. 2.As shown in Figure 2, LED lamp of the present invention from top to bottom comprises: lampshade 10, LED wafer 20, substrate 30, electric wire 40, LED driving element (transformer) 60, plastic cement lamp housing 85 (comprising plastic cement radiating fin 86 one-body molded) and metal joint 70.Above-mentioned lampshade 10 is LED exiting surfaces, can be cloudy surface, to reduce the spot light of LED.Substrate 30 can be that a PCB (printed circuit board (PCB)) substrate has LED wafer load bearing seat and circuit pattern, and PCB substrate 30 bottom is affixed on an aluminium base to provide better capacity of heat transmission again.
Plastic cement lamp housing 85 top of the present invention is a plane (hereinafter referred to as lamp housing on plane 85A) parallel with aluminium base.On the lamp housing of plastic cement lamp housing, plane 85A puts into metal ferrules after the mould for establishing position in forming process, make metal imbed (burying forming/in-molded insert molding) in plastic cement lamp housing plastic cement injection, form one-body molded metallic plastic cement lamp housing (cross section view as Fig. 2, Fig. 3).On lamp housing, plane 85A also selectively imbeds sheet metal, becket or metal collar 92 afterwards in plastic cement lamp housing is shaping, such as, in Fig. 2, the cross section of sheet metal, becket or metal collar 92 is ㄇ shapes, in Fig. 3, the cross section of sheet metal, becket or metal collar 92 is π shapes, in Fig. 4, the cross section of sheet metal, becket or metal collar 92 presents double-T, in Fig. 5, the cross section of sheet metal, becket or metal collar 92 is outward extending inverted L-shaped, and the sheet metal in Fig. 6, becket or metal collar 92 are sheet metal or becket.Horizontal plane described here is then that on lamp housing, plane directly contacts with substrate 30, and vertical face (from top to bottom) is embedded in plastic cement lamp housing 85 (not arriving plastic cement lamp housing bottom surface).
The reason that sheet metal, becket or metal collar 92 does not contact driving element is that the heat that LED wafer luminescence produces makes substrate temperature usually above driving element, difference due to temperature makes to produce thermograde between substrate and driving element, heat is delivered to driving element by the metal of lamp housing inside, makes driving element temperature raise and reduce the life-span on the contrary.In order to avoid the generation of the problems referred to above, sheet metal of the present invention, becket or metal collar are buried/embed in plastic cement lamp housing, but not to plastic cement lamp housing bottom surface, after the heat that LED wafer luminescence produces passes to substrate and sheet metal, becket or metal collar 92, plastic cement by plastic cement lamp housing dispels the heat, and the heat that LED driving element 60 produces then is passed to outside plastic cement lamp housing 85 by the plastic cement inside plastic cement lamp housing 85.In addition, can alternatively be used the heat radiation that heat-conducting glue or conducting strip promote LED driving element between the downside of LED driving element and LED base.On lamp housing, plane 85A can be coated with thermal grease, thermal paste or use fin (not shown) to strengthen heat radiation and to be close contact in substrate 30 ability.Substrate 30 locks on lamp housing before plane 85A with screw, and substrate 30 can be metal substrate or ceramic substrate.On lamp housing, plane 85A alternative coats some thermal greases, to strengthen contiguity ability.Substrate 30 also can be metal substrate and on the lamp housing of plastic cement lamp housing 85 of the present invention, plane 85A just in time can provide the support of said metal substrates 30, please refer to the stereogram of the plastic cement lamp housing 85 comprising plane 85A on lamp housing shown in Fig. 7.In Fig. 7, on lamp housing, plane 85A is provided with a wire hole 88, four screw holes 87, and an annular hole 90.
Note that in said structure, the present invention there is no existing insulating wrapped plastic cement 50.This is because the present invention adopts plastic cement lamp housing 85 (comprising plastic cement radiating fin 86).Plastic cement lamp housing 85 is filled metal, metal oxide powder or non-metallic carbide, nitride or oxide powder by plastic material and formed, tool electrical insulating property.Above-mentioned plastic material can be selected from Merlon (PC) or polyolefin (polyolefin), and packing material is selected from the metals such as silver, aluminium, gold, copper, nickel, zinc, aluminium nitride, aluminium oxide, beryllium oxide, magnesia, zinc oxide, tungsten carbide or metal oxide or tungsten-carbide powder.Nonmetal oxide or carbide, nitride powder then comprise one or more powder wherein such as boron nitride, diamond, graphite, carborundum, silicon nitride.Plastic cement lamp housing 85 mixes above-mentioned packing material powder by plastic material and is formed and have proof voltage and be greater than 4KV, and surface impedance is greater than the insulation characterisitic of 1E+9 Ω/sq, and conforms with the flame retardant effect of more than UL94V2 standard; UL94V2 refers to the anti-flaming standard that American insurance business formulates, and must extinguish during combustion test in 30 seconds, but a vertical plastic cement can light surgery cotton.Higher standard is that UL94V1 and V0, UL94V1 and UL94V0 must extinguish when referring to combustion test respectively in 30 and 10 seconds, but drips a vertical plastic cement and can not light surgery cotton.Plastic cement lamp housing 85 material of the present invention also meets UL94V1 and V0 standard.
Such as, weight percent mixed proportion such as the polyolefin of above-mentioned plastic material and packing material is about 5 ~ 45%, and packing material is 35 ~ 95%, more details discussion, please refer to another patent application case of applicant, TaiWan, China patent application case number is 100140804.
The cylinder 91 height (referring to Fig. 2 ~ Fig. 6) of more than 0.1 centimetre is had, to improve plastic cement lamp housing moulding aesthetic feeling between lamp housing and metal joint 70.Owing to being plastic cement lamp housing 85, cost, weight all can reduce than existing aluminum lamp housing.Lamp housing be no matter simple or special moulding can very easy making because the present invention is plastic cement lamp housing 85, every existing plastic cement process technology can be easy to transfer to make plastic cement lamp housing 85 of the present invention.Wire hole 88 and plastic cement lamp housing 85 one-shot forming.Such as, can there be multi-disc plastic cement radiating fin 86 plastic cement lamp housing 85 outside, also can not present with plastic cement radiating fin 86 completely.Existing aluminium processing cost is high, and special moulding relative cost is higher and do not conform to economic benefit.
In another embodiment, on lamp housing, plane 85A is provided with some holes, or annular hole 90.A cylindrical metal sheet ring-like cylindrical metal sheet, becket or metal collar 92 or multi-disc combined again or elongated metal ring plate are pressed in annular hole 90.Cylindrical metal sheet can increase area of dissipation, and the insulating heat-conductive plastic cement in the present invention has the good capacity of heat transmission (thermal conductivity factor is about 1W/m-K to 3W/m-K).Sheet metal, becket or metal collar 92 does not need extra wire, and they are imbedded in plastic cement lamp housing 85, and the heat received can directly be dispelled the heat away by large-area plastic cement lamp housing 85 again.
The present invention also provides the manufacture method of light emitting diode bulb, and step is as follows:
First, by above-mentioned plastic material and packing material powder and dyestuff mixing again through processing and cut to make particles.Wherein, the weight ratio of plastic material and packing material powder makes plastic cement lamp housing at least can reach the fire retardancy of more than UL94V2, surface impedance reaches and is greater than 1E+9 Ω/sq, proof voltage is greater than 4KV, thermal conductivity is at least greater than 1W/m-K etc. and requires and select, and dyestuff is mixed in particles, after ejection formation, plastic cement lamp housing 85 directly just has predetermined color, and without the need to painting in addition again.
Then, prepare a plastic cement lamp housing mould, and preset metal ferrules is in the default place of mould, the section of metal ferrules is ㄇ font (as Fig. 2), π font (as Fig. 3).And the default place of above-mentioned mould, be such as the annular hole of plane 85A on lamp housing, or the hole etc. that on lamp housing, plane 85A presets, to make plastic cement lamp housing after plastic cement injection just containing metal ferrules (burying forming/in-molded).Therefore, the cost of reprocessing can be reduced.Certainly, also after plastic cement lamp housing is shaping, sheet metal (ring) can be pressed into again in addition.Certainly, this will increase extra cost.
And then, ejection forming technique is imposed to penetrate a plastic cement lamp housing on mould to particles.
Plastic cement lamp housing is separated on mould, subsequently, plane on the lamp housing that the substrate comprising light emitting diode (LED) wafer by is installed on plastic cement lamp housing, wherein, be coated with some thermal greases, thermal paste below substrate with the upper plane of plastic cement lamp housing or use fin, to make the better of both laminatings.Then, by a LED driving element, be installed on plastic cement lamp housing by plastic cement lamp housing lower part outlet inner, and a power line is connected to this substrate through plane on this lamp housing.
Subsequently, one metal joint is connected in plastic cement lamp housing bottom, with the power input providing external power source to be input into this LED driving element thus with viscose glue; Finally, then connect a lampshade in the upper plane of this plastic cement lamp housing, to form light emitting diode bulb finished product.
Light emitting diode bulb of the present invention has the following advantages:
1) use plastic cement lamp housing 85, there is the high surface impedance of plastic cement, but have close to heat dissipation metal performance and flame retardant effect.
2) the plastic cement radiating fin on plastic cement lamp housing 85 is also flame-retarded heat-conducting plastic cement, by ejection formation, and recyclablely to reuse.
3) with plastic cement lamp housing 85 substitution of Al housing and aluminium matter radiating fin, weight is relatively lighter, and material cost and processing cost are all low.
4) on lamp housing, plane 85A imbeds sheet metal, becket or metal collar can promote that heat is reached plastic cement radiating fin by LED wafer, substrate and LED driving element.
5) LED driving element is directly contacted with plastic cement lamp housing, insulate completely, does not need extra plastic casing to pack the danger of also not getting an electric shock.
6) plastic cement lamp housing uses burying forming/in-molded once to complete (one-body molded), can reduce processing, manpower and energy-saving and carbon-saving.
7) cylinder height of more than 0.1 centimetre is had between plastic cement radiating fin and metal joint, with as the aesthetic feeling in the moulding of plastic cement lamp housing.
8) color of plastic cement lamp housing, just consumer can like according to need in the particles stage, mix predetermined dyestuff, do not need to paint in addition again, reduce cost, also can increase appearance.
Though the present invention illustrates as above with preferred embodiments, so itself and be not used to limit the present invention spirit with invention entity only terminate in above-described embodiment.All person skilled in the art persons, when can understanding easily and utilizing other element or mode to produce identical effect.Therefore not departing from the amendment done in spirit of the present invention and category, all should comprise within the scope of the claims.
Claims (10)
1. a light emitting diode bulb, is characterized in that, comprising:
One substrate, it has LED circuit pattern;
More than one LED wafer, it is positioned on the LED circuit pattern on this substrate;
One LED driving element, it connects an external power source, and the conversion of this LED driving element exports this external power source for the input power on this LED circuit pattern needed for the driving of those LED wafers;
One plastic cement lamp housing, this substrate accommodating and this LED driving element in it, this plastic cement lamp housing is made up of the electric insulation material of flame-retarded heat-conducting, comprise plastic material and packing material, wherein, this plastic material is selected from Merlon and polyolefin one wherein, this packing material selects free metal, metal oxide, metal hydroxides, nonmetal oxide, non-metallic carbide, non-metal nitride powder, and any one mixing arbitrarily in the group that forms, and wherein said packing material at least comprises and has releasing far infrared material, to make this plastic cement lamp housing, do not need extra coating or process, this light emitting diode bulb natural environment and serviceability temperature under, there is the characteristic of emitting far infrared ray,
This plastic cement lamp housing has plane on one and the lamp housing that fits of this substrate, on this lamp housing, plane is provided with wire hole, the power supply output line of this LED driving element connects this substrate through this wire hole, on this lamp housing, plane is also provided with hole, imbed sheet metal, becket or metal collar in this hole, this interior outside imbedding sheet metal or metal collar is described plastic material;
One lampshade, it is connected in this plastic cement lamp housing top, and is positioned at above those LED wafers; And
One metal joint, it is connected in this plastic cement lamp housing bottom, and this external power source is inputted by this metal joint, and is input into the input of this LED driving element.
2. light emitting diode bulb as claimed in claim 1, it is characterized in that, the material of described plastic cement lamp housing comprises plastic material and packing material, wherein this plastic material makes this plastic cement lamp housing possess the fire retardancy of more than UL94V2, surface impedance reaches and is greater than 1E+9 Ω/sq, thermal conductivity is more than 1W/m-K, and insulation proof voltage is greater than 4KV.
3. light emitting diode bulb as claimed in claim 1, it is characterized in that, described plastic cement lamp housing also comprises multiple plastic cement radiating fin formed thereon, this plastic cement lamp housing and those plastic cement radiating fins one-body molded, have the cylinder height of more than 0.1 centimetre between this plastic cement radiating fin lower edge and this metal joint.
4. light emitting diode bulb as claimed in claim 1, is characterized in that, described sheet metal, becket or metal collar to be embedded in plastic cement lamp housing and to be less than the vertical face height of plastic cement lamp housing.
5. light emitting diode bulb as claimed in claim 1, is characterized in that having the fin promoting to dispel the heat or thermal paste between described LED driving element and plastic cement lamp housing.
6. a manufacture method for light emitting diode bulb, is characterized in that, at least comprises following steps:
Particles is provided, those particles are mixed by plastic material and packing material powder to process from strand, wherein, the weight ratio of plastic material and packing material powder at least can reach the fire retardancy of more than UL94V2 according to plastic cement lamp housing, surface impedance reaches and is greater than 1E+9 Ω/sq, and thermal conductivity is at least greater than the requirement of 1W/m-K and selectes;
There is provided a plastic cement lamp housing mould, preset first sheet metal is in the default place of this mould, and the section of this first sheet metal is selected from the one in the group be made up of ㄇ font and π font;
With this plastic cement lamp housing mould for mould, ejection forming technique is imposed to those particles, with the one-body molded plastic cement lamp housing containing this first sheet metal;
Plane on the lamp housing that the substrate comprising LED wafer by is installed on this plastic cement lamp housing;
By a LED driving element, be installed on this plastic cement lamp housing by plastic cement lamp housing lower part outlet inner, and a power line is connected this substrate through plane on this lamp housing;
Be connected a metal joint in this plastic cement lamp housing bottom, an external power source is input into the power input of this LED driving element by this metal joint; And
Connect lampshade plane on the lamp housing of this plastic cement lamp housing, to form this light emitting diode bulb.
7. the manufacture method of light emitting diode bulb as claimed in claim 6, is characterized in that, also comprise mixed dye in the step of this particles to have predetermined color to make this shaping plastic cement lamp housing.
8. the manufacture method of light emitting diode bulb as claimed in claim 6, it is characterized in that, any one with Merlon and polyolefin one wherein for main material, during this packing material selects free metal, metal oxide, metal hydroxides, nonmetal oxide, non-metallic carbide, non-metal nitride powder and mixes arbitrarily the group that forms of described plastic material and packing material powder.
9. a manufacture method for light emitting diode bulb, is characterized in that, at least comprises following steps:
Particles is provided, those particles are by plastic material, packing material powder, and dyestuff mixes, wherein, the weight ratio of plastic material and packing material powder at least can reach the fire retardancy of more than UL94V2 according to plastic cement lamp housing, surface impedance reaches 1E+9 Ω/sq, and thermal conductivity is at least greater than the requirement of 1W/m-K and selectes, and this dyestuff provides the color of end product;
There is provided a plastic cement lamp housing mould, this plastic cement lamp housing mould includes heat radiation fin structure, and this heat radiation fin structure is shaped in this plastic cement lamp housing mould, is reserved with hole at the book office of this plastic cement lamp housing mould;
With this plastic cement lamp housing mould for mould, ejection formation is imposed to those particles, with this plastic cement lamp housing one-body molded;
Plane on the lamp housing that the substrate comprising LED wafer by is installed on this plastic cement lamp housing;
By a LED driving element, be installed on this plastic cement lamp housing by plastic cement lamp housing lower part outlet inner, and a power line is connected this substrate through plane on this lamp housing;
Be connected a metal joint in this plastic cement lamp housing bottom, an external power source is input into the power input of this LED driving element by this metal joint; And
Connect lampshade plane on the lamp housing of this plastic cement lamp housing, to form this light emitting diode bulb.
10. the manufacture method of light emitting diode bulb as claimed in claim 9, it is characterized in that, also comprise the step of one first sheet metal being suppressed hole place reserved on this plastic cement lamp housing, this first sheet metal is selected from the one in a becket, multiple sheet metal and group that both form.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101126529 | 2012-07-23 | ||
| TW101126529A TW201250154A (en) | 2012-07-23 | 2012-07-23 | Structure of plastic heat sink for LED bulb and method of making the same |
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| Publication Number | Publication Date |
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| CN103574344A CN103574344A (en) | 2014-02-12 |
| CN103574344B true CN103574344B (en) | 2015-09-02 |
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| CN201210429026.9A Expired - Fee Related CN103574344B (en) | 2012-07-23 | 2012-10-31 | Light-emitting diode bulb and manufacturing method thereof |
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| CN (1) | CN103574344B (en) |
| TW (2) | TW201250154A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106764520A (en) * | 2016-12-14 | 2017-05-31 | 安徽极光照明工程有限公司 | A kind of plastic cement heat radiation type LED bulb |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014041470A2 (en) * | 2012-09-11 | 2014-03-20 | Koninklijke Philips N.V. | Heat sink structure and method of manufacturing the same |
| CN104235748B (en) * | 2013-06-19 | 2018-08-31 | 欧司朗有限公司 | Lamp housing and its manufacturing method and lighting device including the lamp housing |
| GB2523844B (en) * | 2014-03-08 | 2016-04-27 | Lighttherm Ltd | LED lamp with embedded circuitry |
| RU2663178C2 (en) * | 2014-10-17 | 2018-08-02 | Общество с ограниченной ответственностью "ДиС ПЛЮС" | General-purpose led lamp |
| CN104292795A (en) * | 2014-10-29 | 2015-01-21 | 胡运冲 | Preparation method of impact resistant polycarbonate |
| US9605821B2 (en) * | 2014-11-19 | 2017-03-28 | GE Lighting Solutions, LLC | Outdoor LED luminaire with plastic housing |
| EP3249289A4 (en) * | 2014-12-26 | 2018-05-16 | Sokolov, Yuriy Borisovich | General-purpose led lamp with cast housing/radiator |
| WO2016105237A1 (en) * | 2014-12-26 | 2016-06-30 | Юрий Борисович СОКОЛОВ | Method for manufacturing an led bulb |
| US20190063738A1 (en) * | 2015-07-28 | 2019-02-28 | Yuriy Borisovich Sokolov | Led bulb |
| RU2592890C1 (en) * | 2015-07-28 | 2016-07-27 | Юрий Борисович Соколов | Led lamp |
| CN105252686A (en) * | 2015-11-03 | 2016-01-20 | 厦门泰启力飞电子科技有限公司 | Manufacturing method for LED radiator |
| RU2643526C2 (en) | 2016-05-17 | 2018-02-02 | Юрий Борисович Соколов | Led source of lighting with power supply from unstable tree-phase ac network |
| RU2633966C1 (en) | 2016-11-30 | 2017-10-20 | Юрий Борисович Соколов | Power supply from multi-phase alternating current network with correction of harmonic oscillations |
| CN109605653A (en) * | 2018-10-11 | 2019-04-12 | 上海德罕电子科技有限公司 | A kind of processing technology of automobile logo plate |
| CN209672089U (en) * | 2019-03-07 | 2019-11-22 | 厦门赢科光电有限公司 | A kind of intelligent lamp |
| NO347427B1 (en) * | 2021-07-13 | 2023-10-30 | Ctm Lyng As | Light Installation comprising recycled plastic and method for its manufacture |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1608110A (en) * | 2001-12-26 | 2005-04-20 | 大塚化学株式会社 | Resin composition for reflecting plate |
| CN101419962A (en) * | 2007-10-24 | 2009-04-29 | 张守仁 | LED, production method therefore and illuminator manufactured by the LED |
| TWM433515U (en) * | 2012-03-02 | 2012-07-11 | Yong Mei Hao Co Ltd | A heat-dissipating structure for an LED lamp |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110101841A1 (en) * | 2009-11-02 | 2011-05-05 | Yue Qin | LED lamp |
| KR101028339B1 (en) * | 2010-07-29 | 2011-04-11 | 금호전기주식회사 | Light emitting bulb using thermal conductor |
-
2012
- 2012-07-23 TW TW101126529A patent/TW201250154A/en unknown
- 2012-10-31 CN CN201210429026.9A patent/CN103574344B/en not_active Expired - Fee Related
-
2013
- 2013-01-04 TW TW102100365A patent/TWI498508B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1608110A (en) * | 2001-12-26 | 2005-04-20 | 大塚化学株式会社 | Resin composition for reflecting plate |
| CN101419962A (en) * | 2007-10-24 | 2009-04-29 | 张守仁 | LED, production method therefore and illuminator manufactured by the LED |
| TWM433515U (en) * | 2012-03-02 | 2012-07-11 | Yong Mei Hao Co Ltd | A heat-dissipating structure for an LED lamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106764520A (en) * | 2016-12-14 | 2017-05-31 | 安徽极光照明工程有限公司 | A kind of plastic cement heat radiation type LED bulb |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201250154A (en) | 2012-12-16 |
| TWI498508B (en) | 2015-09-01 |
| TW201405067A (en) | 2014-02-01 |
| CN103574344A (en) | 2014-02-12 |
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