CN103375707A - Improved light emitting diode (LED) light source substrate structure and LED light source with same - Google Patents
Improved light emitting diode (LED) light source substrate structure and LED light source with same Download PDFInfo
- Publication number
- CN103375707A CN103375707A CN2012101247341A CN201210124734A CN103375707A CN 103375707 A CN103375707 A CN 103375707A CN 2012101247341 A CN2012101247341 A CN 2012101247341A CN 201210124734 A CN201210124734 A CN 201210124734A CN 103375707 A CN103375707 A CN 103375707A
- Authority
- CN
- China
- Prior art keywords
- light source
- led light
- solderability
- line
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to an improved light emitting diode (LED) light source substrate structure which comprises a circuit board provided with a metal thin layer on the lower surface, a solderable copper glue layer arranged on the upper surface of the circuit board, a tin soldering layer formed on the solderable copper glue layer, an LED illuminating assembly arranged on the solderable copper glue layer, a metal heat dissipation body attached to the metal thin layer disposed on the lower surface of the circuit board and a layer of heat dissipation coatings sprayed on the lower surface of the metal heat dissipation body. The tin soldering layer is formed on the solderable copper glue layer, and then the LED illuminating assembly is arranged on the solderable copper glue layer and is fixed by the tin soldering layer; the solderable copper glue layer is conducts electricity to the LED illuminating assembly through the tin soldering layer, the LED illuminating assembly receives electricity and then illuminates, and heat generated by the LED illuminating assembly during illuminating is dissipated through the metal heat dissipation body and the heat dissipation coatings. An LED light source has the advantages of being low in cost, simple in structure, high in safety and the like.
Description
Technical field
The present invention relates to a kind of light-emitting device, relate in particular to a kind of led light source board structure with the low and excellent radiation performance of cost and by the LDE light source of its manufacturing.
Background technology
In recent years since the manufacturing technology of LED lamp reach its maturity, and LED has that power consumption is low, heating degree is low, long service life, startup speed soon, rich color and the good advantage of brightness, can save in a large number the power consumption of lighting.Also therefore, today that environmental protection ideas comes into one's own increasingly, LED replaces the main flow that conventional lamp becomes the future market gradually.
Although LED has above-mentioned various advantages, but when LED is used in lighting use, form the LED light fixture with a plurality of LED lamp modularities, provide required illumination by modular LED light fixture, and the LED light fixture also can produce heat energy luminous when illumination is provided, if its effectively dissipation of heat energy that produces, getting off for a long time to affect the service life of LED light fixture.
In existing LED heat dissipation technology, generally all be to dispel the heat with the ceramic heat sink heat radiation or with aluminium fin; Wherein, the radiating mode of aluminium fin is installed in the surface of LED module with the radiating fin of aluminum, when the LED module is luminous, by the radiating fin of aluminum the heat that the LED module produces is given dissipation.Although such radiating mode can distribute the heat that the LED module produces, but the radiating fin of aluminum is except can dispelling the heat, therefore the function that also has conduction must carry out the work of insulation between LED module and radiating fin, occur with the situation that prevents from shocking by electricity.
And traditional ceramic heat sink is printed on ceramic heat sink with elargol with circuit, and after printing is finished with 700 the degree more than the long-time sintering of high temperature, circuit is solidified in ceramic heat sink.Yet such production method not only expends time in long, manufacture process also quite repeatedly, and employed equipment and energy cost are all quite high in the manufacture process.
Therefore, for problem and the deficiency that existing LED radiator produces, design a kind of can quick heat radiating, a cost led light source board structure lower and simple in structure problem being badly in need of at present solving.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of good heat dissipation effect, the led light source board structure that cost is low, simple in structure, easy to make and contain the led light source of this structure.
Solving a kind of technical scheme that technical problem of the present invention adopts is: a kind of improved led light source board structure is provided, and it comprises:
One led light source substrate radiator;
But one is arranged on the solderability copper glue-line on a surface of this led light source substrate radiator;
But one is formed at the soldering-tin layer on this solderability copper glue-line;
But one is arranged at the LED luminescence component on this solderability copper glue-line; And
One deck is sprayed on another surperficial heat radiation coating of this led light source substrate radiator;
Wherein, but when pasting, pays behind this led light source substrate radiator this solderability copper glue-line, be solidified to form circuit via the low temperature barbecue, and but this soldering-tin layer is formed on this solderability copper glue-line, but then this LED luminescence component is arranged at this solderability copper glue-line, and fixes this LED luminescence component by this soldering-tin layer; But should solderability copper glue-line see through this soldering-tin layer conduction to this LED luminescence component, it is luminous that this LED luminescence component is received behind electric power, and the heat that produces when by this led light source substrate radiator and heat radiation coating that this LED luminescence component is luminous leaves.
In the present invention, this heat radiation coating is the epoxy resin that surface distributed has nano particle.
In the present invention, this led light source substrate radiator is shaped as square, circle or strip.
In the present invention, but should solderability copper glue-line be formed at another surface of this led light source substrate radiator with screen painting, steel plate printing, spraying, transfer printing mode.
In the present invention, but but but should solderability copper glue-line substitute with solderability copper cream or solderability copper slurry.
Solving the another kind of technical scheme that technical problem of the present invention adopts is: a kind of improved led light source board structure is provided, and it comprises:
A lower surface has the circuit board of thin metal layer;
But one is arranged on the solderability copper glue-line of the upper surface of this circuit board;
But one is formed at the soldering-tin layer on this solderability copper glue-line;
But one is arranged at the LED luminescence component on this solderability copper glue-line;
One is close to the metallic heat dissipating part on the thin metal layer of this circuit board lower surface; And
One deck is sprayed on the heat radiation coating of this metallic heat dissipating part lower surface;
Wherein, but this soldering-tin layer is formed on this solderability copper glue-line, but then this LED luminescence component is arranged at this solderability copper glue-line, and fix this LED luminescence component by this soldering-tin layer; But should solderability copper glue-line see through this soldering-tin layer conduction to this LED luminescence component, it is luminous that this LED luminescence component is received behind electric power, and the heat that produces when by this metallic heat dissipating part and heat radiation coating that this LED luminescence component is luminous leaves.
In the present invention, this heat radiation coating is the epoxy resin that surface distributed has nano particle.
In the present invention, this metallic heat dissipating part is made of the different sheet metal of two-layer material.
In the present invention, this metallic heat dissipating part is shaped as square, circle or strip.
Solving another technical scheme that technical problem of the present invention adopts is: a kind of led light source is provided, it comprises lamp housing, base, also comprise according to above-mentioned a kind of improved led light source board structure, described lamp housing covers described led light source board structure, described led light source board structure arranges in the described base, and described led light source board structure is electrically connected with described base by wire.
Compared with prior art, led light source board structure of the present invention and led light source have good heat dissipation effect, cost is low, simple in structure, save material, because do not need larger metal heat sink so that weight and volume reduces, security also higher, be difficult for breaking out of fire, be difficult for electric leakage and meet the advantage such as international standard.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the stereogram of a kind of improved led light source board structure the first embodiment of the present invention;
Fig. 2 is the sectional view of Fig. 1;
Fig. 3 is the stereogram of a kind of improved led light source board structure the second embodiment of the present invention;
Fig. 4 is the sectional view of Fig. 3;
Fig. 5 is the stereogram of a kind of improved led light source board structure the 3rd embodiment of the present invention;
Fig. 6 is the front view according to the led light source of the preparation of a kind of improved led light source board structure of the present invention;
Fig. 7 is epoxy resin and the schematic diagram of nano particle after mixing of the first painting method among the present invention;
Fig. 8 is the sectional view of the led light source substrate radiator in the first embodiment of the invention;
Fig. 9 is epoxy resin and the schematic diagram of nano particle after mixing of the second painting method among the present invention;
Figure 10 is that the nanoscale inertia bubble among the present invention is attached to nano particle enlarged diagram on every side;
Figure 11 is the sectional view of the led light source substrate radiator in the first embodiment of the invention.
The specific embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
As shown in Figures 1 and 2, Fig. 1 and Fig. 2 have shown the first embodiment of a kind of improved led light source board structure of the present invention, and it comprises: a led light source substrate radiator 10 (this substrate radiator not only is used as substrate but also be used as radiator); One be arranged on these led light source substrate radiator 10 1 surfaces (upper surface) but solderability copper glue-line 20; But one is formed at the soldering-tin layer 30 on this solderability copper glue-line 20; But be arranged at the LED luminescence component 40 on this solderability copper glue-line 20; And one deck is sprayed on the heat radiation coating 50 on another surface (lower surface) of this led light source substrate radiator 10.This heat radiation coating is the liquid or solid-state heat radiation coating of heat conduction.Being shaped as of this led light source substrate radiator 10 is square, circle or strip, and its material is the good metal materials of thermal diffusivity such as copper, aluminium or albronze, chooses according to actual needs.But should solderability copper glue-line 20 be the surfaces that are formed at this led light source substrate radiator 10 with screen painting, steel plate printing, spraying, transfer printing mode.But but but these solderability copper glue-line 20 usefulness solderability copper cream or solderability copper slurry substitute.In order to prevent electric leakage, but insulating materials between this solderability copper glue-line 20 and this led light source substrate radiator 10, but but be provided with equally insulating materials (such as spray insulated paint) at the outer surface of the outer surface of this solderability copper glue-line 20 and led light source substrate radiator 10 that should solderability copper glue-line 20 places.
But when pasting, pays behind this led light source substrate radiator 10 this solderability copper glue-line 20, be solidified to form circuit via the low temperature barbecue, in this first embodiment, the optimum temperature that this barbecue solidifies is 100 ℃ to 200 ℃, and but this soldering-tin layer 30 is formed on this solderability copper glue-line 20, but then this LED luminescence component 40 is arranged at this solderability copper glue-line 20, and fixes this LED luminescence component 40 by this soldering-tin layer 30; Wherein, but should see through these soldering-tin layer 30 conductions to this LED luminescence component 40 by solderability copper glue-line 20, it is luminous that this LED luminescence component 40 is received behind electric power, and the heat that produces when by this led light source substrate radiator 10 and heat radiation coating 50 that this LED luminescence component 40 is luminous leaves.
As shown in Figures 3 and 4, Fig. 3 and Fig. 4 have shown the second embodiment of a kind of improved led light source board structure of the present invention, and it comprises: a lower surface is provided with the led light source circuit board 210 (pcb board) of thin metal layer; But one is arranged on the solderability copper glue-line 220 of these led light source circuit board 210 upper surfaces; But one is formed at the soldering-tin layer 230 on this solderability copper glue-line 220; But be arranged at the LED luminescence component 240 on this solderability copper glue-line 220; One is close to the heat radiation coating 250 that metallic heat dissipating part 260 on the thin metal layer of these led light source circuit board 10 lower surfaces and one deck are sprayed on these metallic heat dissipating part 260 lower surfaces.This heat radiation coating is the liquid or solid-state heat radiation coating of heat conduction.Being shaped as of this metallic heat dissipating part 260 and circuit board 210 is square, circle or strip, and the material of this metallic heat dissipating part 260 is the good metal materials of thermal diffusivity such as copper, aluminium or albronze, chooses according to actual needs.But but but these solderability copper glue-line 20 usefulness solderability copper cream or solderability copper slurry substitute.In order to prevent electric leakage, but between this solderability copper glue-line 220 and this circuit board 210, be provided with insulating materials, but but be provided with equally insulating materials (such as spray insulated paint) at the outer surface of the outer surface of this solderability copper glue-line 220 and circuit board 210 that should solderability copper glue-line 220 places.
As shown in Figure 5, Fig. 5 has shown the 3rd embodiment of a kind of improved led light source board structure of the present invention, the difference of the 3rd embodiment and the second embodiment is: increase layer of metal fin 360 between this metallic heat dissipating part 260, this heat radiation coating 250 is sprayed on this metal fin 360 lower surfaces.This metal fin 360 is corresponding with these metallic heat dissipating part 260 shapes.The material of this metal fin 360 is identical or different from the material of this metallic heat dissipating part 260, chooses according to actual needs.In like manner, for the first embodiment, led light source substrate radiator 10 also can be made of two-layer different metal level.
As shown in Figure 6, produce a kind of led light source according to above-mentioned improved led light source board structure.This improved led light source board structure is arranged in the transparent or translucent spherical lamp housing 60, is connected to base 80 by the wire 70 that connects the LED luminescence component.The material of this base 80 is that plastics, metal material or plastics and metal material combine.This led light source is simple in structure, save material, cost is low, because do not need larger metal heat sink so that weight and volume reduces, security also higher, be difficult for breaking out of fire, be difficult for electric leakage and meet international standard.
Referring to Fig. 7 and Fig. 8, the present invention also provides a kind of method that forms one deck heat radiation coating on the surface of the bossed led light source substrate of tool radiator 10 (or metallic heat dissipating part 210 or metal fin 360), it comprises the steps: at first, as shown in Figure 7 and Figure 8, with nano particle 18 and epoxy resin 16 abundant mix and blends, add simultaneously the associated materials that can carry out electrostatic painting process, and repeatedly stirring behind the hot melt, plastotype forms uniform heat radiation coating, and this nano particle 18 is selected from carborundum, boron nitride, aluminium nitride, aluminium oxide, one or more of titanium dioxide or carbon; Again, this heat radiation coating is coated in the surface of this led light source substrate radiator 10 (or metallic heat dissipating part 210 or metal fin 360), and put into heating furnace or baking box and be heated to 180 ℃～220 ℃ and kept 20～30 minutes, the first half section epoxy resin of baking period has the heat fusing phenomenon, nano particle with high-heating radiation floats on the outermost layer of epoxy resin after changing because of proportion, the second half section epoxy resin of baking period has the curing phenomenon, it is inner in epoxy resin that the outermost nano particle with high-heating radiation that floats on epoxy resin this moment then can deposition, as long as epoxy skins is without destroying aging phenomenon, then can possess for a long time thermolysis, this technique is called high hot melt coating process; Nano particle is formed on the surface of this epoxy resin after the cooling.
Further, in order to increase area of dissipation, can be provided with a plurality of projections on the surface of this led light source substrate radiator 10 (or metallic heat dissipating part 210 or metal fin 360).
See also Fig. 9 to Figure 11, the present invention also provides the another kind of method that forms one deck heat radiation coating on the surface of the bossed led light source substrate of tool radiator 10 (or metallic heat dissipating part 210 or metal fin 360), it comprises the steps: at first, as shown in Figure 9, with nano particle 18 and liquid-state epoxy resin 16 abundant mix and blends, add simultaneously the materials such as suspending agent, dispersant, can be made into the heat radiation coating of liquid spraying coating process after repeatedly stirring.This can be avoided nano particle to produce the nanometer agglomeration, but therefore long preservation after the sealed cans again.When this heat radiation coating sprays; be limited by the material behaviors such as suspending agent; even if with high-temperature baking; nano particle still have no idea totally the to be suspended in top layer of fin; therefore to produce and possess heat radiation usefulness fin; must in this heat radiation coating, inject nanoscale inertia bubble 22 (such as nitrogen with the nano bubble machine; air etc.); nanoscale inertia bubble 22 is attached on the nano particle with radiating effect; thereby; buoyancy by nanoscale inertia bubble makes the nano particle come-up or is suspended in the outermost layer of fin simultaneously in spraying; as long as epoxy skins is without destroying aging phenomenon; then can possess for a long time heat radiation usefulness, this technique is called the nano bubble suspension method.
This dispersant mainly is the surfactant that lipophilic group and hydrophilic group form, such as LCFA, softex kw (CTAB) etc.; The inorganic electrolyte of small-molecular weight or inorganic polymer are such as sodium metasilicate, calgon etc.; The polymer of macromolecule and polyelectrolyte are such as gelatin, carboxymethyl cellulose, poly-methyl acrylate, PEI etc.It is an amount of that the adding of dispersant is wanted, and unsuitable excessive and not enough, no person can cause flocculation.This suspending agent is selected from the suspending agent of existing nano particle.
The flat-shaped substrate radiator 10 (or metallic heat dissipating part 210 or metal fin 360) that possesses the nano particle of radiating effect has possessed certain heat dissipation, but want to promote more heat radiation usefulness, then must change the shape of substrate radiator 10 (or metallic heat dissipating part 210 or metal fins 360).Therefore on flat-shaped substrate radiator 10 (or metallic heat dissipating part 210 or metal fin 360), also be provided with projection, with increasing heat radiation area, square, circular and oval shape that these projections can form.And suitably the projection of height can promote heat radiation usefulness, and can reduce the heat radiation straight line and disturb, and under the thermal shock minimum state, can produce the highest heat-radiation heat-dissipating usefulness.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. improved led light source board structure is characterized in that it comprises:
One led light source substrate radiator;
But one is arranged on the solderability copper glue-line on a surface of this led light source substrate radiator;
But one is formed at the soldering-tin layer on this solderability copper glue-line;
But one is arranged at the LED luminescence component on this solderability copper glue-line; And
One deck is sprayed on another surperficial heat radiation coating of this led light source substrate radiator;
Wherein, but when pasting, pays behind this led light source substrate radiator this solderability copper glue-line, be solidified to form circuit via the low temperature barbecue, and but this soldering-tin layer is formed on this solderability copper glue-line, but then this LED luminescence component is arranged at this solderability copper glue-line, and fixes this LED luminescence component by this soldering-tin layer; But should solderability copper glue-line see through this soldering-tin layer conduction to this LED luminescence component, it is luminous that this LED luminescence component is received behind electric power, and the heat that produces when by this led light source substrate radiator and heat radiation coating that this LED luminescence component is luminous leaves.
2. a kind of improved led light source board structure as claimed in claim 1, it is characterized in that: this heat radiation coating is the epoxy resin that surface distributed has nano particle.
3. a kind of improved led light source board structure as claimed in claim 1 is characterized in that: being shaped as of this led light source substrate radiator is square, circle or strip.
4. a kind of improved led light source board structure as claimed in claim 1 is characterized in that: but should solderability copper glue-line be formed at another surface of this led light source substrate radiator with screen painting, steel plate printing, spraying, transfer printing mode.
5. a kind of improved led light source board structure as claimed in claim 1 is characterized in that: but but but should substitute with solderability copper cream or solderability copper slurry by solderability copper glue-line.
6. improved led light source board structure is characterized in that it comprises:
A lower surface has the circuit board of thin metal layer;
But one is arranged on the solderability copper glue-line of the upper surface of this circuit board;
But one is formed at the soldering-tin layer on this solderability copper glue-line;
But one is arranged at the LED luminescence component on this solderability copper glue-line;
One is close to the metallic heat dissipating part on the thin metal layer of this circuit board lower surface; And
One deck is sprayed on the heat radiation coating of this metallic heat dissipating part lower surface;
Wherein, but this soldering-tin layer is formed on this solderability copper glue-line, but then this LED luminescence component is arranged at this solderability copper glue-line, and fix this LED luminescence component by this soldering-tin layer; But should solderability copper glue-line see through this soldering-tin layer conduction to this LED luminescence component, it is luminous that this LED luminescence component is received behind electric power, and the heat that produces when by this metallic heat dissipating part and heat radiation coating that this LED luminescence component is luminous leaves.
7. a kind of improved led light source board structure as claimed in claim 6, it is characterized in that: this heat radiation coating is the epoxy resin that surface distributed has nano particle.
8. a kind of improved led light source board structure as claimed in claim 6, it is characterized in that: this metallic heat dissipating part is made of the different sheet metal of two-layer material.
9. a kind of improved led light source board structure as claimed in claim 6 is characterized in that: being shaped as of this metallic heat dissipating part is square, circle or strip.
10. led light source, it comprises lamp housing, base, it is characterized in that, comprise that also basis is such as the described a kind of improved led light source board structure of claim 1-9 any one, described lamp housing covers described led light source board structure, described led light source board structure arranges in the described base, and described led light source board structure is electrically connected with described base by wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210124734.1A CN103375707B (en) | 2012-04-25 | 2012-04-25 | A kind of LED light source board structure of improvement and the LED light source containing this structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210124734.1A CN103375707B (en) | 2012-04-25 | 2012-04-25 | A kind of LED light source board structure of improvement and the LED light source containing this structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103375707A true CN103375707A (en) | 2013-10-30 |
| CN103375707B CN103375707B (en) | 2016-03-02 |
Family
ID=49461258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210124734.1A Active CN103375707B (en) | 2012-04-25 | 2012-04-25 | A kind of LED light source board structure of improvement and the LED light source containing this structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103375707B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017148033A1 (en) * | 2016-03-03 | 2017-09-08 | 京东方科技集团股份有限公司 | Display substrate and production method thereof, and display device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101075590A (en) * | 2006-05-17 | 2007-11-21 | 台湾积体电路制造股份有限公司 | Package component |
| JP3138726U (en) * | 2007-10-30 | 2008-01-17 | 齊瀚光電股▲ふん▼有限公司 | Light emitting diode (LED) package structure using aluminum substrate and light emitting diode lamp having this package structure |
| US20090008671A1 (en) * | 2007-07-06 | 2009-01-08 | Lustrous Technology Ltd. | LED packaging structure with aluminum board and an LED lamp with said LED packaging structure |
| CN201428972Y (en) * | 2009-07-12 | 2010-03-24 | 王学邦 | Light-emitting diode lamp cluster |
| CN201526915U (en) * | 2009-10-26 | 2010-07-14 | 沈李豪 | LED spherical bubble lamp shell |
| TWM390543U (en) * | 2009-12-07 | 2010-10-11 | chuan-fu Chen | Device for reducing temperature influence to LED components |
| CN201741694U (en) * | 2010-01-07 | 2011-02-09 | 林礼裕 | Ceramic radiator |
| CN102020963A (en) * | 2010-12-02 | 2011-04-20 | 浙江科创新材料科技有限公司 | High-temperature-resistant and high thermal conductive adhesive and preparation method thereof |
| US20110108881A1 (en) * | 2009-11-06 | 2011-05-12 | Everlight Electronics Co., Ltd. | Method for manufacturing light-emitting diode |
| CN102290384A (en) * | 2010-06-17 | 2011-12-21 | 富士电机株式会社 | Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof |
-
2012
- 2012-04-25 CN CN201210124734.1A patent/CN103375707B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101075590A (en) * | 2006-05-17 | 2007-11-21 | 台湾积体电路制造股份有限公司 | Package component |
| US20090008671A1 (en) * | 2007-07-06 | 2009-01-08 | Lustrous Technology Ltd. | LED packaging structure with aluminum board and an LED lamp with said LED packaging structure |
| JP3138726U (en) * | 2007-10-30 | 2008-01-17 | 齊瀚光電股▲ふん▼有限公司 | Light emitting diode (LED) package structure using aluminum substrate and light emitting diode lamp having this package structure |
| CN201428972Y (en) * | 2009-07-12 | 2010-03-24 | 王学邦 | Light-emitting diode lamp cluster |
| CN201526915U (en) * | 2009-10-26 | 2010-07-14 | 沈李豪 | LED spherical bubble lamp shell |
| US20110108881A1 (en) * | 2009-11-06 | 2011-05-12 | Everlight Electronics Co., Ltd. | Method for manufacturing light-emitting diode |
| TWM390543U (en) * | 2009-12-07 | 2010-10-11 | chuan-fu Chen | Device for reducing temperature influence to LED components |
| CN201741694U (en) * | 2010-01-07 | 2011-02-09 | 林礼裕 | Ceramic radiator |
| CN102290384A (en) * | 2010-06-17 | 2011-12-21 | 富士电机株式会社 | Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof |
| CN102020963A (en) * | 2010-12-02 | 2011-04-20 | 浙江科创新材料科技有限公司 | High-temperature-resistant and high thermal conductive adhesive and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017148033A1 (en) * | 2016-03-03 | 2017-09-08 | 京东方科技集团股份有限公司 | Display substrate and production method thereof, and display device |
| US10128220B2 (en) | 2016-03-03 | 2018-11-13 | Boe Technology Group Co., Ltd. | Display substrate, manufacturing method thereof, display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103375707B (en) | 2016-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20100066230A1 (en) | Heat dissipating structure of led circuit board and led lamp tube comprised thereof | |
| CN103574344B (en) | Light-emitting diode bulb and manufacturing method thereof | |
| CN102297352B (en) | LED (light-emitting diode) lamp based on composite heat-radiating technique | |
| CN101482233A (en) | LED spot light | |
| CN104791736B (en) | A kind of LED light module of liquid-cooling heat radiation | |
| CN202501252U (en) | No-screw type LED bulb lamp | |
| CN203167425U (en) | Metal printed circuit board | |
| CN104565961B (en) | Anti-corrosion LED (Light Emitting Diode) lamp | |
| CN204083920U (en) | A kind of all-round smooth LEDbulb lamp | |
| CN203298086U (en) | High-luminance LED spot lamp | |
| CN201741694U (en) | Ceramic radiator | |
| CN103375707B (en) | A kind of LED light source board structure of improvement and the LED light source containing this structure | |
| CN202736979U (en) | Improved LED light source substrate structure and LED light source comprising same | |
| CN207517729U (en) | The luminous uniform planar LED light source of one kind | |
| CN203757669U (en) | Liquid-cooled LED (light-emitting diode) light module | |
| CN204042774U (en) | One can solder type LED-baseplate | |
| CN102661591A (en) | Novel heat radiating device with thin film circuit for light emitting diode (LED) street lamp | |
| CN201731301U (en) | Powerful radiation type high-power LED explosion-proof lamp | |
| CN203309568U (en) | Led lamp | |
| CN104110590A (en) | Low-thermal-resistance radiating LED lamp | |
| CN201420994Y (en) | Dewing proof LED street lamp | |
| CN202871854U (en) | LED substrate structure | |
| CN201748236U (en) | Improved structure of LED luminaire | |
| CN204573961U (en) | Radiator with embedded lines and LED module | |
| CN204573674U (en) | LEDbulb lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liu Jingsong Inventor after: Liang Yifan Inventor before: Liang Yifan |
|
| COR | Change of bibliographic data | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 27D, Sea View Plaza, No. 18 Taizi Road, Shekou, Nanshan District, Shenzhen City, Guangdong Province, 518067 Patentee after: Aixin Environmental Protection Materials (Shenzhen) Co.,Ltd. Address before: 27D, Sea View Plaza, No. 18 Taizi Road, Shekou, Nanshan District, Shenzhen City, Guangdong Province, 518067 Patentee before: PROVENCE TECHNOLOGY (SHENZHEN) Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |