CN103366954A - Laminated ceramic capacitor - Google Patents
Laminated ceramic capacitor Download PDFInfo
- Publication number
- CN103366954A CN103366954A CN2013101093371A CN201310109337A CN103366954A CN 103366954 A CN103366954 A CN 103366954A CN 2013101093371 A CN2013101093371 A CN 2013101093371A CN 201310109337 A CN201310109337 A CN 201310109337A CN 103366954 A CN103366954 A CN 103366954A
- Authority
- CN
- China
- Prior art keywords
- electrode
- isolated
- electrode part
- interior
- monolithic ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 69
- 238000003475 lamination Methods 0.000 claims abstract description 41
- 239000003990 capacitor Substances 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 153
- 230000000694 effects Effects 0.000 description 25
- 238000000034 method Methods 0.000 description 15
- 238000001354 calcination Methods 0.000 description 12
- 210000001161 mammalian embryo Anatomy 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000005684 electric field Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 101100369068 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) TDA1 gene Proteins 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- AMVVEDHCBDQBJL-UHFFFAOYSA-N [Ca][Zr] Chemical compound [Ca][Zr] AMVVEDHCBDQBJL-UHFFFAOYSA-N 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000032696 parturition Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- -1 polyethylene butyraldehyde Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The invention provides a laminated ceramic capacitor which can satisfy the requirements for miniaturization and large capacitance and can effectively inhibit vibration which causes sound. The central part of the 14th inner electrode layer (13) existing in the center of a lamination direction among 26 inner electrode layers (13) of the laminated ceramic capacitor (10-1) has all parts of a first isolated electrode part (13a) where a continuous electrode part (CEP) coexists with at least one isolated electrode part (IEP) which is not electrically continuous with the continuous electrode part (CEP).
Description
Technical field
The present invention relates to a kind of monolithic ceramic capacitor that comprises capacitor body, this capacitor body has the structure that a plurality of interior electrode layers are formed across the dielectric layer lamination.
Background technology
This monolithic ceramic capacitor can be because along the electric field that produces between the subtend part of the interior electrode layer of lamination direction adjacency, and in the dielectric layer of this internal electrode interlayer, producing the mechanical strain that is caused by electrostriction effect (Electrostrictive effect), thereby in monolithic ceramic capacitor, produce the vibration that is caused by this mechanical strain.In addition, well-known, monolithic ceramic capacitor is being installed in former because described vibration that the what is called that produces under the state of circuit substrate rings.
As the preferred method that suppresses described vibration (described ringing), known following method, namely, (1) utilizes advanced low-k materials to form described dielectric layer and suppress described mechanical strain, (2) be made as shape as described interior electrode layer being divided into two parts, only utilize the part that is formed by the dielectric layer that is present in the middle of these two parts to suppress described mechanical strain (the following patent documentation 1 of reference).
But, according to described method (1), because in order to ensure large electrostatic capacitance, can't avoid the number of plies of interior electrode layer and dielectric layer to increase, so be difficult to satisfy in recent years the demand to miniaturization and large electric capacity.And, according to described method (2), because in order to ensure large electrostatic capacitance, can't avoid the size of monolithic ceramic capacitor to increase, so be difficult to satisfy in recent years the demand to miniaturization and large electric capacity.
[background technology document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid-Open 2004-193352 communique
Summary of the invention
[problem that invention will solve]
The object of the present invention is to provide a kind of monolithic ceramic capacitor that satisfies the demand of miniaturization and large electric capacity and can effectively suppress to become the vibration of the reason of ringing.
[technological means of dealing with problems]
In order to reach described purpose, monolithic ceramic capacitor is characterised in that and comprises: capacitor body has the structure that a plurality of interior electrode layers are formed across the dielectric layer lamination; And at least 1 layer of interior electrode layer that is present at least lamination direction central authorities in described a plurality of interior electrode layer in the central part comprises first isolated all parts of electrode part, these first isolated all parts of electrode part be continuous electrode section, with not and the electrically continuous isolated electrode part coexistence of this continuous electrode section.
[effect of invention]
According to the present invention, owing to have isolated electrode part in first isolated all parts of electrode part, so in the situation that does not all have first isolated all parts of electrode part along the electric field that produces between the subtend part of the interior electrode layer of lamination direction adjacency (at least one has the interior electrode layer of first isolated all parts of electrode part) less than both, thus, in the dielectric layer of this internal electrode interlayer, the mechanical strain that is caused by electrostriction effect reduces, reduce by this mechanical strain, and effectively be suppressed at the vibration that produces in the monolithic ceramic capacitor.Thus, monolithic ceramic capacitor is being installed in the situation of circuit substrate, also can by being suppressed at the vibration that produces in this monolithic ceramic capacitor, effectively suppressing ringing take this vibration as reason.
And, because no matter on the lamination direction the isolated electrode part of one first isolated all parts of electrode part of the interior electrode layer of adjacency (at least one has the interior electrode layer of first isolated all parts of electrode part) and another one with which kind of form subtend, all can between this isolated electrode part and another one, form series capacitance, so utilize this series capacitance to fill up the electric capacity that is formed between the two, and can effectively suppress the electrostatic capacitance reduction of monolithic ceramic capacitor.
In a word, according to the present invention, owing to can satisfy the demand of miniaturization and large electric capacity, and can effectively suppress to become the vibration of the reason of ringing, so can positively reach the purpose of expection.
Described purpose of the present invention and in addition purpose, constitutive characteristic and action effect can understand by following explanation and accompanying drawing.
Description of drawings
Fig. 1 (A) is the longitudinal section of the monolithic ceramic capacitor of broad ways central cutout the first execution mode, and Fig. 1 (B) is the longitudinal section along the B-B line of Fig. 1 (A) of this monolithic ceramic capacitor.
Fig. 2 (A) is the vertical view of the interior electrode layer with first isolated all parts of electrode part in the interior electrode layer shown in Fig. 1 (A) and Fig. 1 (B), Fig. 2 (B) be in the interior electrode layer shown in Fig. 1 (A) and Fig. 1 (B) have first isolated all parts of electrode part and across the vertical view of the interior electrode layer of the interior electrode layer subtend shown in dielectric layer and Fig. 2 (A), Fig. 2 (C) is the enlarged drawing that first shown in Fig. 2 (A) and Fig. 2 (B) isolates all parts of electrode part.
Fig. 3 (A) and Fig. 3 (B) are the key diagrams that utilizes the reduction of the electrostatic capacitance that the isolated electrode part of first isolated all parts of electrode part realizes to suppress.
Fig. 4 (A) and Fig. 4 (B) are the longitudinal sections corresponding with Fig. 1 (A) and Fig. 1 (B) of the variation example of the monolithic ceramic capacitor shown in presentation graphs 1 (A) and Fig. 1 (B).
Fig. 5 (A) is the longitudinal section of the monolithic ceramic capacitor of broad ways central cutout the second execution mode, and Fig. 5 (B) is the longitudinal section along the B-B line of Fig. 5 (A) of this monolithic ceramic capacitor.
Fig. 6 (A) is the vertical view of the interior electrode layer with first isolated all parts of electrode part and second isolated all parts of electrode part in the interior electrode layer shown in Fig. 5 (A) and Fig. 5 (B), Fig. 6 (B) is that first isolated all parts of electrode part and second that have in the interior electrode layer shown in Fig. 5 (A) and Fig. 5 (B) isolate all parts of electrode part, and across the vertical view of the interior electrode layer of the interior electrode layer subtend shown in dielectric layer and Fig. 6 (A), Fig. 6 (C) is the enlarged drawing of isolated all parts of electrode part of second shown in Fig. 2 (A) and Fig. 2 (B).
Fig. 7 (A) and Fig. 7 (B) are the key diagrams of the formation method of isolated all parts of electrode part of second shown in Fig. 6 (A) and Fig. 6 (B).
Fig. 8 (A) and Fig. 8 (B) are the vertical views corresponding with Fig. 6 (A) and Fig. 6 (B) of the variation example of the interior electrode layer shown in presentation graphs 6 (A) and Fig. 6 (B).
Fig. 9 (A) and Fig. 9 (B) are the vertical views corresponding with Fig. 6 (A) and Fig. 6 (B) of other variation examples of the interior electrode layer shown in presentation graphs 6 (A) and Fig. 6 (B).
Figure 10 (A) and Figure 10 (B) are the interior electrode layer shown in presentation graphs 6 (A) and Fig. 6 (B) and then the vertical views corresponding with Fig. 6 (A) and Fig. 6 (B) other variation examples.
Figure 11 is the longitudinal section corresponding with Fig. 5 (B) with monolithic ceramic capacitor of the interior electrode layer shown in Figure 10 (A) and Figure 10 (B).
Figure 12 (A) and Figure 12 (B) are the vertical views corresponding with Fig. 6 (A) and Fig. 6 (B) of other variation examples of the interior electrode layer shown in presentation graphs 6 (A) and Fig. 6 (B).
Figure 13 (A) and Figure 13 (B) are the longitudinal sections corresponding with Fig. 5 (A) and Fig. 5 (B) of the variation example of the monolithic ceramic capacitor shown in presentation graphs 5 (A) and Fig. 5 (B).
[explanation of symbol]
10-1,10-2 monolithic ceramic capacitor
11 capacitor bodies
12 outer electrodes
13 interior electrode layers
13a first isolated all parts of electrode part
13b second isolated all parts of electrode part
14 dielectric layers
C1 electric capacity
C2 electric capacity
C2 ' electric capacity
C3 electric capacity
CL cuts off line
The Cs series capacitance
Cs ' series capacitance
CEP continuous electrode section
CEPa continuous electrode section
CEPb continuous electrode section
The DL dielectric is given birth to embryo
The H1 height
The H2 height
The H3 height
L1 length
L2 length
L3 length
L4 length
L5 length
IEP isolates electrode part
IEPa isolates electrode part
IEPb isolates electrode part
The 3D region that TDA1 is corresponding with lamination direction central authorities
The PL internal electrode pattern
The PLa coating portion
The TH through hole
The W1 width
The W2 width
The W3 width
The W4 width
The W5 width
Embodiment
" the first execution mode "
The structure of＜monolithic ceramic capacitor 10-1 〉
At first, the structure of monolithic ceramic capacitor 10-1 described.Monolithic ceramic capacitor 10-1 shown in Fig. 1 (A) and Fig. 1 (B) comprises: the capacitor body 11 of rectangular shape roughly, and the reference dimension of length, width and height has the relation of length＞width=height or the relation of length＞width＞height; Reach 1 pair of outer electrode 12, be arranged on the length direction both ends of this capacitor body 11.
Each internal electrode 13 comprises the metals such as nickel, copper, palladium, silver, and thickness separately is about 1 μ m, and has roughly the same essentially rectangular shape profile.The left side from the interior electrode layer 13 of upper several odd-levels in 26 layers of interior electrode layer 13 is electrically connected at the outer electrode 12 in left side, and is electrically connected at the outer electrode 12 on right side from the right of the interior electrode layer 13 of upper several even levels.
Each dielectric layer 14, boundary and downside border comprise the ferroelectrics such as barium titanate, strontium titanates, calcium titanate, magnesium titanate, calcium zirconate, zirconium calcium titanate, barium zirconate, titanium oxide, the thickness of each dielectric layer 14 is about 1 μ m, and the thickness on boundary and downside border is about 40 μ m.
As shown in Figure 1, the 14 layers of interior electrode layer 13 that are present in lamination direction central authorities in 26 layers of interior electrode layer 13 in the central part have following first isolated all part 13a of electrode part.Fig. 2 (A) expression have in 14 layers of interior electrode layer 13 of first isolated all part 13a of electrode part in Fig. 1 from the upper surface of interior electrode layer 13 of several odd-levels, Fig. 2 (B) represent in these 14 layers of interior electrode layers 13 in Fig. 1 from the upper surface of interior electrode layer 13 of several even levels.
The TDA1 that represents with 2 chain lines among Fig. 1 represents the 3D region corresponding with " lamination direction central authorities " in the preceding paragraph, this 3D region is the length of the subtend part of the interior electrode layer 13 of adjacency to be made as L1 on the lamination direction, width is made as W1, when the height that 26 layers of interior electrode layer 13 are existed is made as H1, by the size that deducts L2 and L3 gained from length L 1, from width W1 deduct W2 and W3 gained size, and to deduct the size of H2 and H3 gained from height H 1 roughly out specific.And " its middle body " in the preceding paragraph is by the size that deducts L2 and L3 gained from length L 1 and to deduct the size of W2 and W3 gained from width W1 roughly out specific.In addition, preferably the size of L2 and L3 in 30～50% scope of length L 1, preferably the size of W2 and W3 in 5～50% scope of width W 1, and preferably the size of H2 and H3 in 5～50% scope of height H 1.
Shown in Fig. 2 (C), although first isolated all part 13a of electrode part refer to have the electrically continuous CEP of continuous electrode section of a plurality of through hole TH of all size, with not and electrically continuous at least 1 part that isolated electrode part IEP coexists of the CEP of this continuous electrode section.This Fig. 2 (C) is based on the image (multiplying power is 1000 times) that utilizes scanning electron microscope (Scanning Electron Microscope) observation to get as first isolated all part 13a of electrode part of preproduction, result according to the observation, the location of isolated electrode part IEP is the inboard of slightly large through hole TH, and the shape of isolated electrode part IEP and size are various.
The preferred method for making example of＜monolithic ceramic capacitor 10-1 〉
Then, the preferred method for making example of described monolithic ceramic capacitor 10-1 described.When making, prepare: internal electrode is with sticking with paste (paste), comprises nickel by powder, terpinol (solvent), forms ethyl cellulose (adhesive), and the various additives such as dispersant of residual carbon easily; And dielectric layer is with slurry (slurry), comprises barium titanate powder, ethanol (solvent), polyethylene butyraldehyde (adhesive), and various additives such as dispersant.And, with specific thicknesses coating dielectric layer slurry, and carry out drying, give birth to embryo (dielectric green sheet) and make dielectric, and arrange and will give birth on the embryo with sticking with paste layer printing to this dielectric with the internal electrode that unit are obtains the essentially rectangular profile of quantity corresponding to quantity according to matrix, and carry out drying, give birth to embryo and make with the dielectric of internal electrode pattern.And, the dielectric with internal electrode pattern of giving birth to embryo, certain number with the dielectric of certain number give birth to embryo, and the dielectric of certain number give birth to embryo mode arranged side by side and sequentially carry out lamination and be laminated, do not calcine laminate and make.Then, will not calcine laminate and cut into clathrate, and make the not calcining chip corresponding with capacitor body 11.Then, a plurality of chips of not calcining are fed into calciner, divide to plant at the specified temp corresponding with described nickel by powder and described barium titanate powder and calcine (comprising the processing of unsticking mixture and calcination processing).And, through the length direction both ends coating of the chip of calcining with internal electrode with the outer electrode of sticking with paste roughly the same composition with sticking with paste, implement to burn attached processing, and make 1 pair of outer electrode.
In this method for making example, key point is that the unsticking mixture of the described calcination process temperature hold-time in processing is shortened, the carbon residual quantity of the lamination direction central authorities of not calcining chip is raise, burn by the residual carbon in the calcination processing, and the strong reducing environment of formation locality, carry out the sintering of dielectric layer, and realize spheroidizing and the successional reduction of interior electrode layer.Thus, form with first at the middle body through a plurality of interior electrode layers of the lamination direction central authorities of the chip of calcining and isolate part corresponding to all part 13a of electrode part.
＜effect, the effect of utilizing monolithic ceramic capacitor 10-1 to obtain 〉
As mentioned above, the middle body of the 14 layer interior electrode layer 13 being present in lamination direction central authorities of monolithic ceramic capacitor 10-1 in 26 layers of interior electrode layer 13 has first isolated all part 13a of electrode part, these first isolated all part 13a of electrode part be the CEP of continuous electrode section, with not and electrically continuous at least 1 the isolated electrode part IEP coexistence of the CEP of this continuous electrode section.
That is to say, owing to have at least 1 isolated electrode part IEP at each first isolated all part 13a of electrode part, so all do not have the situation of first isolated all part 13a of electrode part less than both along the electric field that produces between the subtend part of the interior electrode layer 13 of lamination direction adjacency (at least one has the interior electrode layer 13 of first isolated all part 13a of electrode part), thus, in the dielectric layer of 13 of this interior electrode layers, the mechanical strain that is caused by electrostriction effect reduces, reduce by this mechanical strain, and effectively be suppressed at the vibration that produces among the monolithic ceramic capacitor 10-1.Thus, monolithic ceramic capacitor 10-1 is being installed in the situation of circuit substrate, also can by being suppressed at the vibration that produces among this monolithic ceramic capacitor 10-1, effectively suppressing ringing take this vibration as reason.
And, owing to have at least 1 isolated electrode part IEP at each first isolated all part 13a of electrode part, so in the interior electrode layer 13 (at least one has first isolated all part 13a of electrode part) of lamination direction adjacency, can obtain isolated electrode part IEP and the CEP of continuous electrode section of another first isolated all part 13a of electrode part and the form of isolated electrode part IEP subtend of one first isolated all part 13a of electrode part, the form of the CEP of the continuous electrode section subtend of the isolated electrode part IEP of one first isolated all part 13a of electrode part and another first isolated all part 13a of electrode part, the form of the isolated electrode part IEP subtend of the isolated electrode part IEP of one first isolated all part 13a of electrode part and another first isolated all part 13a of electrode part, or the form of the isolated electrode part IEP of one first isolated all part 13a of electrode part and interior electrode layer 13 subtends that do not have first isolated all part 13a of electrode part etc.
That is to say, because no matter on the lamination direction the isolated electrode part IEP of one first isolated all part 13a of electrode part of the interior electrode layer 13 of adjacency (at least one has the interior electrode layer 13 of first isolated all part 13a of electrode part) and another one with which kind of form subtend, between this isolated electrode part IEP and another one, all can form series capacitance, so utilize this series capacitance to fill up the electric capacity that is formed between the two, and can effectively suppress the electrostatic capacitance reduction of monolithic ceramic capacitor 10-1.
Utilize Fig. 3 (A) and Fig. 3 (B) that the inhibition of the electrostatic capacitance reduction of the preceding paragraph is described particularly herein.The CEPb of continuous electrode section of the isolated electrode part IEPa of first isolated all part 13a of electrode part of Fig. 3 (A) expression upside and first isolated all part 13a of electrode part of downside and the state of isolated electrode part IEPb subtend.Under this state, generation capacitor C 1 between the isolated electrode part IEPa of first isolated all part 13a of electrode part of upside and the CEPa of continuous electrode section, generation capacitor C 2 between the CEPb of continuous electrode section of the isolated electrode part IEPa of first isolated all part 13a of electrode part of upside and first isolated all part 13a of electrode part of downside, between the isolated electrode part IEPb of the isolated electrode part IEPa of first isolated all part 13a of electrode part of upside and first isolated all part 13a of electrode part of downside, produce capacitor C 2 ', generation capacitor C 3 between the isolated electrode part IEPb of first isolated all part 13a of electrode part of downside and the CEPb of continuous electrode section.
The series capacitance Cs that capacitor C 1 and capacitor C 2 form as the upside of Fig. 3 (B) shown in, capacitor C 1, capacitor C 2 ' with the capacitor C 3 series capacitance Css ' of formation shown in the downside of Fig. 3 (B).Be formed on the first electric capacity that isolates between all part 13a of electrode part that first of upside isolates all part 13a of electrode part and downside because these series capacitances Cs and Cs ' fill up, reduce so can effectively suppress the electrostatic capacitance of monolithic ceramic capacitor 10-1.
Although the diagram of omission, but isolate at the isolated electrode part IEPa of first isolated all part 13a of electrode part of upside and first of downside in the situation of the CEPb of continuous electrode section subtend of all part 13a of electrode part, also can form at least series capacitance Cs, and, isolate at the isolated electrode part IEPa of first isolated all part 13a of electrode part of upside and first of downside in the situation of isolated electrode part IEPb subtend of all part 13a of electrode part, also can form at least series capacitance Cs ', in addition, in the situation of the isolated electrode part IEPa of first isolated all part 13a of electrode part of upside and internal electrode 13 subtends of first isolated all the part 13a of electrode part that do not have downside, also can form series capacitance Cs, therefore, the electrostatic capacitance that in these cases, also can effectively suppress monolithic ceramic capacitor 10-1 reduces.
In a word, according to described monolithic ceramic capacitor 10-1, owing to can satisfy the demand of miniaturization and large electric capacity, and can effectively suppress to become the vibration of the reason of ringing, so can positively reach the purpose of expection.
The variation example of＜monolithic ceramic capacitor 10-1 〉
In the above description, represented that the middle body of the 14 layers of interior electrode layer 13 that are present in lamination direction central authorities in 26 layers of interior electrode layer 13 has the monolithic ceramic capacitor 10-1 of first isolated all part 13a of electrode part, but, have when the middle body of 1 layer～13 layers of interior electrode layer 13 that are being present in lamination direction central authorities in the situation of first isolated all part 13a of electrode part, middle body at 15 layers～25 layers of interior electrode layer 13 that are present in lamination direction central authorities has in the situation of first isolated all part 13a of electrode part, or have at 26 layers of interior electrode layer, 13 whole middle bodies in the situation of first isolated all part 13a of electrode part (with reference to Fig. 4 (A) and Fig. 4 (B)), also can obtain and described identical effect, effect.
" the second execution mode "
At first, the structure of monolithic ceramic capacitor 10-2 described.Fig. 5 (A), and Fig. 5 (B) shown in monolithic ceramic capacitor 10-2 monolithic ceramic capacitor 10-1 textural and the first execution mode different aspect be as shown in Figure 5,14 layers of interior electrode layer 13 that are present in lamination direction central authorities in 26 layers of interior electrode layer 13 also have following second isolated all part 13b of electrode part at its peripheral part except part in the central has first isolated all part 13a of electrode part.
Fig. 6 (A) expression comprise in 14 layers of interior electrode layer 13 of first isolated all part 13a of electrode part and second isolated all part 13b of electrode part in Fig. 5 from the upper surface of interior electrode layer 13 of several odd-levels, Fig. 6 (B) represent in these 14 layers of interior electrode layers 13 in Fig. 5 from the upper surface of interior electrode layer 13 of several even levels.According to these figure as can be known, second isolated all part 13b of electrode part are arranged on the 3 limit parts except outside electrode fillet of 14 layers of interior electrode layer 13 that are present in lamination direction central authorities.
" its peripheral part " in upper the preceding paragraph be by the size of the L4 that is set in length L 1 both sides and L5 and be set in the W4 of width W 1 both sides and the size of W5 roughly out specific.In addition, preferably the size of L4 and L5 in 0.1～5% scope of length L 1, and preferably the size of W4 and W5 in 0.1～10% scope of width W 1.
Shown in Fig. 6 (C), although second isolated all part 13b of electrode part refer to have the electrically continuous CEP of continuous electrode section of a plurality of through hole TH of all size, with not and electrically continuous at least 1 part that isolated electrode part IEP coexists of the CEP of this continuous electrode section.This Fig. 6 (C) is based on the image (multiplying power is 1000 times) that utilizes scanning electron microscope (Scanning Electron Microscope) observation to get as second isolated all part 13b of electrode part of preproduction, result according to the observation, the location of isolated electrode part IEP is the inboard of slightly large through hole TH or the inboard that is formed on the slightly large recess (without symbol) of periphery, and the shape of isolated electrode part IEP and size are various.
The preferred method for making example of＜monolithic ceramic capacitor 10-2 〉
Then, to the preferred method for making example of described monolithic ceramic capacitor 10-2, especially from the preferred method for making example of described＜monolithic ceramic capacitor 10-1 different place describes.
Preferred method for making example at described＜monolithic ceramic capacitor 10-1〉" step of embryo is given birth in making with the dielectric of internal electrode pattern " in, shown in Fig. 7 (A) and Fig. 7 (B), give birth to the whole part (hereinafter referred to as coating portion PLa) that forms the thickness attenuation of this internal electrode pattern PL of periphery of the internal electrode pattern PL on the embryo DL in dielectric.This coating portion PLa be except being the part of thickness along with laterally and gradually attenuation, also can be whole all thin parts or produces the part that polishing scratch is arranged at periphery.And the formation of this coating portion PLa can be regulated with the viscosity of sticking with paste or print speed printing speed is regulated (such as silk screen printing time scraper speed) etc. and realized simply by internal electrode.In addition, the CL shown in Fig. 7 (A) and Fig. 7 (B) is the preferred method for making example of described＜monolithic ceramic capacitor 10-1〉" will not calcine laminate and cut into cancellate step " in the cut-out line.
If this coating portion PLa is arranged in internal electrode pattern PL, so in the preferred method for making example of described＜monolithic ceramic capacitor 10-1〉" step of calcining not calcining chip " in, because the thin thickness of this coating portion PLa, so realize easily spheroidizing and successional reduction in the calcination processing, thus, form with second at the peripheral part through a plurality of interior electrode layers of the lamination direction central authorities of the chip of calcining and isolate part corresponding to all part 13b of electrode part.
＜effect, the effect of utilizing monolithic ceramic capacitor 10-2 to obtain 〉
As mentioned above, the middle body of the 14 layer interior electrode layer 13 being present in lamination direction central authorities of monolithic ceramic capacitor 10-2 in 26 layers of interior electrode layer 13 has first isolated all part 13a of electrode part, these first isolated all part 13a of electrode part are the CEP of continuous electrode section, with not with electrically continuous at least 1 the isolated electrode part IEP coexistence of the CEP of this continuous electrode section, and the peripheral part at these 14 layers of interior electrode layers 13 has second isolated all part 13b of electrode part, and these second isolated all part 13b of electrode part are the CEP of continuous electrode section, with not with electrically continuous at least 1 the isolated electrode part IEP coexistence of the CEP of this continuous electrode section.
That is to say, owing to have at least 1 isolated electrode part IEP at each first isolated all part 13a of electrode part and each second isolated all part 13b of electrode part, so in the situation that does not all have first isolated all part 13a of electrode part and second isolated all part 13b of electrode part along the electric field that produces between the subtend part of the interior electrode layer 13 of lamination direction adjacency (at least one has the interior electrode layer 13 of first isolated all part 13a of electrode part) less than both, thus, in the dielectric layer of 13 of this interior electrode layers, the mechanical strain that is caused by electrostriction effect reduces, reduce by this mechanical strain, and effectively be suppressed at the vibration that produces among the monolithic ceramic capacitor 10-2.Thus, monolithic ceramic capacitor 10-2 is being installed in the situation of circuit substrate, also can by being suppressed at the vibration that produces among this monolithic ceramic capacitor 10-2, effectively suppressing ringing take this vibration as reason.
And, owing to have at least 1 isolated electrode part IEP at each first isolated all part 13a of electrode part and each second isolated all part 13b of electrode part, so in the interior electrode layer 13 (at least one has first isolated all part 13a of electrode part) of lamination direction adjacency, except in described＜effect of utilizing monolithic ceramic capacitor 10-1 to obtain, effect〉described in form beyond, the isolated electrode part IEP that also can obtain one second isolated all part 13b of electrode part and the CEP of continuous electrode section of another second isolated all part 13b of electrode part and isolate the form of electrode part IEP subtend, the form of the CEP of the continuous electrode section subtend of the isolated electrode part IEP of one second isolated all part 13b of electrode part and another second isolated all part 13b of electrode part, the form of the isolated electrode part IEP subtend of the isolated electrode part IEP of one second isolated all part 13b of electrode part and another second isolated all part 13b of electrode part, or the form of the isolated electrode part IEP of one second isolated all part 13b of electrode part and interior electrode layer 13 subtends that do not have second isolated all part 13b of electrode part etc.
That is to say, because no matter on the lamination direction the isolated electrode part IEP of one first isolated all part 13a of electrode part of the interior electrode layer 13 of adjacency (at least one has the interior electrode layer 13 of first isolated all part 13a of electrode part) and another one with which kind of form subtend, between this isolated electrode part IEP and another one, all can form series capacitance, fill up the electric capacity that is formed between the two so utilize this series capacitance, and the electrostatic capacitance that can effectively suppress monolithic ceramic capacitor 10-2 reduces, and because no matter on the lamination direction the isolated electrode part IEP of one second isolated all part 13b of electrode part of the interior electrode layer 13 of adjacency (at least one has the interior electrode layer 13 of second isolated all part 13b of electrode part) and another one with which kind of form subtend, between this isolated electrode part IEP and another one, all can form series capacitance, so utilize this series capacitance to fill up the electric capacity that is formed between the two, and can effectively suppress the electrostatic capacitance reduction of monolithic ceramic capacitor 102.Since the inhibitory action that the latter's electrostatic capacitance reduces with utilize Fig. 3 (A) and Fig. 3 (B) in described＜effect, effect of utilizing monolithic ceramic capacitor 10-1 to obtain in the content of explanation basic identical, so omission explanation herein.
In addition, because the periphery of each interior electrode layer 13 produces concentrating of electric field because of edge effect easily, so following worry is arranged, namely, increase between the periphery of the dielectric layer 14 of 13 of this interior electrode layers and the mechanical strain that is caused by electrostriction effect of Outboard Sections thereof, and produce the crack at the Outboard Sections of the periphery of this dielectric layer 14.But, form aforesaid series capacitance owing to have the interior electrode layer 13 of second isolated all part 13b of electrode part, so the concentrated of electric field that is caused by edge effect is eased, thus, the periphery of dielectric layer 14 and the mechanical strain that is caused by electrostriction effect of Outboard Sections thereof are reduced, and can eliminate the worry that produces the crack at the Outboard Sections of the periphery of this dielectric layer 14.
The variation example of＜monolithic ceramic capacitor 10-2 〉
In the above description, represented that second isolated all part 13b of electrode part are arranged on the monolithic ceramic capacitor 10-2 of the 3 limit parts except outside electrode fillet of 14 layers of interior electrode layer 13 that are present in lamination direction central authorities, but be arranged at second isolated all part 13b of electrode part in the situation of 14 layers of interior electrode layer 13 and 2 limit parts outer electrode fillet adjacency that are present in lamination direction central authorities (with reference to Fig. 8 (A) and Fig. 8 (B)), second isolated all part 13b of electrode part are arranged in the situation on 14 layers of interior electrode layer 13 and 1 limit outer electrode fillet adjacency that is present in lamination direction central authorities (with reference to Fig. 9 (A) and Fig. 9 (B), and Figure 10 (A) and Figure 10 (B)), or second isolated all part 13b of electrode part be arranged in the situation of 14 layers of interior electrode layer 13 and 1 limit part outer electrode fillet subtend that is present in lamination direction central authorities (with reference to Figure 12 (A) and Figure 12 (B)), also can obtain and described identical effect, effect.
Especially shown in Figure 10 (A) and Figure 10 (B), even if be interior electrode layer 13 and 1 limit outer electrode fillet adjacency, in the situation of the asymmetric 2 kinds of interior electrode layers 13 in position of second isolated all part 13b of electrode part, as shown in figure 11, also can be made into the structure every 1 layer of ground is present in the left and right sides among the figure as second isolated all part 13b of electrode part.
In addition, in the above description, represented that the peripheral part of the 14 layers of interior electrode layer 13 that are present in lamination direction central authorities in 26 layers of interior electrode layer 13 has the monolithic ceramic capacitor 10-2 of second isolated all part 13b of electrode part, but with first isolated all part 13a of electrode part similarly, have when the peripheral part of 1 layer～13 layers of interior electrode layer 13 that are being present in lamination direction central authorities in the situation of second isolated all part 13b of electrode part, peripheral part at 15 layers～25 layers of interior electrode layer 13 that are present in lamination direction central authorities has in the situation of second isolated all part 13b of electrode part, or have at 26 layers of interior electrode layer, 13 whole peripheral parts in the situation of first isolated all part 13a of electrode part (with reference to Figure 13 (A) and Figure 13 (B)), also can obtain and described identical effect, effect.
Claims (8)
1. monolithic ceramic capacitor is characterized in that comprising:
Capacitor body has the structure that a plurality of interior electrode layers are formed across the dielectric layer lamination; And
At least 1 layer of interior electrode layer that is present at least lamination direction central authorities in described a plurality of interior electrode layer in the central part has first isolated all parts of electrode part, these first isolated all parts of electrode part be continuous electrode section, with not and the electrically continuous isolated electrode part coexistence of this continuous electrode section.
2. monolithic ceramic capacitor according to claim 1 is characterized in that:
Described first isolated all parts of electrode part are arranged among described a plurality of interior electrode layers whole.
3. monolithic ceramic capacitor according to claim 1 is characterized in that:
At least 1 limit part of at least 1 layer of interior electrode layer that is present at least lamination direction central authorities in described a plurality of interior electrode layer in its peripheral part has second isolated all parts of electrode part, these second isolated all parts of electrode part be continuous electrode section, with not and the electrically continuous isolated electrode part coexistence of this continuous electrode section.
4. monolithic ceramic capacitor according to claim 3 is characterized in that:
Described second isolated all parts of electrode part are arranged among described a plurality of interior electrode layers whole.
5. it is characterized in that according to claim 3 or 4 described monolithic ceramic capacitors:
Described a plurality of interior electrode layer has the essentially rectangular profile, and described second isolated all parts of electrode part are arranged on the 3 limit parts except outside electrode fillet of interior electrode layer.
6. it is characterized in that according to claim 3 or 4 described monolithic ceramic capacitors:
Described a plurality of interior electrode layer has the essentially rectangular profile, and described second isolated all parts of electrode part are arranged on interior electrode layer and 2 limit parts outer electrode fillet adjacency.
7. it is characterized in that according to claim 3 or 4 described monolithic ceramic capacitors:
Described a plurality of interior electrode layer has the essentially rectangular profile, and described second isolated all parts of electrode part are arranged on interior electrode layer and 1 limit part outer electrode fillet adjacency.
8. it is characterized in that according to claim 3 or 4 described monolithic ceramic capacitors:
Described a plurality of interior electrode layer has the essentially rectangular profile, and described second isolated all parts of electrode part are arranged on interior electrode layer and 1 limit part outer electrode fillet subtend.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012079613A JP5620938B2 (en) | 2012-03-30 | 2012-03-30 | Multilayer ceramic capacitor |
| JP2012-079613 | 2012-03-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103366954A true CN103366954A (en) | 2013-10-23 |
| CN103366954B CN103366954B (en) | 2016-04-20 |
Family
ID=49368092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310109337.1A Active CN103366954B (en) | 2012-03-30 | 2013-03-29 | Monolithic ceramic capacitor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5620938B2 (en) |
| CN (1) | CN103366954B (en) |
| TW (1) | TWI482185B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210074476A1 (en) * | 2019-09-09 | 2021-03-11 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101983154B1 (en) * | 2013-11-05 | 2019-05-28 | 삼성전기주식회사 | Multi-Layered Ceramic Capacitor |
| JP2016127262A (en) * | 2014-12-26 | 2016-07-11 | 太陽誘電株式会社 | Feedthrough multilayer ceramic capacitor |
| JP6971036B2 (en) * | 2017-01-27 | 2021-11-24 | 京セラ株式会社 | Laminated electronic components |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0982558A (en) * | 1995-09-18 | 1997-03-28 | Murata Mfg Co Ltd | Multilayer ceramic electronic component |
| JP2010040624A (en) * | 2008-08-01 | 2010-02-18 | Panasonic Corp | Multilayer ceramic electronic component and its manufacturing method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05166667A (en) * | 1991-12-19 | 1993-07-02 | Matsushita Electric Ind Co Ltd | Manufacture of laminated ceramic capacitor |
| JPH08316087A (en) * | 1995-05-11 | 1996-11-29 | Tokin Corp | Laminated ceramic electronic component and its manufacturing |
| JP2000012377A (en) * | 1998-06-17 | 2000-01-14 | Murata Mfg Co Ltd | Laminated ceramic electronic component and manufacture of the same |
| JP4793168B2 (en) * | 2006-03-31 | 2011-10-12 | 株式会社村田製作所 | Multilayer capacitor and multilayer capacitor mounting structure |
| US8446705B2 (en) * | 2008-08-18 | 2013-05-21 | Avx Corporation | Ultra broadband capacitor |
| JP2011134832A (en) * | 2009-12-24 | 2011-07-07 | Kyocera Corp | Stacked ceramic capacitor and method of manufacturing the same |
-
2012
- 2012-03-30 JP JP2012079613A patent/JP5620938B2/en active Active
-
2013
- 2013-03-28 TW TW102111243A patent/TWI482185B/en active
- 2013-03-29 CN CN201310109337.1A patent/CN103366954B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0982558A (en) * | 1995-09-18 | 1997-03-28 | Murata Mfg Co Ltd | Multilayer ceramic electronic component |
| JP2010040624A (en) * | 2008-08-01 | 2010-02-18 | Panasonic Corp | Multilayer ceramic electronic component and its manufacturing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210074476A1 (en) * | 2019-09-09 | 2021-03-11 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
| US11495404B2 (en) * | 2019-09-09 | 2022-11-08 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201351463A (en) | 2013-12-16 |
| CN103366954B (en) | 2016-04-20 |
| JP5620938B2 (en) | 2014-11-05 |
| JP2013211357A (en) | 2013-10-10 |
| TWI482185B (en) | 2015-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6812477B2 (en) | Multilayer ceramic capacitors, manufacturing methods for multilayer ceramic capacitors, and mounting boards for multilayer ceramic capacitors | |
| JP7227690B2 (en) | Multilayer ceramic capacitor and manufacturing method thereof | |
| CN104103423B (en) | Multilayer ceramic capacitor and method of manufacturing the same | |
| CN102652343B (en) | Lamination type ceramic electronic part | |
| JP5825322B2 (en) | Multilayer ceramic capacitor, method for manufacturing the same, and mounting substrate for multilayer ceramic capacitor | |
| CN102640240B (en) | Laminated ceramic capacitor | |
| JP2007243040A (en) | Laminated ceramic electronic component | |
| JP6869677B2 (en) | Multilayer ceramic capacitors and their manufacturing methods | |
| JP2012253245A (en) | Multilayer electronic component and manufacturing method of the same | |
| CN103366954B (en) | Monolithic ceramic capacitor | |
| JP2017212272A (en) | Multilayer ceramic capacitor | |
| US11031186B2 (en) | Capacitor component | |
| JP4586831B2 (en) | CERAMIC GREEN SHEET STRUCTURE AND METHOD FOR PRODUCING MULTILAYER CERAMIC ELECTRONIC COMPONENT | |
| JP2011124540A (en) | Stacked ceramic capacitor and method of manufacturing the same | |
| CN103887062B (en) | Multilayer ceramic capacitor and its manufacture method | |
| JP2005174974A (en) | Manufacturing method for laminated piezoelectric body | |
| JP2000150292A (en) | Layered ceramic capacitor | |
| JP2015130475A (en) | Multilayer ceramic capacitor and manufacturing method therefor | |
| JP2005101317A (en) | Ceramic electronic component and its manufacturing method | |
| JP4432450B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| KR101771737B1 (en) | Laminated ceramic electronic parts and fabricating method thereof | |
| JP4882778B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| KR20150005577A (en) | Laminated ceramic capacitor | |
| JP4729993B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| JP4431895B2 (en) | Manufacturing method of laminated electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |