JPH05166667A - Manufacture of laminated ceramic capacitor - Google Patents

Abstract

PURPOSE:To provide the manufacturing method of a laminated ceramic capacitor wherein, even when the thickness of an internal electrode layer is made thin, a drop in its electrostatic capacity, an increase in its irregularity and an increase in its equivalent series resistance are hard to occur the manufacturing method of the laminated ceramic capacitor which is used in various electronic circuits. CONSTITUTION:In a process to form internal electrode layers 12, continuous stripe-shaped or mesh-shaped protruding and recessed parts are executed to the surface of a ceramic green sheet 11; after that, the internal electrode layers 12 are formed. Thereby, islands are hard to form in the internal electrode layers 12, and it is possible to restrain that defects of the title capacitor such as a drop in its electrostatic capacity, an increase in its irregularity and an increase in its equivalent series resistance are caused.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a monolithic ceramic capacitor used in various electronic circuits.

[0002]

2. Description of the Related Art In recent years, with the miniaturization of electronic equipment, the demand for chip-type electronic components as a device for high-density surface mounting of electronic circuits has expanded, and monolithic ceramic capacitors are known as thin-layer / high-multilayer ceramic capacitors. It has become widely used due to its higher capacity than that of a disk-type ceramic capacitor and its high reliability due to the ceramic-metal integrated structure.

Various methods are used as a method for forming a laminated structure of a laminated ceramic capacitor, but in general, it is manufactured by the following steps. A. Method of printing a metal paste on a ceramic green sheet (1) A step of forming a ceramic dielectric green sheet by a doctor blade method, a reverse roll coater method, a printing method, or the like.

(2) A step of forming an internal electrode by applying a metal paste such as Pd on the ceramic green sheet by a printing method or the like.

(3) A step of sequentially stacking the ceramic green sheets having the internal electrodes formed thereon so as to have a laminated structure which can be alternately connected to the opposing external electrodes, and then pressurizing and pressing. B. Method of forming ceramic green sheet on printed metal paste (1) Pd on carrier such as base film by printing method
A step of applying a metal paste such as to form internal electrodes.

(2) A step of forming a ceramic dielectric green sheet on a carrier such as a base film having internal electrodes formed thereon by a doctor blade method, a reverse roll coater method, a printing method or the like.

(3) A step of sequentially stacking the ceramic green sheets with the internal electrodes buried therein, forming a laminated structure capable of connecting to the opposing external electrodes, and then applying pressure and pressure.

A conventional example of a method for forming a laminated structure in a method for manufacturing a laminated ceramic capacitor will be described below with reference to the drawings.

FIG. 11 is a sectional view showing a method for forming a laminated structure of the conventional method A, and FIG. 12 is a perspective view of the same. Figure 1
1 and FIG. 12, 1 is a ceramic green sheet, 2 is an internal electrode layer formed by applying a metal paste onto the ceramic green sheet 1 by a method such as screen printing, and 3 is a ceramic green having the internal electrode layer 2 formed thereon. It is a laminated molded body obtained by laminating and press-bonding the sheet 1.

Here, the ceramic dielectric green sheet 51 formed by the doctor blade method, the reverse roll coater method, the printing method or the like (FIGS. 11A and 12).
A metal paste such as Pd is applied to (a)) by a printing method or the like to form the internal electrode layer 52 (FIG. 11B, FIG. 1).
2 (b)). In FIG. 12B, a ceramic green sheet one layer below is also shown to show the opposing internal electrode layers.

Next, the ceramic green sheets 1 are sequentially stacked so that the formed internal electrode layers 2 are alternately connected to the opposing terminal electrodes to obtain a laminated structure of a laminated ceramic capacitor (FIG. 11 (c), FIG. 12 (c)). Although an example of stacking the ceramic green sheets on which the internal electrodes have been formed is shown here, it is possible to combine the internal electrode forming step and the stacking step to stack the ceramic green sheets without the internal electrodes and form the internal electrodes. A laminated structure may be obtained by repeating it alternately.

FIG. 13 is a sectional view showing a method for forming a laminated structure according to the conventional method B. In FIG. 13, 4 is a base film that serves as a carrier for forming internal electrodes and ceramic dielectric layers, and 5 is an internal electrode layer formed by applying a metal paste on the base film 4 by a method such as screen printing. 6 is a ceramic dielectric layer formed by a doctor blade method, a reverse roll coater method, a printing method or the like on the base film 4 on which the internal electrode layer 5 is formed, and 7 is a ceramic green sheet in which the internal electrode layer 5 is embedded.
It is a laminated molded body obtained by pressure bonding.

Here, the internal electrode layer 5 is formed on the base film 4 made of polyethylene terephthalate by a method such as screen printing of a metal paste (see FIG. 13).
(A)), and further, a ceramic dielectric layer 6 is formed thereon by a doctor blade method, a reverse roll coater method, a printing method, or the like (FIG. 13B).

Next, the above-mentioned ceramic green sheets in which the internal electrode layers 5 are embedded are sequentially stacked so that the internal electrode layers 5 are alternately connected to the opposing external electrodes to obtain a laminated structure of a laminated ceramic capacitor ( FIG.
(C)).

In the monolithic ceramic capacitor obtained by such a manufacturing method, it is desirable that the thickness of the internal electrode layer is as thin as possible for the reasons described below. (1) The thickness of the entire laminated body can be suppressed to be small, and as a result, the number of times of lamination is increased with the same shape, and a capacitor having a higher capacity can be obtained. (2) Distortion due to the thickness of the internal electrode, which is inherent in the laminated body (particularly in the case of the conventional method A, a large strain occurs because the thickness of the internal electrode is not compensated by the ceramic dielectric). As a result, structural defects such as delamination after sintering are reduced. (3) Generally, for the internal electrodes, a noble metal such as Pd that is stable even when fired at high temperature together with the ceramic dielectric is used.
Reduction of electrode consumption has a great effect on cost reduction.

[0016]

However, the above-mentioned conventional method has the following problems when the internal electrode layers are made too thin.

The laminated green bodies 3 and 7 obtained by the conventional methods A and B are fired in an electric furnace or the like, whereby the ceramic green sheet 1, the ceramic dielectric layer 6 and the internal electrode layers 2 and 5 are respectively formed. It will sinter and will function as a ceramic capacitor element. FIG. 14 shows an enlarged schematic view microscopically showing the state of the internal electrode layers after firing of a general monolithic ceramic capacitor. It is generally known that powder compacts are shrunk and shrunk in the sintering process, and the internal electrode layers of the above-mentioned laminated compacts are also shrunk by sintering during metal sintering in the sintering step. Since the internal electrode layers are generally formed to be as thin as possible for the reasons described above, in the laminated ceramic capacitor after firing, the internal electrode layers usually have not only the sintered Pd internal electrodes 8 but also minute void portions 9. It is confirmed by observation with a scanning electron microscope.

When such a minute void portion is sufficiently smaller than the thickness of the ceramic dielectric layer, an equipotential surface is formed in the entire internal electrode layer, and the void portion should be ignored electrically. You can However, if the thickness of the internal electrode layer is made too thin, the void portion expands rather than the actual thickness becomes thin. It is surrounded by and isolated in an island shape (the isolated part is called an island) and is not electrically connected to the terminal electrode. FIG. 15 is an enlarged schematic view microscopically showing the state of the internal electrode layer after firing of the laminated ceramic capacitor when the thickness of the internal electrode layer is too thin. In this way, if the minute void portion of the internal electrode layer expands and further extends to the island 10, the size of that region can no longer be ignored as compared with the thickness of the ceramic dielectric layer, and the size of the internal electrode is reduced. This reduces the effective area and leads to a decrease in capacitance. This island is generated stochastically,
Further, the contribution to the reduction of the capacitance when generated is varied depending on the size of the island, so that the capacitance is reduced and the variation is increased at the same time. Furthermore, in a monolithic ceramic capacitor, the internal electrode is a counter electrode that forms a capacitance, and at the same time it also functions as a lead electrode that connects the counter electrode to a terminal electrode. Also leads to an increase in

As described above, in the conventional method as described above, when the thickness of the internal electrode layer is made too thin, defects such as a decrease in capacitance and an increase in dispersion and an increase in equivalent series resistance are caused. It was

In view of the above problems, the present invention provides a method for manufacturing a monolithic ceramic capacitor which is less likely to cause a decrease in capacitance, an increase in variations and an increase in equivalent series resistance even if the thickness of the internal electrode layers is reduced. The purpose is.

[0021]

In order to achieve this object, a method of manufacturing a multilayer ceramic capacitor according to the present invention is such that, when an internal electrode layer is formed, a stripe or mesh having continuous recesses is formed on the surface of a ceramic green sheet. The metal paste is applied after the roughening process is performed.

Further, according to the present invention, after the metal paste is applied to form the internal electrode layer, the surface of the internal electrode layer is subjected to a striped or mesh-shaped concavo-convex process with continuous convex portions.

Further, according to the present invention, a carrier such as a base film having a striped or meshed concavo-convex pattern on the surface thereof is used in the step of forming a ceramic green sheet having embedded internal electrodes.

Further, according to the present invention, in the step of forming a ceramic green sheet in which the internal electrodes are embedded, after the internal electrode layers are formed on the carrier such as a base film by a method such as coating a metal paste, the internal electrode layers are formed. The surface is subjected to a striped or mesh-shaped concavo-convex process with continuous convex portions.

[0025]

According to these configurations, the surface of a carrier such as a ceramic green sheet or a base film, which is a base for forming the internal electrode layers by applying a metal paste or the like, is processed to have an uneven surface, or By subjecting the electrode layer itself to unevenness, a striped or mesh-like thick portion is formed on the internal electrode layer. In this thick part, voids are less likely to occur due to firing shrinkage even after firing of the laminated molded body, so that islands are less likely to be generated, and therefore defects such as a decrease in capacitance and an increase in dispersion and an increase in equivalent series resistance are prevented. It will be suppressed.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view showing a laminated structure forming method of a method for manufacturing a laminated ceramic capacitor according to an embodiment of the present invention, and FIG. 2 is a schematic perspective view of the same. In FIGS. 1 and 2, 11 is a ceramic green sheet, 12 is an internal electrode layer formed on an uneven ceramic green sheet, and 13 is a laminated molding in which ceramic green sheets having an internal electrode layer are laminated and pressure-bonded. Body, 14 is a surface plate having an uneven surface for unevenly processing the ceramic green sheet 11, 11b is a surface plate 14
It is a ceramic green sheet that has been textured with.

First, a ceramic green sheet 11 of BaTiO ₃ -based ceramic dielectric (see FIGS. 1A and 2).
(A)) is prepared, and then, a hairline process (one-way polishing process using a # 400 abrasive paper on the surface of the stainless steel surface plate 14 is performed, and the processed surface is continuous in stripes in both concave and convex portions). The ceramic green sheet 11 was pressure-molded by using a press die on which the striped concavo-convex pattern was formed by () (FIGS. 1B and 2B). The pressing force at this time is 500 kg
It was / cm ² . Pb paste was applied and dried by a printing method on the uneven surface of the ceramic green sheet 11b to form the internal electrode layer 12 (FIGS. 1C and 2).
(C)).

Next, the ceramic green sheet 1 is formed so that the internal electrode layers 12 are alternately connected to the opposing terminal electrodes.
1b were sequentially stacked and pressure-bonded to obtain a laminated molded body 13 (FIGS. 1D and 2D). Obtained laminated molded body 13
Was fired in an electric furnace at 1300 ° C for 2 hours, and glass frit was added to both ends of the fired element.
8 g paste is applied and dried to form terminal electrodes, and then 8
A terminal electrode was baked under the conditions of keeping at 50 ° C. for 10 minutes to prepare a sample of a laminated ceramic capacitor.

In preparing the samples, several kinds of samples having different thicknesses of the internal electrode layers were prepared by adjusting the printing conditions when printing the internal electrode layers. Since it is difficult to measure the average thickness of the internal electrode layer of each sample with high accuracy, the dry weight per unit area of the printed coating film of the Pd paste was used as a substitute evaluation value. Each sample thus obtained was measured using a Yokogawa Hewlett-Packard LCR meter HP-4274A at 1 KHz.
The capacitance in Vrms was measured. Also, the equivalent series resistance was measured using an impedance analyzer HP-4192A manufactured by the same company. The electrical characteristics were measured with 20 samples in all cases, and the plot results are shown in FIGS. 7 and 9 with the average value and the maximum and minimum values as data. In addition, in each drawing, as a comparative example, a measurement result in the case where a trial production is performed by the same method without performing the concavo-convex processing (conventional method A) is shown as a conventional example 1.

(Embodiment 2) FIG. 3 is a sectional view showing a laminated structure forming method of a method for manufacturing a laminated ceramic capacitor according to an embodiment of the present invention. In FIG. 3, 11 is a ceramic green sheet, 12 is an internal electrode layer formed on the ceramic green sheet 11, 13 is a laminated molded body obtained by laminating and pressure bonding ceramic green sheets having an internal electrode layer formed thereon, and 14 is an internal electrode. A surface plate having an uneven surface for unevenly processing the layer 12 and an internal electrode layer 12b having an uneven surface processed by the surface plate 14.

First, a ceramic green sheet 11 (FIG. 3 (a)) of BaTiO ₃ -based ceramic dielectric was prepared, and Pd paste was applied and dried on the surface by a printing method to form an internal electrode layer 12 (see FIG. 3 (b)). next,
The surface of the stainless steel surface plate 14 is subjected to a striped concavo-convex process by a hairline process using a # 400 abrasive paper (one-way polishing process, and the processed surface is continuous in a striped pattern with concave and convex portions). The internal electrode layer 12 was pressure-molded using the above-mentioned press die (FIG. (C)). The pressing force at this time is 500
It was kg / cm ² . In this way, after obtaining the ceramic green sheet having the textured internal electrode layer (Fig. (D)), the internal electrode layers 12 are sequentially stacked so as to be alternately connected to the opposing terminal electrodes, and are pressed and laminated. Molded body 1
3 was obtained (Fig. (E)). The obtained laminated compact 13 is fired in an electric furnace under the conditions of 1300 ° C. and 2 hours of keeping,
Further, Ag paste containing glass frit is applied to both ends of the baked element and dried to form a terminal electrode, and then 850 ° C.
The terminal electrode was baked under the condition of keeping for 10 minutes to prepare a sample of the laminated ceramic capacitor.

In preparing the samples, several kinds of samples having different thicknesses of the internal electrode layers were prepared by adjusting the printing conditions when printing the internal electrode layers. Since it is difficult to measure the average thickness of the internal electrode layer of each sample with high accuracy, the dry weight per unit area of the printed coating film of the Pd paste was used as a substitute evaluation value. Each sample thus obtained was measured using a Yokogawa Hewlett-Packard LCR meter HP-4274A at 1 KHz.
The capacitance in Vrms was measured. Also, the equivalent series resistance was measured using an impedance analyzer HP-4192A manufactured by the same company. The electrical characteristics were measured using 20 samples, and the results obtained by plotting average values and maximum / minimum values as data are shown in FIGS. 7 and 9. In addition,
In each of the drawings, as a comparative example, the measurement result in the case of making a prototype by the same method without performing the concavo-convex machining (the conventional method A) is shown as a conventional example 1.

(Embodiment 3) FIG. 4 is a sectional view showing a laminated structure forming method of a method for manufacturing a laminated ceramic capacitor according to an embodiment of the present invention. In FIG. 4, reference numeral 15 is a base film having an uneven surface, 16 is an internal electrode layer formed on the base film 15, and 17 is an internal electrode layer 1.
6, a ceramic dielectric layer formed from above 6;
Is a laminated green body obtained by laminating and pressure-bonding ceramic green sheets each including a ceramic dielectric layer 17 in which the internal electrode layers 16 are embedded.

First, a base film 15 made of polyethylene terephthalate serving as a carrier for forming internal electrodes and forming a ceramic dielectric layer is prepared, and a hairline process (a unidirectional polishing process, using a # 400 polishing paper on the surface is prepared. The processed surface is striped in a continuous manner in both concave and convex portions (FIG. 4A), and the internal electrode layer 16 is formed by applying and drying Pd paste on the surface by a printing method. Was formed (FIG. 4 (b)). Next, a slurry (slurry) of BaTiO ₃ -based ceramic dielectric was prepared, and was applied and dried on the base film 15 on which the internal electrode layer 16 was formed by the doctor blade method to form the ceramic dielectric layer 17 (FIG. 4). (C)).

In this way, after obtaining a ceramic green sheet consisting of the ceramic dielectric layer 17 in which the internal electrode layers 16 are embedded, the internal electrode layers 16 are sequentially stacked and crimped so that they are alternately connected to the opposing terminal electrodes. Thus, a laminated molded body 13 was obtained (FIG. 4 (d)).

The obtained laminated molded body 13 was placed in an electric furnace 13
Firing is performed under the conditions of keeping at 00 ° C for 2 hours, and further, Ag paste containing glass frit is applied to both ends of the fired element and dried to form a terminal electrode, and then the terminal electrode is kept under the condition of keeping at 850 ° C for 10 minutes. A sample of a laminated ceramic capacitor was prepared by baking.

In preparing the samples, several kinds of samples having different thicknesses of the internal electrode layers were prepared by adjusting the printing conditions when printing the internal electrode layers. Since it is difficult to measure the average thickness of the internal electrode layer of each sample with high accuracy, the dry weight per unit area of the printed coating film of the Pd paste was used as a substitute evaluation value. Each sample thus obtained was measured using a Yokogawa Hewlett-Packard LCR meter HP-4274A at 1 KHz.
The capacitance in Vrms was measured. Also, the equivalent series resistance was measured using an impedance analyzer HP-4192A manufactured by the same company. The electrical characteristics were measured using 20 samples, and the results of plotting the average value and the maximum / minimum values as data were plotted in FIGS. 8 and 10. In addition, in each drawing, as a comparative example, a measurement result in the case where a trial production is performed by the same method without performing the concavo-convex processing (the conventional method B) is shown as a conventional example 2.

(Embodiment 4) FIG. 5 is a schematic sectional view of a laminated structure forming method of a method for manufacturing a laminated ceramic capacitor according to an embodiment of the present invention. In FIG. 5, 18 is a base film having a smooth surface, 16 is an internal electrode layer formed on the base film 18, and 14 is an internal electrode layer 1.
A surface plate having an uneven surface for processing 6 unevenly, 16b is an internal electrode layer processed by the surface plate 14 to be uneven, 17 is a ceramic dielectric layer formed further on the internal electrode layer 16b, and 13 is A ceramic green sheet composed of a ceramic dielectric layer 17 in which the internal electrode layers 16b are embedded is laminated.
It is a pressure-sensitive laminated molded body.

First, a base film 18 made of polyethylene terephthalate serving as a carrier for forming internal electrodes and forming a ceramic dielectric layer is prepared, and Pd paste is applied and dried on the surface by a printing method to form the internal electrode layer 16. (FIG. 5A).

Next, # 400 is applied to the surface of the stainless steel surface plate.
The internal electrode is formed by using a press die that has been subjected to striped concavo-convex processing by hairline processing (one-way polishing processing and the processed surface is continuous in both concave and convex portions) The layer 16 was pressure-molded (FIG. 5 (b)). The applied pressure at this time was 500 kg / cm ² . In addition, BaTiO ₃
A base film 18 having a slurry (slurry) of a ceramic-based ceramic dielectric material and having an internal electrode layer 16b having an uneven surface
A ceramic dielectric layer 17 was formed by applying and drying the same on the surface of FIG. 5C by the doctor blade method (FIG. 5C).
(D)).

In this way, after obtaining the ceramic green sheet consisting of the ceramic dielectric layer 17 in which the internal electrode layers 16 are embedded, the internal electrode layers 16b are sequentially stacked so as to be connected to the terminal electrodes which are alternately opposed, and pressure-bonded. Thus, a laminated molded body 13 was obtained (FIG. 5 (e)). Obtained laminated molded body 1
No. 3 was fired in an electric furnace under the conditions of 1300 ° C. for 2 hours, and the Ag paste containing glass frit was applied to both ends of the fired element and dried to form a terminal electrode.
A terminal electrode was baked under the conditions of 850 ° C. and 10 minutes keeping to prepare a sample of a laminated ceramic capacitor.

In preparing the samples, several kinds of samples having different thicknesses of the internal electrode layers were prepared by adjusting the printing conditions when printing the internal electrode layers. Since it is difficult to measure the average thickness of the internal electrode layer of each sample with high accuracy, the dry weight per unit area of the printed coating film of the Pd paste was used as a substitute evaluation value. Each sample thus obtained was measured using a Yokogawa Hewlett-Packard LCR meter HP-4274A at 1 KHz.
The capacitance in Vrms was measured. Also, the equivalent series resistance was measured using an impedance analyzer HP-4192A manufactured by the same company. The electrical characteristics were measured using 20 samples, and the results obtained by plotting average values and maximum / minimum values as data are shown in FIGS. 8 and 10. In addition, in each drawing, as a comparative example, a measurement result in the case where a trial production is performed by the same method without performing the concavo-convex processing (the conventional method B) is shown as a conventional example 2.

As can be seen from FIGS. 7 to 10, according to this embodiment, the surface of a carrier such as a ceramic green sheet or a base film, which is a base for forming internal electrode layers by a method such as coating a metal paste, is used. By making unevenness, or by making unevenness in the internal electrode layer itself, a thick portion such as a stripe or a mesh is formed in the internal electrode layer. In the thick portion, voids are less likely to occur due to firing shrinkage even after firing of the laminated molded body, so that islands are less likely to be generated.

FIG. 6 is an enlarged schematic view microscopically showing the state of the internal electrode layers after firing of the laminated ceramic capacitor in the case where the thickness of the internal electrode layers is reduced in this embodiment. Here, 19 corresponds to a position of a thick portion of the internal electrode layer before firing (a concave position due to uneven processing of the surface of a carrier such as a ceramic green sheet or a base film, or a convex position due to uneven processing of the internal electrode layer). Yes). Compared to the case of FIG. 15, the direction in which the void portion spreads due to firing shrinkage is limited by the thick portion of the internal electrode layer that is continuous in a striped pattern, and although the total area is almost the same, it is difficult to form a wide area island. It is easy to guess. Therefore, it is possible to suppress the occurrence of defects such as a decrease in capacitance, an increase in variation, and an increase in equivalent series resistance.

It can be said that the generation of islands does not occur at all because it occurs stochastically, but even if the void portion spreads and islands begin to occur, in the present embodiment, the thick portion of the internal electrode layer continues. The electrical continuity decreases in the direction orthogonal to the direction, but the electrical continuity is easily maintained in the parallel direction. Therefore, particularly in the case of striped concavo-convex processing, the effect of preventing a decrease in capacitance and other defects can be further enhanced by making the direction of the strips as close as possible to the connecting direction of the internal electrodes and the terminal electrodes. On the contrary, when they are orthogonal to each other, the deterioration of capacitance and other defects are worsened.

As described above, islands are generated stochastically, and the present invention has the effect of reducing this probability. Therefore, the thick portion of the internal electrode layer has a striped pattern or a mesh pattern. Although it is a requirement of the present invention that all of the thick portions are not necessarily continuous to the edge of the internal electrode layer, the internal electrode layer as a whole is at least connected to the connection direction. It is enough if the continuity is high.

[0048]

As described above, according to the method for manufacturing a laminated ceramic capacitor of the present invention, the surface of a carrier such as a ceramic green sheet or a base film, which is a base for forming internal electrode layers by a method such as coating a metal paste, is used. By roughening the surface of the internal electrode layer itself or by roughening the internal electrode layer itself, thick portions are formed in the internal electrode layer in a stripe shape or a mesh shape. Since voids are less likely to occur due to firing shrinkage,
It becomes difficult to create islands. Therefore, it is possible to suppress the occurrence of defects such as a decrease in capacitance, an increase in variation, and an increase in equivalent series resistance, and the practical effect is great.

[Brief description of drawings]

1A to 1D are cross-sectional views showing a laminated structure forming method of a method for manufacturing a laminated ceramic capacitor according to a first embodiment of the present invention.

2A to 2D are perspective views showing a laminated structure forming method of a method for manufacturing a laminated ceramic capacitor according to Embodiment 1 of the present invention.

3A to 3E are schematic cross-sectional views showing a laminated structure forming method of a method for manufacturing a laminated ceramic capacitor according to a second embodiment of the present invention.

4A to 4D are schematic cross-sectional views showing a laminated structure forming method of a method for manufacturing a laminated ceramic capacitor according to a third embodiment of the present invention.

5 (a) to (e) are schematic cross-sectional views showing a laminated structure forming method of a method for manufacturing a laminated ceramic capacitor according to Example 4 of the present invention.

FIG. 6 is an enlarged schematic diagram microscopically showing a state of the internal electrode layer after firing of the multilayer ceramic capacitor when the thickness of the internal electrode layer is thin in the present example.

FIG. 7: Examples 1 and 2 of the present invention and conventional method A
Chart showing the relationship between the Pd paste coating film dry weight and the electrostatic capacitance

FIG. 8: Examples 3 and 4 of the present invention and conventional method B
Chart showing the relationship between the Pd paste coating film dry weight and the electrostatic capacitance

FIG. 9: Examples 1 and 2 of the present invention and conventional method A
Chart showing the relationship between the dry weight of Pd paste coating film and the equivalent series resistance in

10 is a characteristic diagram showing the relationship between the equivalent series resistance and the dry weight of the Pd paste coating film in Examples 3 and 4 of the present invention and conventional method A. FIG.

11A to 11C are cross-sectional views showing a laminated structure forming method of a method of manufacturing a laminated ceramic capacitor according to Conventional Method A.

12A to 12C are perspective views showing a laminated structure forming method of a method for manufacturing a laminated ceramic capacitor according to a conventional method A.

13A to 13C are cross-sectional views showing a method for forming a laminated structure in a method for manufacturing a laminated ceramic capacitor according to a conventional method B.

FIG. 14 is an enlarged schematic view microscopically showing a state of internal electrode layers after firing of a general monolithic ceramic capacitor.

FIG. 15 is an enlarged schematic view microscopically showing the state of the internal electrode layer after firing of the multilayer ceramic capacitor when the thickness of the internal electrode layer is too thin.

[Explanation of symbols]

 11, 11b Ceramic green sheet 12, 12b, 16, 16b Internal electrode layer 13 Laminated body 14 Surface plate 15, 18 Base film 17 Ceramic dielectric layer

Claims (4)

[Claims] 1. An internal electrode layer is formed on a ceramic green sheet, and the ceramic green sheet on which the internal electrode layer is formed is laminated and crimped so that the internal electrode layers are connected to terminal electrodes which are alternately opposed to each other. A step of obtaining a laminated molded body, and when forming the internal electrode layer, after subjecting the surface of the ceramic green sheet to a continuous striped or mesh-shaped concavo-convex process, applying a metal paste to the internal electrode layer A method for manufacturing a monolithic ceramic capacitor, comprising: 2. An internal electrode layer is formed on a ceramic green sheet, and the ceramic green sheet on which the internal electrode layer is formed is laminated and pressure-bonded so that the internal electrode layers are alternately connected to terminal electrodes facing each other. A multilayer ceramic capacitor having a step of obtaining a multilayer molded body, which comprises applying a metal paste to form an internal electrode layer, and then subjecting the surface of the internal electrode layer to continuous striped or mesh-shaped uneven processing. Production method. 3. A step of forming a ceramic green sheet in which an internal electrode layer is embedded by forming an internal electrode layer on a carrier such as a base film in advance and then forming a ceramic green sheet layer thereon, and the ceramic green sheet. A step of stacking sheets so that the internal electrode layers are alternately connected to terminal electrodes which are alternately opposed to each other and press-bonding to obtain a laminated molded body, and a base having a continuous striped or mesh-shaped concavo-convex process on the surface A method for manufacturing a monolithic ceramic capacitor, which comprises using a carrier such as a film. 4. A step of forming a ceramic green sheet in which an internal electrode layer is embedded by forming an internal electrode layer on a carrier such as a base film in advance and then forming a ceramic green sheet layer thereon, and the ceramic green sheet. Stacking the sheets so that the internal electrode layers are alternately connected to the opposing terminal electrodes and press-bonding to obtain a laminated molded body, and after forming the internal electrode layers on a carrier such as a base film, A method for manufacturing a monolithic ceramic capacitor, which comprises subjecting a surface of an electrode layer to continuous striped or mesh-shaped uneven processing.