JP2002231570A - Multilayer electronic component and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer electronic component, and its manufacturing method, in which capacitance is enhanced while suppressing variation and, at the same time, the connection strength of an inner electrode layer and an outer electrode is enhanced. SOLUTION: An end part of the inner electrode layer 11 is oxidized to form an oxide layer 15 which is then provided, on the outer electrode 7 side, with a conductive part 17 for connecting the inner electrode layer 11 electrically with the outer electrode 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a multilayer electronic component and a method of manufacturing the same, and more particularly, to a multilayer electronic component used for a multilayer ceramic capacitor and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller and higher in density, multilayer electronic components, for example, multilayer ceramic capacitors, have been required to be smaller in size, have higher capacitance, and have reduced capacitance variations. In addition, the thickness of the dielectric layer is reduced and the number of layers is increased, the effective area of the internal electrode layer is increased, and the bonding between the internal electrode layer and the external electrode is strengthened.

FIG. 5 shows such a laminated electronic component.
As shown in (a), conventionally, a printed pattern of an internal electrode layer 81 is controlled to form a laminated electronic device in which an end margin portion 87 having a length L is formed from an end surface on which an external electrode 85 of an electronic component body 80 is formed. Parts are known.

As a method of reducing the end margin, conventionally, masking is performed on an end face on which an external electrode is formed, and as shown in FIG. 5B, the end face is alternately formed only on the end face of the internal electrode layer 81 by a sputtering method. A laminated electronic component having an insulating portion is known (see Japanese Patent Application Laid-Open No. 3-91217).

In the multilayer electronic component shown in FIG. 5B, the internal electrode layer 81 exposed on the end face of the electronic component body is provided.
Are alternately insulated, and external electrodes 85
By reducing the width of the end margin part,
Smaller and larger capacity is being achieved.

[0006]

However, FIG.
In the conventional multilayer electronic component shown in (a), an end margin portion 83 is formed in an electronic component main body 83 in order to maintain insulation between an external electrode 85 at one end and an internal electrode layer 81 facing the external electrode 85. As a result, the end margin portion 83 becomes long and not only a sufficient capacitance cannot be obtained, but also the internal electrode layer 81
Due to the thickness difference between the end margin portion without the gap and the capacitance generating portion on which the internal electrode layer 81 is formed, the internal electrode layer 8
There is a problem that deformation and delamination of No. 1 occur.

In the multilayer electronic component shown in FIG. 5B, an insulating portion 89 is formed only at the exposed end of the internal electrode layer 81 to insulate the component, and the bonding area of the insulating film is small. Since the insulating portion 89 is apt to be damaged or missing, which leads to a short circuit, and a minute masking is required in the insulating process of the internal electrode layer 81 exposed at both ends, for example, as an insulating process method, There is a problem that the method is limited to high-cost methods such as a sputtering method and a vapor deposition method.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a laminated electronic component having a high connection strength between an internal electrode layer and an external electrode while improving the capacitance and reducing a short-circuit failure, and a method of manufacturing the same. I do.

[0009]

According to the laminated electronic component of the present invention, a pair of the internal electrode layers are alternately connected to the end face of the electronic component main body in which the dielectric layers and the internal electrode layers are alternately laminated. In the multilayer electronic component formed by forming the external electrode, the end of the internal electrode layer on the side of the external electrode is oxidized to form an oxide layer, and the oxide layer and the dielectric layer near the oxide layer are formed. And a conductive portion for electrically connecting the internal electrode layer and the external electrode.

According to such a configuration, the thickness of the oxide layer of the multilayer electronic component can be reduced, so that the distance (end margin) for insulating between the internal electrode layer and the external electrode is provided.
Can be minimized, the effective area of the internal electrode layer can be increased, and the capacitance can be increased.

Further, since the conductive portion formed on the end portion of the internal electrode layer and the dielectric layer in the vicinity thereof is originally a part of the internal electrode layer, the connection with the external electrode is increased, and as a result, static electricity is increased. Variations in capacitance can be suppressed.

Further, since the oxide layer is formed without protruding from the end face of the electronic component body, the conventional method in which the oxide layer is formed to protrude from the end of the internal electrode layer using sputtering or the like. In comparison, the adhesive strength between the oxide layer or the internal electrode layer and the external electrode can be increased.

In the above-mentioned laminated electronic component, it is preferable that individual internal electrode layers alternately laminated with the dielectric layers are formed so as to be exposed on all side surfaces.

Since the area of the internal electrode layer formed between the dielectric layers can be made substantially the same as the area of the dielectric layer,
Since there is almost no variation in capacitance and there is no thickness difference depending on the location of the electronic component main body, it is possible to particularly prevent the occurrence of delamination due to internal stress caused by the thickness difference.

In the above-mentioned laminated electronic component, the depth of the oxide layer is desirably 50 μm or less. When the thickness is 50 μm or less, the margin area can be minimized for miniaturization and high capacitance of the multilayer electronic component, and the conductivity of the conductive portion formed between the internal electrode layer and the external electrode is reduced. Therefore, the variation in capacitance can be reduced.

In the above-mentioned multilayer electronic component, it is desirable that a plurality of conductive portions are formed in one oxide layer and a dielectric layer in the vicinity thereof. For example, on the end surface of the electronic component body, a plurality of conductive portions are formed in the oxide layer formed on the end portion of the single internal electrode layer and the dielectric layer in the vicinity thereof so that a non-conductive portion remains. By doing so, the bonding strength between the internal electrode layer and the external electrode can be increased.

In the multilayer electronic component, it is desirable to provide a pair of external electrodes on the same end surface of the electronic component body. For example, by forming a pair of external electrodes that are alternately connected to the internal electrode layers close to one end face of the multilayer ceramic capacitor, the symmetry of the current path is increased, so that the impedance at high frequencies can be reduced. Since the current flowing in the capacitor can be dispersed, the electromagnetic field distribution of the multilayer ceramic capacitor can be made uniform and the self-inductance can be reduced.

According to the method of manufacturing a laminated electronic component of the present invention, dielectric green sheets and internal electrode patterns are alternately laminated,
A step of producing a laminated molded body in which the entire outer peripheral edge of the internal electrode pattern is exposed at the end face, and a step of firing the laminated molded body in a non-oxidizing atmosphere to produce an electronic component body in a low oxygen atmosphere. Heat treating the electronic component body to oxidize the entire outer peripheral edge of the internal electrode layer to form an oxide layer,
A step of fabricating an electronic component body in which a dielectric layer and an internal electrode layer whose entire outer peripheral edge is an oxide layer are alternately laminated, and locally heating the oxide layer in a reducing atmosphere. hand,
Forming a conductive portion in the oxide layer and a dielectric layer in the vicinity thereof; and applying and baking an external electrode paste to an end face of the electronic component body, and a pair of external electrodes in which the internal electrode layers are alternately connected. And a step of producing the same.

In this manufacturing method, it is not necessary to control the shape and position of the internal electrode pattern, so that a multilayer electronic component can be easily manufactured.

Then, in order to convert the internal electrode layer itself exposed at the end face of the electronic component body into an oxide layer, the oxide layer does not stick out to the end face of the electronic component body, and the internal electrode layer is formed by sputtering or the like. Compared with the conventional case in which the oxide layer is formed in a convex shape at the end, the oxide layer can be integrally formed on the end face of the electronic component body, so that the adhesive strength of the oxide layer to the electronic component body And a highly reliable laminated electronic component with high reliability can be manufactured.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Structure) The multilayer electronic component of the present invention will be described by taking a multilayer ceramic capacitor as an example.

As shown in FIG. 1, the laminated electronic component of the present invention is formed by forming a pair of external electrodes 7 on the end faces 3 and 5 of a rectangular parallelepiped electronic component main body 1. ,
Dielectric layers 9 and internal electrode layers 11 are alternately laminated, and the entire outer peripheral edge of the internal electrode layer 11 of the electronic component body 13 in which the entire outer peripheral portion of the internal electrode layer 11 is exposed is oxidized. ,
An oxide layer 15 is formed.

On one end face 3 of the electronic component body 1 on which the external electrode 7 is formed, the oxide layer 15 and the oxide layer 15 are connected so that the end of the internal electrode layer 11 is electrically connected to the external electrode 7 alternately. The conductive layer 17 is formed by reducing the dielectric layer 9 in the vicinity thereof. On the other end face 5, the end of the internal electrode layer 11 where the conductive section 17 is not formed on the end face 3 is connected to the external electrode 7. The conductive layer 17 is formed on the oxide layer 15 and the dielectric layer 9 in the vicinity thereof so as to be electrically connected alternately.
Are formed. In this case, when the oxide layer 15 is made conductive, the diameter increases in the direction of the end faces 3 and 5 of the electronic component body 1 to form the conductive portion 17.

Although not shown, for example, an Ni plating film, Sn or Sn-
A Pb alloy plating layer is formed. These are to prevent the solder erosion of the external electrode 7 and to supplement the solder wettability.

As shown in FIG. 2A, the electronic component body 13 has dielectric layers 9 and internal electrode layers 11 alternately laminated.
The internal electrode layer 11 is formed so as to be exposed on the entire peripheral surface including both end surfaces 3 and 5 where the external electrode 7 is formed.

As shown in FIG. 2B, the oxide layer 15 formed on the end of the internal electrode layer 11 exposed on the end faces 3 and 5 connected to the external electrode 7 and the dielectric layer near the oxide layer 15 are formed. The conductive part 17 is formed on the electronic component 9, thereby forming the electronic component body 1.

As shown in FIG. 2C, the conductive layer 17 formed on the oxide layer 15 and the dielectric layer 9 near the oxide layer 15 has an internal electrode layer on the end faces 3 and 5 of the electronic component body 1. 1
1 and is formed so as to penetrate the oxide layer 15 having a thickness t and reach the internal electrode layer 11. Then, the diameter increases from the internal electrode layer 11 to the external electrode 7. That is, it is desirable to form the tapered shape. Thereby, the electrical connection between the internal electrode layer 11 and the external electrode 7 can be reliably performed.

Further, the conductive portion 17 formed in the oxide layer 15 is formed by heating in a reducing gas atmosphere since the oxide layer 15 is obtained by oxidizing the metal of the internal electrode layer 11. Is reduced to the original metal, and the conductivity can be locally increased to 10 ⁵ S · m ⁻¹ or more.

The conductive portion 17 formed on the dielectric layer 9 in the vicinity of the oxide layer 15 widened from the oxide layer 15 has, for example, a laser irradiation area slightly larger than the width of the end of the internal electrode layer 11. The width of the conductive portion 17 between the internal electrode layer 11 and the external electrode 7 is increased by this setting, and the electrical connectivity between the internal electrode layer 11 and the external electrode 7 can be further improved. In addition, it is possible to reduce the electric loss (decrease in capacitance) of the multilayer ceramic capacitor.

The conductive portion formed on the dielectric layer 9
17, the dielectric layer 9 is made of BaTiO._ThreeSystem dielectric material
Is heated in a reducing gas atmosphere to obtain BaT
iO _ThreeMn solid-dissolved emits electrons, and BaTiO_ThreeIs half
To make it conductive, the conductivity of the dielectric layer 9 is locally reduced to 10S.
・ M^-1It can be raised more than that. In addition, BaTiO _Three
Y for system dielectric_TwoO_ThreeIn a reducing atmosphere even if
When heated, the conductivity of the dielectric layer 9 can be similarly increased.
Wear.

When the thickness t of the oxide layer 15 is 50 μm or less, the volumetric efficiency of the capacitance of the multilayer electronic component can be increased, and in particular, the variation can be suppressed. In order to increase the adhesive strength between the electronic component body 13 and the oxide layer 15 and the electrical insulation between the opposing and insulated external electrode 7, the thickness is particularly preferably 0.1 to 20 μm.

In the multilayer electronic component of the present invention, the thickness of the dielectric layer 9 is preferably 10 μm or less in order to increase the capacitance. 1.5 to 4 μm is desirable.

The thickness of the internal electrode layer 11 is preferably 2 μm or less from the viewpoint of miniaturization of the capacitor. In order to prevent delamination by the internal electrode layer 11 and enhance reliability, the thickness is preferably 0.3 to 1 μm. Is desirably within the range.

(Material) The dielectric layer 9 used for the electronic component body 1 is made of a sheet-shaped ceramic sintered body.
For example, it is made of a dielectric ceramic formed by firing a green sheet containing BaTiO ₃ as a main component and Mn.

The internal electrode layer 11 is made of a metal film obtained by sintering a conductive paste film. As the conductive paste, for example, a base metal such as Ni, Co, or Cu is used. Ni metal is used in terms of matching with the firing temperature of the dielectric material to be formed, conductivity of the metal, and cost.

The metal components of the external electrode 7 are Ni, C
It is made of a metal containing o, Cu and the like, and further contains a glass component.

(Production Method) Next, a method for producing a multilayer electronic component comprising the multilayer ceramic capacitor of the present invention will be described with reference to FIG.
This will be described based on the multilayer electronic component.

First, using the dielectric powder, the ceramic of the dielectric layer 9 is formed by a doctor blade method, a pulling method, a reverse roll coater method, a gravure coater method, a screen printing method, a gravure printing method, a die coater method or the like. Make a green sheet.

As the dielectric material, specifically, BaT
_{iO 3 -MnO-MgO-Y 2} O dielectric powder and sintering aid such ₃ can be suitably used. Further, the thickness of the ceramic green sheet of the dielectric layer 9 is preferably 12 μm or less, and particularly, from 2.5 to 4.
A range of 5 μm is desirable.

Next, an internal electrode pattern is formed on the surface of the ceramic green sheet of the dielectric layer by a doctor blade method, a reverse roll coater method, a gravure coater method, a screen printing method, a gravure printing method, a die coater method or the like. . The thickness of the internal electrode pattern is desirably 2.4 μm or less, particularly preferably in the range of 0.6 to 1.2 μm, from the viewpoint of reducing the size and increasing the reliability of the capacitor. For forming the internal electrode pattern, a thin film forming method such as a sputtering method or a plating method may be used.

Then, a plurality of ceramic green sheets to be the dielectric layers 9 on which the internal electrode patterns are formed are laminated and pressed, and cut into a predetermined shape, whereby the entire outer peripheral end of the internal electrode pattern is exposed. A green body is produced.

Then, after demolding the electronic component body at 250 to 300 ° C. in the air or at 500 to 800 ° C. in a low oxygen atmosphere with an oxygen partial pressure of 0.1 to 1 Pa, 1100 to 1100 in a non-oxidizing atmosphere. It is fired at 1300 ° C. for 2 to 3 hours to obtain the electronic component body 13.

Further, the internal electrode exposed on the outer surface of the electronic component body 1 is subjected to a heat treatment at 900 to 1100 ° C. for 3 to 10 hours under a low oxygen partial pressure of about 0.1 to 10 ⁻⁴ Pa. An oxide layer 15 is formed at the end of the layer 11.

Next, the oxide layer 15 is heated by a method such as a laser heating method in a reducing atmosphere to form a conductive portion 17. In this method, when the beam diameter is set to the width of the end of the internal electrode layer 11, the dielectric layer 9 outside the oxide layer 15 is also heated by the diffusion of the beam, so that a conductive portion can be formed. .

At this time, heating is performed in a reducing gas atmosphere such as H ₂ , or a reducing agent such as metal Al powder is previously applied to the surface of the oxide layer 15 and the dielectric layer 9 in the vicinity thereof. Thereby, the conductivity of the end faces 3 and 5 including the oxide layer 15 and the dielectric layer 9 in the vicinity thereof can be promoted.

Finally, an external electrode paste is applied to the end surfaces 3 and 5 of the obtained electronic component body 1 and baked to form external electrodes 7 electrically connected to the internal electrode layers 11, as shown in FIG. A laminated electronic component is manufactured.

(Function) In the multilayer electronic component configured as described above, the oxide layer 15 is formed at the end of the internal electrode layer 11 and the oxide layer 15 and the dielectric layer 9 near the oxide layer 15 are formed. By providing a conductive portion 17 for electrically connecting the internal electrode layer 11 and the external electrode 7, the internal electrode layer 11 can be formed on almost the entire surface of the dielectric layer 9, Since the insulation distance between the end and the external electrode 7 can be minimized and the effective area of the internal electrode layer 11 can be increased, the capacitance of the multilayer electronic component can be increased. At the same time, the variation can be reduced.

Furthermore, since the area of the internal electrode layer 11 formed between the dielectric layers 9 is substantially the same as that of the dielectric layer 9, there is no difference in thickness between the parts of the multilayer electronic component. Delamination can be prevented from occurring due to the internal stress caused by the thickness difference.

In the above example, the oxide layer 15 is formed on the entire outer peripheral edge of the internal electrode layer 11, but the oxide layer is formed only on the end faces 3 and 5 of the electronic component body 1 on which the external electrodes 7 are formed. Even if it is formed, the end margin can be minimized.

Further, in the multilayer electronic component of the present invention, FIG.
As shown in (2), the oxide layer 43 formed at the end of the internal electrode layer and the dielectric layer 9 in the vicinity thereof are provided with two conductive portions 51 for electrically connecting the same internal electrode layer and external electrodes. It can also be formed. That is, the end surface 45 of the electronic component body 53
By forming two conductive portions 51 so that a portion that is not conductive remains on one internal electrode layer, the bonding area between the oxide layer 43 and the electronic component body 53 can be increased, Strength can be increased.

FIG. 4A shows another multilayer electronic component of the present invention. In this multilayer electronic component, the same electronic component main body 63 formed by forming an oxide layer 61 is used. A pair of external electrodes 67a and 67b are formed on the end surface 65.

In this case, as shown in FIG. 4B, of the internal electrode layers 69a and 69b formed on the electronic component body 63, a conductive layer for electrically connecting the odd-numbered internal electrode layers 69a to the external electrodes 67a. And a conductive portion 73b for electrically connecting the even-numbered internal electrode layer 69b to the external electrode 67b are formed on the right side, and the conductive portions 73a and 73b formed on the left and right are stacked in the stacking direction. It is isolated so that it does not overlap when viewed from the viewpoint.

As described above, the external electrode 67 is provided on the same end face 65.
By forming two a and 67b, the current path becomes symmetrical, so that the impedance at high frequencies can be reduced. Further, the mountability has a high degree of freedom and the mounting area can be reduced. .

[0054]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, BaTiO ₃ , MgCO ₃ , MnCO ₃
And Y ₂ O ₃ powder and CaO, Si as grain boundary phase components
A green slurry to be the dielectric layer 9 was prepared by preparing a ceramic slurry comprising O _{2 and the} like, and butyral resin and toluene as organic components, and applying the slurry on a PET film by a doctor blade method.

Thereafter, the green sheet was peeled off from the PET film to form a 9 μm-thick ceramic green sheet, and ten of these were laminated to form an end face ceramic green sheet layer. Then, these end face ceramic green sheet layers were dried. This end face ceramic green sheet layer was arranged on a base plate, pressed by a press machine, and adhered to the base plate.

On the other hand, the same ceramic slurry as described above was applied on a PET film by a doctor blade method, and dried to form a ceramic green sheet having a thickness of 3.6 μm.

Next, an internal electrode paste was prepared by kneading Ni powder having an average particle size of 0.2 μm, ethyl cellulose, and an organic vehicle with three rolls.

Thereafter, the above-mentioned internal electrode paste was printed on one main surface of the obtained ceramic green sheet using a screen printing apparatus, dried, and then peeled off.

Thereafter, 351 green sheets on which the internal electrode patterns were formed were laminated on the end face ceramic green sheet layers, and thereafter, the end face ceramic green sheet layers were further laminated to produce a laminated molded article. .

Next, the laminated molded body is placed on a mold,
From the laminating direction, the pressure is increased stepwise by a pressing plate of a press machine to perform pressure bonding. After that, the laminated molded body is cut into a predetermined chip shape, and as shown in FIG. An electronic component body 13 having an end exposed at the end faces 3 and 5 was produced.

Next, heating was performed at 300 ° C. in the air or at 500 ° C. in an oxygen / nitrogen atmosphere of 0.1 Pa to remove the solder. Further, in an oxygen / nitrogen atmosphere of 10 ^-7 Pa, 130
The electronic component body 1 was baked at 0 ° C. for 2 hours and heat-treated at 1000 ° C. in an oxygen / nitrogen atmosphere of 10 ⁻² Pa to form an oxide layer 15 as shown in FIG. I got At this time, the thickness of the oxide layer 15 is 0.05 to 70.
μm.

A sample of a comparative example shown in FIG. 5A in which an end margin portion was formed by a printing pattern and a side margin portion was heat-treated to form an oxide layer was also prepared.

Further, by using a sputtering method using masking, the insulating portions 8 are alternately provided only on the end faces of the internal electrode layers 11.
A sample of Comparative Example shown in FIG.

Thereafter, conductive portions 17 were formed in the oxide layer 15 and the dielectric layer 9 in the vicinity thereof so that the internal electrode layers 11 were electrically connected to the external electrodes 7 alternately. At this time, in the laser heating method, the beam diameter was set to be slightly larger than the width of the end of the internal electrode layer 11, and the entire surface of the end faces 3, 5 of the single internal electrode layer 11 was locally heated.

Thereafter, the end faces 3 and 5 of the electronic component body 1
u paste and baked at 900 ° C.
/ Sn plating was performed to form an external electrode 7 connected to the internal electrode layer 11, thereby producing a multilayer electronic component as shown in FIG. In addition, sample No. For No. 8, the laminated electronic component of FIG. 3 was produced.

The thickness of the dielectric layer 9 interposed between the internal electrode layers 11 of the multilayer ceramic capacitor thus obtained was 3 μm, and the effective number of laminated dielectric layers 9 was 350.

Next, for each of the 100 samples produced, a frequency of 1 kHz and an AC voltage of 1 were measured using a capacitance meter.
The capacitance at V, its variation and dielectric loss were measured, and the short-circuit rate was also evaluated.

Also, a copper wire was connected on the external electrode 7 and pulled from both sides to measure the strength of the connection portion of the external electrode 7. Table 1 shows the results.

[0069]

[Table 1]

As is clear from the results in Table 1, the sample No. of the present invention in which the oxide layer 15 having the conductive portion 17 was formed on the end faces 3 and 5 of the electronic component body 1 was obtained. 1 to 8, the capacitance was 9.1 μF or more, and the tensile strength of the external electrode 7 was 5.2.
The characteristics of the multilayer capacitor could be improved with a high value of kgf or more and almost no short circuit. In particular, in Sample No. 1 in which the thickness of the oxide layer 15 was formed in the range of 0.1 to 20 μm and one conductive portion 17 was formed. In the cases of 2 to 4, the capacitance is 9.6.
With a μF or more and a tensile strength of 5.3 kgf or more, short-circuit failure was not observed, and the thinner the oxide layer, the more the variation in capacitance could be reduced, and a multilayer ceramic capacitor with good characteristics could be obtained. .

Further, the thickness of the oxide layer 15 is set to 20 μm,
Sample No. 2 in which two conductive portions 17 were formed. 8
The capacitance is as high as 9.6 μF, and particularly, the tensile strength is 5.
The maximum value was 8 kgf.

On the other hand, as shown in FIGS. 5A and 5B, the sample No. In Nos. 9 and 10, the capacitance was low, the variation in the capacitance was large, and the tensile strength was low.

[0073]

As described in detail above, in the multilayer electronic component of the present invention, an oxide layer is formed at the end of the internal electrode layer, and furthermore, a conductive portion is provided on this oxide layer, The end margin can be minimized, the effective area of the internal electrode layer can be increased, the capacitance can be increased, and the variation can be reduced.

Further, since there is no thickness difference depending on the location of the electronic component body, it is possible to prevent the occurrence of delamination due to internal stress caused by the thickness difference.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a multilayer electronic component of the present invention.

2A is a perspective view showing an electronic component body, FIG. 2B is a perspective view showing an electronic component body in which an oxide layer and a conductive portion are formed on the electronic component body, and FIG. It is a schematic sectional drawing which expands and shows the state in which the conductive part was formed in the layer.

FIG. 3 is a perspective view showing another laminated electronic component of the present invention in which two conductive portions are formed on one internal electrode layer.

4A is a perspective view showing still another laminated electronic component of the present invention in which two external electrodes are provided on the same end face of the electronic component body, and FIG. 4B is a perspective view showing the oxide of FIG. 5A. It is a perspective view which shows the formation position of the conductive part in a layer.

FIG. 5A is a schematic cross-sectional view of a conventional multilayer electronic component manufactured by controlling a printing pattern and forming an end margin portion, and FIG. FIG. 7 is a schematic cross-sectional view of a conventional laminated electronic component manufactured by alternately performing an insulation process on the electronic component.

[Explanation of symbols]

 1, 53, 63, 81 ... electronic component body 3, 5, 45, 65 ... end face 7, 67a, 67b, 85 ... external electrode 9 ... ... Dielectric layers 11, 69a, 69b, 81 Internal electrode layers 13 Electronic components Body 15, 43, 61 ... oxide layer 17, 51, 73a, 73b ... conductive part

Claims (6)

[Claims] 1. A laminated electronic component comprising a pair of external electrodes formed by alternately connecting said internal electrode layers to an end surface of an electronic component body in which dielectric layers and internal electrode layers are alternately laminated. Oxidizing an end of the internal electrode layer on the side of the external electrode to form an oxide layer, and electrically connecting the internal electrode layer and the external electrode to the oxide layer and a dielectric layer in the vicinity thereof. A multilayer electronic component, comprising: a conductive portion for connecting to the electronic component. 2. The multilayer electronic component according to claim 1, wherein an oxide layer is formed on the entire outer peripheral edge of the internal electrode layer. 3. The multilayer electronic component according to claim 1, wherein the depth of the oxide layer is 50 μm or less. 4. The multilayer electronic component according to claim 1, wherein a plurality of conductive portions are formed in one oxide layer and a dielectric layer near the oxide layer. . 5. The multilayer electronic component according to claim 1, wherein a pair of external electrodes are provided on the same end surface of the electronic component body. 6. A step of alternately laminating dielectric green sheets and internal electrode patterns to form a laminated molded body in which the entire outer peripheral end of the internal electrode pattern is exposed at the end face, Baking in an atmosphere, a step of preparing an electronic component body in a low oxygen atmosphere, and heat treating the electronic component body to oxidize the entire outer peripheral edge of the internal electrode layer to form an oxide layer, A step of fabricating an electronic component body in which a dielectric layer and an internal electrode layer whose entire outer peripheral edge is an oxide layer are alternately laminated, and locally heating the oxide layer in a reducing atmosphere. Forming a conductive portion on the oxide layer and the dielectric layer in the vicinity thereof, and applying and baking an external electrode paste to an end surface of the electronic component body to form a pair of external electrodes in which the internal electrode layers are alternately connected. And a step of manufacturing an electrode. Preparation of multilayer electronic parts that.