JP2016127262A - Feedthrough multilayer ceramic capacitor - Google Patents

Feedthrough multilayer ceramic capacitor Download PDF

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Publication number
JP2016127262A
JP2016127262A JP2015203774A JP2015203774A JP2016127262A JP 2016127262 A JP2016127262 A JP 2016127262A JP 2015203774 A JP2015203774 A JP 2015203774A JP 2015203774 A JP2015203774 A JP 2015203774A JP 2016127262 A JP2016127262 A JP 2016127262A
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external electrode
capacitor
length
height
width
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JP2015203774A
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Japanese (ja)
Inventor
知彦 財満
Tomohiko Zaima
知彦 財満
伸 中安
Shin Nakayasu
伸 中安
隆 笹木
Takashi Sasaki
隆 笹木
不器男 木下
Fukio Kinoshita
不器男 木下
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太陽誘電株式会社
Taiyo Yuden Co Ltd
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Priority to JP2014265701 priority
Application filed by 太陽誘電株式会社, Taiyo Yuden Co Ltd filed Critical 太陽誘電株式会社
Priority claimed from US14/973,666 external-priority patent/US9922770B2/en
Publication of JP2016127262A publication Critical patent/JP2016127262A/en
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Abstract

Provided is a feedthrough multilayer ceramic capacitor capable of improving strength when mounted on a circuit board.
A through-type multilayer ceramic capacitor 10-1 includes a first external electrode 12 provided at one end in a length direction of a capacitor body 11, and a second external electrode provided at the other end in the length direction of the capacitor body 11. In addition to including the external electrode 13, a part of the both sides in the height direction of the capacitor body 11 and both sides in the width direction of the capacitor body 11 are contacted with the first external electrode 12 and the second external electrode 13 at the center in the length direction of the capacitor body 11. A quadrangular cylindrical third external electrode 14 is provided so as to continuously cover a part thereof.
[Selection] Figure 2

Description

  The present invention relates to a feedthrough multilayer ceramic capacitor.

  In relation to the feedthrough multilayer ceramic capacitor, Patent Document 1 described below discloses a feedthrough multilayer ceramic capacitor 100 (hereinafter simply referred to as a feedthrough capacitor 100) as shown in FIG.

  The feedthrough capacitor 100 has a substantially rectangular parallelepiped shape that satisfies the condition of length L11> width W11> height H11, and has a length slightly smaller than these length L11, width W11, and height H11. A substantially rectangular parallelepiped capacitor main body 101 defined by the width and height, the first external electrode 102 provided at one end in the length direction of the capacitor main body 101, and the other end in the length direction of the capacitor main body 101. The second external electrode 103, the third external electrode 104 provided at the approximate center of the one end of the capacitor body 101 in the width direction, and the fourth external electrode provided at the approximate center of the other end of the capacitor body 101 in the width direction. 105.

  In the capacitor main body 101, a plurality of first internal electrode layers (not shown) and a plurality of second internal electrode layers (not shown) are alternately arranged in the height direction via dielectric layers (not shown). Stacked capacitor portions are provided. One end portions of the plurality of first internal electrode layers are connected to the first external electrode 102, the other end portion is connected to the second external electrode 103, and one end portions of the plurality of second internal electrode layers are third. It is connected to the external electrode 104 and the other end is connected to the fourth external electrode 105.

  By the way, this type of through-type multilayer ceramic capacitor is still required to be reduced in size and thickness, and in particular, there is a concern about strength when mounted on a circuit board with respect to reduction in thickness. This point will be described below with reference to FIG.

  The conventional feedthrough capacitor 100 shown in FIG. 1 is generally sucked by a suction nozzle at the part supply location at the center of one surface in the height direction or the other surface (see the + mark in FIG. 1A) or its vicinity. It is transported later and mounted on a circuit board such as a circuit board (component mounting board) capable of surface mounting, a circuit board (component built-in board) capable of surface mounting and internal mounting, etc.

  However, since the conventional feedthrough capacitor 100 shown in FIG. 1 has a structure in which a load is directly applied to the capacitor body 101 from the suction nozzle when mounted, there is a concern that the capacitor body 101 may crack due to this load. Regardless of the size of the crack, the crack allows water intrusion into the capacitor body 101. Therefore, there is a probability that the first internal electrode layer and the second internal electrode layer are corroded by the infiltrated water and the capacity is lowered. And the probability that the first internal electrode layer and the second internal electrode layer are short-circuited to cause functional failure increases.

JP 2008-294298 A

  An object of the present invention is to provide a feedthrough multilayer ceramic capacitor capable of improving strength when mounted on a circuit board.

  In order to solve the above-described problems, a through-type multilayer ceramic capacitor according to the present invention includes a plurality of first internal electrode layers and a plurality of second electrodes in a substantially rectangular parallelepiped capacitor body defined by a length, a width, and a height. A through-type multilayer ceramic capacitor provided with a capacitor portion in which internal electrode layers are alternately stacked in a height direction through dielectric layers, wherein (1) the capacitor body is provided at one end in the length direction of the capacitor body. Provided so as to continuously cover one surface in the length direction, part of both sides in the height direction and part of both surfaces in the width direction, and one end in the length direction of the plurality of first internal electrode layers is connected A first external electrode; and (2) the other end in the length direction of the capacitor body is continuously covered with the other surface in the length direction, part of both sides in the height direction, and part of both sides in the width direction. The other end in the length direction of the plurality of first internal electrode layers A third external electrode connected to the capacitor body; and (3) a part of both sides of the capacitor body in the height direction in a non-contact manner with the first external electrode and the second external electrode at the longitudinal center of the capacitor body. And one end of the plurality of second electrode layers are connected to one of the portions covering a part of the both sides of the width direction, and the other A rectangular tube-shaped third external electrode connected to the other end in the width direction of the plurality of second electrode layers, and (4) when the through-type multilayer ceramic capacitor is viewed from the height direction. The dimension of the first external electrode along the length of the capacitor body is E1, the dimension of the second external electrode along the length of the capacitor body is E2, and the length of the capacitor body of the third external electrode is E2. When the dimension along the length is E3, the dimension E1 and the front Dimensions E3 will satisfy the condition of E1 <E3, and the dimension E3 and the dimension E2 is satisfies the condition of E2 <E3.

  ADVANTAGE OF THE INVENTION According to this invention, the penetration type multilayer ceramic capacitor which can aim at the intensity | strength improvement when mounting in a circuit board can be provided.

FIG. 1A is a view showing one surface in the height direction of a conventional through-type multilayer ceramic capacitor, and FIG. 1B is a view showing one surface in the same width direction. FIG. 2A is a view showing one surface in the height direction of the feedthrough multilayer ceramic capacitor according to the first embodiment of the present invention, and FIG. 2B is a view showing one surface in the same width direction. FIG. 3A is a view showing the shape of the first internal electrode layer built in the capacitor body, and FIG. 3B is a view showing the shape of the second internal electrode layer built in the capacitor body. FIG. 4 is an enlarged cross-sectional view taken along line S1-S1 in FIG. FIG. 5 is an enlarged cross-sectional view taken along line S2-S2 of FIG. FIG. 6 is an enlarged sectional view taken along line S3-S3 of FIG. FIG. 7 is an enlarged view of FIG. FIG. 8A is a view showing one surface in the height direction of the feedthrough multilayer ceramic capacitor according to the second embodiment of the present invention, and FIG. 2B is a view showing one surface in the same width direction. FIG. 9A is a diagram showing the shape of the first internal electrode layer built in the capacitor body, and FIG. 9B is a diagram showing the shape of the second internal electrode layer built in the capacitor body. FIG. 10 is a view showing one surface of the capacitor main body in the height direction. FIG. 11 is an enlarged cross-sectional view taken along line S4-S4 in FIG. 12A is a diagram showing a modification of the shape of the first internal electrode layer shown in FIG. 9A, and FIG. 12B is a diagram instead of the first internal electrode layer shown in FIG. 9A. FIG. 11 is a view corresponding to FIG. 10 showing one surface in the height direction of the capacitor body using the first internal electrode layer shown in FIG.

<< First Embodiment >>
First, the structure and effects of the feedthrough multilayer ceramic capacitor 10-1 (hereinafter simply referred to as feedthrough capacitor 10-1) according to the first embodiment of the present invention will be described with reference to FIGS. 4 and 6 illustrate five first internal electrode layers 15 described later and five second internal electrode layers 16 described later. This is for convenience of illustration and is described later. The number of first internal electrode layers 15 and the number of second internal electrode layers 16 to be described later are not limited.

  As shown in FIGS. 2A and 2B, the feedthrough capacitor 10-1 has a substantially rectangular parallelepiped shape that satisfies the condition of length L1> width W1> height H1. A substantially rectangular parallelepiped capacitor main body 11 defined by a length, width and height slightly smaller than the length L1, the width W1 and the height H1, and one end portion in the length direction of the capacitor main body 11 (FIG. 2A) And the first external electrode 12 provided at the left end of FIG. 2B and the other end in the length direction of the capacitor body 11 (the right end of FIGS. 2A and 2B). The first external electrode 12 and the second external electrode 13 are not in contact with the second external electrode 13 and the central portion in the length direction of the capacitor main body 11 (the left and right central portions in FIGS. 2A and 2B). And the third external electrode 14 having a quadrangular cylindrical shape. Further, of both the height direction both surfaces and the width direction both surfaces of the capacitor body 11, a portion 11 a between the first external electrode 12 and the third external electrode 14 and a portion between the second external electrode 13 and the third external electrode 14. 11b is exposed (hereinafter referred to as an exposed portion 11a and an exposed portion 11b).

  As shown in FIG. 4, the capacitor body 11 includes a dielectric first protective part PP1, a plurality of first internal electrode layers 15 and a plurality of second internal electrode layers 16 with a dielectric layer 17 interposed therebetween. Capacitance portions CP and dielectric second protection portions PP2 alternately stacked in the height direction are arranged in layers in the height direction in the same order. Each first internal electrode layer 15 has a substantially rectangular shape as shown in FIG. 3A, and is one end in the length direction (the left end in FIG. 3A) and the other end in the length direction. Each (right end portion in FIG. 3A) integrally has a narrow drawer portion 15a extending in the length direction. On the other hand, each second internal electrode layer 16 has a substantially rectangular shape as shown in FIG. 3B, and has one end in the width direction (the lower end in FIG. 3B) and the other end in the width direction. Each (upper end portion in FIG. 3B) integrally has a narrow drawer portion 16a extending in the width direction.

  As can be seen from FIGS. 4 to 6, one end portion in the length direction of each first internal electrode layer 15, specifically, the left end edge of the left lead portion 15 a in FIG. 3A is a postscript portion of the first external electrode 12. The other end in the length direction of each first internal electrode layer, specifically, the right end edge of the right lead portion 15a in FIG. 3A is connected to a postscript portion 13a of the second external electrode 13. Electrically connected. On the other hand, one end in the width direction of each second internal electrode layer 16, specifically, the lower end edge of the lower lead portion 16 a in FIG. 3B is electrically connected to the postscript portion 14 c of the third external electrode 14, The other end in the width direction of each second internal electrode layer 16, specifically, the upper end edge of the upper lead portion 16 a in FIG. 3B is electrically connected to the postscript portion 14 d of the third external electrode 14.

  The first protective part PP1, each dielectric layer 17, and the second protective part PP2 are made of dielectric ceramics having substantially the same composition and substantially the same dielectric constant, and the thicknesses of the dielectric layers 17 are substantially the same. . This dielectric ceramic is preferably a dielectric ceramic mainly composed of barium titanate, strontium titanate, calcium titanate, magnesium titanate, calcium zirconate, calcium zirconate titanate, barium zirconate, titanium oxide, etc. More preferably, dielectric ceramics of ε> 1000 or class 2 (high dielectric constant type) can be used. “Dielectric ceramics with substantially the same composition and substantially the same dielectric constant” as used herein means that at least one of the composition and the dielectric constant is within an allowable range due to the degree of sintering, etc. The meaning includes the case where the thickness is almost the same, as well as the case where the thickness is slightly different within the allowable range or manufacturing tolerance due to the degree of compression at the time of lamination. Include as its meaning.

  Each first internal electrode layer 15 and each second internal electrode layer 16 are made of good conductors having substantially the same composition, and the thickness of each first internal electrode layer 15 and each second internal electrode layer 16 is substantially the same. . As the good conductor, a good conductor mainly composed of nickel, copper, palladium, platinum, silver, gold, an alloy thereof or the like can be used. The term “good conductor having substantially the same composition” as used herein includes not only the case where the composition is exactly the same, but also the case where the composition is slightly different within an allowable range due to the degree of sintering, etc. In addition to the case where the thicknesses are exactly the same, the meaning includes the case where the thickness is slightly different within the allowable range or within the manufacturing tolerance due to the degree of compression during lamination.

  As shown in FIGS. 4 to 6, the first external electrode 12 includes a portion 12 a that covers one surface in the length direction of the capacitor body 11 (left surface in FIGS. 4 and 5), and one surface in the height direction of the capacitor body 11 ( A portion 12b covering a part of the upper surface in FIG. 4, a portion 12c covering a part of the other surface in the height direction of the capacitor body 11 (lower surface in FIG. 4), and one surface in the width direction of the capacitor body 11 (lower surface in FIG. 5). ) And a portion 12e covering a part of the other surface in the width direction of the capacitor main body 11 (upper surface in FIG. 5). The first external electrode 12 has a thickness of a portion 12f near the ridgelines (pointing to four ridgelines) of one surface in the length direction of the capacitor main body 11 (left surface in FIGS. 4 and 5) of the portions 12b to 12e. It is thicker than the thickness (hereinafter referred to as the thick portion 12f).

  The dimensions of the portions 12b to 12e along the length of the capacitor body 11 are the same in the design reference dimensions that do not include manufacturing tolerances. Further, the thicknesses of the portions 12b to 12e are the same in design reference dimensions not including manufacturing tolerances.

  As shown in FIGS. 4 to 6, the second external electrode 13 includes a portion 13 a that covers the other surface in the length direction of the capacitor body 11 (the right surface in FIGS. 4 and 5), and one surface in the height direction of the capacitor body 11. (A top surface in FIG. 4), a portion 13 b covering a part of the capacitor body 11, a portion 13 c covering a part of the other surface in the height direction (a bottom surface in FIG. 4), and one surface in the width direction of the capacitor body 11 (in FIG. 5). A portion 13d covering a part of the lower surface and a portion 13e covering a part of the other surface in the width direction of the capacitor body 11 (upper surface in FIG. 5) are continuously provided. The second external electrode 13 has portions 13b to 13e having a thickness of a portion 13f close to a ridgeline (pointing to four ridgelines) on the other surface in the length direction of the capacitor body 11 (the right surface in FIGS. 4 and 5). (Hereinafter, referred to as a thick portion 13f).

  The dimensions of the portions 13b to 13e along the length of the capacitor body 11 are the same in the design reference dimensions that do not include manufacturing tolerances. Moreover, the thickness of the parts 13b-13e is the same in the design reference dimension which does not include a manufacturing tolerance.

  As shown in FIGS. 4 to 6, the third external electrode 14 includes a portion 14 a that covers a part of one surface in the height direction of the capacitor body 11 (upper surface in FIGS. 4 and 6), and the height of the capacitor body 11. A portion 14b that covers a part of the other surface in the direction (the lower surface in FIGS. 4 and 6), a portion 14c that covers a part of one surface in the width direction of the capacitor body 11 (the lower surface in FIG. 5, the left surface in FIG. 6), and the capacitor body 11 continuously covers a portion 14d covering a part of the other surface in the width direction 11 (the upper surface in FIG. 5 and the right surface in FIG. 6). The third external electrode 14 has a thickness of a portion 14e close to a ridgeline (pointing to two ridgelines) of one surface in the height direction of the capacitor body 11 (upper surface in FIGS. 4 and 6), and the height of the capacitor body 11. The thickness of the portion 14e close to the ridge line (pointing to the two ridge lines) of the other direction surface (the lower surface in FIGS. 4 and 6) is thicker than the thickness of the portions 14a to 14d (hereinafter referred to as the thick portion 14e). say).

  The dimensions of the portions 14a to 14d along the length of the capacitor body 11 are the same in the design reference dimensions that do not include manufacturing tolerances. Moreover, the thickness of the parts 14a-14d is the same in the design standard dimension which does not include a manufacturing tolerance.

  The first external electrode 12, the second external electrode 13, and the third external electrode 14 are each a two-layer structure of a base film that is in close contact with the outer surface of the capacitor body 11 and a surface film that is in close contact with the outer surface of the base film, or And a multilayer structure having at least one intermediate film between the base film and the surface film. The base film is made of, for example, a baked film, and a good conductor mainly composed of nickel, copper, palladium, platinum, silver, gold, or an alloy thereof can be used for the baked film. The surface film is made of, for example, a plating film, and a good conductor whose main component is preferably copper, tin, palladium, gold, zinc, or an alloy thereof can be used for the plating film. The intermediate film is made of, for example, a plating film, and a good conductor whose main component is preferably platinum, palladium, gold, copper, nickel, an alloy thereof, or the like can be used for the plating film.

  As shown in FIG. 2A, the feedthrough capacitor 10-1 described above has a dimension along the length of the capacitor body 11 of the first external electrode 12 when the feedthrough capacitor 10-1 is viewed from the height direction. Is E1, the dimension of the second external electrode 13 along the length of the capacitor body 11 is E2, and the dimension of the third external electrode 14 along the length of the capacitor body 11 is E3, the dimensions E1 and E3 are The condition E1 <E3 is satisfied, and the dimension E2 and the dimension E3 satisfy the condition E2 <E3. Incidentally, the dimension E1 and the dimension E2 may be the same or slightly different in the design standard dimension not including the manufacturing tolerance.

  The above-mentioned conditions of E1 <E3 and E2 <E3 are effective for “improvement of strength at the time of mounting”, and the effectiveness (effect) will be described below.

  The feedthrough capacitor 10-1 is transported after being sucked by a suction nozzle at the center of one surface in the height direction or the other surface (refer to the + sign in FIG. 2A) or its vicinity at the part supply location. It is mounted on a circuit board, for example, a circuit board (component mounting board) that enables surface mounting, a circuit board (component built-in board) that enables surface mounting and internal mounting, and the like.

  Since the conventional feedthrough capacitor 100 shown in FIG. 1 has a structure in which a load is directly applied to the capacitor body 101 from the suction nozzle when mounted, there is a concern that the capacitor body 101 may crack due to this load. On the other hand, the feedthrough capacitor 10-1 described above has the third external electrode 14 in the shape of a square tube at the center in the length direction of the capacitor body 11, and the above-described conditions of E1 <E3 and E2 < Since the condition of E3 is satisfied, the load from the suction nozzle at the time of mounting can be received by the third external electrode 14, and this load is distributed to the third external electrode 14 having a rectangular tube shape. Accordingly, the capacitor main body 11 can be prevented from cracking at the time of mounting, and the strength at the time of mounting can be improved. Desirably, the dimension E3 of the third external electrode 14 is designed to be as large as possible. In this way, the relaxation action can be obtained more reliably, and the contact position of the suction nozzle with respect to the third external electrode 14 is shifted. But you can get the same benefits.

  In addition, as shown in FIG. 7, the feedthrough capacitor 10-1 described above has a total area of a planar contour when the feedthrough capacitor 10-1 is viewed from the height direction as TAR, and the first external electrode 12. When the area of the planar outline is AR1, the area of the planar outline of the second external electrode 13 is AR2, and the area of the planar outline of the third external electrode 14 is AR3, the total area TAR, area AR1, area AR2, and area AR3 Satisfies the condition of 0.6 ≦ (AR1 + AR2 + AR3) /TAR≦0.9. Incidentally, the area AR1 and the area AR2 may be the same or slightly different from each other in the design standard dimension not including the manufacturing tolerance.

  Since the above-mentioned condition of 0.6 ≦ (AR1 + AR2 + AR3) /TAR≦0.9 is effective for “reliability improvement at the time of connection”, its effectiveness (effect) will be described below.

  After the feedthrough capacitor 10-1 is mounted on a circuit board, the external electrodes 12 to 14 are electrically connected to conductor pads and the like. Specifically, in a circuit board (component mounting board) capable of surface mounting, each external electrode 12 to 14 is electrically connected to a conductor pad using solder, and surface mounting and internal mounting. In the circuit board (component built-in board) that enables the external electrodes 12 to 14 to be electrically connected to the conductor pads using solder, and the conductor vias are electrically connected to the external electrodes 12 to 14. Connected to.

  The conventional feedthrough capacitor 100 shown in FIG. 1 does not have the third external electrode 14 like the feedthrough capacitor 10-1, and when the feedthrough capacitor 100 is viewed from the height direction. Since the occupation ratio of the area sum of the planar outlines of the first external electrode 102 to the fourth external electrode 105 to the area of the planar outline is about 50%, the conductor pad and the conductor are only required to be slightly displaced from the mounting position on the circuit board. There is a concern that the reliability of electrical connection with vias may be reduced. On the other hand, in the feedthrough capacitor 10-1, the third external electrode 14 having a rectangular tube shape is present at the center in the length direction of the capacitor body 11, and the feedthrough capacitor 10-1 is arranged in the height direction. Occupying ratio of the area sum of the planar outlines of the first external electrode 12 to the third external electrode 14 with respect to the area of the planar outline when viewed from above is 60% or more, and 0.6 ≦ (AR1 + AR2 + AR3) / TAR ≦ 0. Since the condition of No. 9 is satisfied, even when the mounting position on the circuit board is slightly shifted, the intended electrical connection can be performed accurately and the reliability at the time of connection can be improved.

  In addition, 0.6 in the above-mentioned conditions of 0.6 ≦ (AR1 + AR2 + AR3) /TAR≦0.9 satisfies the above-mentioned conditions of E1 <E3 and E2 <E3, and the above “improvement of strength when mounted” Is a lower limit considering that Further, 0.9 in the same condition is a short circuit between the first external electrode 12 and the third external electrode 14 when the external electrodes 12 to 14 and the conductive pads or the conductive vias are electrically connected, and the first 2 is an upper limit value in consideration of avoiding a short circuit between the external electrode 13 and the third external electrode 14.

  Further, in the feedthrough capacitor 10-1, the surface roughness of the first external electrode 12, the surface roughness of the second external electrode 13, and the surface roughness of the third external electrode 14 are determined by the exposed portions 11a and 11b of the capacitor body 11. It is rougher than the surface roughness. Incidentally, the surface roughness of the first external electrode 12 and the surface roughness of the second external electrode 13 may be the same or slightly different in the design reference roughness not including the manufacturing tolerance.

  Since the roughness relationship described above is effective for “preventing peeling of the sealing resin”, its effectiveness (effect) will be described below.

  The feedthrough capacitor 10-1 described above may be sealed with a synthetic resin after being electrically connected to a conductor pad or the like of a circuit board. In particular, in a circuit board (component built-in board) capable of surface mounting and internal mounting, most of the internal mounting feedthrough capacitor 10-1 is sealed with a synthetic resin to ensure airtightness.

  The conventional feedthrough capacitor 100 shown in FIG. 1 does not have the roughness relationship as the feedthrough capacitor 10-1 described above. Therefore, when the feedthrough capacitor 100 after connection is sealed with a synthetic resin, the capacitor Since the adhesion of the sealing resin to the external electrodes 102 to 105 is weaker than the adhesion of the sealing resin to the main body 101, the sealing resin is peeled off from the external electrodes 102 to 105, causing corrosion and the like. There are concerns. On the other hand, since the surface roughness of the external electrodes 12 to 14 is rougher than the surface roughness of the exposed portions 11 a and 11 b of the capacitor body 11, the feedthrough capacitor 10-1 described above is sealed against the external electrodes 12 to 14. The adhesion of the stop resin can be increased to prevent the sealing resin from peeling off.

  Further, in the feedthrough capacitor 10-1, the thickness of the portion (thick portion 12f) near the ridge line on the first surface of the capacitor body 11 in the first external electrode 12 is thicker than the thickness of the portions 12b to 12d. The thickness (thick portion 13f) of the second external electrode 13 near the ridge line on the other surface in the length direction of the capacitor body 11 is thicker than the thickness of the portions 13b to 13d. The thickness of the portion close to the ridge line on one surface in the height direction (thick wall portion 14e) and the thickness of the portion close to the ridge line on the other surface in the height direction of the capacitor body 11 (thick wall portion 14e) are larger than the thickness of the portions 14a to 14d. Is also thicker.

  Since the thickness relationship described above is effective for “preventing connection failure”, its effectiveness (effect) will be described below.

  The feedthrough capacitor 10-1 described above may be used after being packaged in a tape-shaped packing material having a component housing recess. The through-type capacitor 10-1 packaged in the tape-shaped packing material is removed from the component housing recess by the suction nozzle after the cover tape is peeled off from the tape body, and mounted on the circuit board as described above. .

  Since the conventional feedthrough capacitor 100 shown in FIG. 1 does not have the thickness relationship (thick portions 12f, 13f, and 14e) as the feedthrough capacitor 10-1 described above, it is packaged in a tape-shaped packing material. Then, the surfaces of the external electrodes 102 to 105, particularly the surfaces on both sides in the height direction used for electrical connection, come into contact with the bottom surfaces of the component storage recesses of the tape-shaped packing material and the recess closing surfaces of the cover tapes. There is a concern that deterioration, dirt, and the like may occur due to friction, which may cause defects in the electrical connection between the external electrodes 102 to 105. On the other hand, since the feedthrough capacitor 10-1 is provided with thick portions 12f, 13f, and 14e near the ridgeline of the capacitor body 11 in each of the external electrodes 12-14, Even after packaging, the surfaces of the external electrodes 12 to 14, particularly the surfaces on both sides in the height direction used for electrical connection (the surfaces of the portions 12 b, 12 c, 13 b, 13 c, 14 a and 14 b) are the tape-shaped packing material. It is possible to suppress contact with the bottom surface of the component housing recess and the recess closing surface of the cover tape, thereby preventing each surface from being altered or contaminated due to friction, whereby each of the external electrodes 12 to 14 can be prevented. It is possible to prevent connection failure when electrically connecting the conductor pad and the conductor via.

Next, we prepared to confirm the effectiveness (effect) described above,
・ Evaluation sample 1 corresponding to feedthrough capacitor 10-1 shown in FIGS.
Sample 2 for evaluation corresponding to the conventional feedthrough capacitor 100 shown in FIG.
The specifications will be described using the symbols shown in each figure as appropriate. Incidentally, the dimension values described later are design reference dimensions that do not include manufacturing tolerances.

The specifications of the evaluation sample 1 are as follows.
-Overall length L is 1000 μm, width W is 600 μm, height H is 220 μm
・ The length of the capacitor body 11 is 960 μm, the width is 560 μm, and the height is 180 μm.
The thickness of the first protection part PP1 and the thickness of the second protection part PP2 of the capacitor body 11 are 30 μm, and the thickness of the capacitance part CP is 120 μm.
The thickness of the first internal electrode layer 15 and the thickness of the second internal electrode layer 16 included in the capacitor portion CP is 0.7 μm, the thickness of the dielectric layer 17 is 0.8 μm, and the first internal electrode layer 15 layer The number of the second internal electrode layers 16 is 40. The first protective part PP1, each dielectric layer 17, and the second protective part PP2 are dielectric ceramics mainly composed of barium titanate. 1 internal electrode layer 15 and each 2nd internal electrode layer 16 are the good conductor which has nickel as a main component, the thickness of the parts 12b-12e of the 1st external electrode 12, the thickness of the parts 13b-13e of the 2nd external electrode 13, and 3rd The thickness of the parts 14a to 14d of the external electrode 14 is 15 μm, the thickness of the part 12a of the first external electrode 12 and the thickness of the part 13a of the second external electrode 13 are 20 μm, and the thick part 12f of each external electrode 12 to 14 , 13f and 14e are 20 μm thick
The first external electrode 12, the second external electrode 13, and the third external electrode 14 have a two-layer structure of a base film mainly composed of nickel and a surface film mainly composed of copper. A dimension E1 of the first external electrode 12 The dimension E2 of the second external electrode 13 is 200 μm, and the dimension E3 of the third external electrode 14 is 350 μm.
The surface roughness Ra of the first external electrode 12, the surface roughness Ra of the second external electrode 13, and the surface roughness Ra of the third external electrode 14 are 0.31 μm or more, and the surfaces of the exposed portions 11a and 11b of the capacitor body 11 Roughness Ra is 0.08μm or less

  Here, the manufacturing method of the sample 1 for evaluation is introduced briefly. In production, first, a ceramic slurry containing barium titanate powder, ethanol (solvent), polyvinyl butyral (binder), and additives such as a dispersant is prepared, and nickel powder, terpineol (solvent), and ethyl cellulose (binder) are prepared. ) And an additive such as a dispersant.

  Subsequently, using a coating device such as a die coater or a gravure coater and a drying device, a ceramic slurry is coated on the surface of the carrier film and dried to produce a first green sheet. Further, using a printing device such as a screen printing machine or a gravure printing machine and a drying device, a metal paste is printed on the surface of the first green sheet in a matrix or zigzag pattern and dried to be used for the first internal electrode layer 15. The second green sheet on which the pattern group was formed was produced, and a metal paste was printed on the surface of the first green sheet in a matrix or zigzag pattern and dried to form a pattern group for the second internal electrode layer 16. A third green sheet is produced.

  Subsequently, using a laminating apparatus such as a movable suction head having a punching blade and a heater, the unit sheets punched from the first green sheet are stacked until they reach a predetermined number and are thermocompression bonded to correspond to the second protective part PP2. Create the site. Subsequently, using the same laminating apparatus, a unit sheet (first internal sheet) punched from the second green sheet on a unit sheet (including the pattern group for the second internal electrode layer 16) punched from the third green sheet. The portion corresponding to the capacitor portion CP is produced by repeating the operation of stacking and thermocompression bonding (including the pattern group for the electrode layer 15). Subsequently, using the same laminating apparatus as described above, the unit sheets punched from the first green sheet are stacked until they reach a predetermined number and are thermocompression bonded to produce a portion corresponding to the first protection part PP1. Subsequently, using a main crimping apparatus such as a hot isostatic press or a mechanical or hydraulic press, the stacked parts are subjected to main thermocompression to produce an unfired laminated sheet.

  Subsequently, by using a cutting device such as a blade dicing machine or a laser dicing machine, the unfired laminated sheet is cut into a lattice shape, and an unfired chip corresponding to the capacitor body 11 is produced. Subsequently, using a firing apparatus such as a tunnel-type firing furnace or a box-type firing furnace, a large number of unfired chips are subjected to a temperature corresponding to barium titanate and nickel in a reducing atmosphere or in a low oxygen partial pressure atmosphere. The capacitor body 11 is fabricated by firing (including binder removal processing and firing processing) using a profile.

  Subsequently, using a coating device such as a roller coating machine or a dip coating machine and a drying device, a metal paste (using the metal paste) is applied to both ends in the length direction of the capacitor body 11 and dried. After a baking process is performed in the same atmosphere to form a base film, a surface film covering the base film is formed by a plating process such as electrolytic plating, and the first external electrode 12 and the second external electrode 13 are manufactured. Further, using the same coating apparatus and drying apparatus as described above, a metal paste (using the metal paste is applied) is applied to the central portion in the length direction of the capacitor body 11 and dried, followed by baking in the same atmosphere as described above. After forming the base film, a surface film covering the base film is formed by a plating process such as electrolytic plating, and the third external electrode 14 is manufactured. Subsequently, the surface of the first external electrode 12, the surface of the second external electrode 13, and the surface of the third external electrode 14 are subjected to chemical etching to roughen the surfaces.

On the other hand, the specification of the evaluation sample 2 differs from the specification of the evaluation sample 1 only in the following points. Incidentally, the manufacturing method of the evaluation sample 2 is the same as the manufacturing method of the evaluation sample 1 except for the last chemical etching treatment.
The thickness of the first external electrode 102, the thickness of the second external electrode 103, the thickness of the third external electrode 104, and the thickness of the fourth external electrode 105 are 20 μm.
The dimension E13 of the third external electrode 104 and the dimension E14 of the fourth external electrode 105 are 350 μm, the dimension E15 of the third external electrode 104 and the dimension E16 of the fourth external electrode 105 are 150 μm (the dimensions E13 to E16 are shown in FIG. See))
The surface roughness Ra of the first external electrode 102, the surface roughness Ra of the second external electrode 103, the surface roughness Ra of the third external electrode 104, and the surface roughness Ra of the fourth external electrode 105 are 0.06 μm or less, The surface roughness Ra of the exposed portion of the capacitor body 101 is 0.08 μm or less.

  Next, the results of confirming the effectiveness (effect) described above using the evaluation samples 1 and 2 will be described.

  In the sample 1 for evaluation, since the dimension E1 of the first external electrode 12 and the dimension E2 of the second external electrode 13 are both 200 μm and the dimension E3 of the third external electrode 14 is 350 μm, the condition of E1 <E3 is satisfied. The condition of E2 <E3 is satisfied. On the other hand, the evaluation sample 2 does not have the quadrangular cylindrical third external electrode 14 unlike the evaluation sample 1, and therefore does not satisfy the both conditions. Regarding the strength improvement at the time of mounting, the bending strength of a total of five evaluation samples 1 and the bending strength of a total of five evaluation samples 2 were measured, and the bending strength of the evaluation sample 1 was 180 gf or more. The bending strength of the sample 2 for evaluation was 110 gf or less. From this, the evaluation sample 1 corresponding to the feedthrough capacitor 10-1 shown in FIGS. 2 to 7 is compared with the evaluation sample 2 corresponding to the previous feedthrough capacitor 100 shown in FIG. It can be said that it is effective for “improvement of strength when mounted”.

  Further, the evaluation sample 1 is obtained when the evaluation sample 1 is viewed from the height direction (the area AR1 of the planar outline of the first external electrode 12 + the area AR2 + of the planar outline of the second external electrode 13 + the area of the third external electrode 14). Since the calculated value of the area of the planar contour AR3) / the total area TAR of the planar contour of the evaluation sample 1 (average value of a total of five) is 0.77, 0.6 ≦ (AR1 + AR2 + AR3) / TAR ≦ 0 .9 condition is satisfied. On the other hand, when the evaluation sample 2 is viewed from the height direction, the evaluation sample 2 (the area of the planar outline of the first external electrode 102 + the area of the planar outline of the second external electrode 103 + the area of the third external electrode 104) Since the calculated value (the total area of the plane contour of the area of the plane contour + the area of the plane contour of the fourth external electrode 105) / the total area of the plane contour of the sample 2 for evaluation) is 0.50, the above condition is satisfied. Not satisfied. From this, the evaluation sample 1 corresponding to the feedthrough capacitor 10-1 shown in FIGS. 2 to 7 is compared with the evaluation sample 2 corresponding to the previous feedthrough capacitor 100 shown in FIG. It can be said that it is effective for “improvement of connection reliability”.

  Furthermore, in the sample 1 for evaluation, the surface roughness Ra of the first external electrode 12, the surface roughness Ra of the second external electrode 13, and the surface roughness Ra of the third external electrode 14 are 0.31 μm or more. Since the surface roughness Ra of the exposed portions 11 a and 11 b is 0.08 μm or less, the surface roughness of each of the first external electrode 12, the second external electrode 13, and the third external electrode 14 is that of the exposed portion of the capacitor body 11. Satisfies the roughness relationship of being rougher than the surface roughness. On the other hand, the evaluation sample 2 includes the surface roughness Ra of the first external electrode 102, the surface roughness Ra of the second external electrode 103, the surface roughness Ra of the third external electrode 104, and the surface roughness of the fourth external electrode 105. Since Ra is 0.06 μm or less and the surface roughness Ra of the exposed portion of the capacitor body 101 is 0.08 μm or less, the above-described roughness relationship is not satisfied. From this, the evaluation sample 1 corresponding to the feedthrough capacitor 10-1 shown in FIGS. 2 to 7 is compared with the evaluation sample 2 corresponding to the previous feedthrough capacitor 100 shown in FIG. It can be said that it is effective for “preventing peeling of the sealing resin”.

  Furthermore, in the sample 1 for evaluation, the thickness of the portions 12b to 12e of the first external electrode 12, the thickness of the portions 13b to 13e of the second external electrode 13, and the thickness of the portions 14a to 14d of the third external electrode 14 are 15 μm. The thicknesses of the thick portions 12f, 13f, and 14e of the external electrodes 12 to 14 are 20 μm, and there is a 5 μm gap between them. That is, even if the evaluation sample 1 is packaged in a tape-shaped packing material having a component storage recess, the surfaces of the external electrodes 102 to 105, particularly the surfaces on both sides in the height direction used for electrical connection, are tape-shaped packing materials. It is difficult to come into contact with the bottom surface of the component housing recess and the recess closing surface of the cover tape. On the other hand, the evaluation sample 2 does not have a gap like the evaluation sample 1. Therefore, when the evaluation sample 2 is packaged in a tape-shaped packaging material having a component housing recess, the surfaces of the external electrodes 102 to 105, particularly the surfaces on both sides in the height direction used for solder connection and via connection, are tape-shaped. Contact with the inner surface of the component housing recess of the material or the recess closing surface of the cover tape tends to cause alteration or contamination due to friction on each surface. From this, the evaluation sample 1 corresponding to the feedthrough capacitor 10-1 shown in FIGS. 2 to 7 is compared with the evaluation sample 2 corresponding to the previous feedthrough capacitor 100 shown in FIG. It can be said that it is useful for “preventing poor connection”.

<Modification of First Embodiment>
(1) As the above-described feedthrough capacitor 10-1 (including the evaluation sample 1), the maximum thickness (thickness of the thick portion 12f) of the both sides in the height direction of the first external electrode 12 and the second external The maximum thickness of both side portions of the electrode 13 in the height direction (thickness of the thick portion 13f) and the maximum thickness of both side portions of the third external electrode 14 in the height direction (thickness of the thick portion 14e) are substantially the same. Although the maximum thickness of the both sides in the height direction of the first external electrode 12 and the maximum thickness of the both sides in the height direction of the second external electrode 13 are shown, If the maximum thickness is reduced, it is effective for “improvement of stability” after the feedthrough capacitor 10-1 is mounted on the circuit board.

  That is, in the feedthrough capacitor 10-1, the maximum thickness of the both sides in the height direction of the third external electrode 14 is equal to the maximum thickness of the both sides in the height direction of the first external electrode 12 and the second thickness. When the thickness is larger than the maximum thickness of the both sides in the height direction of the external electrode 13, the feedthrough capacitor 10-1 mounted on the circuit board is inclined or the first external electrode 12 or the second external electrode 13 is lifted. There is a concern that the subsequent electrical connection may be hindered. However, the maximum thickness of both the height direction both sides of the first external electrode 12 is T1max, the maximum thickness of the both sides of the second external electrode 13 in the height direction is T2max, and both the height directions of the third external electrode 14 are both When the maximum thickness of the portion is T3max, the maximum thickness T1max and the maximum thickness T3max satisfy the condition of T1max> T3max, and the maximum thickness T2max and the maximum thickness T3max satisfy the condition of T2max> T3max. By doing so, it is possible to prevent the above-described inclination and lifting, and to achieve the “improvement of stability”.

  (2) Although the feedthrough capacitor 10-1 (including the evaluation sample 1) described above has not been provided with any particular spacing restrictions on the exposed portions 11a and 11b of the capacitor body 11, these exposed portions 11a and 11b If the distance of 11b is determined based on the average thickness of the both sides in the height direction of the third external electrode 14, it is effective for “prevention of short circuit” due to ion migration.

  That is, in the feedthrough capacitor 10-1, the third external electrode 14 has a quadrangular cylindrical shape and has a large area on both sides in the height direction. When the thickness increases, a phenomenon (ion migration) occurs in which metal ions move from the third external electrode 14 to the first external electrode 12 and the second external electrode 13 through the ceramic body 11 due to a concentration gradient, There is a concern that a short circuit may occur in the external electrode 14, the first external electrode 12, and the second external electrode 13. However, when the average thickness of both side portions of the third external electrode 14 in the height direction is T3ave, the interval between the exposed portions 11a of the capacitor body 11 is I1, and the interval between the exposed portions 11b of the capacitor body 11 is I2. I1 and I2 refer to FIG. 2A), the average thickness T3ave and the interval I1 satisfy the condition of T3ave ≦ I1 / 2, and the average thickness T3ave and the interval I2 satisfy the condition of T3ave ≦ I2 / 2. If satisfied, the ion migration can be suppressed and the “prevention of short circuit” can be achieved.

  In order to confirm the effectiveness (effect) related to the “prevention of short circuit”, the dimension E1 of the third external electrode 14 of the evaluation sample 1 is increased so that both the interval I1 and the interval I2 are 40 μm, and The average thickness T3ave of the both sides in the height direction of the third external electrode 14 is set to 17.5 μm in accordance with the sample 1 for evaluation, and the average of both sides in the height direction of the third external electrode 14 of the sample A1 A sample A2 having a thickness T3ave of 20 μm and a sample A3 having an average thickness T3ave of both sides in the height direction of the third external electrode 14 of the sample A1 of 22.5 μm were prepared. Then, after each 100 samples A1 to A3 were left in an atmosphere of 85 ° C. and 85% humidity for 500 hours, the third external electrode 14 and the second electrode 14 and the third external electrode 14 were obtained using a high resistance meter (Agilent, 4329A). When the short-circuit occurrence rate with the first external electrode 12 and the short-circuit occurrence rate with the third external electrode 14 and the second external electrode 13 were examined, the short-circuit occurrence rate of the sample A1 was 0% and the short-circuit occurrence rate of the sample A2 was 0%. The short-circuit occurrence rate of sample A3 was 5%. That is, the samples A1 and A2 that satisfy the above-mentioned conditions of T3ave ≦ I1 / 2 and T3ave ≦ I2 / 2 are more effective in the “prevention of short circuit” than the sample A3 that does not satisfy the conditions. Was confirmed.

  (3) As the above-described feedthrough capacitor 10-1 (including the sample 1 for evaluation), the exposed portions 11a and 11b of the capacitor body 11 are not provided with a special interval restriction. If the interval 11b is determined based on the length L1 of the feedthrough capacitor 10-1, it is effective for "reduction of ESL (equivalent series inductance)".

  That is, in the feedthrough capacitor 10-1, the ESL increases as the substantial current distance between the first internal conductor layer 15 and the second internal electrode layer 16 increases. However, when the length of the feedthrough capacitor 10-1 is L1, the interval between the exposed portions 11a of the capacitor body 11 is I1, and the interval between the exposed portions 11b is I2 (L1, I1 and I2 are shown in FIG. 2A). If the distance I1 and the length L1 satisfy the condition of I1 ≦ 0.15 × L1 and the distance I2 and the length L1 satisfy the condition of I2 ≦ 0.15 × L1, “Reduction of ESL” can be achieved. Incidentally, the interval I1 and the interval I2 may be the same or slightly different from each other in the design standard dimension not including the manufacturing tolerance.

  In order to confirm the effectiveness (effect) related to the “reduction of ESL”, the same sample B1 as the sample 1 for evaluation (the length L1 is 1000 μm, both the intervals I1 and I2 are 125 μm), and the first sample B1 3 The sample E2 in which the dimension E1 of the external electrode 14 is reduced to reduce both the interval I1 and the interval I2 to 150 μm, and the dimension E1 of the third external electrode 14 in the sample B1 is reduced to reduce both the interval I1 and the interval I2 to 175 μm. Sample B3 was prepared. And when the ESL value of each of 100 samples B1 to B3 was examined using a network analyzer (manufactured by Agilent, 8753D), the ESL value (average value) of sample B1 was 15 pF, and the ESL value of sample B2 ( The average value) was 18 pF, and the ESL value (average value) of Sample B3 was 20 pF. In other words, the samples B1 and B2 satisfying the above-mentioned conditions of I1 ≦ 0.15 × L1 and I2 ≦ 0.15 × L1 are compared with the sample B3 not satisfying the same conditions in the above “reduction of ESL”. It was confirmed that it was effective.

<< Second Embodiment >>
First, the structure, effect, etc. of the feedthrough multilayer ceramic capacitor 10-2 (hereinafter simply referred to as feedthrough capacitor 10-2) according to the second embodiment of the present invention will be described with reference to FIGS.

  The feedthrough capacitor 10-2 is different from the feedthrough capacitor 10-1 in the structure in that the first internal electrode layer 15 shown in FIG. The internal electrode layer 18 (see FIG. 9A) is used. Since the structure other than this difference is the same as that of the feedthrough capacitor 10-1, the effects other than those obtained based on this difference are the same as the effects obtained with the feedthrough capacitor 10-1. Each description is omitted.

  Each of the first internal electrode layers 18 has an I shape as shown in FIG. 9A, and both sides in the width direction (FIG. 9) of one end portion in the length direction (left end portion in FIG. 9A). A narrow drawer extending in the width direction on both sides in the width direction (upper and lower sides in FIG. 9A) of the other side in the length direction (the right end portion in FIG. 9A) and the other end in the length direction (the right end portion in FIG. 9A). The portion 18a is integrally formed. Since the lead portion 18a of each first internal electrode layer 18 extends in the width direction similarly to the lead portion 16a of the second internal electrode layer 16, as can be seen from FIG. When the first internal electrode layer 18 and the second internal electrode layer 16 are projected in parallel to each other, the lower left portion between the lead portion 18a and the middle lower lead portion 16a in FIG. 10, and the upper left lead portion 18a and the middle upper lead portion. An interval I3 is formed between 16a, and an interval I4 is provided between the lower right drawer 18a and the lower center drawer 16a in FIG. 10 and between the lower right drawer 18a and the lower center drawer 16a. It is formed.

  As can be seen from FIG. 11, one end in the length direction of each first internal electrode layer 18, specifically, the lower and upper edges of the lower left and upper left lead portions 18 a in FIG. 9A are the first outer electrodes 12. 12d and 12e are electrically connected to each other, and the other end in the length direction of each of the first internal electrode layers 18, specifically, the lower end edges of the two right lead portions 18a in FIG. The upper end edge is electrically connected to the portion 13d and the portion 13e of the second external electrode 13, respectively.

  In the feedthrough capacitor 10-2, as shown in FIG. 10, the length of the first internal electrode layer 18 projected in parallel on one surface of the capacitor body 11 in the height direction is set to L2. The distance between the one lead portion 18a in the direction and the lead portion 16a of the second internal electrode layer 16 is I3, and the other lead portion 18a in the length direction of the first internal electrode layer 18 and the lead portion 16a of the second internal electrode layer 16 When the interval is I4, the interval I3 and the length L2 satisfy the condition of I3 ≦ 0.35 × L2, and the interval I4 and the length L2 satisfy the condition of I4 ≦ 0.35 × L2. . Incidentally, the interval I3 and the interval I4 may be the same or slightly different from each other in the design standard dimension not including the manufacturing tolerance.

  The condition of I3 ≦ 0.35 × L2 and the condition of I4 ≦ 0.35 × L2 are effective for “reduction of ESL (equivalent series inductance)”. That is, in the feedthrough capacitor 10-2, ESL increases as the substantial current distance between the first internal conductor layer 18 and the second internal electrode layer 16 increases. However, if the above-described conditions of I3 ≦ 0.35 × L2 and I4 ≦ 0.35 × L2 are satisfied, the “ESL reduction” can be achieved.

  In order to confirm the effectiveness (effect) related to this “reduction of ESL”, the first internal electrode layer 15 of the evaluation sample 1 (length L2 is 960 μm) is shown in FIG. The sample 18 is changed to the layer 18 and the positions of the lead-out portions 18a are changed to set the intervals I3 and I4 to 306 μm, and the positions of the lead-out portions 18a of the first internal electrode layer 18 of the sample C1 are changed. Sample C2 having I4 of 336 μm and sample C3 having interval I3 and interval I4 of 366 μm were prepared by changing the position of the lead-out portion 18a of the first internal electrode layer 18 of sample C1. Incidentally, the widths (the dimension in the direction along the length L2 in FIG. 10) of the lead portions 18a and 16a in the samples C1 to C3 were unified to 90 μm. Then, when the ESL values of 100 samples C1 to C3 were examined using a network analyzer (manufactured by Agilent, 8753D), the ESL value (average value) of sample C1 was 13 pF, and the ESL value of sample C2 ( The average value) was 15 pF, and the ESL value (average value) of Sample C3 was 17 pF. That is, the samples C1 and C2 satisfying the above-described conditions of I3 ≦ 0.35 × L2 and I4 ≦ 0.35 × L2 are compared with the sample C3 not satisfying the same conditions as the above “reduction of ESL”. It was confirmed that it was effective.

<Modification of Second Embodiment>
(1) As the above-described feedthrough capacitor 10-2 (including samples C1 and C2), the one using the first internal electrode layer 18 shown in FIG. 9A is shown. This first internal electrode layer Instead of 18, the first internal electrode layer 19 shown in FIG. As shown in FIG. 12B, the first internal electrode layer 19 has a length extending from one end in the length direction of the capacitor body 11 to the other end in the length direction. The shape is different from the first internal electrode layer 18 shown in FIG. As can be seen from FIG. 12B, even when the first internal electrode layer 19 is used, the first internal electrode is disposed on the entire surface of the capacitor body 10 in the same manner as when the first internal electrode layer 18 is used. When the layer 19 and the second internal electrode layer 16 are projected in parallel, the lower left lead portion 19a and the lower center lead portion 16a in FIG. 12B, as well as the upper left, the lead portion 19a, and the upper center lead portion 16a. An interval I3 is formed between the lower right drawer portion 19a and the lower center drawer portion 16a in FIG. 12B, and between the lower right drawer portion 19a and the lower center drawer portion 16a. Is formed.

  (2) The feedthrough capacitor 10-2 (including the samples C1 and C2) includes the conditions described in (1) to (3) of <Modification of the first embodiment>, that is, “T1max>. “T3max condition and T2max> T3max condition”, “T3ave ≦ I1 / 2 condition and T3ave ≦ I2 / 2”, “I1 ≦ 0.15 × L1 condition and I2 ≦ 0.15 × L1 condition” Can be adopted as appropriate, and the same effect can be obtained by adopting.

  10-1 ... through-type multilayer ceramic capacitor, 11 ... capacitor body, 11a, 11b ... exposed portion of the capacitor body, 12 ... first external electrode, 12a ... a portion of the first external electrode that covers one surface in the length direction of the capacitor body, 12b: a portion covering a part of one surface in the height direction of the capacitor body in the first external electrode, 12c: a portion covering a part of the other surface in the height direction of the capacitor body in the first external electrode, 12d: in the first external electrode A portion covering a part of one surface in the width direction of the capacitor body, 12e... A portion covering a part of the other surface in the width direction of the capacitor body in the first external electrode, 12f... A thick portion of the first external electrode, 13. Electrode, 13a: A portion covering the other surface in the length direction of the capacitor body in the second external electrode, 13b: A portion of one surface in the height direction of the capacitor body in the second external electrode Covering part, 13c: Part covering the other part of the second external electrode in the height direction of the capacitor body, 13d: Part covering the part of the second external electrode in the width direction of the capacitor body, 13e: Second external part A part of the electrode that covers a part of the other surface in the width direction of the capacitor body, 13f ... a thick part of the second external electrode, 14 ... a third external electrode, 14a ... one surface in the height direction of the capacitor body in the third external electrode 14bc: a portion covering a part of the other surface in the height direction of the capacitor body in the third external electrode, 14c: a portion covering a part of one surface in the width direction of the capacitor body in the third external electrode, 14d ... 3 A portion of the external electrode that covers a part of the other surface in the width direction of the capacitor body, 14e, a thick portion of the fourth external electrode, 15 a first internal electrode layer, 15a, a lead portion of the first internal electrode layer, 16 ... Second internal electrode layer, 16a ... extraction part of second internal electrode layer, 17 ... dielectric layer, CP ... capacitance part, PP1 ... first protection part, PP2 ... second protection part, 10-2 ... penetrating multilayer ceramic Capacitors, 18 ... first internal electrode layer, 18a ... leading portion of the first internal electrode layer, 19 ... first internal electrode layer, 19a ... leading portion of the first internal electrode layer.

Claims (11)

  1. A plurality of first internal electrode layers and a plurality of second internal electrode layers are alternately stacked in the height direction through a dielectric layer in a substantially rectangular parallelepiped capacitor body defined by length, width and height. A through-type multilayer ceramic capacitor provided with a capacitance portion,
    (1) One end of the capacitor body in the length direction is provided so as to continuously cover one surface in the length direction, part of both sides in the height direction, and part of both surfaces in the width direction. A first external electrode to which one longitudinal end of the first internal electrode layer is connected;
    (2) provided at the other end in the length direction of the capacitor body so as to continuously cover the other side in the length direction, part of both sides in the height direction and part of both sides in the width direction, A second external electrode to which the other longitudinal ends of the plurality of first internal electrode layers are connected;
    (3) A part of both sides of the capacitor body in the height direction and a part of both sides in the width direction are continuously connected to the center part in the length direction of the capacitor body in a non-contact manner with the first external electrode and the second external electrode. One end of the plurality of second electrode layers is connected to one of the portions covering a part of both sides in the width direction, and the width of the plurality of second electrode layers is connected to the other. A quadrangular cylindrical third external electrode to which the other end in the direction is connected,
    (4) E1 is a dimension along the length of the capacitor body of the first external electrode when the through-type multilayer ceramic capacitor is viewed from the height direction, and is along the length of the capacitor body of the second external electrode. When the dimension is E2, and the dimension of the third external electrode along the length of the capacitor body is E3, the dimension E1 and the dimension E3 satisfy the condition of E1 <E3, and the dimension E2 and the dimension The dimension E3 satisfies the condition of E2 <E3.
    Through-type multilayer ceramic capacitors.
  2. The total area of the planar outline when the feedthrough multilayer ceramic capacitor is viewed from the height direction is TAR, the area of the planar outline of the first external electrode is AR1, and the area of the planar outline of the second external electrode is AR2. When the area of the planar contour of the third external electrode is AR3, the total area TAR, the area AR1, the area AR2, and the area AR3 are such that 0.6 ≦ (AR1 + AR2 + AR3) /TAR≦0.9. Are satisfied,
    The feedthrough multilayer ceramic capacitor according to claim 1.
  3. Of both the height direction both sides and the width direction both sides of the capacitor body, a portion between the first external electrode and the third external electrode, and a portion between the second external electrode and the third external electrode are respectively Exposed
    The surface roughness of the first external electrode, the surface roughness of the second external electrode, and the surface roughness of the third external electrode are rougher than the surface roughness of the exposed portion of the capacitor body.
    The feedthrough multilayer ceramic capacitor according to claim 1 or 2.
  4. In the first external electrode, the thickness of the portion near the ridge line on one surface in the length direction of the capacitor body is thicker than the thickness of the other portion.
    In the second external electrode, the thickness of the portion near the ridge line on the other surface in the length direction of the capacitor body is thicker than the thickness of the other portion.
    In the third external electrode, the thickness of the portion close to the ridge line on one surface in the height direction of the capacitor body and the thickness of the portion close to the ridge line on the other surface in the height direction of the capacitor body are thicker than the thickness of the other portion.
    The feedthrough multilayer ceramic capacitor according to claim 1.
  5. The feedthrough multilayer ceramic capacitor has a height of 250 μm or less.
    The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 4.
  6. T1max is the maximum thickness of the both sides in the height direction of the first external electrode, T2max is the maximum thickness of the both sides in the height direction of the second external electrode, and When the maximum thickness is T3max, the maximum thickness T1max and the maximum thickness T3max satisfy the condition of T1max> T3max, and the maximum thickness T2max and the maximum thickness T3max satisfy the condition of T2max> T3max. Is pleased,
    The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 5.
  7. Of both the height direction both sides and the width direction both sides of the capacitor body, a portion between the first external electrode and the third external electrode, and a portion between the second external electrode and the third external electrode are respectively Exposed
    The average thickness of the both sides in the height direction of the third external electrode is T3ave, the interval between the exposed portions of the capacitor body between the first external electrode and the third external electrode is I1, and the capacitor body When the interval of the exposed portion between the second external electrode and the third external electrode is I2, the average thickness T3ave and the interval I1 satisfy the condition of T3ave ≦ I1 / 2, and the average thickness T3ave and the interval I2 satisfy the condition of T3ave ≦ I2 / 2.
    The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 6.
  8. Of both the height direction both sides and the width direction both sides of the capacitor body, a portion between the first external electrode and the third external electrode, and a portion between the second external electrode and the third external electrode are respectively Exposed
    The length of the feedthrough capacitor is L1, the interval of the exposed portion between the first external electrode and the third external electrode in the capacitor body is I1, and the second external electrode and the third external body in the capacitor body are When the interval of the exposed portion between the external electrodes is I2, the interval I1 and the length L1 satisfy the condition of I1 ≦ 0.15 × L1, and the interval I2 and the length L1 are I2 ≦ Satisfies the condition of 0.15 × L1,
    The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 7.
  9. The plurality of first internal electrode layers have a shape having narrow lead portions extending in the length direction at both ends in the length direction, and the plurality of second internal electrode layers extend in the width direction at both width direction ends. It has a shape with a narrow drawer,
    The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 8.
  10. The plurality of first internal electrode layers have a shape having narrow lead portions extending in the width direction on both sides in the width direction at both ends in the length direction, and the plurality of second internal electrode layers have a width at both ends in the width direction. It has a shape with a narrow drawer extending in the direction,
    The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 8.
  11. The length of the capacitor main body is L2, and one lead portion in the length direction of the plurality of first internal electrode layers projected in parallel on one surface in the height direction of the capacitor main body and the lead of the plurality of second internal electrode layers are drawn. When the interval between the lead portion of the plurality of first internal electrode layers and the lead portion of the plurality of second internal electrode layers is I4, the interval between the portion I3 and the second internal electrode layer is I3. The length L2 satisfies the condition of I3 ≦ 0.35 × L2, and the interval I4 and the length L2 satisfy the condition of I4 ≦ 0.35 × L2.
    The feedthrough multilayer ceramic capacitor according to claim 10.
JP2015203774A 2014-12-26 2015-10-15 Feedthrough multilayer ceramic capacitor Withdrawn JP2016127262A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016149424A (en) * 2015-02-12 2016-08-18 Tdk株式会社 Stack penetration capacitor
JP2016149426A (en) * 2015-02-12 2016-08-18 Tdk株式会社 Stack penetration capacitor
KR20200031042A (en) 2018-09-13 2020-03-23 다이요 유덴 가부시키가이샤 Multilayer ceramic capacitor and circuit board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244058A (en) * 1993-02-19 1994-09-02 Murata Mfg Co Ltd Chip type feedthrough capacitor
JP2000058376A (en) * 1998-08-04 2000-02-25 Tdk Corp Ceramic capacitor
JP2006100708A (en) * 2004-09-30 2006-04-13 Taiyo Yuden Co Ltd Three-terminal laminate capacitor and circuit board mounted therewith
JP2009218363A (en) * 2008-03-10 2009-09-24 Tdk Corp Feedthrough multilayer capacitor
JP2014220377A (en) * 2013-05-08 2014-11-20 Tdk株式会社 Laminated feedthrough capacitor

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6048230U (en) * 1983-09-11 1985-04-04
JPH0373422U (en) * 1989-11-22 1991-07-24
JP3903757B2 (en) * 2001-09-05 2007-04-11 株式会社村田製作所 Chip-shaped electronic component manufacturing method and chip-shaped electronic component
JP3850398B2 (en) * 2003-08-21 2006-11-29 Tdk株式会社 Multilayer capacitor
WO2006104613A2 (en) * 2005-03-01 2006-10-05 X2Y Attenuators, Llc Conditioner with coplanar conductors
JP2007035848A (en) * 2005-07-26 2007-02-08 Taiyo Yuden Co Ltd Stacked ceramic capacitor and its manufacturing method
JP4983400B2 (en) * 2007-05-25 2012-07-25 株式会社村田製作所 Feed-through three-terminal capacitor
JP4725629B2 (en) * 2008-10-14 2011-07-13 Tdk株式会社 Manufacturing method of multilayer feedthrough capacitor
JP5062237B2 (en) * 2009-11-05 2012-10-31 Tdk株式会社 Multilayer capacitor, mounting structure thereof, and manufacturing method thereof
JP5246215B2 (en) * 2010-07-21 2013-07-24 株式会社村田製作所 Ceramic electronic components and wiring boards
JP5267583B2 (en) * 2011-01-21 2013-08-21 株式会社村田製作所 Multilayer ceramic electronic components
JP2012156315A (en) * 2011-01-26 2012-08-16 Murata Mfg Co Ltd Multilayer ceramic electronic component
JP5620938B2 (en) * 2012-03-30 2014-11-05 太陽誘電株式会社 Multilayer ceramic capacitor
JP5811152B2 (en) * 2012-11-05 2015-11-11 株式会社村田製作所 Multilayer ceramic electronic component, method for manufacturing the same, taping electronic component range, method for manufacturing the same, and method for direction identification
KR101452058B1 (en) * 2012-12-06 2014-10-22 삼성전기주식회사 Multi-layered ceramic electronic component
JP5689143B2 (en) * 2013-03-19 2015-03-25 太陽誘電株式会社 Low profile multilayer ceramic capacitor
JP2014220527A (en) * 2014-08-13 2014-11-20 株式会社村田製作所 Multilayer capacitor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244058A (en) * 1993-02-19 1994-09-02 Murata Mfg Co Ltd Chip type feedthrough capacitor
JP2000058376A (en) * 1998-08-04 2000-02-25 Tdk Corp Ceramic capacitor
JP2006100708A (en) * 2004-09-30 2006-04-13 Taiyo Yuden Co Ltd Three-terminal laminate capacitor and circuit board mounted therewith
JP2009218363A (en) * 2008-03-10 2009-09-24 Tdk Corp Feedthrough multilayer capacitor
JP2014220377A (en) * 2013-05-08 2014-11-20 Tdk株式会社 Laminated feedthrough capacitor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016149424A (en) * 2015-02-12 2016-08-18 Tdk株式会社 Stack penetration capacitor
JP2016149426A (en) * 2015-02-12 2016-08-18 Tdk株式会社 Stack penetration capacitor
KR20200031042A (en) 2018-09-13 2020-03-23 다이요 유덴 가부시키가이샤 Multilayer ceramic capacitor and circuit board

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JP2018152593A (en) 2018-09-27
KR20160079636A (en) 2016-07-06

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