CN103362827B - The manufacture method of pump-unit and pump-unit - Google Patents
The manufacture method of pump-unit and pump-unit Download PDFInfo
- Publication number
- CN103362827B CN103362827B CN201310101035.XA CN201310101035A CN103362827B CN 103362827 B CN103362827 B CN 103362827B CN 201310101035 A CN201310101035 A CN 201310101035A CN 103362827 B CN103362827 B CN 103362827B
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- Prior art keywords
- circuit substrate
- connector
- pump
- drive coil
- partition
- Prior art date
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- Expired - Fee Related
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- 238000000034 method Methods 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims abstract description 181
- 238000005192 partition Methods 0.000 claims abstract description 69
- 230000007246 mechanism Effects 0.000 claims abstract description 43
- 230000014759 maintenance of location Effects 0.000 claims abstract description 35
- 229920005989 resin Polymers 0.000 claims description 51
- 239000011347 resin Substances 0.000 claims description 51
- 238000004804 winding Methods 0.000 claims description 25
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 238000007493 shaping process Methods 0.000 claims description 14
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 3
- 241001061264 Astragalus Species 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000003872 anastomosis Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D13/0686—Mechanical details of the pump control unit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D13/0606—Canned motor pumps
- F04D13/064—Details of the magnetic circuit
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
A kind of pump-unit, can guarantee the large space for forming drive circuit on circuit substrate.The tabular wall portion (21) that pump-unit (1) comprises annular wall (20) and blocked the side of annular wall.Stator (5) comprises and is configured to circular drive coil (4), and is fixed on annular wall outer circumferential side.Each drive coil comprises the terminal pins (35) that centrally axis (L) direction is outstanding.Circuit substrate (7) is fixed on tabular wall portion, and under the state orthogonal with central axial direction, be configured at position overlapping with multiple drive coil when observing from central axial direction.Circuit substrate is provided with multiple terminal pins through holes (47) that the terminal pins (35) for each drive coil runs through.Retention mechanism (49) for circuit substrate being fixed on partition (18) is formed in towards the position of radial outside away from central axis.Therefore, large space can be guaranteed inside multiple terminal pins through hole.
Description
Technical field
The present invention relates to and be a kind ofly fixed with the pump-unit of circuit substrate and the manufacture method of pump-unit by the configuration pump chamber of impeller and the separated partition of stator.
Background technique
A kind of pump-unit is described in patent documentation 1, it comprises the rotor being provided with impeller, the stator of the ring-type comprising the multiple drive coils being configured to ring-type and the circuit substrate for carrying out the power supply control towards multiple drive coil, and the pump chamber being configured with impeller is separated by partition with stator and circuit substrate.
In the pump-unit of patent documentation 1, partition comprises: the annular wall formed with the central axis coaxial of multiple drive coil; And by the tabular wall portion of the side of the central axial direction of this annular wall blocking.Stator is fixed on the outer circumferential side of annular wall, and each drive coil comprises terminal pins, and centrally axial direction is outstanding under the state of end portion being wound with winding wire for terminal pins.Circuit substrate is rounded, and under the state orthogonal with central axial direction, be configured at position overlapping with multiple drive coil when observing from central axial direction.Circuit substrate is fixed on tabular wall portion, and the retention mechanism for circuit substrate being fixed on partition is formed in center, the i.e. central axis of circuit substrate.The circuit substrate outer periphery comprised along circuit substrate are arranged in multiple through holes of ring-type, and the terminal pins of each drive coil runs through each through hole.
Patent documentation 1: Japanese Patent Laid-Open 2007-288959 publication
In the pump-unit of patent documentation 1, the retention mechanism for circuit substrate being fixed on partition is formed in the center of circuit substrate.In addition, in all-round scope, the terminal pins of each drive coil runs through the outer peripheral edge portion of circuit substrate.Consequently, circuit substrate there is no large space, thus there is the lower such problem of design freedom of the wiring pattern designing the drive circuit formed on circuit substrate.
Summary of the invention
In view of the above problems, technical problem of the present invention is to provide a kind of can guarantees the pump-unit in large space for forming drive circuit and the manufacture method of pump-unit on circuit substrate.
For solving the problems of the technologies described above, the feature of pump-unit of the present invention comprises: rotor, and this rotor is provided with impeller; Stator, this stator comprises the multiple drive coils being configured to ring-type; Circuit substrate, this circuit substrate comprises the drive circuit for controlling the power supply towards multiple above-mentioned drive coil, and is configured to the state orthogonal with above-mentioned central axial direction when observing from the central axial direction of multiple above-mentioned drive coil with the position of multiple above-mentioned drive coil overlap; And partition, the pump chamber being configured with above-mentioned impeller is separated with foregoing circuit substrate and said stator by this partition, and be fixed with foregoing circuit substrate and said stator, along the terminal pins that above-mentioned central axial direction is outstanding under the state that each drive coil is included in the end portion being wound with winding wire, foregoing circuit substrate has: multiple through holes that the above-mentioned terminal pins for each drive coil runs through; And the wiring pattern of the above-mentioned drive circuit to be electrically connected with the end portion of above-mentioned winding wire, foregoing circuit substrate and the fastening retention mechanism of above-mentioned partition are located at the position of the lateral offset from above-mentioned central axis towards radial direction.
According to the present invention, the retention mechanism for circuit substrate being fixed on partition is located at towards the position of radial outside away from central axis, and therefore, situation about being located on central axis with retention mechanism compares, and easily can guarantee large space on circuit substrate.Therefore, when forming the wiring pattern of drive circuit on circuit substrate, the design freedom of wiring pattern can be improved.
In the present invention, it is preferable that, above-mentioned drive circuit comprises the drive integrated circult for controlling the power supply towards multiple above-mentioned drive coil, and above-mentioned drive integrated circult is configured on the above-mentioned central axis of foregoing circuit substrate.Like this, the electronic component that the such ratio of drive integrated circult is relatively large can easily be installed.In this case, it is preferable that, above-mentioned partition is formed a fastening projection and location projection, above-mentioned fastening projection is configured for above-mentioned retention mechanism foregoing circuit substrate being fixed on above-mentioned partition, above-mentioned location projection is used for positioning foregoing circuit substrate, and, foregoing circuit substrate is formed with the fastener hole that inserts for above-mentioned fastening projection and the positioning hole for the insertion of above-mentioned location projection, protruding outside not from above-mentioned positioning hole towards above-mentioned circuit substrate of the front end of above-mentioned location projection.According to said structure, then can with circuit substrate relative to partition location together with easily permanent circuit substrate, in addition, can also prevent location projection from hindering the configuration of other circuit components.In addition, even if drive integrated circult is larger components and parts, as long as be configured at the face of the foregoing circuit substrate of opposite side relative to above-mentioned location projection, then also can drive integrated circult be configured at circuit substrate by the mode that location projection hinders.
In the present invention, it is preferable that, said pump device has the connector for the electric power from outside being supplied to above-mentioned drive circuit, above-mentioned connector is electrically connected with above-mentioned wiring pattern under the state of outer peripheral edge portion being fixed on foregoing circuit substrate, this outer peripheral edge portion be foregoing circuit substrate be positioned at the part with above-mentioned retention mechanism opposite side across above-mentioned central axis.Like this, the large space for the formation of wiring pattern can be guaranteed in the part near connector, therefore, the loss of electric power can be suppressed.
In the present invention, in order to avoid the liquid comes into contact circulated in pump chamber to drive coil, circuit substrate, it is preferable that, said pump device comprises resin seal member, and this resin seal member is fixed on the face being positioned at opposite side relative to above-mentioned pump chamber in above-mentioned partition under a state part for said stator, foregoing circuit substrate and above-mentioned connector covered.
In the present invention, it is preferable that, above-mentioned connector comprises and the bonder terminal that extends of foregoing circuit substrate-parallel ground, and above-mentioned wiring pattern comprises in the outer peripheral edge portion of foregoing circuit substrate the connector connecting pad that soldering has above-mentioned bonder terminal.Like this, by being increased the attachment portion between bonder terminal and connector connecting pad, the adhesive strength of soldering can be improved.
In the present invention, following structure can be adopted, said pump device comprises the connector fixed mechanism for above-mentioned connector being fixed on foregoing circuit substrate, above-mentioned connector fixed mechanism comprises circuit substrate side fixing part and connector side fixing part, wherein, foregoing circuit substrate-side fixing part is located at the position being positioned at the circumferential both sides of above-mentioned connector connecting pad on foregoing circuit substrate, and above-mentioned connector side fixing part is located at the position being positioned at the circumferential both sides of above-mentioned bonder terminal on above-mentioned connector.If comprise such connector fixed mechanism, then can make fixedly to become firm between connector and circuit substrate.
In the present invention, it is preferable that, the gate vestiges of above-mentioned resin seal member be positioned at than foregoing circuit substrate more by above-mentioned radial direction outside and than the position of above-mentioned connector closer to above-mentioned retention mechanism.According to this structure, when using mould to carry out shaping to resin seal member, cast gate is formed near retention mechanism, and resin injects near retention mechanism.Therefore, situation circuit substrate being bent because of the resin of injection can be suppressed.In this case, following structure can be adopted: on above-mentioned partition, be formed with a fastening projection and location projection, above-mentioned fastening projection is configured for above-mentioned retention mechanism foregoing circuit substrate being fixed on above-mentioned partition, above-mentioned location projection is used for positioning foregoing circuit substrate, and, foregoing circuit substrate is formed the fastener hole inserted for above-mentioned fastening projection and the positioning hole inserted for above-mentioned location projection, above-mentioned drive integrated circult is configured at the face being positioned at opposite side relative to above-mentioned fastening projection and above-mentioned location projection of foregoing circuit substrate, and be configured between above-mentioned fastening projection and above-mentioned connector.
In this case, it is preferable that, above-mentioned gate vestiges is located at the position more leaning on multiple above-mentioned drive coil side in above-mentioned central axial direction than foregoing circuit substrate, and above-mentioned wiring pattern is located at the real estate with multiple above-mentioned drive coil opposite side that is positioned in foregoing circuit substrate.Like this, when using mould to carry out shaping to resin seal member, cast gate is formed in the opposite side of real estate, and resin injects from the side contrary with real estate.Therefore, can prevent or suppress the resin because injecting and the wiring pattern being located at circuit substrate is stripped.
In the present invention, peel off from circuit substrate to suppress drive integrated circult, it is preferable that, above-mentioned gate vestiges occurs in a position, when observing from above-mentioned central axial direction, above-mentioned gate vestiges, above-mentioned retention mechanism, above-mentioned central axis, above-mentioned drive integrated circult and above-mentioned connector are positioned on straight line.In this case, it is preferable that, each above-mentioned drive coil comprises the bobbin being wound with above-mentioned winding wire, above-mentioned bobbin is formed by insulative resin material, and comprise above-mentioned cylinder portion, be formed at the lip part of inner side and the lip part in outside of both sides, above-mentioned cylinder portion, and for the terminal pins fixing part that above-mentioned terminal pins is fixed, above-mentioned terminal pins fixing part is located at the lip part of the above-mentioned inner side of above-mentioned bobbin relative to the above-mentioned drive coil being configured in the position overlapping with above-mentioned connector, above-mentioned terminal pins fixing part is relative to the lip part being configured in the above-mentioned outside being located at above-mentioned bobbin with the above-mentioned drive coil of the nonoverlapping position of above-mentioned connector.According to said structure, then connector is in the position farthest away from cast gate, and in addition, the circuit substrate be positioned near cast gate is located at the terminal pins supporting of the lip part in the outside of bobbin, therefore, can suppress because of injected resin, circuit substrate to be bent.
In this case, it is preferable that, the plane shape observed from above-mentioned central axial direction of above-mentioned drive integrated circult is rectangular, and long side direction is orthogonal with the imaginary line above-mentioned gate vestiges, above-mentioned retention mechanism, above-mentioned central axis, above-mentioned drive integrated circult and above-mentioned connector connected.Like this, when carrying out shaping to resin seal member, the length of drive integrated circult on the direction that circuit substrate easily bends can be shortened.Therefore, drive integrated circult can be prevented from strippable substrate or damage.
In the present invention, it is preferable that, each drive coil comprises the bobbin being wound with above-mentioned winding wire, and the part between above-mentioned bobbin and above-mentioned terminal pins of the end portion of the above-mentioned winding wire of each drive coil is in lax state.Like this, when carrying out shaping to resin seal member, can prevent or suppress the end portion of cutting line astragal because of the resin of injection.
Then, the feature of the manufacture method of said pump device of the present invention is, above-mentioned connector is fixed on foregoing circuit substrate, and said stator and foregoing circuit substrate are fixed on above-mentioned partition, said stator and circuit substrate are configured in mould, and utilize mould to keep in the outer peripheral edge portion of above-mentioned partition and above-mentioned connector from foregoing circuit substrate towards connector connection part protruding outside, by resin from more leaning on the outside of above-mentioned radial direction than foregoing circuit substrate and injecting above-mentioned mould than above-mentioned connector closer to the position of above-mentioned retention mechanism, with by shaping for above-mentioned resin seal member.
According to the present invention, when using mould to carry out shaping to resin seal member, resin is injected by from by near retention mechanism fastening to circuit substrate and partition, therefore, can suppress because of the resin of injection, circuit substrate to be bent.
According to the present invention, the large space of configurable drive integrated circult etc. can be guaranteed on circuit substrate.
Accompanying drawing explanation
Fig. 1 is the sectional view of the pump-unit of embodiment of the present invention.
Fig. 2 is the stereogram of partition, stator, circuit substrate and connector.
Fig. 3 is the exploded perspective view of partition and stator.
Fig. 4 is the worm's eye view observing partition, stator, circuit substrate and connector from below.
Fig. 5 is the sectional view of partition, stator, circuit substrate and connector.
(symbol description)
1 pump-unit
3 rotors
4,4 (1) ~ 4 (12) drive coils
5 stators
6 drive circuits
7 circuit substrates
7a real estate
8 impellers
9 connectors
15 pump chambers
18 partitions
19 resin seal member
33 bobbins
34 winding wires
35 terminal pins
40 drive integrated circults
43 wiring patterns
43c connector connecting pad
47,47 (1) ~ 47 (12) terminal pins are with through hole (through hole)
49 retention mechanisms
52 connector fixed mechanisms
53 connector fixed holes (circuit substrate side fixing part)
55 bonder terminals
56 fixing hook portions (connector side fixing part)
70 gate vestiges
L central axis
L1 imaginary line
Embodiment
Below, with reference to accompanying drawing, the pump-unit of embodiment of the present invention is described.
(overall structure)
Fig. 1 is the sectional view of the pump-unit 1 of embodiment of the present invention.In the following description, the upside (side, Z1 direction) of Fig. 1 is set to " on " side, the downside (side, Z2 direction) of Fig. 1 is set to D score side.
The pump-unit 1 of present embodiment is the pump being called as sealing pump type, and it has: the rotor 3 comprising magnet 2; Comprise the stator 5 of the multiple drive coils 4 being configured to ring-type; And the circuit substrate 7 comprised for the drive circuit 6 controlled the power supply towards multiple drive coil 4.Rotor 3 is provided with impeller 8, circuit substrate 7 is provided with the connector 9 for electric power to be supplied to drive circuit 6 from outside.Impeller 8, rotor 3, stator 5 and circuit substrate 7 are configured at the inner side of housing 11, and the connector connection part 9a as the joint be connected with outside of connector 9 exposes from housing 11.The upper shell 13 that housing 11 comprises shell 12 and covered on the top of shell 12, together with shell 12 and upper shell 13 are fixed to one another by screw 14.
Upper shell 13 is formed the sucting 13a of fluid and the discharge portion 13b of fluid.Between shell 12 and upper shell 13, be formed with pump chamber 15, this pump chamber 15 flows through towards discharge portion 13b for the fluid sucked from sucting 13a.Anastomosis part between shell 12 and upper shell 13 is configured with the sealing component (O shape ring) 16 of the sealing for guaranteeing pump chamber 15.Shell 12 comprises partition 18 and under the state lower surface of partition 18 and side covered, is fixed on the resin seal member 19 of partition 18.Partition 18 comprises: be set as the annular wall 20 coaxial with central axis L; By the discoid tabular wall portion 21 that the lower end of annular wall 20 blocks; And the partition lip part 22 to expand from the upper end part of annular wall 20 towards radial outside, the top of partition lip part 22 is formed as pump chamber 15.Partition 18 is separated between pump chamber 15, impeller 8 and rotor 3 and stator 5 and circuit substrate 7.
When powering towards multiple drive coil 4 via drive circuit 6, rotor 3 rotates around central axis L.When making impeller 8 rotate in pump chamber 15 by this, fluid is inhaled into pump chamber 15 from sucting 13a, and discharges from discharge portion 13b.
(rotor)
As shown in Figure 1, rotor 3 retaining member 25 that comprises magnet 2, sleeve 24 and magnet 2 and sleeve 24 are kept.The lip part 27 that retaining member 25 comprises a portion 26 and radially expands above cylinder portion 26, impeller 8 is fixed on lip part 27.Magnet 2 is fixed on the outer circumferential side in a portion 26.Sleeve 24 cylindrically, and is fixed on the inner circumferential side in a portion 26.
Rotor 3 is supported on stationary axle 28 in revolvable mode.The upper end of stationary axle 28 is held in upper shell 13, and the lower end of stationary axle 28 is held in the upper surface portion of the tabular wall portion 21 of partition 18.The axis of stationary axle 28 extends in the vertical direction.Herein, the axis of stationary axle 28 is the rotation centerline of rotor 3, and is the central axis L being configured to circular multiple drive coils 4.
Stationary axle 28 inserts the inner circumferential side of sleeve 24.In addition, stationary axle 28 is provided with two thrust-bearing components 29 in the mode of clamping sleeve 24 along the vertical direction.In the present embodiment, sleeve 24 works as the radial bearing of rotor 3, and sleeve 24 and thrust-bearing component 29 work as the thrust-bearing of rotor 3.Impeller 8 is configured at the inside of pump chamber 15.That is, impeller 8 is configured at the outside (upside) of annular wall 20 on central axis L direction.The magnet 2 of rotor 3 is configured at the inner side of the annular wall 20 of partition 18.That is, magnet 2 is configured at the position offset downward from pump chamber 15 on central axis L direction.
(stator)
Fig. 2 is the stereogram of partition 18, stator 5, circuit substrate 7 and connector 9.Fig. 3 is the exploded perspective view of partition 18 and stator 5.As shown in Figure 1, Figure 3, stator 5 comprises: be configured to circular multiple drive coils 4; And to the stator core 30 that above-mentioned multiple drive coil 4 supports.As shown in Figure 2 and Figure 3, in this example, stator 5 comprises 12 drive coils 4 (1) ~ 4 (12).Stator 5 is installed on the outer circumferential side of the annular wall 20 of partition 18, and multiple drive coil 4 (1) ~ 4 (12) across annular wall 20 diametrically relative with the magnet 2 of rotor 3 (with reference to Fig. 1).
Stator core 30 is the stacked and laminate cores formed of the thinner magnetic sheet that is made up of magnetic material.As shown in Figure 3, stator core 30 comprises annular portion 31 and the multiple salient poles 32 outstanding from annular portion 31 towards the inner side of radial direction.The circular outer periphery face of annular portion 31 becomes the circular outer periphery face of stator core 30.The outer circumferential face of stator core 30 is limited by the outer circumferential face of annular portion 31.The equiangularly gap-forming of multiple salient poles 32.Each salient pole 32 in multiple salient pole 32 is supported with respectively drive coil 4 (1) ~ 4 (12).
Each drive coil 4 comprises: bobbin 33; Be wound in the winding wire 34 of bobbin 33; And be wound with the pair of terminal pin 35 of end portion of winding wire 34.Bobbin 33 is formed by Ins. ulative material such as resins, and it comprises: axis is towards the cylinder portion 36 of radial direction; The lip part 37 of paired inner side expanded in the direction with axis vertical take-off from the both sides of the axial direction in cylinder portion 36 and the lip part 37 in outside; And be located at the terminal pins fixing part 38 of lower portion of lip part 37 of axial direction side in a portion 36.Terminal pins fixing part 38 is radially given prominence to from the lip part 37 of side.
Winding wire 34 is wound in the outer circumferential side in a portion 36 between paired medial flange portion 37 and the lip part 37 in outside.Pair of terminal pin 35 is pressed into the fixed hole 38a being located at terminal pins fixing part 38, and projects upwards in central axis L side.Terminal pins 35 is wrapped the end portion of winding wire 34.The part of end portion between bobbin 33 and terminal pins 35 of winding wire 34 is in lax state.The cylinder portion 36 of bobbin 33 is sheathed on salient pole 32 from the inner side of radial direction, so that each drive coil 4 is supported on stator core 30.Consequently, winding wire 34 is in the state being wound in salient pole 32 by bobbin 33.
Herein, multiple drive coil 4 (1) ~ 4 (12) is respectively in mutually the same shape, but when observing from central axis L direction, be configured at contrary with the cover set direction towards salient pole 32 of other nine drive coils 4 (4) ~ 4 (12) with the cover set direction towards salient pole 32 of three drive coils 4 (1) ~ 4 (3) of the position of connector 9 overlap.That is, three drive coils 4 (1) ~ 4 (3) are sheathed on salient pole 32 under the state making terminal pins fixing part 38 be positioned at radially inner side, and the lip part 37 not forming terminal pins fixing part 38 side is abutted with annular portion 31.Therefore, three drive coils 4 (1) ~ 4 (3) being configured at radially inner side relative to connector 9 are configured with terminal pins fixing part 38 on the lip part 37 of inner side.In addition, all the other nine drive coils 4 (4) ~ 4 (12) are sheathed on salient pole 32 under the state making terminal pins fixing part 38 be positioned at radial outside, and the lip part 37 being formed with terminal pins fixing part 38 side is abutted with annular portion 31.That is, the lip part 37 in outside being configured at radial outside is configured with terminal pins fixing part 38.As shown in Figure 2, in nine drive coils 4 (4) ~ 4 (12), the upper-end surface 38b of the terminal pins fixing part 38 of bobbin 33 (face by stator core 30 side) is abutted with the lower end surface 31a of the annular portion 31 of stator core 30.
(circuit substrate)
Fig. 4 is the worm's eye view observing partition 18, stator 5, circuit substrate 7 and connector 9 from the below in central axis L direction.Circuit substrate 7 is firm substrates of rigidity, the plane shape on the whole in circular.Circuit substrate 7 is configured at position overlapping with multiple drive coil 4 (1) ~ 4 (12) when observing from central axis L direction under the state orthogonal with central axis L direction.Circuit substrate 7 is double-sided substrates that the wiring pattern 43 of drive circuit 6 is formed at two sides.
As shown in Figure 4, drive circuit 6 comprises: for the drive integrated circult 40 controlled the power supply towards multiple drive coil 4 (1) ~ 4 (12); According to the Hall element (electronic component) 41 that the magnetic force of magnet 2 detects around the angle of swing of central axis L rotor 3; And resistance 42, circuit substrate 7 is equiped with these components.
As shown in Figure 2, Figure 4 shows, circuit substrate 7 comprises the first notch part 45 being cut out breach (otch) by straight line shape in a part for its periphery.In addition, also be positioned at across central axis L with the part of the first notch part 45 opposite side on comprise the second notch part 46 being cut out breach by straight line shape.First notch part 45 and the second notch part 46 for forming location during wiring pattern 43 etc. on circuit substrate 7.Or the first notch part 45 and the second notch part 46 are for the location when the electronic parts and components of drive circuit 6 being installed in circuit substrate 7.In addition, as shown in Figure 4, circuit substrate 7 is formed multiple terminal pins through hole (through hole) 47, multiple Hall element through hole 48, fastener hole 50, two positioning holes 51 and two connector fixed holes 53, wherein, above-mentioned multiple terminal pins through hole 47 runs through for the terminal pins 35 of each drive coil 4, above-mentioned multiple Hall element through hole 48 runs through for the terminal of Hall element 41, above-mentioned fastener hole 50 forms the retention mechanism 49 circuit substrate 7 being fixed on partition 18, above-mentioned two positioning holes 51 are for being positioned circuit substrate 7 for partition 18, above-mentioned two connector fixed holes 53 are configured for the connector fixed mechanism 52 of fixed connector 9.The terminal of each terminal pins 35 and Hall element 41 is in the state running through circuit substrate 7 via terminal pins through hole 47 and Hall element through hole 48, is wound in the end portion of the winding wire 34 of each terminal pins 35 and the terminal of Hall element 41 and is soldered to and is positioned at on the wiring pattern 43 of the real estate of each drive coil 4 opposite side.
As shown in Figure 4, the edge of opening of each terminal pins through hole 47 is formed in wiring pattern 43 as the winding wire pad 43a of the attachment portion be connected with the end portion of each drive coil 4.In addition, the edge of opening of Hall element through hole 48 is formed in wiring pattern 43 as the Hall element pad 43b of the attachment portion be connected with the terminal of Hall element 41.In addition, extend from the edge section of the first notch part 45 along the direction orthogonal with breach on the real estate 7a of the downside of circuit substrate 7 as the connector connecting pad 43c of the attachment portion connected with connector 9 in wiring pattern 43.As shown in Figure 2, connector fixed hole 53 is located at the circumferential both sides of connector connecting pad 43c.Herein, connector 9 comprises the bonder terminal 55 extended abreast with circuit substrate 7 and the fixing hook portion 56 being located at the position being positioned at bonder terminal 55 both sides in the circumferential in the below of circuit substrate 7, by by bonder terminal 55 on the real estate 7a of the downside of circuit substrate 7 soldering in connector connecting pad 43c, and fixing hook portion 56 is embedded connector fixed hole 53, thus connector 9 is installed on circuit substrate 7.That is, fixingly form with hook portion 56 and connector fixed hole 53 the connector fixed mechanism 52 connector 9 being fixed on circuit substrate 7.
As shown in Figure 4, be formed in multiple terminal pins through holes 47 of circuit substrate 7, terminal pins through hole 47 (1) ~ 47 (3) is formed at the inner side of connector connecting pad 43c, and this terminal pins through hole 47 (1) ~ 47 (3) runs through for the terminal pins 35 being configured at three drive coils 4 (1) ~ 4 (3) of the position overlapping with connector 9 when observing from central axis L direction.Each terminal pins 35 of three drive coils 4 (1) ~ 4 (3) is distinguished penetrating terminal pin through hole 47 (1) ~ 47 (3) and extends downward.The end portion being wound in the winding wire 34 of each terminal pins 35 be located at the winding wire pad 43a of each terminal pins with the edge of opening of through hole 47 (1) ~ 47 (3) and be connected.
The terminal pins through hole 47 (4) ~ 47 (12) run through for the terminal pins 35 of nine drive coils 4 (4) ~ 4 (12) except three drive coils 4 (1) ~ 4 (3) is formed at the outer peripheral edge portion of circuit substrate 7, and arranges in the circumferential along outer periphery.Circuit substrate 7 is cut out breach from outer circumferential side and is formed by these terminal pins through holes 47 (4) ~ 47 (12) being located at the outer peripheral edge portion of circuit substrate 7, and towards periphery side opening.Each terminal pins 35 of nine drive coils 4 (4) ~ 4 (12) runs through these terminal pins through holes 47 (4) ~ 47 (12) respectively and extends downward.The end portion being wound in the winding wire 34 of each terminal pins 35 be located at the winding wire pad 43a of each terminal pins with the edge of opening of through hole 47 (4) ~ 47 (12) and be connected.
Herein, drive coil 4 (1), drive coil 4 (4), drive coil 4 (7) and drive coil 4 (10) utilize wiring pattern 43 to be electrically connected, and form the such as U phase in U phase, V phase, W phase.Drive coil 4 (2), drive coil 4 (5), drive coil 4 (8) and drive coil 4 (11) utilize wiring pattern 43 to be electrically connected, and form the such as V phase in U phase, V phase, W phase.Drive coil 4 (3), drive coil 4 (6), drive coil 4 (9) and drive coil 4 (12) utilize wiring pattern 43 to be electrically connected, and form the such as W phase in U phase, V phase, W phase.Therefore, three drive coils 4 (1) ~ 4 (3) being configured at the position overlapping with connector 9 when observing from central axis L direction become out of phase drive coil respectively.
Hall element through hole 48 is formed in the circumferential side of the terminal pins through hole 47 (1) ~ 47 (3) being formed at radially inner side.Resistance 42 is equiped with at the circumferential opposite side of terminal pins through hole 47 (1) ~ 47 (3).As shown in Figure 2, Hall element 41 is configured at the annular wall 20 of partition 18 to detect the magnetic force of magnet 2 of the inner side being positioned at annular wall 20 in the mode of the annular wall 20 near partition 18.The terminal of Hall element 41 runs through Hall element through hole 48 and extends downward, terminal be located at the Hall element pad 43b of Hall element with the edge of opening of through hole 48 and be connected.
It is rectangular drive integrated circult 40 that the position be positioned on center line axis L on the lower surface of circuit substrate 7 is configured with plane shape.Drive integrated circult 40 is configured at the space of the inner side of terminal pins through hole 47 (1) ~ 47 (12) in circuit substrate 7.As shown in Figure 2, on circuit substrate 7, between the second notch part 46 and drive integrated circult 40, be provided with fastener hole 50 towards radial outside away from the position of center line axis L.Fastener hole 50 is positioned at drive coil 4 (8) side farthest away from connector 9 in the inner side of the multiple drive coils 4 (1) ~ 4 (12) being configured to ring-type.In addition, as shown in Figure 2, between the first notch part 45 and central axis L, two positioning holes 51 are formed with.Herein, the center of fastener hole 50, drive integrated circult 40, central axis L and connector 9 are positioned on straight line, and it is orthogonal with the imaginary line L1 center of fastener hole 50, drive integrated circult 40, central axis L and connector 9 connected that drive integrated circult 40 is configured to its long side direction.Terminal 40a, 40b of drive integrated circult 40 are located at a pair side relative on the short side direction of this drive integrated circult 40 respectively, and the terminal 40a being located at the side relative with connector 9 utilizes wiring pattern 43 to be electrically connected with bonder terminal 55.Overlapping with drive integrated circult 40 when two positioning holes 51 are observed from central axis L direction, and be formed at the both sides of imaginary line L1 respectively.
(shell)
Fig. 5 is the sectional view of partition 18, stator 5, circuit substrate 7 and connector 9.As shown in Fig. 2, Fig. 3, Fig. 5, be formed with a fastening projection 60 for circuit substrate 7 being fixed on partition 18 at the lower surface of the tabular wall portion 21 of partition 18 and be used for two location projections 61 that circuit substrate 7 is positioned.Fastening projection 60 is formed at the position corresponding with the fastener hole 50 of circuit substrate 7 at the lower surface of tabular wall portion 21, and location projection 61 is formed at the position corresponding with positioning hole 51 at the lower surface of tabular wall portion 21.
As shown in Fig. 3, Fig. 5, be formed with circular stepped part 60a at the fore-end of fastening projection 60, in fastening projection 60, the forward end of circular stepped part 60a becomes the diameter path part 60b less than the diameter of the terminal side of circular stepped part 60a.The height dimension of path part 60b is less than the thickness size of circuit substrate 7, is formed with tapped hole 60c at the front-end face of path part 60b.In addition, as shown in Figure 3, be formed with circular stepped part 61a at the fore-end of location projection 61, the forward end of circular stepped part 61a becomes the diameter path part 61b less than the diameter of the terminal side of circular stepped part 61a.The height dimension of the path part 61b of location projection 61 is less than the thickness size of circuit substrate 7.Therefore, under the state that the positioning hole 51 that the path part 61b of location projection 61 is inserted circuit substrate 7 is located, the front end of location projection 61 and the front end of path part 61b can not be positioned at than positioning hole 51 position more on the lower, namely the outside of circuit substrate 7 can not be projected to, thus, even if the position of the positioning hole 51 of circuit substrate 7 is located in the configuring area as the drive integrated circult 40 of larger components and parts, the configuration of the drive integrated circult 40 of the lower surface being located at circuit substrate 7 also can not be hindered.
Herein, as shown in Figure 5, the path part 60b that circuit substrate 7 is in fastening projection 60 inserts fastener hole 50 and the state of the path part 61b of location projection 61 insertion positioning hole 51, and utilizing tap bolt 63 to be anchored on partition 18, this tap bolt 63 screws in tapped hole 60c from the real estate 7a side being formed with wiring pattern 43 across packing ring 62.That is, fastening projection 60, packing ring 62 and tap bolt 63 form the retention mechanism 49 circuit substrate 7 being fixed on partition 18 together with fastener hole 50.Under the state that circuit substrate 7 is fixed on partition 18, fixing base 7 is oriented to the posture parallel with tabular wall portion 21 and the state of locating around central axis L being in across the position of certain intervals along center line axis L direction relative to the lower surface of tabular wall portion 21.
As depicted in figs. 3 and 5, pod (positioning part) 64 is formed with in the circular outer periphery face of the annular wall 20 of partition 18.Each pod 64 is the square grooves extended in the vertical direction, is a part for its backup plate shape wall portion 21 side and the part removal of leaning on partition lip part 22 side to be formed.In addition, multiple pod 64 equiangularly gap-forming annular wall 20 all-round on.Be protuberance 65 between multiple pod 64.
Herein, as shown in Figure 5, under the state that drive coil 4 is supported in stator core 30, salient pole 32 to comprise from the cylinder portion 36 of bobbin 33 towards radially inner side outstanding projection 32a, and stator core 30 is by embedding pod 64 from below by this projection 32a under being supported in the state being positioned partition 18.That is, pod 64 can be chimeric with the projection 32a of salient pole 32, by embedding projection 32a in chimeric mode, stator 5 is positioned partition 18 around central axis L.In addition, by making projection 32a abut with the inner peripheral surface part 64a of the upper end of pod 64, stator 5 is positioned partition 18 on central axis L direction.Under the state that stator 5 is positioned partition 18, be located at the terminal pins fixing part 38 of lower flange 37 overlapping with inner peripheral surface part 64a on central axis L direction, the two end portions of the circumference of its upper-end surface 38b is in the state abutted with the lower end surface part 65a of protuberance 65 (with reference to Fig. 3), wherein, the lip part 37 being positioned at radially inner side of three drive coils (1) ~ 4 (3) of the position overlapping with connector 9 is configured in when above-mentioned lip part 37 refers to and observes from central axis L direction.In addition, be configured in and be in the lip part 37 being positioned at radially inner side of nine drive coils 4 (4) ~ 4 (12) of the nonoverlapping position of connector 9 state abutted with the outer circumferential face part of the arc-shaped of lip part 65.
Resin seal member 19 is for the protection of drive coil 4 and circuit substrate 7 in order to avoid they are subject to the impact of fluid, and it is made up of resins such as unsaturated polyester resins.Resin seal member 19 be by by resin injection to be in be fixed with stator 5 and circuit substrate 7 state under partition 18 and formed.In addition, drive coil 4 and circuit substrate 7 cover by resin seal member 19 completely, and by except in connector 9 from circuit substrate 7 towards connector connection part 9a protruding outside except connector 9 a part cover.
When carrying out molding and forming to resin seal member 19, connector 9 is fixed on circuit substrate 7, and circuit substrate 7 and stator 5 are fixed on partition 18.Then, under the state utilizing mould (not shown) to keep the outer peripheral edge portion 22a (with reference to Fig. 5) of partition lip part 22 and the connector connection part 9a of connector 9, stator 5 and circuit substrate 7 are configured in mould.Then, resin seal member 19 is formed by resin is injected mould from the cast gate being located at mould and makes it solidify.
Herein, cast gate is located at than circuit substrate 7 more by radial outside and than the position of connector 9 closer to fastener hole 50.In addition, the outer circumferential side of drive coil 4 is located at by cast gate.Consequently, as shown in Figure 1, shown in Figure 5, in resin seal member 19, be positioned at the outer circumferential side of drive coil 4 and be formed with gate vestiges 70 than connector 9 closer to the position of fastener hole 50.In this example, the center of gate vestiges 70, fastener hole 50, central axis L, drive integrated circult 40 and connector 9 are positioned on straight line.
(action effect)
According to this example, the retention mechanism 49 for circuit substrate 7 being fixed on partition 18 is located at towards the position of radial outside away from central axis L.Therefore, situation about being located on central axis L with retention mechanism 49 compares, and can guarantee large space on circuit substrate 7.Therefore, easily the drive integrated circult 40 as larger components and parts is configured at circuit substrate 7.In addition, when forming the wiring pattern 43 of drive circuit 6 on circuit substrate 7, the design freedom of wiring pattern 43 can be improved.
In addition, according to this example, retention mechanism 49 is located at and is positioned at the position with connector 9 opposite side across central axis L, therefore, can guarantee large space, and can suppress the loss of electric power in the part near connector 9.
In addition, according to this example, connector 9 comprises the bonder terminal 55 extended abreast with circuit substrate 7, and this bonder terminal 55 is soldered on connector connecting pad 43c.Therefore, the attachment portion between bonder terminal 55 and connector connecting pad 43c is elongated, can improve the adhesive strength of soldering.In addition, connector 9 by the fixing hook portion 56 of being located at connector 9 be located at substrate connector fixed hole 53 engaging and be installed on circuit substrate 7.Therefore, fixedly become firm between connector 9 and circuit substrate 7, even if the connector connection part 9a that mould will utilized time shaping for resin seal member 19 to keep connector 9, connector 9 also can not depart from from circuit substrate 7.
Then, in this example, use mould when carrying out shaping to resin seal member 19, resin is more injected than the side of connector 9 closer to retention mechanism 49 by radial outside by from than circuit substrate 7.In addition, when observing from central axis L direction, the center of cast gate (gate vestiges 70), fastener hole 50, central axis L and connector 9 are positioned on straight line.Therefore, the resin because injecting can be suppressed and make the situation that circuit substrate 7 bends.In addition, resin is more injected by the side of drive coil 4 than circuit substrate 7 by from central axis L direction, and the wiring pattern 43 of drive circuit 6 is located at the real estate 7a with the downside of multiple drive coil 4 (1) ~ 4 (12) opposite side in circuit substrate 7.Therefore, when using mould to carry out shaping to resin seal member 19, can prevent or suppress the wiring pattern 43 making because of injected resin to be located at circuit substrate 7 to peel off.
In addition, the long side direction of drive integrated circult 40 is orthogonal with the imaginary line L1 center of cast gate (gate vestiges 70), fastener hole 50, central axis L and connector 9 connected, therefore, when carrying out shaping to resin seal member 19, the length of drive integrated circult 40 on the direction that circuit substrate 7 bends is shorter.Consequently, can prevent drive integrated circult 40 from peeling off or damage from substrate.
In addition, the end portion of the winding wire 34 of each drive coil 4 is wound in terminal pins 35 in a relaxed state, therefore, when carrying out shaping to resin seal member 19, can prevent or suppress the end portion of the cutting line astragal 34 because of injected resin.
(other mode of execution)
In addition, in the above example, the magnet 2 of rotor 3 is configured at the inner side of the multiple drive coils 4 (1) ~ 4 (12) being configured to ring-type, but also can be configured in the pump-unit 1 of the structure (external rotor) in the outside of the multiple drive coils 4 (1) ~ 4 (12) being configured to ring-type in the magnet 2 of rotor 3 and apply the present invention.
In addition, in the above example, be made up of fastener hole 50, fastening projection 60, tap bolt 63 for the retention mechanism 49 circuit substrate 7 being fixed on partition 18, but circuit substrate 7 is also fixed on partition 18 by methods such as press-in, riveted joints by retention mechanism 49.
In addition, in the above example, the cast gate of resin by injection is a place in a mold, but the mould comprising multiple cast gate also can be used to carry out shaping to resin seal member 19.In this case, if at least one cast gate is located at than circuit substrate 7 more by radial outside and than the position of connector 9 closer to fastener hole 50, then circuit substrate 7 can be suppressed to bend when resin seal member 19 is shaping.
Claims (18)
1. a pump-unit, is characterized in that, comprising:
Rotor, this rotor is provided with impeller;
Stator, this stator comprises the multiple drive coils being configured to ring-type;
Circuit substrate, this circuit substrate comprises the drive circuit for controlling the power supply towards multiple described drive coil, and is configured to the state orthogonal with described central axial direction when observing from the central axial direction of multiple described drive coil with the position of multiple described drive coil overlap; And
Partition, the pump chamber being configured with described impeller separates with described circuit substrate and described divided stator by this partition, and is fixed with described circuit substrate and described stator,
Along the terminal pins that described central axial direction is outstanding under the state that each drive coil is included in the end portion being wound with winding wire,
Described circuit substrate has: multiple through holes that the described terminal pins for each drive coil runs through; And the wiring pattern of the described drive circuit to be electrically connected with the end portion of described winding wire,
Described circuit substrate and the fastening retention mechanism of described partition are located at the position of the lateral offset from described central axis towards radial direction.
2. pump-unit as claimed in claim 1, is characterized in that,
Described drive circuit comprises the drive integrated circult for controlling the power supply towards multiple described drive coil,
Described drive integrated circult is configured on the described central axis of described circuit substrate.
3. pump-unit as claimed in claim 2, is characterized in that,
Described partition is formed a fastening projection and location projection, described fastening projection is configured for the described retention mechanism described circuit substrate being fixed on described partition, described location projection is used for positioning described circuit substrate, and, described circuit substrate is formed the fastener hole inserted for described fastening projection and the positioning hole inserted for described location projection
Protruding outside not from described positioning hole towards described circuit substrate of the front end of described location projection.
4. pump-unit as claimed in claim 3, is characterized in that,
Described drive integrated circult is configured at the face being positioned at opposite side relative to described location projection of described circuit substrate, and described location projection is used for positioning described circuit substrate.
5. pump-unit as claimed in claim 2, is characterized in that,
Described pump-unit has the connector for the electric power from outside being supplied to described drive circuit,
Described connector is electrically connected with described wiring pattern under the state of outer peripheral edge portion being fixed on described circuit substrate, this outer peripheral edge portion be described circuit substrate be positioned at the part with described retention mechanism opposite side across described central axis.
6. pump-unit as claimed in claim 5, is characterized in that,
Described pump-unit comprises resin seal member, and this resin seal member is fixed on the face being positioned at opposite side relative to described pump chamber in described partition under a state part for described stator, described circuit substrate and described connector covered.
7. pump-unit as claimed in claim 6, is characterized in that,
Described connector comprises the bonder terminal extended abreast with described circuit substrate,
Described wiring pattern comprises in the outer peripheral edge portion of described circuit substrate the connector connecting pad that soldering has described bonder terminal.
8. pump-unit as claimed in claim 7, is characterized in that,
Described pump-unit comprises the connector fixed mechanism for described connector being fixed on described circuit substrate,
Described connector fixed mechanism comprises circuit substrate side fixing part and connector side fixing part, wherein, described circuit substrate side fixing part is located at the position being positioned at the circumferential both sides of described connector connecting pad on described circuit substrate, and described connector side fixing part is located at the position being positioned at the circumferential both sides of described bonder terminal on described connector.
9. the pump-unit according to any one of claim 6 to 8, is characterized in that,
The gate vestiges of described resin seal member be positioned at than described circuit substrate more by described radial direction outside and than the position of described connector closer to described retention mechanism.
10. pump-unit as claimed in claim 9, is characterized in that,
Described gate vestiges is located at the position more leaning on multiple described drive coil side in described central axial direction than described circuit substrate,
Described wiring pattern is located at the real estate with multiple described drive coil opposite side that is positioned in described circuit substrate.
11. pump-units as claimed in claim 10, is characterized in that,
Described gate vestiges occurs in a position,
When observing from described central axial direction, described gate vestiges, described retention mechanism, described central axis, described drive integrated circult and described connector are positioned on straight line.
12. pump-units as claimed in claim 11, is characterized in that,
Each described drive coil comprises the bobbin being wound with described winding wire,
Described bobbin is formed by insulative resin material, and comprises a portion, is formed at the lip part of inner side of both sides, described cylinder portion and the lip part in outside and for the fixing terminal pins fixing part of described terminal pins,
Described terminal pins fixing part is located at the lip part of the described inner side of described bobbin relative to the described drive coil being configured in the position overlapping with described connector,
Described terminal pins fixing part is relative to the lip part being configured in the described outside being located at described bobbin with the described drive coil of the nonoverlapping position of described connector.
13. pump-units as claimed in claim 9, is characterized in that,
Described gate vestiges occurs in a position,
When observing from described central axial direction, described gate vestiges, described retention mechanism, described central axis, described drive integrated circult and described connector are positioned on straight line.
14. pump-units as claimed in claim 13, is characterized in that,
The plane shape observed from described central axial direction of described drive integrated circult is rectangular, and long side direction is orthogonal with the imaginary line described gate vestiges, described retention mechanism, described central axis, described drive integrated circult and described connector connected.
15. pump-units as claimed in claim 9, is characterized in that,
Each drive coil comprises the bobbin being wound with described winding wire,
The part between described bobbin and described terminal pins of the end portion of the described winding wire of each drive coil is in lax state.
16. pump-units as claimed in claim 9, is characterized in that,
Described partition is formed a fastening projection and location projection, described fastening projection is configured for the described retention mechanism described circuit substrate being fixed on described partition, described location projection is used for positioning described circuit substrate, and, described circuit substrate is formed the fastener hole inserted for described fastening projection and the positioning hole inserted for described location projection
Described drive integrated circult is configured at the face being positioned at opposite side relative to described fastening projection and described location projection of described circuit substrate, and is configured between described fastening projection and described connector.
The manufacture method of 17. 1 kinds of pump-units according to claim 6, is characterized in that,
Described connector is fixed on described circuit substrate, and described stator and described circuit substrate is fixed on described partition,
Utilize mould to keep from described circuit substrate towards connector connection part protruding outside in the outer peripheral edge portion of described partition and described connector, and in this condition, described stator and circuit substrate be configured in mould,
By resin from than described circuit substrate more by described radial direction outside and inject described mould than described connector closer to the position of described retention mechanism, with by shaping for described resin seal member.
The manufacture method of 18. pump-units as claimed in claim 17, is characterized in that,
When being located at the cast gate of the described resin injection of confession of described mould from described central axial direction observation, described cast gate, described retention mechanism, described central axis, described drive integrated circult and described connector are positioned on straight line.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012071097A JP6129478B2 (en) | 2012-03-27 | 2012-03-27 | Pump device and method of manufacturing pump device |
| JP2012-071097 | 2012-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103362827A CN103362827A (en) | 2013-10-23 |
| CN103362827B true CN103362827B (en) | 2015-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310101035.XA Expired - Fee Related CN103362827B (en) | 2012-03-27 | 2013-03-26 | The manufacture method of pump-unit and pump-unit |
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| Country | Link |
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| JP (1) | JP6129478B2 (en) |
| CN (1) | CN103362827B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017025854A (en) * | 2015-07-27 | 2017-02-02 | 日本電産サンキョー株式会社 | Pump device |
| JP6652360B2 (en) * | 2015-09-30 | 2020-02-19 | 日本電産サンキョー株式会社 | Pump device |
| JP6556580B2 (en) | 2015-09-30 | 2019-08-07 | 日本電産サンキョー株式会社 | Motor and motor manufacturing method |
| JP6576773B2 (en) | 2015-09-30 | 2019-09-18 | 日本電産サンキョー株式会社 | Pump device |
| JP6722515B2 (en) * | 2016-05-30 | 2020-07-15 | 日本電産サンキョー株式会社 | motor |
| JP7403336B2 (en) | 2020-02-10 | 2023-12-22 | 三菱重工業株式会社 | electric compressor |
| TWI722832B (en) * | 2020-03-16 | 2021-03-21 | 建準電機工業股份有限公司 | Liquid cooling system and pump thereof |
| JP2022080962A (en) * | 2020-11-19 | 2022-05-31 | 日本電産サンキョー株式会社 | Pump device |
| CN113417878A (en) * | 2021-08-03 | 2021-09-21 | 烟台东德实业有限公司 | Stator-encapsulated hydrogen circulating pump and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1633564A (en) * | 2001-03-13 | 2005-06-29 | 戴维产品股份有限公司 | Pump |
| JP2006348802A (en) * | 2005-06-14 | 2006-12-28 | Asmo Co Ltd | Electric pump |
| CN101025160A (en) * | 2006-02-16 | 2007-08-29 | 日本电产三协株式会社 | Pump and pumping system |
| CN101051776A (en) * | 2006-02-17 | 2007-10-10 | 日本电产三协株式会社 | Pump and pump system |
| JP2008175090A (en) * | 2007-01-16 | 2008-07-31 | Mitsuba Corp | Motor-driven pump |
| CN101501341A (en) * | 2006-08-09 | 2009-08-05 | 日本电产三协株式会社 | Pump and pump system |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10311290A (en) * | 1997-05-13 | 1998-11-24 | Japan Servo Co Ltd | Canned motor pump and manufacture thereof |
| JP4686811B2 (en) * | 2000-05-09 | 2011-05-25 | パナソニック電工株式会社 | Cand pump |
| JP2002112489A (en) * | 2000-10-02 | 2002-04-12 | Canon Electronics Inc | Coil bobbin structure |
| JP2005180211A (en) * | 2003-12-16 | 2005-07-07 | Asmo Co Ltd | Fluid supply device |
| JP4695010B2 (en) * | 2006-04-19 | 2011-06-08 | 日本電産サンキョー株式会社 | Brushless motor with built-in circuit board |
| JP2009100628A (en) * | 2007-10-19 | 2009-05-07 | Aisan Ind Co Ltd | Electrically driven pump |
| JP5349005B2 (en) * | 2007-10-29 | 2013-11-20 | 株式会社山田製作所 | Electric pump |
| JP2009144661A (en) * | 2007-12-17 | 2009-07-02 | Yamada Seisakusho Co Ltd | Vibration damping structure of motor-driven pump and method of assembling the vibration damping structure |
| JP2010004701A (en) * | 2008-06-23 | 2010-01-07 | Nsk Ltd | Operation condition detecting device |
| JP5465098B2 (en) * | 2010-06-14 | 2014-04-09 | 三菱電機株式会社 | Pump and heat pump device |
| JP2012034533A (en) * | 2010-08-02 | 2012-02-16 | Nidec Techno Motor Holdings Corp | Motor pump and method of manufacturing the same |
-
2012
- 2012-03-27 JP JP2012071097A patent/JP6129478B2/en not_active Expired - Fee Related
-
2013
- 2013-03-26 CN CN201310101035.XA patent/CN103362827B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1633564A (en) * | 2001-03-13 | 2005-06-29 | 戴维产品股份有限公司 | Pump |
| JP2006348802A (en) * | 2005-06-14 | 2006-12-28 | Asmo Co Ltd | Electric pump |
| CN101025160A (en) * | 2006-02-16 | 2007-08-29 | 日本电产三协株式会社 | Pump and pumping system |
| CN101051776A (en) * | 2006-02-17 | 2007-10-10 | 日本电产三协株式会社 | Pump and pump system |
| CN101501341A (en) * | 2006-08-09 | 2009-08-05 | 日本电产三协株式会社 | Pump and pump system |
| JP2008175090A (en) * | 2007-01-16 | 2008-07-31 | Mitsuba Corp | Motor-driven pump |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6129478B2 (en) | 2017-05-17 |
| JP2013204431A (en) | 2013-10-07 |
| CN103362827A (en) | 2013-10-23 |
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